JPH0245432U - - Google Patents
Info
- Publication number
- JPH0245432U JPH0245432U JP12438288U JP12438288U JPH0245432U JP H0245432 U JPH0245432 U JP H0245432U JP 12438288 U JP12438288 U JP 12438288U JP 12438288 U JP12438288 U JP 12438288U JP H0245432 U JPH0245432 U JP H0245432U
- Authority
- JP
- Japan
- Prior art keywords
- hybrid
- groove
- sensor module
- engaged
- rear part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000003287 optical effect Effects 0.000 claims description 6
- 239000011347 resin Substances 0.000 claims 2
- 229920005989 resin Polymers 0.000 claims 2
Landscapes
- Photometry And Measurement Of Optical Pulse Characteristics (AREA)
Description
第１図はこの考案の光センサモジユールの一例
を示す縦断側面図、第２図は同上のケースにハイ
ブリツトＩＣを組み込む状態を示す縦断側面図、
第３図は従来の光センサモジユールの分解斜視図
、第４図は同上の組立状態の縦断側面図、第５図
は同上を組立てたものの縦断側面図である。
１１…ケース、１２…溝、１３…ハイブリツト
ＩＣ、１５…赤外線センサ、１７…窓、１８…光
学系レンズ。
FIG. 1 is a vertical side view showing an example of the optical sensor module of this invention, and FIG. 2 is a vertical side view showing a hybrid IC installed in the same case.
FIG. 3 is an exploded perspective view of a conventional optical sensor module, FIG. 4 is a longitudinal sectional side view of the same as the above in an assembled state, and FIG. 5 is a longitudinal sectional side view of the same as the above assembled. DESCRIPTION OF SYMBOLS 11...Case, 12...Groove, 13...Hybrid IC, 15...Infrared sensor, 17...Window, 18...Optical system lens.
Claims (1)
の後部に赤外線センサを取り付けたハイブリツト
ＩＣを固定し、該赤外線センサを該窓に臨ませた
光センサモジユールにおいて、該樹脂ケース後部
内側にハイブリツトＩＣの両端縁を係合させる溝
を設け、該ハイブリツトＩＣの両端縁を該溝に係
合させて固定したことを特徴とする光センサモジ
ユール。 In the optical sensor module, a hybrid IC with an infrared sensor is fixed to the rear part of a resin case having a window with an optical system lens, and the hybrid IC is mounted inside the rear part of the resin case. 1. An optical sensor module characterized in that a groove is provided in which both ends of the hybrid IC are engaged, and both ends of the hybrid IC are engaged with and fixed in the groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12438288U JPH0245432U (en) | 1988-09-22 | 1988-09-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12438288U JPH0245432U (en) | 1988-09-22 | 1988-09-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0245432U true JPH0245432U (en) | 1990-03-28 |
Family
ID=31374063
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12438288U Pending JPH0245432U (en) | 1988-09-22 | 1988-09-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0245432U (en) |
-
1988
- 1988-09-22 JP JP12438288U patent/JPH0245432U/ja active Pending