JPH025243A - Optical card - Google Patents
Optical cardInfo
- Publication number
- JPH025243A JPH025243A JP63151589A JP15158988A JPH025243A JP H025243 A JPH025243 A JP H025243A JP 63151589 A JP63151589 A JP 63151589A JP 15158988 A JP15158988 A JP 15158988A JP H025243 A JPH025243 A JP H025243A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- card
- resin
- optical recording
- optical
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000003287 optical effect Effects 0.000 title claims abstract description 67
- 239000000758 substrate Substances 0.000 claims abstract description 25
- 229920002050 silicone resin Polymers 0.000 claims abstract description 12
- 239000000463 material Substances 0.000 abstract description 18
- 229920005989 resin Polymers 0.000 abstract description 15
- 239000011347 resin Substances 0.000 abstract description 15
- 230000035945 sensitivity Effects 0.000 abstract description 9
- 239000002904 solvent Substances 0.000 abstract description 5
- 238000010894 electron beam technology Methods 0.000 abstract description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract description 3
- 230000002411 adverse Effects 0.000 abstract description 3
- 230000015572 biosynthetic process Effects 0.000 abstract description 3
- 229910052710 silicon Inorganic materials 0.000 abstract description 3
- 238000005452 bending Methods 0.000 abstract description 2
- 239000000155 melt Substances 0.000 abstract description 2
- 230000006866 deterioration Effects 0.000 abstract 2
- 239000010703 silicon Substances 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 52
- 238000001723 curing Methods 0.000 description 7
- 230000000694 effects Effects 0.000 description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 5
- LRFVTYWOQMYALW-UHFFFAOYSA-N 9H-xanthine Chemical compound O=C1NC(=O)NC2=C1NC=N2 LRFVTYWOQMYALW-UHFFFAOYSA-N 0.000 description 4
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 4
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 4
- 238000007259 addition reaction Methods 0.000 description 4
- 239000004417 polycarbonate Substances 0.000 description 4
- 229920000515 polycarbonate Polymers 0.000 description 4
- 238000000859 sublimation Methods 0.000 description 4
- 230000008022 sublimation Effects 0.000 description 4
- 239000000956 alloy Substances 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 238000006482 condensation reaction Methods 0.000 description 3
- 239000000975 dye Substances 0.000 description 3
- 229920006332 epoxy adhesive Polymers 0.000 description 3
- 230000001678 irradiating effect Effects 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 229920001296 polysiloxane Polymers 0.000 description 3
- BCHZICNRHXRCHY-UHFFFAOYSA-N 2h-oxazine Chemical compound N1OC=CC=C1 BCHZICNRHXRCHY-UHFFFAOYSA-N 0.000 description 2
- AGIJRRREJXSQJR-UHFFFAOYSA-N 2h-thiazine Chemical compound N1SC=CC=C1 AGIJRRREJXSQJR-UHFFFAOYSA-N 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 2
- 229920003319 Araldite® Polymers 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- OWYWGLHRNBIFJP-UHFFFAOYSA-N Ipazine Chemical compound CCN(CC)C1=NC(Cl)=NC(NC(C)C)=N1 OWYWGLHRNBIFJP-UHFFFAOYSA-N 0.000 description 2
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- PYKYMHQGRFAEBM-UHFFFAOYSA-N anthraquinone Natural products CCC(=O)c1c(O)c2C(=O)C3C(C=CC=C3O)C(=O)c2cc1CC(=O)OC PYKYMHQGRFAEBM-UHFFFAOYSA-N 0.000 description 2
- 150000004056 anthraquinones Chemical class 0.000 description 2
- 229910052786 argon Inorganic materials 0.000 description 2
- 239000000298 carbocyanine Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- DZVCFNFOPIZQKX-LTHRDKTGSA-M merocyanine Chemical compound [Na+].O=C1N(CCCC)C(=O)N(CCCC)C(=O)C1=C\C=C\C=C/1N(CCCS([O-])(=O)=O)C2=CC=CC=C2O\1 DZVCFNFOPIZQKX-LTHRDKTGSA-M 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- IEQIEDJGQAUEQZ-UHFFFAOYSA-N phthalocyanine Chemical compound N1C(N=C2C3=CC=CC=C3C(N=C3C4=CC=CC=C4C(=N4)N3)=N2)=C(C=CC=C2)C2=C1N=C1C2=CC=CC=C2C4=N1 IEQIEDJGQAUEQZ-UHFFFAOYSA-N 0.000 description 2
- QWYZFXLSWMXLDM-UHFFFAOYSA-M pinacyanol iodide Chemical compound [I-].C1=CC2=CC=CC=C2N(CC)C1=CC=CC1=CC=C(C=CC=C2)C2=[N+]1CC QWYZFXLSWMXLDM-UHFFFAOYSA-M 0.000 description 2
- 229920005668 polycarbonate resin Polymers 0.000 description 2
- 239000004431 polycarbonate resin Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920005672 polyolefin resin Polymers 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- AAAQKTZKLRYKHR-UHFFFAOYSA-N triphenylmethane Chemical compound C1=CC=CC=C1C(C=1C=CC=CC=1)C1=CC=CC=C1 AAAQKTZKLRYKHR-UHFFFAOYSA-N 0.000 description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 2
- 229940075420 xanthine Drugs 0.000 description 2
- IVUBJNPDPBDVLT-UHFFFAOYSA-N 2,15,28,41,53,55-hexaza-54,56-diazanidatridecacyclo[40.10.1.13,14.116,27.129,40.04,13.06,11.017,26.019,24.030,39.032,37.043,52.045,50]hexapentaconta-1,3,5,7,9,11,13,15,17,19,21,23,25,27(55),28,30,32,34,36,38,40,42(53),43,45,47,49,51-heptacosaene oxovanadium(2+) Chemical compound [V+2]=O.[N-]1C(N=C2C3=CC4=CC=CC=C4C=C3C(N=C3C4=CC5=CC=CC=C5C=C4C(=N4)[N-]3)=N2)=C(C=C2C(C=CC=C2)=C2)C2=C1N=C1C2=CC3=CC=CC=C3C=C2C4=N1 IVUBJNPDPBDVLT-UHFFFAOYSA-N 0.000 description 1
- 101100008049 Caenorhabditis elegans cut-5 gene Proteins 0.000 description 1
- 229930192627 Naphthoquinone Natural products 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 125000003668 acetyloxy group Chemical group [H]C([H])([H])C(=O)O[*] 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 125000003545 alkoxy group Chemical group 0.000 description 1
- 125000000751 azo group Chemical group [*]N=N[*] 0.000 description 1
- 239000011111 cardboard Substances 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 238000005323 electroforming Methods 0.000 description 1
- 238000001227 electron beam curing Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 150000002430 hydrocarbons Chemical group 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 239000012768 molten material Substances 0.000 description 1
- LKKPNUDVOYAOBB-UHFFFAOYSA-N naphthalocyanine Chemical compound N1C(N=C2C3=CC4=CC=CC=C4C=C3C(N=C3C4=CC5=CC=CC=C5C=C4C(=N4)N3)=N2)=C(C=C2C(C=CC=C2)=C2)C2=C1N=C1C2=CC3=CC=CC=C3C=C2C4=N1 LKKPNUDVOYAOBB-UHFFFAOYSA-N 0.000 description 1
- 150000002791 naphthoquinones Chemical class 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 150000001282 organosilanes Chemical class 0.000 description 1
- 125000003544 oxime group Chemical group 0.000 description 1
- 239000000088 plastic resin Substances 0.000 description 1
- 150000003058 platinum compounds Chemical class 0.000 description 1
- 229920013716 polyethylene resin Polymers 0.000 description 1
- -1 polysiloxane Polymers 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000005469 synchrotron radiation Effects 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 229930195735 unsaturated hydrocarbon Natural products 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Landscapes
- Credit Cards Or The Like (AREA)
- Thermal Transfer Or Thermal Recording In General (AREA)
- Optical Record Carriers And Manufacture Thereof (AREA)
Abstract
Description
【発明の詳細な説明】 〈産業上の利用分野〉 本発明は追記書込み可能な光カードに関する。[Detailed description of the invention] <Industrial application field> The present invention relates to a write-once optical card.
〈従来技術〉
近年、各分野に広く用いられている磁気カードに対して
より高い機能の付加が求められるようになり、磁気カー
ドに比べ、記憶容量が大きいカード状記録媒体として光
カードが提案され、なかでも、追加書込み型光カードは
利用範囲が広く、有望視されている。<Prior art> In recent years, there has been a demand for higher functionality to be added to magnetic cards, which are widely used in various fields, and optical cards have been proposed as a card-like recording medium with a larger storage capacity than magnetic cards. Among them, write-on type optical cards have a wide range of applications and are considered promising.
現在光ディスクなどで、応用されている追加書込み型光
記録媒体の記録方法として、ダイレクト・リード・アフ
ター・ライト（ＤＲＡＷ）形式があり、この形式の記録
方法は、薄膜状に形成された光記録層にレーザ光等の放
射光を熱源として照射して光記録材料に物理的、化学的
変化を与え、デジタル情報をピットの形で記録するヒー
トモード記録であり、光記録材料を永久変形させる温度
で加熱しない限り記録が消滅することがないという利点
を持つ。The direct read after write (DRAW) format is a recording method for write-on optical recording media currently used in optical discs, etc., and this recording method uses an optical recording layer formed in a thin film. This is a heat mode recording in which digital information is recorded in the form of pits by irradiating the optical recording material with synchrotron radiation such as a laser beam as a heat source to cause physical and chemical changes to the optical recording material. It has the advantage that the records will not be erased unless heated.
ＤＲＡＷ形式の光記録材料としては、Ｔｅ系化合物やア
ントラキノン系、ナフトキノン系、トリフェニルメタン
系、カルボシアニン系、メロシアニン系、キサンチン系
、アゾ系、アジン系、チアジン系、オキサジン系、フタ
ロシアニン系、スクアリリウム系などの有機色素が用い
られる。DRAW format optical recording materials include Te-based compounds, anthraquinone-based, naphthoquinone-based, triphenylmethane-based, carbocyanine-based, merocyanine-based, xanthine-based, azo-based, azine-based, thiazine-based, oxazine-based, phthalocyanine-based, and squarylium. Organic dyes such as dyes are used.
これらの光記録材料により形成された光記録部に、半導
体レーザ等の記録光、例えば８３０±１５Ｉｍの波長の
光が照射されると、照射された部分が昇温し、昇華或い
は熔融する。レーザ照射部の昇華或いは熔融部分はその
周辺に移動し孔、すなわちビットが形成される。そこで
、光デイスク型光記録媒体では昇華または熔融にともな
うレーザ光照射部分の移動を妨げることがないように光
記録層の記録面と対向するカード基板に空間層を設けて
いる。When the optical recording portion formed of these optical recording materials is irradiated with recording light from a semiconductor laser or the like, for example, light with a wavelength of 830±15 Im, the irradiated portion is heated and sublimated or melted. The sublimated or melted portion of the laser irradiated portion moves to its periphery, forming a hole, that is, a bit. Therefore, in the optical disk type optical recording medium, a space layer is provided on the card substrate facing the recording surface of the optical recording layer so as not to impede the movement of the laser beam irradiated part due to sublimation or melting.
〈発明が解決しようとする課題〉
しかしながら、前述のＤＲＡＷ形式の光カードを製作す
る場合には次に述べる問題点がある。<Problems to be Solved by the Invention> However, when producing the above-mentioned DRAW format optical card, there are the following problems.
光カードは、−Ｓにキャッシュカードやクレジットカー
ドと同様に携帯して使用されることが多く、種々雑多に
加えられる外力による光カードの変形または破損に対し
てカードの強度をもたせる必要があり、さらにカードと
しての機能上から薄くすることが必要である。このため
、光記録層に隣接させて空間層を有する従来のＤＲＡＷ
形式の光デイスク型光記録媒体の構造をそのままカード
に適用した場合はカードの強度低下或いはカードの１型
化を招来するため、その構造をそのまま採用することは
困難である。Optical cards are often carried around and used in the same way as cash cards and credit cards, and it is necessary to provide the card with strength against deformation or damage caused by various external forces applied to the optical card. Furthermore, it is necessary to make it thin from the viewpoint of its functionality as a card. For this reason, conventional DRAW that has a spatial layer adjacent to the optical recording layer
If the structure of an optical disc type optical recording medium is applied to a card as it is, the strength of the card will be reduced or the card will become one type, so it is difficult to use the structure as is.
そのため、追加書込み型光カードは光記録層に隣接して
空間層を設けないカード基板、光記録層および、そのほ
かの透明層などの各層を一体に密着する構造を採用する
ことが考えられる。Therefore, it is conceivable that an additional write-on type optical card adopts a structure in which each layer, such as a card substrate without a space layer adjacent to the optical recording layer, the optical recording layer, and other transparent layers, are tightly adhered to each other.
そこで、光記録層の記録材料の昇華或いは熔融によるレ
ーザ光の照射部からの移動による変形を妨げない空間層
の代わるものとして熱可塑樹脂が考えられる。しかし、
光記録材料の移動変形に対して抵抗となるため、レーザ
光によるデータ書込み感度を低下させる傾向があること
がわかった。Therefore, a thermoplastic resin can be considered as an alternative to the space layer, which does not prevent the recording material of the optical recording layer from deforming due to movement from the laser beam irradiation area due to sublimation or melting. but,
It has been found that this tends to reduce data writing sensitivity using laser light because it provides resistance to the movement and deformation of the optical recording material.
例えば、光記録層と、硬度があり弾性のない固体とが密
着状態になると、レーザ光照射により光記録材料が昇華
、蒸発あるいは熔融する場合、物質の移動空間が生じな
いため、ビット内の圧力上昇により昇華或いは蒸発が抑
制されるため、また熔融部分の移動が妨げられるため記
録感度は非常に低く、高いレニザ出力が必要となる。For example, when an optical recording layer and a hard, non-elastic solid come into close contact, when the optical recording material sublimates, evaporates, or melts due to laser beam irradiation, there is no space for the material to move, so the pressure inside the bit increases. Since sublimation or evaporation is suppressed by rising, and movement of the molten portion is inhibited, the recording sensitivity is very low and a high laser output is required.
また、ビットの形状についても、昇華あるいは熔融物質
の移動する空間がないためビット周辺に再析出するため
、ビット形状が悪くなり、コントラストの低下が見られ
る。Furthermore, regarding the shape of the bit, since there is no space for sublimation or molten material to move, redeposition occurs around the bit, resulting in a poor bit shape and a decrease in contrast.
よって、本発明は前述の問題点に基づき、カードの薄型
化を図るとともに、外力に耐えうる強度とし、記録感度
が十分に得られる密着構造の光カードの提供を目的とす
る。SUMMARY OF THE INVENTION Therefore, based on the above-mentioned problems, the present invention aims to provide an optical card having a close-contact structure that can reduce the thickness of the card, have strength enough to withstand external forces, and provide sufficient recording sensitivity.
〈課題を解決するための手段と作用〉
前記目的を達成するために本発明の光カードは透明基板
上に光記録層を積層し、この光記録層にシリコーン樹脂
からなる光記録層のビット形成にともなう変形を吸収す
るバッファー層を積層した後、光記録層を積層して設け
たことを特徴とするものである。<Means and effects for solving the problems> In order to achieve the above object, the optical card of the present invention has an optical recording layer laminated on a transparent substrate, and bit formation of an optical recording layer made of silicone resin is formed on this optical recording layer. This is characterized in that an optical recording layer is laminated after a buffer layer that absorbs the deformation caused by this is laminated.
本発明の光カードの基本的構成を第１図および第２図を
参照して説明する。The basic structure of the optical card of the present invention will be explained with reference to FIGS. 1 and 2.
図中１は透明基板、２はＴｅ系の合金或いは有機色素か
らなる光記録層、３はシリコーン樹脂からなるバッフ１
−層、４は接着剤、５は裏打ち用基牟反である。In the figure, 1 is a transparent substrate, 2 is an optical recording layer made of a Te-based alloy or organic dye, and 3 is a buffer 1 made of silicone resin.
- layer, 4 is adhesive, 5 is backing substrate.
透明基板１は通常、ポリカーボネート樹脂、ポリカポネ
ートスチレン混合樹脂、アクリル樹脂、エポキシ樹脂、
オレフィン系樹脂などでレーザ光にて読み取りの際のト
ラッキングを可能とするために案内溝が形成されている
。The transparent substrate 1 is usually made of polycarbonate resin, polycarbonate styrene mixed resin, acrylic resin, epoxy resin,
Guide grooves are formed using olefin resin or the like to enable tracking when reading with a laser beam.
光記録層は、アントラキノン系、ナフトキレン系、トリ
フェニルメタン系、カルボシアニン系、メロシアニン系
、キサンチン系、アゾ系、アジン系、チアジン系、オキ
サジン系、フタロシアニン系、ナフタロシアニン系、ス
クアリウム系などの有機色素、Ｔｅ、Ｔｅ−５ｅ、Ｔｅ
−Ｃ，Ｔｅ −−Ｃ５ｔ 、Ｔｅ−Ｔｅｎｔ 、Ｔｅ−
３ｂ、Ｔｅ −Ｇｅ等のＴｅ系合金−Ｔｅ−３ｅ−３ｂ
、Ｔｅ５ｅ−Ｇｅ等のＴ６−５ｅ系合金といったＴｅ化
合物を使用して形成されている。The optical recording layer is made of organic materials such as anthraquinone, naphthokylene, triphenylmethane, carbocyanine, merocyanine, xanthine, azo, azine, thiazine, oxazine, phthalocyanine, naphthalocyanine, and squalium. Dye, Te, Te-5e, Te
-C, Te --C5t, Te-Tent, Te-
3b, Te-based alloy such as Te-Ge-Te-3e-3b
, Te5e-Ge, and other T6-5e alloys.
バッファー層３は書き込み時、記録層にレーザ光が照射
された際、加熱され昇温した記録材料が熔融あるいは昇
華し、レーザ光照射部の周辺に移動して孔、すなわちビ
ットを形成する力を妨げないものでＤＲＡＷ形式の光記
録材料に隣接するものとして、空間層すなわち空気また
は窒素といった気体あるいは真空状態のときとビット形
成状態が同様に得られるような材料であることが必要で
ある。During writing, when the recording layer is irradiated with a laser beam, the buffer layer 3 generates a force that causes the heated recording material to melt or sublimate and move to the periphery of the laser beam irradiation area to form holes, that is, bits. As an unobstructed material adjacent to the DRAW type optical recording material, it is necessary to use a material that provides a space layer, that is, a gas such as air or nitrogen, or a bit forming state similar to that in a vacuum state.
−ＦＧ的にこのバッファー層を構成する樹脂は、適当な
溶剤で樹脂を溶解し、光記録層上に塗布し、バッファー
層として形成するが、このように溶剤を用いた場合、溶
剤の種類によっては光記録層、さらには透明基板をも溶
解させてしまうといった悪影響を与えてしまうため、影
響を与えないような溶剤を選択する必要がある。しかし
ながら、このように限定された溶剤に溶解する樹脂は極
めて種類が少なく、適当な樹脂を選択ことが大変能しい
問題となっている。従って、このことがＤＲＡＷ形式に
より追加書込み可能な光カードを製作する上で障害とな
っていたが、これについて、光硬化型又は電子線硬化型
のシリコーン樹脂、すなわち無溶剤の硬化型樹脂を用い
ることにより、使用可能な光記録材料の範囲を広げるこ
とも可能である。- In terms of FG, the resin constituting the buffer layer is formed by dissolving the resin in a suitable solvent and coating it on the optical recording layer to form the buffer layer. Since this has an adverse effect of dissolving the optical recording layer and even the transparent substrate, it is necessary to select a solvent that does not have such an effect. However, there are extremely few types of resins that can be dissolved in these limited solvents, making it extremely difficult to select an appropriate resin. Therefore, this has been an obstacle in producing an optical card that can be additionally written in the DRAW format, but for this purpose, a photo-curable or electron beam-curable silicone resin, that is, a solvent-free curable resin, is used. By doing so, it is also possible to widen the range of usable optical recording materials.
裏打ち基板は、光記録層の保護とカードの機穢的特性を
保証する材料であり、ポリカーボネート樹脂、ポリカー
ボネートスチレン混合樹脂、アクリル樹脂、エポキシ樹
脂、オレフィン樹脂、他に塩化ビニル樹脂、ポリエチレ
ン樹脂等のプラスチック樹脂板が良く、これを接着剤に
より、積層密着し機械的強度に優れ、且つ薄型化を図っ
て光カードを製作することができる。The backing substrate is a material that protects the optical recording layer and guarantees the mechanical properties of the card, and is made of polycarbonate resin, polycarbonate styrene mixed resin, acrylic resin, epoxy resin, olefin resin, vinyl chloride resin, polyethylene resin, etc. Plastic resin plates are good, and by laminating them together with an adhesive, they have excellent mechanical strength and can be made thinner to produce optical cards.
バッファ層に使用されるシリコーン樹脂はその硬化反応
から、付加反応型と縮合反応型に分けられる付加反応は
次式（１）で示される。The curing reaction of the silicone resin used in the buffer layer can be divided into an addition reaction type and a condensation reaction type, and the addition reaction is shown by the following formula (1).
山 ３
Ｈｓ
ＯＨ３
ビニル基のような不飽和炭化水素基を持つポリオルガノ
シロキサンとケイ素原子に直接結合した水素原子を持つ
ポリオルガノシロキサンを白金化合物等の触媒により付
加反応することにより架橋硬化するというものである。Mountain 3 Hs OH3 Crosslinking and curing is achieved through an addition reaction between a polyorganosiloxane having an unsaturated hydrocarbon group such as a vinyl group and a polyorganosiloxane having a hydrogen atom directly bonded to a silicon atom using a catalyst such as a platinum compound. It is.
縮合反応型は、ケイ素原子に結合した水酸基を持つポリ
オルガノシロキサンと、加水分解可能な基（たとえば、
アルコキシ基、オキシム基、アセトキシ基など）を持つ
オルガノシランまたはポリシロキサンとの縮合反応によ
り架橋、硬化する。The condensation reaction type is a polyorganosiloxane with a hydroxyl group bonded to a silicon atom and a hydrolyzable group (e.g.
It is crosslinked and cured by a condensation reaction with organosilane or polysiloxane having alkoxy groups, oxime groups, acetoxy groups, etc.).
。Ｈｓ ／ ＼ Ｏ 〜Ｃ５ｉ−ＯＨ ＯＨ３ Ｈｓ というものである。. Hs ／＼ O ~C5i-OH OH3 Hs That is what it is.
付加反応型は架橋密度の分子構造をｉｔ！ Ｉ！ｆｌす
ることにより、軟かいゲル状に硬化するもの力＜１斗ら
れる。このような構造が、軟かいゲル状硬化物、あるい
はゴム状弾性体は、レーザ光の照射により、光記録層に
ピットを形成する際に、光８己録上面の変形を吸収する
作用がある。又、紫外線、電子線硬化タイプも、メチル
基とビニル基とを紫外線電子線の照射で生ずるラジカル
により反応させるというもので、
ＣＨ。For the addition reaction type, the molecular structure of the crosslink density is determined by it! I! By fl, the material hardens into a soft gel-like state. A soft gel-like cured material or rubber-like elastic material with such a structure has the effect of absorbing deformation of the upper surface of the optical recording layer when pits are formed in the optical recording layer by irradiation with laser light. . In addition, the ultraviolet and electron beam curing type reacts methyl groups and vinyl groups with radicals generated by irradiation with ultraviolet and electron beams.
ＣＩ。C.I.
〜ＯＳｔ −Ｃｕｔ ＣＨオ Ｃｕｔ ５
ｔ−ＣＨｓＣｌ（。~OSt -Cut CHO Cut 5
t-CHsCl(.
ゴム状の弾性体として得られる。Obtained as a rubber-like elastic body.
本発明ではこのバッファー層にシリコーン樹脂を用いる
ことにより記録の感度の低下がなく、しかも高コントラ
ストの記録が可能である。In the present invention, by using a silicone resin for this buffer layer, there is no decrease in recording sensitivity and high contrast recording is possible.
〈実施例〉 以下、実施例を第１図および第２図について説明する。<Example> Embodiments will be described below with reference to FIGS. 1 and 2.
〈実施例１〉
先ず、カード基板１を作製した。つまり、ガラス板（Ｂ
Ｋ−７）にフォトレジスト（ＡＺ−１３５０）をスピン
コータにて塗布する。その後でカッティングマシンにて
アルゴンレーザ光により露光現像しＩｇｏ、８μｍ、ト
ラックピッチ２．５μｍ、深さ０．０７μｍの案内溝を
形成した。次に、この原板にニッケルスタンバを形成し
た。その後、このスタンバに感光性樹脂を塗布して、０
．４鴫で１００ ｒｔｍ Ｘ ３０ ａｓサイズのポリ
カーボネイト基板をおしめで、紫外線を照射して硬化さ
せることによりこの基板に案内溝を形成してカード基板
１とした。次に、カード基板ｌの表面に、Ｔｅを３００
人の厚さに抵抗加熱法により蒸着し、光記録層を形成し
た。<Example 1> First, a card substrate 1 was produced. In other words, the glass plate (B
Photoresist (AZ-1350) is applied to K-7) using a spin coater. Thereafter, it was exposed and developed using an argon laser beam using a cutting machine to form guide grooves having an Igo layer of 8 μm, a track pitch of 2.5 μm, and a depth of 0.07 μm. Next, a nickel stamper was formed on this original plate. After that, apply photosensitive resin to this stanbar and
．． A card substrate 1 was obtained by forming a guide groove on a polycarbonate substrate of 100 rtm x 30 as size by irradiating it with ultraviolet rays and curing it. Next, 300% Te was applied to the surface of the card board l.
An optical recording layer was formed by vapor depositing to a thickness of 100 mm using a resistance heating method.
さらに、光記録Ｎ２の表面に紫外線硬化型シリコーン樹
脂であるＸ Ｅ １７−６１０ （東芝シリコーン■製
）をスクリーン印刷法にて塗布した後、４０ｍＪ ／１
の光を照射することにより硬化させ、バッファー層３を
形成した。Furthermore, after coating the surface of the optical recording N2 with X E 17-610 (manufactured by Toshiba Silicone), which is an ultraviolet curable silicone resin, by screen printing, 40 mJ/1
The buffer layer 3 was formed by curing by irradiating with light.
次いで、バッファー層３の上にエポキシ系接着剤４（チ
バガイギー社、アラルダイト）を介して透明基板５であ
る０、３国厚さで１００■×８０鴫サイズの硬質白色Ｐ
ｖＣとを接着、硬化後にカードサイズ８５．５鵬Ｘ５６
ａ＊に内抜き、光カードを製作した。Next, on the buffer layer 3, a transparent substrate 5 of hard white P with a thickness of 100 mm x 80 mm is attached via an epoxy adhesive 4 (Ciba Geigy, Araldite).
Glue with vC, and after curing, card size is 85.5 x 56
I cut out the inside of A* and produced an optical card.
この様にして製作した光カードを半導体レーザ（８ｍＷ
、１００ＫＨｚ）で記録したとコロ、良好な記録ができ
た。次いで、０．６Ｗの半導体レーザにて再生処理した
ところ良好な信号が得られた。これの記録感度は、光記
録層上に空間層を設けた場合の７０％であり、直接エポ
キシ接着剤を積層した時の５倍の感度を持ちバッファー
層の効果があることがわかる。The optical card produced in this way is powered by a semiconductor laser (8 mW).
, 100 KHz), good recording was possible. Next, a good signal was obtained when reproduction processing was performed using a 0.6 W semiconductor laser. The recording sensitivity of this is 70% of that when a space layer is provided on the optical recording layer, and it is 5 times as sensitive as when an epoxy adhesive is directly laminated, indicating that it has the effect of a buffer layer.
〈実施例２〉
先ず、カード基板１を作製した。つまり、ガラス板（Ｂ
Ｋ−７）にフォトレジスト（ＡＺ−１３５０）をスピン
コーターにて塗布する。その後でカッティングマシンに
てアルゴンレーザ光により露光現像し幅０．８μｍ、ト
ラックピッチ２．５μｍ、深さ０．０７μｍの案内溝を
形成した。次に、この原板にニッケルスタンバ法にて０
．０５〜０．１ｔＩｍの導電膜を形成した後ニッケル電
鋳法にて０．３Ｉｌｌｌ厚さのスタンバを形成した。そ
の後、このスタンバに感光性樹脂を塗布して、０゜４ｔ
ｍで１００ｍＸ８０ｓサイズのポリカーボネイト基板を
おしあて、紫外線を照射して硬化させることによりこの
基板に案内溝を形成してカード基板１とした０次に、カ
ード基＋Ｈ１の表面に、バナジルナフタロシアニンを抵
抗加熱蒸着法により７００人の厚さ形成し、光記録層と
した。<Example 2> First, a card substrate 1 was produced. In other words, the glass plate (B
Apply photoresist (AZ-1350) to K-7) using a spin coater. Thereafter, it was exposed and developed using an argon laser beam using a cutting machine to form a guide groove having a width of 0.8 μm, a track pitch of 2.5 μm, and a depth of 0.07 μm. Next, this original plate was coated with a nickel standby method.
．． After forming a conductive film with a thickness of 0.05 to 0.1 tIm, a stand bar with a thickness of 0.3Illl was formed by nickel electroforming. After that, a photosensitive resin was applied to this stand bar and 0°4t was applied.
A polycarbonate substrate with a size of 100 m x 80 s was placed on the substrate, and guide grooves were formed on this substrate by curing it by irradiation with ultraviolet rays to form a card substrate 1.Next, vanadyl naphthalocyanine was applied to the surface of the card base +H1. It was formed to a thickness of 700 mm using a resistance heating vapor deposition method to form an optical recording layer.
さらに、光記録層２の表面に電子線硬化型シリコーン樹
脂であるＸ Ｅ １’７−８０２ （東芝シリコーン■
製）をスクリーン印刷法にて塗布した後、１５Ｍｒａｄ
の電子線を照射することにより樹脂を硬化させ、２０μ
ｍ厚さのバッファー層３を形成した。Furthermore, the surface of the optical recording layer 2 is coated with X E 1'7-802 (Toshiba Silicone ■
15 Mrad) by screen printing method.
The resin is cured by irradiation with an electron beam of 20μ
A buffer layer 3 having a thickness of m was formed.
次いで、バラファー層３の上にエポキシ系接着剤４（チ
バガイギー社 アラルダイト）を介して透明基板５であ
る０、３ｍｍ厚さで１００ｍｍ×８０団サイズの硬質白
色ＰｖＣとを接着、硬化後にカードサイズ８５．５ｍｍ
Ｘ５６ｍｍに内抜き、光カードを製作した。Next, a hard white PvC transparent substrate 5 with a thickness of 0.3 mm and a size of 100 mm x 80 blocks is bonded onto the balafer layer 3 via an epoxy adhesive 4 (Araldite, Ciba Geigy), and after curing, the card size is 85. .5mm
I cut out the inner part to 56mm and made an optical card.
この様にして製作した光カードを半導体レーザ（８ｍＷ
１００ＫＨｚ）で記録したところ、良好な記録が得
られた。このときの記録密度は光記録層上に空間層を設
けた場合と変わりなくバッファー層があることにより感
度低下が防げ、また０゜６Ｗの半導体レーザにて記録再
生を行ったところ良好な再生信号が得られた。The optical card produced in this way is powered by a semiconductor laser (8 mW).
When recording was performed at a frequency of 100 KHz, good recording was obtained. The recording density at this time is the same as when a spatial layer is provided on the optical recording layer, and the presence of the buffer layer prevents a decrease in sensitivity, and when recording and reproducing using a 0°6W semiconductor laser, a good reproduced signal was obtained. was gotten.
〈発明の効果〉
以上、説明したように本発明によれば、シリコーン樹脂
でバッファー層を形成することにより、記録感度を低下
させることなく、カードの薄型化、曲げ強度に優れ、各
基板間が密着した構造の光カードが得られる。<Effects of the Invention> As explained above, according to the present invention, by forming a buffer layer with silicone resin, the card can be made thinner, has excellent bending strength, and the distance between each substrate is improved without reducing the recording sensitivity. An optical card with a close contact structure can be obtained.
また、紫外線反応硬化型樹脂や電子線反応硬化型樹脂と
いった無溶剤型のシリコーン樹脂でバッファー層を形成
することも可能であり、溶剤によるカード基板や光記録
層への悪影響を与えることもない。It is also possible to form the buffer layer with a solvent-free silicone resin such as an ultraviolet ray reaction curable resin or an electron beam reaction curable resin, and the solvent will not have an adverse effect on the card substrate or optical recording layer.
第１図は本発明の光カードを示す部分拡大断面図であり
、第２図は本発明の光カードの平面口である。
１・・・・・・透明基板 ２・・・・・・光記録層
３・・・・・・バッファー層 ４・・・・・・接着層５
・・・・・・カード基板
特 許 出 願 人
凸版印刷株式会社
代表者 鉛木和失FIG. 1 is a partially enlarged sectional view showing the optical card of the present invention, and FIG. 2 is a plan view of the optical card of the present invention. 1... Transparent substrate 2... Optical recording layer 3... Buffer layer 4... Adhesive layer 5
・・・・・・Card substrate patent application Hitotoppan Printing Co., Ltd. Representative Wazutsu Mizuki
Claims (2)
記録層とバッファー層を挟持してなる光カードであって
、該バッファー層がシリコーン樹脂からなることを特徴
とする光カード。(1) An optical card comprising an optical recording layer and a buffer layer sandwiched between two substrates, at least one of which is transparent, wherein the buffer layer is made of silicone resin.
型であることを特徴とする請求項１記載の光カード。(2) The optical card according to claim 1, wherein the silicone resin is of a photo-curable type or an electron beam-curable type.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63151589A JPH025243A (en) | 1988-06-20 | 1988-06-20 | Optical card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63151589A JPH025243A (en) | 1988-06-20 | 1988-06-20 | Optical card |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH025243A true JPH025243A (en) | 1990-01-10 |
Family
ID=15521820
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63151589A Pending JPH025243A (en) | 1988-06-20 | 1988-06-20 | Optical card |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH025243A (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62256242A (en) * | 1986-04-28 | 1987-11-07 | Toshiba Corp | Optical card |
| JPS62256247A (en) * | 1986-04-28 | 1987-11-07 | Toshiba Corp | Optical card and its production |
-
1988
- 1988-06-20 JP JP63151589A patent/JPH025243A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62256242A (en) * | 1986-04-28 | 1987-11-07 | Toshiba Corp | Optical card |
| JPS62256247A (en) * | 1986-04-28 | 1987-11-07 | Toshiba Corp | Optical card and its production |
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