JPH0245680U - - Google Patents
Info
- Publication number
- JPH0245680U JPH0245680U JP12456788U JP12456788U JPH0245680U JP H0245680 U JPH0245680 U JP H0245680U JP 12456788 U JP12456788 U JP 12456788U JP 12456788 U JP12456788 U JP 12456788U JP H0245680 U JPH0245680 U JP H0245680U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- electronic components
- thermoplastic sheet
- electronic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920001169 thermoplastic Polymers 0.000 claims description 3
- 239000004416 thermosoftening plastic Substances 0.000 claims description 3
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Description
図は本考案の一実施例の断面図である。
1……プリント回路基板、2……電子部品、3
……ハーネス、4……熱可塑性シート。
……ハーネス、4……熱可塑性シート。
Claims (1)
- 電子部品を実装したプリント回路基板の表面に
熱可塑性シートを密着状態に被着し、この熱可塑
性シートで前記電子部品を被覆してプリント回路
基板に固定支持させることを特徴とする電子回路
装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12456788U JPH0245680U (ja) | 1988-09-22 | 1988-09-22 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12456788U JPH0245680U (ja) | 1988-09-22 | 1988-09-22 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0245680U true JPH0245680U (ja) | 1990-03-29 |
Family
ID=31374414
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12456788U Pending JPH0245680U (ja) | 1988-09-22 | 1988-09-22 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0245680U (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015228421A (ja) * | 2014-05-31 | 2015-12-17 | 布施真空株式会社 | 保護処理を施した回路基板、及び回路基板の保護処理方法 |
-
1988
- 1988-09-22 JP JP12456788U patent/JPH0245680U/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015228421A (ja) * | 2014-05-31 | 2015-12-17 | 布施真空株式会社 | 保護処理を施した回路基板、及び回路基板の保護処理方法 |