JPH0256839B2 - - Google Patents
Info
- Publication number
- JPH0256839B2 JPH0256839B2 JP58239470A JP23947083A JPH0256839B2 JP H0256839 B2 JPH0256839 B2 JP H0256839B2 JP 58239470 A JP58239470 A JP 58239470A JP 23947083 A JP23947083 A JP 23947083A JP H0256839 B2 JPH0256839 B2 JP H0256839B2
- Authority
- JP
- Japan
- Prior art keywords
- cut
- wiring board
- printed wiring
- processing
- marking
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000000034 method Methods 0.000 claims description 17
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 239000011889 copper foil Substances 0.000 claims description 3
- 238000012790 confirmation Methods 0.000 description 4
- 238000005530 etching Methods 0.000 description 2
- 238000011179 visual inspection Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
Description
【発明の詳細な説明】
発明の技術分野
本発明は、印刷配線板のＶカツト加工の確認方
法に係り、特に少なくとも２つの独立した配線用
回路を有する印刷配線板をそれぞれの配線用回路
毎に折断するためのＶ字状の切込溝の有無を確認
する方法に関する。DETAILED DESCRIPTION OF THE INVENTION Technical Field of the Invention The present invention relates to a method for confirming V-cut processing of a printed wiring board, and in particular, to a method for checking V-cut processing of a printed wiring board, and particularly for checking a printed wiring board having at least two independent wiring circuits for each wiring circuit. The present invention relates to a method for checking the presence or absence of a V-shaped cut groove for cutting.
従来技術の問題点
一般に、印刷配線板においては、各製造工程に
おけるハンドリング及び諸設備の占有面積又は稼
働効率等を考慮し、１枚の印刷配線板に少なくと
も２つの独立した配線用回路を形成するとともに
各配線用回路の境界線上に折断分離するためのＶ
字状の切込溝を形成し（Ｖカツト加工を施し）、
この印刷配線板形成工程の後のパツケージ組立工
程完了後に、印刷配線板を切込溝に沿つて折断分
離することが行われている。Problems with the Prior Art In general, in printed wiring boards, at least two independent wiring circuits are formed on one printed wiring board, taking into account handling in each manufacturing process, the area occupied by various equipment, operating efficiency, etc. and V for breaking and separating on the boundary line of each wiring circuit.
A letter-shaped cut groove is formed (V-cut processing is applied),
After the package assembly process is completed after the printed wiring board forming process, the printed wiring board is broken and separated along the cut grooves.
しかしながら、Ｖカツト加工が施されているか
否かの確認は、従来、目視検査により行われてい
るため、往々にしてＶカツト加工の施されていな
いものを見逃し易い問題がある。 However, since confirmation of whether V-cut processing has been performed has conventionally been carried out by visual inspection, there is a problem in that it is often easy to overlook items that have not been subjected to V-cut processing.
又、各配線用回路の寸法が異なる場合には、Ｖ
カツト加工時における加工位置そのものが誤つて
なされるおそれがある。 Also, if the dimensions of each wiring circuit are different, V
There is a risk that the cutting position itself may be incorrectly determined during cutting.
特に、Ｖカツト加工が施されていない状態でパ
ツケージ組立工程に廻され、印刷配線板に対する
部品の挿入、はんだ付け、はんだフラツクス除去
等の作業終了後に各配線用回路毎に分離する場合
には電子部品の損傷、時としては配線用回路の損
傷を発生することがあり、分離作業がきわめて困
難となる等の問題がある。 In particular, if the package is sent to the package assembly process without V-cut processing and is separated into each wiring circuit after inserting the components into the printed wiring board, soldering, and removing solder flux, the electronic There are problems such as damage to components and sometimes damage to wiring circuits, making separation work extremely difficult.
発明の目的
本発明は上述した問題に鑑み、Ｖカツト加工が
施されているか否かの確認を効率よくしかも信頼
性の高いものとし得る印刷配線板のＶカツト加工
の確認方法を提供することを目的とする。Purpose of the Invention In view of the above-mentioned problems, it is an object of the present invention to provide a method for confirming V-cut processing of a printed wiring board, which can efficiently and highly reliable confirm whether or not V-cut processing has been performed. purpose.
発明の概要
本発明は折断用の切込溝奥の加工前に、印刷配
線板における各配線用回路の境界線上に切込溝よ
り狭い幅のマーキングを施すようにし、切込溝の
加工後に、マーキングの有無を確認するようにし
たものである。SUMMARY OF THE INVENTION The present invention includes markings with a width narrower than the cut grooves on the boundaries of each wiring circuit on a printed wiring board before processing the back of the cut grooves for cutting, and after processing the cut grooves, This is to check the presence or absence of markings.
実施例
以下、図面を参照してこの発明の実施例を説明
する。Embodiments Hereinafter, embodiments of the present invention will be described with reference to the drawings.
第１図Ａ，Ｂは、第１の発明の１実施例を示す
平面図で、この確認方法は、先ず、２つの独立し
た配線用回路１，２を有する印刷配線板３の各配
線用回路１，２の境界線上に、折断分離するため
のＶ字状の切込溝４の加工（Ｖカツト加工）に、
切込溝４の幅より狭い幅のマーキング５を施す。 FIGS. 1A and 1B are plan views showing one embodiment of the first invention, and this confirmation method first involves each wiring circuit of a printed wiring board 3 having two independent wiring circuits 1 and 2. For processing a V-shaped cut groove 4 on the boundary line of 1 and 2 for breaking and separating (V-cut processing),
A marking 5 having a width narrower than the width of the cut groove 4 is applied.
このマーキング５は、エツチングにより残存せ
しめた銅箔によつて形成されるものである。 This marking 5 is formed from copper foil left by etching.
次いで、マーキング５を施した境界線上に、そ
の幅より広い幅のＶ字状の切込溝４を加工し、こ
の溝加工後に、マーキング５の有無を目視検査す
ることによりＶカツト加工が施されているか否か
を確認する。 Next, a V-shaped cut groove 4 having a width wider than that width is machined on the boundary line where the marking 5 has been applied, and after this groove has been machined, a V-cut process is performed by visually inspecting the presence or absence of the marking 5. Check whether the
したがつて、Ｖカツト加工の確認が、マーキン
グ５の存在の有無をみるだけでよいから、従来技
術に比し、容易にしてかつ短時間で行うことがで
きる。 Therefore, since it is sufficient to check the presence or absence of the marking 5 to confirm the V-cut process, the process can be performed more easily and in a shorter time than in the prior art.
第２図は、第２の発明の一実施例を示す平面図
で、この確認方法は、先ず、２つの独立した配線
用回路１，２を有する印刷配線板３の各配線用回
路１，２の境界線６上に、折断分離するためのＶ
字状の切込溝４（第３図Ｂ参照）の加工前に、相
隣る配線用回路１，２の領域にまたがる電気的回
路７を形成する。 FIG. 2 is a plan view showing an embodiment of the second invention, and this confirmation method first involves each wiring circuit 1, 2 of a printed wiring board 3 having two independent wiring circuits 1, 2. V for breaking and separating on the boundary line 6 of
Before forming the letter-shaped cut grooves 4 (see FIG. 3B), an electrical circuit 7 is formed that spans the areas of the adjacent wiring circuits 1 and 2.
この電気回路７は、境界線６の両端付近に１個
ずつ形成するものであるとともに、第３図Ａに示
すように、境界線６と直交し、かつ両端に孔８を
中心に設けたランド７ａを形成してある。 This electric circuit 7 is formed one each near both ends of the boundary line 6, and as shown in FIG. 7a is formed.
次いで、境界線６上に、第３図Ｂに示すよう
に、切込溝４を形成してから、切込溝４によつて
分断された相隣る領域に存する電気的回路７の電
気的な導通（短絡）の有無をテスター等の計器に
よりチエツクすることによりＶカツト加工が施さ
れているか否かを確認する。 Next, as shown in FIG. 3B, cut grooves 4 are formed on the boundary line 6, and then the electrical circuits 7 existing in the adjacent regions separated by the cut grooves 4 are connected. Confirm whether V-cut processing has been performed by checking for proper continuity (short circuit) using a meter such as a tester.
したがつて、従来技術に比し、Ｖカツト加工の
確認を短時間にしてかつ正確に行うことができる
とともに、その自動化も可能となる。 Therefore, compared to the prior art, it is possible to check the V-cut processing in a shorter time and more accurately, and it is also possible to automate it.
発明の効果
以上の如く本発明によれば、境界線上にＶカツ
ト加工により消去されるマーキングを施すように
したので、従来技術に比し、Ｖカツト加工の確認
を容易にしてかつ短時間に行うことができる。Effects of the Invention As described above, according to the present invention, markings that are erased by the V-cut process are made on the boundary line, so that the V-cut process can be confirmed more easily and in a shorter time than in the prior art. be able to.
特に、本発明確認方法におけるマーキングはエ
ツチングによつて残存せしめた銅箔により形成し
たものであるため、マーキングを印刷によつて形
成する場合に比較して、プリント配線回路を配線
工程に関連した形成工程で済み、工程数の簡易化
を計れるとともに確認の際には、目視によつて簡
単迅速に行え電気的な検査装置等を不要とした確
認が行えるものである。 In particular, since the markings in the confirmation method of the present invention are formed from copper foil left by etching, compared to the case where the markings are formed by printing, the printed wiring circuit is formed in the wiring process. It is possible to simplify the number of steps, and when checking, it can be done simply and quickly by visual inspection, eliminating the need for an electrical inspection device or the like.
第１図Ａ，Ｂはそれぞれ第１の発明の一実施例
を示す平面図、第２図は第２の発明の一実施例を
示す平面図、第３図Ａ，Ｂはそれぞれ要部の拡大
平面図である。
１，２……配線用回路、３……印刷配線板、４
……切込溝、５……マーキング、５……境界線、
７……電気的回路、７ａ……ランド、８……孔。
Figures 1A and B are plan views showing an embodiment of the first invention, Figure 2 is a plan view showing an embodiment of the second invention, and Figures 3A and B are enlargements of essential parts, respectively. FIG. 1, 2...Wiring circuit, 3...Printed wiring board, 4
... Cut groove, 5 ... Marking, 5 ... Boundary line,
7... Electric circuit, 7a... Land, 8... Hole.
Claims (1)
る印刷配線板の各配線用回路の境界に加工される
折断用の切入溝の有無を確認する方法にして、折
断用の切入溝の加工前に、印刷配線板における各
配線用回路の境界線上に切込溝より狭い幅のマー
キングをエツチングによる銅箔により施すように
し、切込溝の加工後に、マーキングの有無を確認
するようにしたことを特徴とする印刷配線板のＶ
カツト加工の確認方法。1. A method of checking the presence or absence of cutting grooves for cutting to be processed at the boundaries of each wiring circuit of a printed wiring board having at least two independent wiring circuits, and before processing the cutting grooves for cutting, printing A marking with a width narrower than the cut groove is made using etched copper foil on the boundary line of each wiring circuit on the wiring board, and the presence or absence of the marking is checked after the cut groove is processed. V of printed wiring board
How to check cut processing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23947083A JPS60130884A (en) | 1983-12-19 | 1983-12-19 | Method of confirming v-cut of printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23947083A JPS60130884A (en) | 1983-12-19 | 1983-12-19 | Method of confirming v-cut of printed circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60130884A JPS60130884A (en) | 1985-07-12 |
| JPH0256839B2 true JPH0256839B2 (en) | 1990-12-03 |
Family
ID=17045243
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23947083A Granted JPS60130884A (en) | 1983-12-19 | 1983-12-19 | Method of confirming v-cut of printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60130884A (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6171691A (en) * | 1984-09-17 | 1986-04-12 | 富士通テン株式会社 | Method of detecting split groove arrangement leakage of split printed board |
| JPH027476Y2 (en) * | 1984-09-26 | 1990-02-22 | ||
| JPS62121043U (en) * | 1986-01-27 | 1987-07-31 | ||
| JP2002158410A (en) * | 2000-11-21 | 2002-05-31 | Ibiden Co Ltd | Printed wiring board and its manufacturing method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS512665B2 (en) * | 1972-03-14 | 1976-01-28 | ||
| JPS57194303A (en) * | 1981-05-26 | 1982-11-29 | Oki Electric Ind Co Ltd | Discrimination method for defective and non-defective of thick film ceramic substrate |
| JPS587375B2 (en) * | 1976-05-11 | 1983-02-09 | オツト−・ビ−ラ− | Method and apparatus for bending a ring from wire or strip |
| JPS5825292A (en) * | 1981-08-08 | 1983-02-15 | 松下電器産業株式会社 | Printed circuit board |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5425005Y2 (en) * | 1974-06-21 | 1979-08-22 | ||
| JPS51122346U (en) * | 1975-03-31 | 1976-10-04 | ||
| JPS5485363U (en) * | 1977-11-30 | 1979-06-16 | ||
| JPS587375U (en) * | 1981-07-06 | 1983-01-18 | パイオニア株式会社 | printed wiring board |
-
1983
- 1983-12-19 JP JP23947083A patent/JPS60130884A/en active Granted
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS512665B2 (en) * | 1972-03-14 | 1976-01-28 | ||
| JPS587375B2 (en) * | 1976-05-11 | 1983-02-09 | オツト−・ビ−ラ− | Method and apparatus for bending a ring from wire or strip |
| JPS57194303A (en) * | 1981-05-26 | 1982-11-29 | Oki Electric Ind Co Ltd | Discrimination method for defective and non-defective of thick film ceramic substrate |
| JPS5825292A (en) * | 1981-08-08 | 1983-02-15 | 松下電器産業株式会社 | Printed circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60130884A (en) | 1985-07-12 |
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