JPH0235525U - - Google Patents
Info
- Publication number
- JPH0235525U JPH0235525U JP11372388U JP11372388U JPH0235525U JP H0235525 U JPH0235525 U JP H0235525U JP 11372388 U JP11372388 U JP 11372388U JP 11372388 U JP11372388 U JP 11372388U JP H0235525 U JPH0235525 U JP H0235525U
- Authority
- JP
- Japan
- Prior art keywords
- package
- frequency device
- case
- base
- metal base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 1
Landscapes
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Description
第１図ａ及びｂは夫々本考案に係るパツケージ
の異つた実施例を示す斜視図、第２図ａ及びｂは
夫々従来のパツケージの構造を示す断面図及び斜
視図、第３図ａ及びｂは夫々従来のパツケージを
使用したＳＡＷフイルタ及び本考案に係るパツケ
ージを使用した同一のＳＡＷフイルタの減衰特性
の比較実験結果を示す図、第４図は本考案の他の
実施例を示す斜視図、第５図は第４図に示すパツ
ケージを使用したＳＡＷフイルタの減衰特性の実
験結果を示す図である。
１…金属製ベース、２…高周波デバイス、８…
ケース、１０及び１１…接地用突起。
Figures 1a and b are perspective views showing different embodiments of the package according to the present invention, Figures 2a and b are sectional views and perspective views respectively showing the structure of a conventional package, and Figures 3a and b. 4 is a diagram showing comparative experimental results of the attenuation characteristics of a SAW filter using a conventional package and the same SAW filter using a package according to the present invention, respectively; FIG. 4 is a perspective view showing another embodiment of the present invention; FIG. 5 is a diagram showing experimental results of the attenuation characteristics of a SAW filter using the package shown in FIG. 4. 1...Metal base, 2...High frequency device, 8...
Case, 10 and 11...Grounding protrusion.
Claims (1)
間に高周波デバイスを封入するパツケージに於い
て、前記ベース或はケースと一体形成した接地用
突起を有することを特徴とする高周波デバイス用
パツケージ。 1. A package for a high-frequency device, the package enclosing a high-frequency device between a metal base and a case hermetically joined thereto, the package having a grounding protrusion integrally formed with the base or the case.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11372388U JPH0235525U (en) | 1988-08-30 | 1988-08-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11372388U JPH0235525U (en) | 1988-08-30 | 1988-08-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0235525U true JPH0235525U (en) | 1990-03-07 |
Family
ID=31353814
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11372388U Pending JPH0235525U (en) | 1988-08-30 | 1988-08-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0235525U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60239113A (en) * | 1984-05-14 | 1985-11-28 | Maruyasu Kogyo Kk | Elastic surface wave filter device |
-
1988
- 1988-08-30 JP JP11372388U patent/JPH0235525U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60239113A (en) * | 1984-05-14 | 1985-11-28 | Maruyasu Kogyo Kk | Elastic surface wave filter device |