JPH0243344U - - Google Patents

Info

Publication number
JPH0243344U
JPH0243344U JP12236288U JP12236288U JPH0243344U JP H0243344 U JPH0243344 U JP H0243344U JP 12236288 U JP12236288 U JP 12236288U JP 12236288 U JP12236288 U JP 12236288U JP H0243344 U JPH0243344 U JP H0243344U
Authority
JP
Japan
Prior art keywords
bonded
wooden
flooring material
parts
wooden flooring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12236288U
Other languages
Japanese (ja)
Other versions
JPH074266Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988122362U priority Critical patent/JPH074266Y2/en
Publication of JPH0243344U publication Critical patent/JPH0243344U/ja
Application granted granted Critical
Publication of JPH074266Y2 publication Critical patent/JPH074266Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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  • Floor Finish (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図および第2図はこの考案の実施例1を示
すもので、第1図は横断面拡大図、第2図は木質
板と緩衝部材との接合部分における接着部と非接
着部の状態を示す木質板の底面図、第3図は木質
床材と床下地との接着部分を示す木質床材の底面
図、第4図ないし第6図は実施例2ないし実施例
4を示す第2図相当の底面図、第7図は実施例5
を示す横断面拡大図、第8図は実施例6を示す第
2図相当の底面図である。 1,20…木質板、2,14…緩衝部材、3,
4,8,10,12,16…接着部、5,9,1
1,13,17…非接着部、F…木質床材。
Figures 1 and 2 show Embodiment 1 of this invention, with Figure 1 being an enlarged cross-sectional view, and Figure 2 being the state of the bonded and non-bonded areas at the joint between the wooden board and the buffer member. FIG. 3 is a bottom view of the wooden flooring showing the bonded area between the wooden flooring and the subfloor, and FIGS. Fig. 7 is a bottom view corresponding to the figure, and Fig. 7 is Example 5.
FIG. 8 is a bottom view corresponding to FIG. 2 showing the sixth embodiment. 1,20...Wood board, 2,14...Buffer member, 3,
4, 8, 10, 12, 16...Adhesive part, 5, 9, 1
1, 13, 17...non-bonded part, F...wood flooring material.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 木質板1,20の下面に緩衝部材2,14が接
合せられている木質床材において、接着部8,1
0,12,16と非接着部5,9,11,13,
17との両方が存在する状態に接合されているこ
とを特徴とする木質床材。
In the wooden flooring material in which the cushioning members 2, 14 are bonded to the lower surfaces of the wooden boards 1, 20, the adhesive parts 8, 1
0, 12, 16 and non-bonded parts 5, 9, 11, 13,
17. A wooden flooring material characterized by being joined in such a way that both 17 and 17 are present.
JP1988122362U 1988-09-19 1988-09-19 Wood flooring Expired - Lifetime JPH074266Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988122362U JPH074266Y2 (en) 1988-09-19 1988-09-19 Wood flooring

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988122362U JPH074266Y2 (en) 1988-09-19 1988-09-19 Wood flooring

Publications (2)

Publication Number Publication Date
JPH0243344U true JPH0243344U (en) 1990-03-26
JPH074266Y2 JPH074266Y2 (en) 1995-02-01

Family

ID=31370221

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988122362U Expired - Lifetime JPH074266Y2 (en) 1988-09-19 1988-09-19 Wood flooring

Country Status (1)

Country Link
JP (1) JPH074266Y2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007092295A (en) * 2005-09-27 2007-04-12 Eidai Co Ltd Flooring with damping material and its manufacturing method
JP2016113766A (en) * 2014-12-12 2016-06-23 パナソニックIpマネジメント株式会社 Floor material

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3428382B2 (en) * 1997-07-24 2003-07-22 松下電工株式会社 Floor panel construction method

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62173439U (en) * 1986-04-23 1987-11-04
JPS6355258A (en) * 1986-08-26 1988-03-09 松下電工株式会社 Floor material
JPH0194529U (en) * 1987-12-15 1989-06-22

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62173439U (en) * 1986-04-23 1987-11-04
JPS6355258A (en) * 1986-08-26 1988-03-09 松下電工株式会社 Floor material
JPH0194529U (en) * 1987-12-15 1989-06-22

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007092295A (en) * 2005-09-27 2007-04-12 Eidai Co Ltd Flooring with damping material and its manufacturing method
JP4668024B2 (en) * 2005-09-27 2011-04-13 永大産業株式会社 Method of manufacturing flooring with cushioning material
JP2016113766A (en) * 2014-12-12 2016-06-23 パナソニックIpマネジメント株式会社 Floor material

Also Published As

Publication number Publication date
JPH074266Y2 (en) 1995-02-01

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