JPH0236273Y2 - - Google Patents
Info
- Publication number
- JPH0236273Y2 JPH0236273Y2 JP7046884U JP7046884U JPH0236273Y2 JP H0236273 Y2 JPH0236273 Y2 JP H0236273Y2 JP 7046884 U JP7046884 U JP 7046884U JP 7046884 U JP7046884 U JP 7046884U JP H0236273 Y2 JPH0236273 Y2 JP H0236273Y2
- Authority
- JP
- Japan
- Prior art keywords
- seat
- board
- rotor plate
- center
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000003990 capacitor Substances 0.000 claims description 19
- 239000000758 substrate Substances 0.000 claims description 8
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 239000004734 Polyphenylene sulfide Substances 0.000 claims description 2
- 239000003365 glass fiber Substances 0.000 claims description 2
- 229920000069 polyphenylene sulfide Polymers 0.000 claims description 2
- 125000006850 spacer group Chemical group 0.000 description 9
- 239000004033 plastic Substances 0.000 description 7
- 229910000679 solder Inorganic materials 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 1
Landscapes
- Adjustable Resistors (AREA)
- Induction Machinery (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Description
【考案の詳細な説明】
この考案はリフロー形式のチツプボンデング基
板に使用されるトリマコンデンサに関する。[Detailed Description of the Invention] This invention relates to a trimmer capacitor used in a reflow type chip bonding board.
従来に於て、リフロー形式のチツプボンデング
基板にはセラミツク・トリマコンデンサが使用さ
れていた。このセラミツク・トリマコンデンサで
は最小静容量が1pF程度であり、さらに小さい静
電容量を要求される場合には、プラスチツク・ト
リマコンデンサを使用しなければならなかつた。 Conventionally, ceramic trimmer capacitors have been used in reflow type chip bonding boards. The minimum capacitance of this ceramic trimmer capacitor was about 1pF, and if an even smaller capacitance was required, a plastic trimmer capacitor had to be used.
しかし、このプラスチツク・トリマコンデンサ
をリフロー形式のチツプボンデング基板に使用す
ると、ハンダペーストの溶融の為に約245℃程度
の熱トンネルを通過させなければならないが、こ
の熱トンネルを通過する際にプラスチツク・トリ
マコンデンサのプラスチツク基板が軟化し、計属
部品の押圧力で熱変形してしまい、熱トンネル通
過後にローター極板の回転が正常に行なえない等
の欠点が存在した。 However, when this plastic trimmer capacitor is used on a reflow type chip bonding board, it must pass through a heat tunnel of about 245°C to melt the solder paste, but when passing through this heat tunnel, the plastic trimmer capacitor There were drawbacks such as the plastic substrate of the capacitor becoming soft and thermally deformed by the pressure of the measuring parts, and the rotor plate not rotating properly after passing through the heat tunnel.
そこで本考案に於ては、中央上面に円座が配設
され、この円座の底面中央に透孔が配設され、円
座に連設して上面に角座が配設され、この角座の
底面中央に透孔の配設された基板と、この基板の
円座底面に埋設されたホツト端子と、前記基板の
角座底面に埋設されたアース端子と、前記基板の
円座内にフイルムを介して配設されたローター極
板と、このローター極板の回転中心に挿嵌され、
下端がホツト端子裏面に係止された回転軸と、前
記ローター極板のフイルム間に配設され、基板の
角座に基部が挿嵌されたステーター極板と、この
ステーター極板の基部を角座底面に配設されたア
ース端子に固着するリベツトと、から成るトリマ
コンデンサと構成した。 Therefore, in the present invention, a circular seat is arranged on the upper center surface, a through hole is arranged in the center of the bottom of this circular seat, a square seat is arranged on the upper surface in series with the circular seat, and this corner seat is arranged on the upper surface. A board with a through hole arranged in the center of the bottom of the seat, a hot terminal buried in the bottom of the round seat of this board, a ground terminal buried in the bottom of the square seat of the board, and a ground terminal buried in the bottom of the round seat of the board. It is inserted into the rotor plate arranged through the film and the rotation center of this rotor plate,
A rotary shaft whose lower end is locked to the back surface of the hot terminal, a stator plate which is disposed between the film of the rotor plate and whose base is inserted into the square seat of the board, The trimmer capacitor consists of a rivet that is fixed to the ground terminal located on the bottom of the seat.
その為に本考案のトリマコンデンサがチツプボ
ンデング基板に配設され熱トンネルでプラスチツ
ク基板が軟化しても、回転軸及びローター極板は
アース端子に固設され、ステーター極板はアース
端子に固設されているので、プラスチツク基板に
金属部品による弾性力が印加されないので、熱で
軟化したプラスチツク基板が外圧で変形を生じる
ことがない。その為にリフロー形式のチツプボン
デング基板用として使用できるトリマコンデンサ
を提供することが可能になつた。 Therefore, the trimmer capacitor of the present invention is installed on a chip bonding board, so that even if the plastic board softens in the heat tunnel, the rotating shaft and rotor plate are fixed to the ground terminal, and the stator plate is fixed to the ground terminal. Since no elastic force is applied to the plastic substrate by the metal parts, the plastic substrate softened by heat will not be deformed by external pressure. Therefore, it has become possible to provide a trimmer capacitor that can be used for reflow type chip bonding boards.
この考案の実施例について面に基づいて説明す
る。基板1はガラス繊維の混合されたポリフエニ
レンサルフアイド樹脂で成形され、この樹脂は耐
熱性に優れ、押圧力が存在しなければ約260℃程
度まで軟化を生じない。この基板1は中央上面に
円座2が配設され、この円座2の底部中心には透
孔3が配設され、この透孔3を中心として円座2
の裏面にも取付座8が配設され、また円座2の底
面にはホツト端子4が埋設され、このホツト端子
4の右端に円座2の透孔3と同心に透孔4aが配
設され、またホツト端子4の左端は基板1外に突
設され、この突設部分は基板1の裏面に折込まれ
て折込部4aを構成する。また基板1上面には円
座2に連設して角座5が配設され、この角座5の
中心には透孔6が配設され、また角座5の底面に
はアース端子7が埋設され、このアース端子7の
左端には角座5の透孔6と同心に透孔7aが配設
され、またアース端子7の右端は基板1に突設さ
れ、この突設部分は基板1の裏面に折込まれて折
込部7bを構成する。そして基板1の円座2内に
ロータリー極板10が挿入され、次にロータリー
極板10の嵌合孔11と同心にスペーサ12げ配
設され、このスペーサ12に絶縁フイルム13の
中心孔14が挿入され、次に角座5にスペーサ2
3が配設され、そして、ステーター極板20が円
座2内に配設されると共に、ステーター極板20
の基部21が角座5に挿入され、スペーサ23の
上部に配設され、またステーター極板20の基部
21の上面にスペーサー24が配設され、このス
ペーサー24、ステーター極板20の基部21の
透孔22、スペーサー23及びアース端子7の透
孔7aを貫通してリベツト25が配設され、この
リベツト25の下端がアース端子7の裏面に押拡
されてステーター極板20をアース端子7に固設
する。この様にして配設されたステーター極板2
0の円座2内の上面に絶縁フイルム15が配設さ
れ、この絶縁フイルム15の中心孔16がスペー
サー12に挿入され、この絶縁フイルム15の上
面にはロータリー極板17が配設され、このロー
タリー極板17の嵌合孔18、スペーサ12、ロ
ーター極板10の嵌合孔11及びホツト端子4の
透孔4aを貫通して回転軸30の軸部31が挿入
され、ホツト端子4の裏面側からは基板1の透孔
3内にスペーサー34,35が挿入され、また取
付座8にはワツシヤー36が配設され、回転軸3
0のカシメ部32がワツシヤー36に挿入され、
このカシメ部32がワツシヤ36の裏面に押拡さ
れて固定される。 An embodiment of this invention will be explained based on aspects. The substrate 1 is molded from polyphenylene sulfide resin mixed with glass fibers, and this resin has excellent heat resistance and does not soften up to about 260° C. unless a pressing force is applied. This substrate 1 has a circular seat 2 disposed on the upper center surface, a through hole 3 is disposed at the center of the bottom of the circular seat 2, and the circular seat 2 is arranged around the through hole 3.
A mounting seat 8 is also provided on the back side of the seat 2, and a hot terminal 4 is buried in the bottom of the seat 2, and a through hole 4a is provided at the right end of the hot terminal 4 concentrically with the through hole 3 of the seat 2. The left end of the hot terminal 4 is provided to protrude outside the board 1, and this protruding portion is folded into the back surface of the board 1 to form a folded portion 4a. In addition, a square seat 5 is arranged on the top surface of the board 1 in series with the circular seat 2, a through hole 6 is arranged in the center of the square seat 5, and a ground terminal 7 is arranged on the bottom surface of the square seat 5. A through hole 7a is provided at the left end of the ground terminal 7 concentrically with the through hole 6 of the square seat 5, and the right end of the earth terminal 7 is provided to protrude into the board 1, and this protruding portion is located on the board 1. is folded into the back surface of the folding part 7b to form a folding part 7b. Then, the rotary electrode plate 10 is inserted into the circular seat 2 of the substrate 1, and then a spacer 12 is placed concentrically with the fitting hole 11 of the rotary electrode plate 10, and the center hole 14 of the insulating film 13 is inserted into the spacer 12. The spacer 2 is inserted into the corner seat 5.
3 is disposed, and the stator pole plate 20 is disposed within the circular seat 2, and the stator pole plate 20 is disposed within the circular seat 2.
The base 21 of the stator plate 20 is inserted into the square seat 5 and disposed on the top of the spacer 23, and a spacer 24 is disposed on the top surface of the base 21 of the stator plate 20. A rivet 25 is provided passing through the through hole 22, the spacer 23, and the through hole 7a of the ground terminal 7, and the lower end of this rivet 25 is pushed and expanded to the back surface of the ground terminal 7, thereby connecting the stator plate 20 to the ground terminal 7. To be fixed. Stator plate 2 arranged in this way
An insulating film 15 is disposed on the upper surface of the circular seat 2 of 0, the center hole 16 of this insulating film 15 is inserted into the spacer 12, and a rotary electrode plate 17 is disposed on the upper surface of this insulating film 15. The shaft portion 31 of the rotating shaft 30 is inserted through the fitting hole 18 of the rotary electrode plate 17, the spacer 12, the fitting hole 11 of the rotor electrode plate 10, and the through hole 4a of the hot terminal 4, and the back surface of the hot terminal 4 is inserted. Spacers 34 and 35 are inserted into the through hole 3 of the substrate 1 from the side, and a washer 36 is arranged on the mounting seat 8, and the rotation shaft 3
0 caulking part 32 is inserted into washer 36,
This caulked portion 32 is expanded and fixed to the back surface of the washer 36.
この様に構成されたトリマコンデンサはアース
端子7の右端及びホツト端子4の左端が基板1の
裏面に折込まれ、この折込部7b,4bがチツプ
ボンデング基板の配線部にハンダペーストを介し
て固設され、熱トンネルを通過させることでハン
ダを溶融させてチツプボンデング基板に固設す
る。 In the trimmer capacitor configured in this way, the right end of the ground terminal 7 and the left end of the hot terminal 4 are folded into the back surface of the board 1, and these folded parts 7b and 4b are fixed to the wiring part of the chip bonding board via solder paste. The solder is melted by passing through a heat tunnel and fixed to the chip bonding board.
そしてトリマコンデンサの静電容量を調整する
為には回転軸30の頭部33のスリ割り33aに
ドライバーの先端を挿嵌させて回転軸30を回動
させるとローター極板10,17が回動して、ス
テーター極板20との間の静電容量が変化し、ト
リマコンデンサとして使用される。 To adjust the capacitance of the trimmer capacitor, insert the tip of a screwdriver into the slot 33a of the head 33 of the rotating shaft 30, rotate the rotating shaft 30, and the rotor plates 10, 17 will rotate. As a result, the capacitance between the capacitor and the stator plate 20 changes, and the capacitor is used as a trimmer capacitor.
第1図はトリマコンデンサの分解斜視図、第2
図はトリマコンデンサの組立時の断面図を表わ
す。
1……基板、2……基板の円座、4……ホツト
端子、5……基板の角座、7……アース端子、1
0,17……ローター極板、13,15……絶縁
フルム、20……ステーター極板、25……リベ
ツト、30……回転軸、36……ワツシヤー。
Figure 1 is an exploded perspective view of the trimmer capacitor, Figure 2
The figure shows a cross-sectional view of the trimmer capacitor when assembled. 1... Board, 2... Round seat of board, 4... Hot terminal, 5... Corner seat of board, 7... Earth terminal, 1
0, 17... Rotor plate, 13, 15... Insulating film, 20... Stator plate, 25... Rivet, 30... Rotating shaft, 36... Washer.
Claims (1)
中央に透孔が配設され、円座に連設して上面に
角座が配設され、この角座の底面中央に透孔の
配設された基板と、この基板の円座底面に埋設
されホツト端子と、前記基板の角座底面に埋設
されたアース端子と、前記基板の円座内にフイ
ルムを介して配設されたローター極板と、この
ローター極板の回転中心に挿嵌され、下端がホ
ツト端子裏面に係止された回転軸と、前記ロー
ター極板のフイルム間に配設され、基板の角座
に基部が挿嵌されたステーター極板と、このス
テーター極板の基部を角座底面に配設されたア
ース端子に固着するリベツトと、から成るトリ
マコンデンサ。 (2) 基板をガラス繊維を混合したポリフエニレン
サルフアイド樹脂で形成した実用新案登録請求
の範囲第1項記載のトリマコンデンサ。[Scope of Claim for Utility Model Registration] (1) A circular seat is provided on the upper center surface, a through hole is provided in the center of the bottom of this circular seat, and a square seat is provided on the upper surface in connection with the circular seat. , a board with a through hole arranged in the center of the bottom of the square seat, a hot terminal buried in the bottom of the round seat of this board, a ground terminal buried in the bottom of the square seat of the board, and a round seat of the board. A rotor plate disposed within the rotor plate via a film, a rotating shaft inserted into the center of rotation of the rotor plate and having its lower end locked on the back surface of the hot terminal, and a rotor plate disposed between the film of the rotor plate. A trimmer capacitor consisting of a stator plate whose base is inserted into a square seat of a circuit board, and a rivet which fixes the base of the stator plate to a ground terminal arranged on the bottom surface of the square seat. (2) The trimmer capacitor according to claim 1, wherein the substrate is made of polyphenylene sulfide resin mixed with glass fiber.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7046884U JPS60183420U (en) | 1984-05-16 | 1984-05-16 | trimmer capacitor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7046884U JPS60183420U (en) | 1984-05-16 | 1984-05-16 | trimmer capacitor |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS60183420U JPS60183420U (en) | 1985-12-05 |
JPH0236273Y2 true JPH0236273Y2 (en) | 1990-10-03 |
Family
ID=30607072
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7046884U Granted JPS60183420U (en) | 1984-05-16 | 1984-05-16 | trimmer capacitor |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS60183420U (en) |
-
1984
- 1984-05-16 JP JP7046884U patent/JPS60183420U/en active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS60183420U (en) | 1985-12-05 |
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