JPH0257342A - Composite fluorine resin composition - Google Patents
Composite fluorine resin compositionInfo
- Publication number
- JPH0257342A JPH0257342A JP20859488A JP20859488A JPH0257342A JP H0257342 A JPH0257342 A JP H0257342A JP 20859488 A JP20859488 A JP 20859488A JP 20859488 A JP20859488 A JP 20859488A JP H0257342 A JPH0257342 A JP H0257342A
- Authority
- JP
- Japan
- Prior art keywords
- fluorine resin
- fluororesin
- basic monomer
- composite
- monomer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002131 composite material Substances 0.000 title claims abstract description 16
- 229910052731 fluorine Inorganic materials 0.000 title abstract description 10
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 title abstract description 9
- 239000011737 fluorine Substances 0.000 title abstract description 9
- 239000011342 resin composition Substances 0.000 title abstract 3
- 239000000463 material Substances 0.000 claims abstract description 25
- 239000000178 monomer Substances 0.000 claims abstract description 25
- 229910052757 nitrogen Inorganic materials 0.000 claims abstract description 3
- 125000004433 nitrogen atom Chemical group N* 0.000 claims abstract description 3
- 239000002344 surface layer Substances 0.000 claims abstract description 3
- 239000000203 mixture Substances 0.000 claims description 13
- 230000000379 polymerizing effect Effects 0.000 claims description 3
- 229920000642 polymer Polymers 0.000 abstract description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 239000002033 PVDF binder Substances 0.000 abstract description 3
- 229920002620 polyvinyl fluoride Polymers 0.000 abstract description 3
- 229920002981 polyvinylidene fluoride Polymers 0.000 abstract description 3
- 239000002904 solvent Substances 0.000 abstract description 2
- 239000011347 resin Substances 0.000 abstract 5
- 229920005989 resin Polymers 0.000 abstract 5
- 238000000034 method Methods 0.000 description 18
- 239000010410 layer Substances 0.000 description 7
- 239000000243 solution Substances 0.000 description 7
- -1 heat resistant Substances 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 229920006244 ethylene-ethyl acrylate Polymers 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 238000007334 copolymerization reaction Methods 0.000 description 4
- 239000005042 ethylene-ethyl acrylate Substances 0.000 description 4
- 229920002493 poly(chlorotrifluoroethylene) Polymers 0.000 description 4
- 239000005023 polychlorotrifluoroethylene (PCTFE) polymer Substances 0.000 description 4
- 230000005855 radiation Effects 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229920000840 ethylene tetrafluoroethylene copolymer Polymers 0.000 description 3
- 230000001678 irradiating effect Effects 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 238000004544 sputter deposition Methods 0.000 description 3
- JKNCOURZONDCGV-UHFFFAOYSA-N 2-(dimethylamino)ethyl 2-methylprop-2-enoate Chemical compound CN(C)CCOC(=O)C(C)=C JKNCOURZONDCGV-UHFFFAOYSA-N 0.000 description 2
- ZWAPMFBHEQZLGK-UHFFFAOYSA-N 5-(dimethylamino)-2-methylidenepentanamide Chemical compound CN(C)CCCC(=C)C(N)=O ZWAPMFBHEQZLGK-UHFFFAOYSA-N 0.000 description 2
- VVJKKWFAADXIJK-UHFFFAOYSA-N Allylamine Chemical compound NCC=C VVJKKWFAADXIJK-UHFFFAOYSA-N 0.000 description 2
- 239000004342 Benzoyl peroxide Substances 0.000 description 2
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 2
- 229920001780 ECTFE Polymers 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 2
- 229910052783 alkali metal Inorganic materials 0.000 description 2
- 150000001340 alkali metals Chemical class 0.000 description 2
- 235000019400 benzoyl peroxide Nutrition 0.000 description 2
- 238000013329 compounding Methods 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 2
- 229910052753 mercury Inorganic materials 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 2
- 239000004810 polytetrafluoroethylene Substances 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- DPBJAVGHACCNRL-UHFFFAOYSA-N 2-(dimethylamino)ethyl prop-2-enoate Chemical compound CN(C)CCOC(=O)C=C DPBJAVGHACCNRL-UHFFFAOYSA-N 0.000 description 1
- UWRZIZXBOLBCON-UHFFFAOYSA-N 2-phenylethenamine Chemical compound NC=CC1=CC=CC=C1 UWRZIZXBOLBCON-UHFFFAOYSA-N 0.000 description 1
- KGIGUEBEKRSTEW-UHFFFAOYSA-N 2-vinylpyridine Chemical compound C=CC1=CC=CC=N1 KGIGUEBEKRSTEW-UHFFFAOYSA-N 0.000 description 1
- FLCAEMBIQVZWIF-UHFFFAOYSA-N 6-(dimethylamino)-2-methylhex-2-enamide Chemical compound CN(C)CCCC=C(C)C(N)=O FLCAEMBIQVZWIF-UHFFFAOYSA-N 0.000 description 1
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- WHNWPMSKXPGLAX-UHFFFAOYSA-N N-Vinyl-2-pyrrolidone Chemical compound C=CN1CCCC1=O WHNWPMSKXPGLAX-UHFFFAOYSA-N 0.000 description 1
- 241001311547 Patina Species 0.000 description 1
- 230000006750 UV protection Effects 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000010062 adhesion mechanism Effects 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 230000000844 anti-bacterial effect Effects 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- DJLHXXNSHHGFLB-UHFFFAOYSA-N ethyl 2-methylprop-2-enoate;n-methylmethanamine Chemical compound CNC.CCOC(=O)C(C)=C DJLHXXNSHHGFLB-UHFFFAOYSA-N 0.000 description 1
- 125000001153 fluoro group Chemical group F* 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- FQPSGWSUVKBHSU-UHFFFAOYSA-N methacrylamide Chemical compound CC(=C)C(N)=O FQPSGWSUVKBHSU-UHFFFAOYSA-N 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- KKFHAJHLJHVUDM-UHFFFAOYSA-N n-vinylcarbazole Chemical compound C1=CC=C2N(C=C)C3=CC=CC=C3C2=C1 KKFHAJHLJHVUDM-UHFFFAOYSA-N 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- 239000003504 photosensitizing agent Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/034—Organic insulating material consisting of one material containing halogen
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
Landscapes
- Coating Of Shaped Articles Made Of Macromolecular Substances (AREA)
- Treatments Of Macromolecular Shaped Articles (AREA)
- Laminated Bodies (AREA)
- Paints Or Removers (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、多くの機能性を有する複合フッ素樹脂組成
物に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] This invention relates to a composite fluororesin composition having many functionalities.
フッ素樹脂は、非接着性、耐熱性、耐薬品性。 Fluororesin is non-adhesive, heat resistant, and chemical resistant.
耐候性等の優れた特性を有している。しかしながら、フ
ッ素樹脂は化学的に安定であるため、他の材料との複合
化が困難でありその用途が限定されている。そのため、
従来からフッ素樹脂材料に他の材料を複合化させ、その
機能を付与させる方法が研究されている。上記フッ素樹
脂材料に他の機能を付与させる方法としては、■アルカ
リ金属処理方法、■スパッタリング処理方法、■放射線
グラフト共重合方法等が知られている。It has excellent properties such as weather resistance. However, since fluororesin is chemically stable, it is difficult to combine it with other materials and its uses are limited. Therefore,
BACKGROUND ART Research has conventionally been carried out on methods of compounding fluororesin materials with other materials and imparting their functions. As methods for imparting other functions to the above-mentioned fluororesin materials, there are known methods such as (1) alkali metal treatment method, (2) sputtering treatment method, and (4) radiation graft copolymerization method.
しかＬ７ながら、上記の方法は様々な問題を有している
。上記■のアルカリ金属処理方法は、危険な作業を伴い
、しかも火災等が発生ずる可能性を有している。また、
上記■のスパッタリング処理方法は、設備等に多くの投
資を必要とするためコスト高になり、しかも真空雰囲気
下でスパッタリングが行われるため連続処理が困難であ
るという問題を有している。さらに、−Ｆ記載の放射線
グラフト共重合方法は、フッ素樹脂が耐放射線性に乏し
いという欠点を有していることから他の材料を複合化さ
せる方法としてはあまり有効とは言えず、しかも設備等
に多くの投資を必要とするためコスト高になるという問
題が生じる。However, the above method has various problems. The alkali metal treatment method (2) above involves dangerous work and has the possibility of causing a fire or the like. Also,
The above sputtering treatment method (2) requires a large amount of investment in equipment, resulting in high costs, and has problems in that continuous treatment is difficult because sputtering is performed in a vacuum atmosphere. Furthermore, the radiation graft copolymerization method described in -F has the disadvantage that the fluororesin has poor radiation resistance, so it cannot be said to be very effective as a method for compositing other materials. Since this method requires a large amount of investment, the problem arises that the cost is high.
この発明は、このような事情に鑑みなされたもので、製
造が安全で、連続的製造が可能で、かつ安価であり、し
かも製造設備が簡易で足りる複合フッ素樹脂組成物の提
供をその目的とする。This invention was made in view of these circumstances, and its purpose is to provide a composite fluororesin composition that is safe to manufacture, can be manufactured continuously, is inexpensive, and requires simple manufacturing equipment. do.
上記の目的を達成するため、この発明の複合フッ素樹脂
組成物は、フッ素樹脂材料の表面層に塩基性モノマーを
重合させてなるという構成をとる。In order to achieve the above object, the composite fluororesin composition of the present invention has a structure in which a basic monomer is polymerized on the surface layer of a fluororesin material.
すなわち、本発明者らは、フッ素樹脂材料に対する複合
化方法の開発について、上記■〜■の方法とは異なる観
点から研究を進めた結果、フッ素樹脂材料の表面層に塩
基性モノマーを重合させると、複合化を実現できること
を見いだしこの発明に到達した。これにより、フッ素樹
脂材料の表面が親水性に改善され、しかも塩基性モノマ
ーが接着剤の作用を有することから他の材料を接着させ
ることが可能となる。That is, the present inventors conducted research on the development of a composite method for fluororesin materials from a different perspective from the methods described in (1) to (3) above. We have discovered that it is possible to realize compounding, and have arrived at this invention. As a result, the surface of the fluororesin material is improved to be hydrophilic, and since the basic monomer has the action of an adhesive, it becomes possible to adhere other materials.
この発明の複合フッ素樹脂組成物は、フッ素樹脂材料と
塩基性モノマーとを用いることにより得られる。The composite fluororesin composition of the present invention is obtained by using a fluororesin material and a basic monomer.
上記フッ素樹脂材料のフッ素樹脂としては、フッ素原子
が含有されているポリマーであれば、特に限定するもの
ではないが、例えば、ポリフッ化ビニル（ＰＶＦ）、ポ
リフッ化ビニリデン（ＰＶｄＦ）、 ポリクロルトリフ
ルオロエチレン（ＰＣＴＦＥ）、ポリテトラフルオロエ
チレン（ＰＴＦＥ）、テトラフルオロエチレン−ヘキサ
フルオロプロピレン共重合体（ＦＥＰ）、テｌ−ラフル
オロエチレンーバーフルオロアルキルビニルエーテル共
重合体（ＰＦＡ）、エチレン−テトラフルオロエチレン
共！ 合体（Ｅ Ｔ Ｆ Ｅ ） 、エチレン−クロル
トリフルオロエチレン共重合体（ＥＣＴＦＥ）等があげ
られる。The fluororesin of the above fluororesin material is not particularly limited as long as it contains a fluorine atom, but examples include polyvinyl fluoride (PVF), polyvinylidene fluoride (PVdF), polychlorotrifluoro. Ethylene (PCTFE), polytetrafluoroethylene (PTFE), tetrafluoroethylene-hexafluoropropylene copolymer (FEP), tetrafluoroethylene-verfluoroalkyl vinyl ether copolymer (PFA), ethylene-tetrafluoroethylene Both! (ETFE), ethylene-chlorotrifluoroethylene copolymer (ECTFE), and the like.
上記塩基性子ツマ−としては、窒素原子を有するものが
好ましく、例えばジメチルアミノエチルアクリレートで
代表される、ジアルキルアミノアルキルアクリレート、
ジメチルアミノエチルメタクリレートで代表されるジア
ルキルアミノアルキルメタクリレート、ジメチルアミノ
プロピルアクリルアミドで代表されるジアルキルアミノ
アルキルアクリルアミド、ジメチルアミノプロピルメタ
クリルアミドで代表されるジアルキルアミノアルキルメ
タクリルアミドが特に好適なものとしてあげられる。ま
た、アクリルアミド、メタクリルアミド、アリルアミン
、アミノスチレン、ビニルカルバゾール等もフッ素樹脂
の接着性の改善が可能であり好適に用いられる。しかし
ながら、ビニルピリジン、ビニルピロリドンは接着性の
改善が認められず、この発明に用いる塩基性モノマーと
・して適当でない。The basic polymer preferably has a nitrogen atom, such as dialkylaminoalkyl acrylate, typified by dimethylaminoethyl acrylate,
Particularly preferred are dialkylaminoalkyl methacrylates typified by dimethylaminoethyl methacrylate, dialkylaminoalkylacrylamides typified by dimethylaminopropylacrylamide, and dialkylaminoalkylmethacrylamides typified by dimethylaminopropyl methacrylamide. Furthermore, acrylamide, methacrylamide, allylamine, aminostyrene, vinylcarbazole, and the like can improve the adhesiveness of the fluororesin and are preferably used. However, vinylpyridine and vinylpyrrolidone are not suitable as basic monomers for use in this invention because they do not show any improvement in adhesion.
上記塩基性モノマーの使用割合は、フッ素樹脂１００重
量部（以下「部」と略す）に対して０．０・１〜５０部
の範囲内に設定するのが好適である。The proportion of the basic monomer used is preferably set within the range of 0.0.1 to 50 parts per 100 parts by weight (hereinafter abbreviated as "parts") of the fluororesin.
この発明の複合フッ素樹脂組成物は、上記の原料を用い
、例えばつぎのようにして製造される。The composite fluororesin composition of the present invention is produced using the above-mentioned raw materials, for example, in the following manner.
すなわち、塩基性モノマーをそのままもしくは溶剤で希
釈しまたは粘度上昇を目的に他のポリマーを溶解させ、
モノマー溶液を用意する。この場合、必要に応じて塩基
性モノマー以外のモノマーを配合してもよい。つぎに、
上記溶液を、フッ素樹脂材料、例えばフッ素樹脂フィル
ム、フッ素樹脂シートあるいは成形品の表面上に塗布し
重合させる。重合方法としては、■上記溶液に触媒を配
合して加熱する、■上記溶液に光増感剤を配合して紫外
線照射をする、■上記溶液にフッ素樹脂層まで到達しな
い低エネルギー電子線を照射する等の方法があげられる
。しかしながら、■の放射線を照射する方法は設備投資
等の負担が大きくなるため、■および■の重合方法が実
用的である。That is, the basic monomer is used as is or diluted with a solvent, or other polymers are dissolved for the purpose of increasing viscosity.
Prepare the monomer solution. In this case, monomers other than the basic monomer may be blended as necessary. next,
The above solution is applied onto the surface of a fluororesin material, such as a fluororesin film, a fluororesin sheet, or a molded article, and polymerized. The polymerization method includes: ■ Adding a catalyst to the above solution and heating it; ■ Adding a photosensitizer to the above solution and irradiating it with ultraviolet rays; ■ Irradiating the above solution with a low-energy electron beam that does not reach the fluororesin layer. There are several ways to do this. However, the method (2) of irradiating with radiation requires a large burden of equipment investment, so the polymerization methods (2) and (4) are practical.
なお、上記フッ素樹脂材料への塩基性モノマーの接着機
構は、下記の（ａ）および（ｂ）の理由からグラフト共
重合ではなく、フッ素樹脂と塩基性モノマー（アミン）
との反応であり、イオン結合によって接着機能が付与さ
れているものと推定される。Note that the adhesion mechanism of the basic monomer to the fluororesin material is not graft copolymerization for the reasons (a) and (b) below, but rather a combination of the fluororesin and the basic monomer (amine).
It is presumed that the adhesion function is imparted by ionic bonding.
（ａ） フッ素樹脂は、耐紫外線性に優れているため
、紫外線照射によってラジカルは生成しにくい。(a) Since fluororesin has excellent ultraviolet resistance, radicals are hardly generated by ultraviolet irradiation.
（ｂ） この発明の複合フッ素樹脂組成物の塩基性モ
ノマー重合層は、例えば温度９０°Ｃの熱水に２４時間
浸漬すると膨潤し、ブラシで擦ると剥離し露出したフッ
素樹脂表面が水をはじく。グラフト共重合であれば水を
はじく現象は生じない。(b) The basic monomer polymerized layer of the composite fluororesin composition of the present invention swells when immersed in hot water at a temperature of 90°C for 24 hours, and peels off when rubbed with a brush, so that the exposed fluororesin surface repels water. . Graft copolymerization does not cause water repellency.
このようにして得られる複合フッ素樹脂組成物は、フッ
素樹脂材料の表面に塩基性モノマー重合層を形成してな
るものであり、フッ素樹脂材料の表面が親水性に変性さ
れている。しかも、上記塩基性モノマー重合層を接着剤
層と利用し他の材料を接着させることが可能となる。The composite fluororesin composition thus obtained has a basic monomer polymerized layer formed on the surface of a fluororesin material, and the surface of the fluororesin material has been modified to be hydrophilic. Furthermore, it becomes possible to use the basic monomer polymerized layer as an adhesive layer to adhere other materials.
以上のように、この発明の複合フッ素樹脂組成物は、フ
ッ素樹脂材料の表面に塩基性モノマーを重合してなるた
め、フッ素樹脂材料を主体とする組成物の表面が親水性
に変性されている。そのうえ、塩基性モノマー重合層を
接着剤層として用い他の材料を接着させることができ、
それによって他の材料の有する接着性、導電性、親水性
、抗菌性、耐摩耗性等多くの特性を自己のものとするこ
とができる。また、フッ素樹脂材料の表面に塩基性上ツ
マ−を重合させるということだけでも、複合フッ素樹脂
組成物の成形中または使用中での熱分解により生じるフ
ッ素系酸性分解ガスが塩基性モノマー重合体に捕捉され
るという効果がある。As described above, the composite fluororesin composition of the present invention is formed by polymerizing a basic monomer on the surface of a fluororesin material, so that the surface of the composition mainly composed of a fluororesin material is modified to be hydrophilic. . Moreover, the basic monomer polymerized layer can be used as an adhesive layer to bond other materials,
As a result, many properties such as adhesiveness, conductivity, hydrophilicity, antibacterial properties, and abrasion resistance possessed by other materials can be obtained as one's own. In addition, simply by polymerizing the basic monomer on the surface of the fluororesin material, the fluorine-based acidic decomposition gas generated by thermal decomposition during molding or use of the composite fluororesin composition is converted into the basic monomer polymer. It has the effect of being captured.
したがって、この発明の複合フッ素樹脂組成物はプリン
ト基板等に用いると、導体の腐食を防止でき非常に有用
である。Therefore, the composite fluororesin composition of the present invention is very useful when used in printed circuit boards and the like because it can prevent corrosion of conductors.
つぎに、実施例について比較例と併せて説明する。Next, examples will be described together with comparative examples.
（実施例１〕
ジメチルアミノエチルメタクリレ−１−１００部および
エチルアクリレ−１−１ＯＯ部にベンゾイルパーオキサ
イド４部を溶解して溶液をつくった。(Example 1) A solution was prepared by dissolving 4 parts of benzoyl peroxide in 1-100 parts of dimethylaminoethyl methacrylate and 1-100 parts of ethyl acrylate.
これを厚み１００μｍのＰＣＴＦＥフィルムに、厚み１
０μｍに塗布し、塗布面を上からポリイミドフィルムで
覆い、１８０°Ｃで３０分間加熱し重合させた。つぎに
、ポリイミドフィルムを除去し、厚み５０μｍのエチレ
ン−エチルアクリレート共重合体フィルム（ＥＥＡ）（
日本ユニカー社製ＭＢ−８３０）と貼り合わせ表面温度
１００°Ｃの熱ロール間を通して圧着し３層構造の接着
シートを得た。これを、さらに厚み５０μｍの銅箔およ
びＥＥＡと合わせて得られたものを表面温度１００°Ｃ
の熱ロール間を通してプリント基板を作製した。このプ
リント基板のＰＣＴＦＥとＥＥＡ間の接着力を測定した
ところ１５ｋｇ／ｃ−で充分な接着力を有していた。This was placed on a 100 μm thick PCTFE film with a thickness of 1
The coated surface was covered with a polyimide film from above and heated at 180°C for 30 minutes to polymerize. Next, the polyimide film was removed and an ethylene-ethyl acrylate copolymer film (EEA) with a thickness of 50 μm (
The adhesive sheet was bonded to MB-830 (manufactured by Nippon Unicar Co., Ltd.) and pressed between heated rolls with a surface temperature of 100°C to obtain an adhesive sheet with a three-layer structure. This was further combined with a 50 μm thick copper foil and EEA, and the resulting product was heated to a surface temperature of 100°C.
A printed circuit board was fabricated by passing it between the hot rolls. When the adhesive force between the PCTFE and EEA of this printed circuit board was measured, it was found to be 15 kg/c-, which was sufficient.
〔実施例２〕
厚み８０μｍのＰＦＡフィルムに、ジメチルアミノプロ
ピルアクリルアミド１００部、ベンゾフェノン１．５部
の混合溶液を厚み５０ ａｒｍに塗布し２ｋＨの高圧水
銀灯を用い、溶液塗布面と高圧水銀灯との距離を２０Ｃ
Ｊにして１０分間照射し重合させた。得られたものは、
重合層が充分にＰＦＡフィルムに接着しており、しかも
重合層が容易に水に濡れるため、ＰＦＡの親水性フィル
ムが得られた。[Example 2] A mixed solution of 100 parts of dimethylaminopropylacrylamide and 1.5 parts of benzophenone was applied to a PFA film with a thickness of 80 μm to a thickness of 50 arms, and a 2 kHz high-pressure mercury lamp was used to adjust the distance between the solution application surface and the high-pressure mercury lamp. 20C
It was irradiated at J for 10 minutes to polymerize. What was obtained is
A hydrophilic film of PFA was obtained because the polymer layer adhered well to the PFA film and was easily wetted by water.
〔実施例３〕
ＰＦＡフィルムに代えて、厚み５０μｍのＦＥＰフィル
ムを用いた。それ以外は実施例２と同様にしてＦＥＰの
親水性フィルムを得た。得られたＦＥＰＩ水性フィルム
は、充分な親水性を有していた。[Example 3] A 50 μm thick FEP film was used instead of the PFA film. Other than that, a hydrophilic film of FEP was obtained in the same manner as in Example 2. The obtained FEPI aqueous film had sufficient hydrophilicity.
〔実施例４〕
ＰＦＡフィルムに代えて、厚み）３０μｍのＥ ＴＦＥ
フィルムを用いた。それ以外は実施例２と同様にしてＥ
ＴＦＥの親水性フィルムを得た。得られたＥＴＦＥ親水
性フィルムは、充分な親水性を有していた。[Example 4] E TFE with a thickness of 30 μm was used instead of the PFA film.
A film was used. Other than that, the procedure was the same as in Example 2.
A hydrophilic film of TFE was obtained. The obtained ETFE hydrophilic film had sufficient hydrophilicity.
〔比較例］
ジメチルアミンエチルメタクリレートの使用をとりやめ
、かつ、ベンゾイルパーオキサイドの配合品を２部に変
えた。それ以外は実施例１と同様にしてプリント基板を
作製した。得られたプリント基板のＰＣＴＦＥ＆ＥＥＡ
間の接着力は僅か５５ｇ／ｃｄＬかなかった。[Comparative Example] The use of dimethylamine ethyl methacrylate was discontinued, and the amount of benzoyl peroxide was changed to 2 parts. A printed circuit board was produced in the same manner as in Example 1 except for the above. PCTFE & EEA of the obtained printed circuit board
The adhesion between the two was only 55 g/cdL.
上記のようにして得られた実施例１品と比較測高を用い
て銅箔の腐食試験を行った。実施例１品および比較測高
を８０°Ｃで２００時間加熱したところ、比較測高は銅
箔部分には緑青部分が生じたが、実施例１品には変化は
見られず銅箔等金属の腐食防止に有効であることがわか
った。A copper foil corrosion test was conducted using the Example 1 product obtained as described above and comparative height measurements. When the product of Example 1 and the comparison height measurement were heated at 80°C for 200 hours, a patina appeared on the copper foil part of the comparison height measurement, but no change was observed in the product of Example 1, and metals such as copper foil It was found to be effective in preventing corrosion.
特許出願人 日東電気工業株式会社 代理人 弁理士 西 藤 征 彦Patent applicant: Nitto Electric Industry Co., Ltd. Agent: Patent Attorney Yukihiko Nishifuji
Claims (2)
させてなることを特徴とする複合フッ素樹脂組成物。(1) A composite fluororesin composition characterized by polymerizing a basic monomer onto the surface layer of a fluororesin material.
求項（１）記載の複合フッ素樹脂組成物。(2) The composite fluororesin composition according to claim (1), wherein the basic monomer has a nitrogen atom.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63208594A JPH078555B2 (en) | 1988-08-23 | 1988-08-23 | Fluororesin composite |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63208594A JPH078555B2 (en) | 1988-08-23 | 1988-08-23 | Fluororesin composite |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0257342A true JPH0257342A (en) | 1990-02-27 |
| JPH078555B2 JPH078555B2 (en) | 1995-02-01 |
Family
ID=16558786
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63208594A Expired - Fee Related JPH078555B2 (en) | 1988-08-23 | 1988-08-23 | Fluororesin composite |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH078555B2 (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6372732A (en) * | 1986-09-16 | 1988-04-02 | Nitto Electric Ind Co Ltd | Graft copolymer |
-
1988
- 1988-08-23 JP JP63208594A patent/JPH078555B2/en not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6372732A (en) * | 1986-09-16 | 1988-04-02 | Nitto Electric Ind Co Ltd | Graft copolymer |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH078555B2 (en) | 1995-02-01 |
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