JPH0243718A - Exterior coating process of capacitor - Google Patents
Exterior coating process of capacitorInfo
- Publication number
- JPH0243718A JPH0243718A JP63194994A JP19499488A JPH0243718A JP H0243718 A JPH0243718 A JP H0243718A JP 63194994 A JP63194994 A JP 63194994A JP 19499488 A JP19499488 A JP 19499488A JP H0243718 A JPH0243718 A JP H0243718A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- film
- film capacitor
- capacitor element
- cut surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003990 capacitor Substances 0.000 title claims abstract description 58
- 238000000576 coating method Methods 0.000 title claims abstract 3
- 239000011347 resin Substances 0.000 claims abstract description 41
- 229920005989 resin Polymers 0.000 claims abstract description 41
- 238000000034 method Methods 0.000 claims abstract description 22
- 239000011248 coating agent Substances 0.000 claims abstract 2
- 238000004806 packaging method and process Methods 0.000 claims description 12
- 239000007788 liquid Substances 0.000 claims description 10
- 239000000463 material Substances 0.000 claims description 5
- 238000003848 UV Light-Curing Methods 0.000 abstract 5
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 abstract 1
- 238000001721 transfer moulding Methods 0.000 description 5
- 238000007796 conventional method Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000003985 ceramic capacitor Substances 0.000 description 3
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000005022 packaging material Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明はコンデンサ、特に積層形コンデンサの外装方法
に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a method of packaging capacitors, particularly multilayer capacitors.
従来の技術
近年、電子機器や電気機器の小形化、薄型化および高密
度化に伴って、電子部品のチップ化および面実装化が進
められている。BACKGROUND OF THE INVENTION In recent years, as electronic devices and electrical devices have become smaller, thinner, and more densely packed, electronic components have been increasingly made into chips and surface-mounted.
チップ型のコンデンサとしては、これまでセラミックコ
ンデンサや固体電解コンデンサが広＜使用されている。Ceramic capacitors and solid electrolytic capacitors have been widely used as chip capacitors.
一方、フィルムコンデンサにおいても、ポリフェニレン
サルファイドフィルムを誘電体に用いた、耐熱性のよい
チップ状の積層形フィルムコンデンサが開発され、はん
だ付は時の温度にも十分に耐え得るようになった。そし
て、セラミックコンデンサや電解コンデンサに比べて電
気特性と信頼性とが優れていることもあって、チップ状
フィルムコンデンサも急速に普及して来ている。On the other hand, in the field of film capacitors, a chip-shaped multilayer film capacitor with good heat resistance has been developed that uses polyphenylene sulfide film as a dielectric, and it has become possible to withstand soldering temperatures well. Chip-shaped film capacitors are also rapidly becoming popular, partly because they have superior electrical characteristics and reliability compared to ceramic capacitors and electrolytic capacitors.
第４図は従来のトランスファー成形によるチップフィル
ムコンデンサの外装方法を説明するための工程斜視図で
ある。FIG. 4 is a process perspective view for explaining a conventional method for packaging a chip film capacitor by transfer molding.
この方法では、図に示すように、コムリード４１にチッ
プフィルムコンデンサ素子４２の外部電極４３．４４を
溶接して多連状にした後、モールド上金型４５と下金型
４６の素子収納部４７（図では上金型４５側の素子収納
部は示されていない）にチップフィルムコンデンサ素子
４２をそれぞれ配置し、両金型４５．４６を合わせる。In this method, as shown in the figure, after welding the external electrodes 43 and 44 of the chip film capacitor element 42 to the comb lead 41 to form a multi-connected structure, The chip film capacitor elements 42 are respectively arranged in 47 (the element housing portion on the upper mold 45 side is not shown in the figure), and both molds 45 and 46 are brought together.
次に、ホッパー４８に入れである粉体エポキシ樹脂４９
をボッド５０に移し、それを溶融させた後、プランジャ
ー５１で６０〜９０ｋｇ／ｃｄの圧力を加えてエボキン
樹脂４９を素子収納部４７に充填し硬化させる。Next, the powdered epoxy resin 49 is placed in the hopper 48.
is transferred to the bod 50 and melted, and then a pressure of 60 to 90 kg/cd is applied with the plunger 51 to fill the Evokin resin 49 into the element housing portion 47 and harden it.
このようにして外装されたチップフィルムコンデンサ５
２が得られる。Chip film capacitor 5 packaged in this way
2 is obtained.
樹脂は、ボッド５０および両金型４５，４６を１５０〜
１８０℃程度に加温することで、溶融硬化させる。The resin used for the body 50 and both molds 45 and 46 was 150~
It is melted and hardened by heating to about 180°C.
第５図は上述のようにして作製されたチップフィルムコ
ンデンサ５２の一部破断斜視図である。FIG. 5 is a partially cutaway perspective view of a chip film capacitor 52 manufactured as described above.
チップフィルムコンデンサ素子４２はコムリードの４１
による電極５３（他方の電極４３に接続されている電極
は図示されていない）を有し、エボキン樹脂による外装
体５４で覆われている。The chip film capacitor element 42 is Comlead's 41
(the electrode connected to the other electrode 43 is not shown), and is covered with an exterior body 54 made of Evokin resin.
このトランスファー成形で得られる製品の特徴は、外形
寸法の精度がよく、そのばらつきの小さいことである。The characteristics of the products obtained by this transfer molding are that the external dimensions have high precision and small variations.
これは金型の素子収納部寸法で製品の外形寸法が決定さ
れることによる。This is because the external dimensions of the product are determined by the dimensions of the element housing portion of the mold.
発明が解決しようとする課題
しかしながら、この従来の方法によれば、第５図に示す
外装体５４の厚み（２か０．３〜０．５＋ｎｎ＋と厚く
、しかもその六面すへてか外装体５４により覆われてい
ることから、製品寸法に占める外装体５４の厚みの割合
が大きくなり、小形化を妨げる要因となっている。Problems to be Solved by the Invention However, according to this conventional method, the thickness of the exterior body 54 shown in FIG. 54, the ratio of the thickness of the exterior body 54 to the product dimensions becomes large, which is a factor that hinders miniaturization.
また、製造コスト的にも、その製造設備が高価であり、
電力料金をはじめとするランニングコストも割高になっ
ている。In addition, in terms of manufacturing costs, the manufacturing equipment is expensive,
Running costs, including electricity rates, are also becoming more expensive.
このように、トランスファー成形により外装体を形成す
るという方法では、チップフィルムコンデンサの小形化
が非常に困難で、セラミックコンデンサなどの他のコン
デンサに比べて形状が大きくなり、また、その製造コス
トが高いので、他のコンデンサよりも単価が高くならざ
るを得ないのが実情である。In this way, it is extremely difficult to miniaturize chip film capacitors using the method of forming the outer body through transfer molding, which results in a larger shape than other capacitors such as ceramic capacitors, and the manufacturing cost is high. Therefore, the reality is that the unit price has to be higher than other capacitors.
本発明は、チップフィルムコンデンサを従来品より小形
化し、かつ安価に製造することができる方法を提供しよ
うとするものである。The present invention aims to provide a method that allows chip film capacitors to be made smaller than conventional products and manufactured at low cost.
課題を解決するための手段
本発明のコンデンサの第１の外装方法は、積層形フィル
ムコンデンサ素子を、支持体上に塗布されている紫外線
硬化樹脂にその切断面を接触させて配置し、紫外線硬化
樹脂を硬化させてから、この硬化した紫外線硬化樹脂膜
を支持体から剥離させて、切断面に紫外線硬化樹脂外装
体を有する積層形フィルムコンデンサ素子を形成する方
法である。Means for Solving the Problems A first method for packaging a capacitor according to the present invention is to place a laminated film capacitor element with its cut surface in contact with an ultraviolet curing resin coated on a support, and to apply an ultraviolet curing resin. This method involves curing the resin and then peeling off the cured ultraviolet curable resin film from the support to form a multilayer film capacitor element having an ultraviolet curable resin exterior body on the cut surface.
本発明の第２の外装方法は、液状外装材料を所定の厚み
に付着させたローラーを、積層形フィルムコンデ〉・す
素子の切断面に接触させて、その切断面に転写し、さら
に、この積層形フィルムコンデンサ素子の切断面上に付
着した液状樹脂材料を硬化させて、外装体とする方法で
ある。In the second packaging method of the present invention, a roller having a predetermined thickness of liquid packaging material is brought into contact with a cut surface of a laminated film container element to transfer the liquid packaging material onto the cut surface. This is a method in which a liquid resin material adhered to the cut surface of a laminated film capacitor element is cured to form an exterior body.
作用
本発明の外装方法においては、積層フィルムコンデンサ
素子の切断面上の外装体が転写されることによって形成
される。したがって、その外装体の厚みは０．００１〜
０．１５ｍｍと非常に薄く形成することが可能となり、
製品外形寸法がほぼ素子寸法と同じくなる。Function: In the packaging method of the present invention, the packaging is formed by transferring the packaging on the cut surface of the multilayer film capacitor element. Therefore, the thickness of the exterior body is 0.001~
It is now possible to form an extremely thin layer of 0.15 mm.
The product external dimensions are almost the same as the element dimensions.
実施例
以下、本発明の方法の実施例について、図面を参照しな
がら説明する。EXAMPLES Hereinafter, examples of the method of the present invention will be described with reference to the drawings.
〔実施例１〕
第１図はチップフィルムコンデンサ素子の切断面に紫外
線硬化樹脂を用いて外装する工程の一例を示す斜視図で
ある。[Example 1] FIG. 1 is a perspective view showing an example of a step of packaging a cut surface of a chip film capacitor element with an ultraviolet curing resin.
支持体として連続した紫外線透過性のフィルムシート１
を使用し、その上にゴムローラーなどを用いて紫外線硬
化樹脂を所定の厚さに塗付して、紫外線硬化樹脂膜２を
形成する。それからフィルムシート１上にフィルムコン
デンサ素子３をその一方の切断面４が紫外線硬化樹脂膜
２と接触するように取り付け、フィルムシート１の素子
３取付面側とは反対側から紫外線ランプ５により紫外線
を照射して、紫外線硬化樹脂膜２を硬化させる。Continuous UV-transparent film sheet 1 as support
The ultraviolet curable resin film 2 is formed by applying ultraviolet curable resin to a predetermined thickness using a rubber roller or the like. Then, the film capacitor element 3 is mounted on the film sheet 1 so that one of its cut surfaces 4 is in contact with the ultraviolet curing resin film 2, and ultraviolet rays are applied to the film sheet 1 from the side opposite to the side on which the element 3 is attached using an ultraviolet lamp 5. The ultraviolet curing resin film 2 is cured by irradiation.
そして、フィルムシート１と紫外線硬化樹脂膜２との界
面で剥離させて、フィルムコンデンサ素子３をフィルム
シート１から取り外す。これにより、フィルムコンデン
サ素子３の一方の切断面４に紫外線硬化樹脂からなる外
装体６が形成される。そして、他方の切断面７について
も、同様にして外装体を付与する。Then, the film capacitor element 3 is removed from the film sheet 1 by peeling it off at the interface between the film sheet 1 and the ultraviolet curing resin film 2. As a result, an exterior body 6 made of ultraviolet curing resin is formed on one cut surface 4 of the film capacitor element 3. Then, the other cut surface 7 is also provided with an exterior body in the same manner.
なお、フィルムシート１としては、紫外線を１％以上透
過するものであればよく、また、その形状も長尺であっ
てもよい。Note that the film sheet 1 may be one that transmits 1% or more of ultraviolet rays, and may have a long shape.
さらに、フィルムシートに代えて紫外線透過性の薄い板
状体を使用してもよい。Furthermore, a thin plate-shaped body that is transparent to ultraviolet rays may be used in place of the film sheet.
〔実施例２〕
第２図はチップフィルムコンデンサ素子の切断面にエポ
キン樹脂からなる外装体を形成する工程の一例を示す斜
視図である。[Example 2] FIG. 2 is a perspective view showing an example of the process of forming an exterior body made of Epoquine resin on a cut surface of a chip film capacitor element.
ゴムローラー８に、外装部材となる液状エポキン樹脂９
を所定の厚みまで伸ばして付着させ、それをフィルムコ
ンデンサ素子３の一方の切断面に接触させる。これによ
り、フィルムコンデンサ素子３の切断面４に液状エボキ
ン樹脂９が転写され、液状エポキン樹脂層１０が形成さ
れる。そして、他方の切断面７についても、同様にして
液状エボキン樹脂９を転写して、樹脂層を形成する。そ
れから、フィルムコンデンサ素子３の切断面４．７に転
写された液状エポキシ樹脂を硬化させることで、フィル
ムコンデンサ素子３の切断面４，７上にエポキン樹脂か
らなる外装体が形成される。A liquid Epoquine resin 9 is applied to the rubber roller 8 as an exterior member.
is stretched and adhered to a predetermined thickness, and brought into contact with one cut surface of the film capacitor element 3. As a result, the liquid Epoquin resin 9 is transferred to the cut surface 4 of the film capacitor element 3, and a liquid Epoquin resin layer 10 is formed. Then, the liquid Evokin resin 9 is similarly transferred to the other cut surface 7 to form a resin layer. Then, by curing the liquid epoxy resin transferred to the cut surfaces 4 , 7 of the film capacitor element 3 , an exterior body made of epoxy resin is formed on the cut surfaces 4 , 7 of the film capacitor element 3 .
第３図に上述の実施例１．２によるチップフィルムコン
デンサ３１の構造を示す。FIG. 3 shows the structure of the chip film capacitor 31 according to the above-described embodiment 1.2.
このフィルムコンデンサ１１はフィルムコンデンサ素子
３の切断面４．７にそれぞれ薄い外装体６．１２が付与
されている。なお、１３．１４はフィルムコンデンサ１
１の外部電極である。In this film capacitor 11, a thin outer body 6.12 is applied to each cut surface 4.7 of the film capacitor element 3. In addition, 13.14 is film capacitor 1
1 external electrode.
上記外装体６．１２の厚み【１はＯ，００１ｍｍ〜０．
１５ｍｍとすることができ、その形状は従来のトランス
ファー成形で得られる製品に比べると、容積比で２０％
〜６０％と大幅に小形化される。これは、将来、フィル
ムコンデンサ素子がより一層小形化される場合には、本
発明の方法は非常に有効である。The thickness of the exterior body 6.12 [1 is 0.001 mm to 0.001 mm].
15mm, and its shape is 20% smaller in volume compared to products obtained by conventional transfer molding.
The size is significantly reduced by ~60%. This means that the method of the present invention will be very effective if film capacitor elements are to be further miniaturized in the future.
そして、実施のための設備は、トンランスファー成形装
置に比べて非常に簡単で、かつ小形でよく、さらに外装
体形成に要する材料も少なくて済むため、ランニングコ
ストが低減され、安価なチップフィルムコンデンサを得
ることができる。The equipment for carrying out the process is much simpler and smaller than a ton transfer molding machine, and less material is required to form the exterior body, so running costs are reduced and inexpensive chip film can be used. Capacitors can be obtained.
発明の効果
本発明の方法によれば、フィルムコンデンサを大幅に小
形化ができ、しかもそれを実施するための設備がトラン
スファー法による場合に比べて非常に簡単でよ＜、シか
も生産ランニングコストが安価で、量産性も向上させる
ことができる。Effects of the Invention According to the method of the present invention, film capacitors can be significantly downsized, and the equipment for carrying out the process is much simpler than in the case of the transfer method, and production running costs are also reduced. It is inexpensive and can improve mass productivity.
第１図および第２図はそれぞれ本発明にかかるフィルム
コンデンサの外装方法の実施例の要部工程を示す斜視図
、第３図はこれらの実施例で得られるフィルムコンデン
サの一部破断斜視図である。
第４図は従来のフィルムコンデンサの外装方法を示す工
程斜視図、第５図はこの従来の方法で得られたフィルム
コンデンサの一部破断斜視図である。
１・・・・・・フィルムシート、２・・・・・・紫外線
硬化樹脂、３・・・・・・フィルムコンデンサ素子、４
，７・・・・・・切断面、５・・・・・・紫外線ランプ
、６・・・・・・外装体、８・・・・・・ゴムローラー
９・・・・・・液状エポキシ樹脂、１０・・・・・液
状エポキシ樹脂層、１１・・・・・・フィルムコンデン
サ、１２・・・・・・外装体、１３．１４・・・・・・
外部電極。
代理人の氏名 弁理士 粟野重孝 はか１名第
図
第
図
７−−−７４）Ｌ／ムシート
６−一一外裟体
第
図
斜
必FIGS. 1 and 2 are perspective views showing the main steps of an example of the method for packaging a film capacitor according to the present invention, and FIG. 3 is a partially cutaway perspective view of a film capacitor obtained by these examples. be. FIG. 4 is a process perspective view showing a conventional method for packaging a film capacitor, and FIG. 5 is a partially cutaway perspective view of a film capacitor obtained by this conventional method. 1... Film sheet, 2... Ultraviolet curing resin, 3... Film capacitor element, 4
, 7...Cut surface, 5...Ultraviolet lamp, 6...Exterior body, 8...Rubber roller 9...Liquid epoxy resin , 10...Liquid epoxy resin layer, 11...Film capacitor, 12...Exterior body, 13.14...
external electrode. Name of agent: Patent attorney Shigetaka Awano (1 person)
Claims (2)
する工程と、積層形フィルムコンデンサ素子を、前記紫
外線硬化樹脂の塗布膜上に、その切断面を接触させて配
置する工程と、前記紫外線硬化樹脂を紫外線照射により
硬化させてから、前記紫外線硬化樹脂を前記支持体との
界面で剥離させて、前記切断面に紫外線硬化樹脂外装体
を有する積層形フィルムコンデンサ素子を形成する工程
とを有することを特徴とするコンデンサの外装方法。(1) a step of applying an ultraviolet curable resin as an exterior member onto a support; a step of arranging a laminated film capacitor element on the coating film of the ultraviolet curable resin with its cut surface in contact; curing the ultraviolet curable resin by ultraviolet irradiation, and then peeling off the ultraviolet curable resin at the interface with the support to form a multilayer film capacitor element having an ultraviolet curable resin exterior body on the cut surface; A method for packaging a capacitor, comprising:
を、積層形フィルムコンデンサ素子の切断面に接触させ
て、前記積層形フィルムコンデンサ素子の前記切断面に
前記液状樹脂材料を転写する工程と、前記積層形フィル
ムコンデンサ素子の前記切断面上に付着した前記液状樹
脂材料を硬化させて、外装体とする工程とを有すること
を特徴とするコンデンサの外装方法。(2) Transferring the liquid resin material to the cut surface of the multilayer film capacitor element by bringing a roller to which the liquid exterior material is adhered to a predetermined thickness into contact with the cut surface of the multilayer film capacitor element; A method for packaging a capacitor, comprising the steps of: curing the liquid resin material adhering to the cut surface of the laminated film capacitor element to form an exterior body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63194994A JPH0243718A (en) | 1988-08-04 | 1988-08-04 | Exterior coating process of capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63194994A JPH0243718A (en) | 1988-08-04 | 1988-08-04 | Exterior coating process of capacitor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0243718A true JPH0243718A (en) | 1990-02-14 |
| JPH0563096B2 JPH0563096B2 (en) | 1993-09-09 |
Family
ID=16333767
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63194994A Granted JPH0243718A (en) | 1988-08-04 | 1988-08-04 | Exterior coating process of capacitor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0243718A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03241802A (en) * | 1990-02-20 | 1991-10-29 | Matsushita Electric Ind Co Ltd | Chip type electronic parts |
| FR2683087A1 (en) * | 1991-10-29 | 1993-04-30 | Europ Composants Electron | Method of producing a capacitor with non-encapsulated layers |
| US5331504A (en) * | 1991-12-27 | 1994-07-19 | Matsushita Electric Industrial Co., Ltd. | Film capacitor and method for manufacturing the same |
| JP2015188111A (en) * | 2015-06-25 | 2015-10-29 | Tdk株式会社 | Electronic part |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52124164A (en) * | 1976-04-12 | 1977-10-18 | Matsushita Electric Ind Co Ltd | Method of manufacturing electronic parts |
| JPS6171638A (en) * | 1984-09-17 | 1986-04-12 | Fujitsu Ltd | Packaging method for electronic component |
| JPS63181409A (en) * | 1987-01-23 | 1988-07-26 | 松下電器産業株式会社 | Laminated film chip capacitor |
-
1988
- 1988-08-04 JP JP63194994A patent/JPH0243718A/en active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52124164A (en) * | 1976-04-12 | 1977-10-18 | Matsushita Electric Ind Co Ltd | Method of manufacturing electronic parts |
| JPS6171638A (en) * | 1984-09-17 | 1986-04-12 | Fujitsu Ltd | Packaging method for electronic component |
| JPS63181409A (en) * | 1987-01-23 | 1988-07-26 | 松下電器産業株式会社 | Laminated film chip capacitor |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03241802A (en) * | 1990-02-20 | 1991-10-29 | Matsushita Electric Ind Co Ltd | Chip type electronic parts |
| FR2683087A1 (en) * | 1991-10-29 | 1993-04-30 | Europ Composants Electron | Method of producing a capacitor with non-encapsulated layers |
| US5331504A (en) * | 1991-12-27 | 1994-07-19 | Matsushita Electric Industrial Co., Ltd. | Film capacitor and method for manufacturing the same |
| JP2015188111A (en) * | 2015-06-25 | 2015-10-29 | Tdk株式会社 | Electronic part |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0563096B2 (en) | 1993-09-09 |
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