JPH0247045U - - Google Patents

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図ないし第３図は本考案の一実施例を示す
ものであり、半導体ウエハ用移送ロボツトの側面
図、第２図は半導体ウエハ用移送ロボツトの平面
図、第３図は半導体ウエハ用移送ロボツトの正面
図、第４図、第５図は本実施例の半導体ウエハ用
移送ロボツトによつて半導体製造装置にウエハカ
セツトを装着する方法を説明するためのものであ
り、第４図ａはウエハカセツトを半導体ウエハ用
移送ロボツトから半導体製造装置上に装着すると
ころを示す説明図、第４図ｂ，ｃ，ｄは半導体製
造装置にウエハカセツトを装着した状態の平面図
、また第４図ｂ′は第４図ｂのＸ―Ｙ矢視図、第
４図ｃ′は第４図ｃのＸ―Ｙ矢視図、第４図ｄ′
は第４図ｄのＸ―Ｙ矢視図、第５図ａはウエハカ
セツトを半導体ウエハ用移送ロボツトから半導体
製造装置上に載置することを示す説明図、第５図
ｂ，ｃ，ｄは半導体製造装置にウエハカセツトを
装着した状態の平面図、第５図ｂ′は第５図ｂの
Ｘ―Ｙ矢視図、第５図ｃ′は第５図ｃのＸ―Ｙ矢
視図、第５図ｄ′は第５図ｄのＸ―Ｙ矢視図、第
６図、第７図ａ，ｂ，ｃは従来の半導体ウエハ用
移送ロボツトを示すものであり、第６図は半導体
ウエハ用移送ロボツトの斜視図、第７図ａ，ｂ，
ｃは半導体ウエハ用移送ロボツトの先端の斜視図
である。 Ｍ……半導体製造装置、Ｒ……半導体ウエハ用
移送ロボツト（移送ロボツト）、Ｃ……アーム部
、１０……ウエハカセツト、１０ａ……半導体ウ
エハ、１１……把持部、１２……水平アーム部、
１３……垂直アーム部、１４……水平旋回部、１
５……振り旋回部。 1 to 3 show an embodiment of the present invention, in which a side view of a semiconductor wafer transfer robot, FIG. 2 a plan view of the semiconductor wafer transfer robot, and FIG. 3 a semiconductor wafer transfer robot are shown. The front view of the robot, FIGS. 4 and 5, are for explaining the method of loading a wafer cassette into semiconductor manufacturing equipment using the semiconductor wafer transfer robot of this embodiment, and FIG. An explanatory view showing how a cassette is mounted on a semiconductor manufacturing equipment from a transfer robot for semiconductor wafers, FIGS. 4b, c, and d are plan views of the state in which a wafer cassette is mounted on a semiconductor manufacturing equipment, and FIG. 4b' is the X-Y arrow view of Figure 4 b, Figure 4 c' is the X-Y arrow view of Figure 4 c, Figure 4 d'
is an X-Y arrow view of FIG. 4d, FIG. 5a is an explanatory diagram showing loading the wafer cassette from the semiconductor wafer transfer robot onto the semiconductor manufacturing equipment, and FIGS. 5b, c, and d are A plan view of a state in which a wafer cassette is attached to a semiconductor manufacturing apparatus, FIG. 5 b' is a view taken along the X-Y arrow in FIG. 5 b, FIG. Figure 5 d' is an X-Y arrow view of Figure 5 d, Figures 6, 7 a, b, and c show conventional semiconductor wafer transfer robots; Perspective view of the transfer robot, Figures 7a, b,
3c is a perspective view of the tip of the semiconductor wafer transfer robot. M... Semiconductor manufacturing equipment, R... Semiconductor wafer transfer robot (transfer robot), C... Arm section, 10... Wafer cassette, 10a... Semiconductor wafer, 11... Gripping section, 12... Horizontal arm section ,
13...Vertical arm part, 14...Horizontal rotating part, 1
5...Swing turning section.

補正 昭６３．１２．９ 図面の簡単な説明を次のように補正する。 明細書第１２頁第１７行〜第１３頁第８行の「
第４図ｂ，ｃ，ｄは〜Ｘ−Ｙ矢視図」とあるのを
、次の文に補正する。 「第４図ｂは半導体製造装置ウエハカセツトを
装着した状態の平面図、第４図ｃは半導体製造装
置にウエハカセツトを装着した状態の平面図、第
４図ｄは半導体製造装置にウエハカセツトを装着
した状態の平面図、また第４図ｅは第４図ｂのＸ
−Ｙ矢視図、第４図ｆは第４図ｃのＸ−Ｙ矢視図
、第４図ｇは第４図ｄのＸ−Ｙ矢視図、第５図ａ
はウエハカセツトを半導体ウエハ用移送ロボツト
から半導体製造装置上に載置することを示す説明
図、第５図ｂは半導体製造装置にウエハカセツト
を装着した状態の平面図、第５図ｃは半導体製造
装置にウエハカセツトを装着した状態の平面図、
第５図ｄは半導体製造装置にウエハカセツトを装
着した状態の平面図、第５図ｅは第５図ｂのＸ−
Ｙ矢視図、第５図ｆは第５図ｃのＸ−Ｙ矢視図、
第５図ｇは第５図ｄのＸ−Ｙ矢視図。」Amendment December 9, 1983 The brief description of the drawing is amended as follows. “In the specification, page 12, line 17 to page 13, line 8,
The phrase "Figure 4 b, c, and d are ~X-Y arrow views" has been corrected to the following sentence. "Figure 4b is a plan view of the semiconductor manufacturing equipment with a wafer cassette installed, Figure 4c is a plan view of the semiconductor manufacturing equipment with the wafer cassette installed, and Figure 4d is a plan view of the semiconductor manufacturing equipment with the wafer cassette installed. A plan view of the installed state, and Figure 4e is the same as X in Figure 4b.
-Y arrow view, Figure 4 f is an X-Y arrow view of Figure 4 c, Figure 4 g is an X-Y arrow view of Figure 4 d, Figure 5 a
5 is an explanatory diagram showing how the wafer cassette is placed on the semiconductor manufacturing equipment from the semiconductor wafer transfer robot, FIG. 5b is a plan view of the wafer cassette mounted on the semiconductor manufacturing equipment, and FIG. A plan view of the device with a wafer cassette attached,
FIG. 5d is a plan view of the semiconductor manufacturing equipment with a wafer cassette attached, and FIG.
Y arrow view, Figure 5 f is an X-Y arrow view of Figure 5 c,
FIG. 5g is an X-Y arrow view of FIG. 5d. ”

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] クリーンルーム内に設置された半導体製造装置
に沿つて設けられた軌道に案内されて移動するこ
とにより、半導体製造装置に半導体ウエハの着脱
を自動的に行う半導体ウエハ用移動ロボツトであ
つて、ウエハカセツトをつかむ把持部と、該把持
部を水平方向に伸縮自在とする水平アーム部と、
この水平アーム部を水平方向に回動自在にかつ上
下動可能に保持する垂直アーム部とを具備してお
り、上記水平アーム部と把持部との間には、把持
部を水平方向に回動させる水平旋回部と、該水平
旋回部に取り付けられて把持部を垂直方向に回動
させる振り旋回部を取り付けたことを特徴とする
半導体ウエハ用移送ロボツト。 A mobile robot for semiconductor wafers that automatically attaches and detaches semiconductor wafers to and from semiconductor manufacturing equipment by moving while being guided by a track provided along the semiconductor manufacturing equipment installed in a clean room, and which handles wafer cassettes. a gripping part for grasping, a horizontal arm part that makes the gripping part expandable and retractable in the horizontal direction;
The horizontal arm part is provided with a vertical arm part that holds the horizontal arm part so as to be rotatable in the horizontal direction and movable up and down. 1. A transfer robot for semiconductor wafers, comprising: a horizontal rotating section for vertically rotating a gripping section; and a swinging section attached to the horizontal rotating section for vertically rotating a gripping section.