JPH0234291A - Method and device for laser beam processing - Google Patents
Method and device for laser beam processingInfo
- Publication number
- JPH0234291A JPH0234291A JP63183659A JP18365988A JPH0234291A JP H0234291 A JPH0234291 A JP H0234291A JP 63183659 A JP63183659 A JP 63183659A JP 18365988 A JP18365988 A JP 18365988A JP H0234291 A JPH0234291 A JP H0234291A
- Authority
- JP
- Japan
- Prior art keywords
- laser beam
- workpiece
- laser
- cutting
- cut
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title description 7
- 238000005520 cutting process Methods 0.000 claims abstract description 53
- 230000003287 optical effect Effects 0.000 claims abstract description 12
- 230000001678 irradiating effect Effects 0.000 claims abstract description 5
- 238000003672 processing method Methods 0.000 claims description 6
- 230000010355 oscillation Effects 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 9
- 238000003698 laser cutting Methods 0.000 description 8
- 239000000463 material Substances 0.000 description 8
- 238000002845 discoloration Methods 0.000 description 5
- 238000001704 evaporation Methods 0.000 description 5
- 230000008020 evaporation Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 239000007769 metal material Substances 0.000 description 3
- 239000000123 paper Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 239000002131 composite material Substances 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 229920001342 Bakelite® Polymers 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004637 bakelite Substances 0.000 description 1
- 239000000805 composite resin Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 239000010985 leather Substances 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Landscapes
- Laser Beam Processing (AREA)
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野コ
この発明は、紙や布、樹脂系複合材料などの非金属材料
を切断するレーザ加工方法及びこの方法を実施するため
のレーザ加工装置に関するものである。[Detailed Description of the Invention] [Industrial Application Field] This invention relates to a laser processing method for cutting non-metallic materials such as paper, cloth, and resin-based composite materials, and a laser processing device for carrying out this method. It is.
［従来の技術］
第６図および表１は「塑性と加工」 （日本塑性加工学
会誌）第２７巻第３０７号（１９８６年８月）、Ｐ２Ｏ
３、Ｐ２Ｏ３に掲載されたレーザ切断の原理図および各
種材料の切断特性を示す表である。[Prior art] Figure 6 and Table 1 are from "Plasticity and Processing" (Journal of the Japan Society for Plasticity Processing), Vol. 27, No. 307 (August 1986), P2O
3. This is a diagram showing the principle of laser cutting published in P2O3 and a table showing the cutting characteristics of various materials.
第６図のレーザ切断の原理図において、レーザ発振器（
１）より出射するレーザビーム（２）を反射ｖＬ（３）
によって屈折させ、集光レンズ（４）で集束したレーザ
ビーム（２）は、Ｏ，Ｎ２などのアシストガス（５）の
噴射とともに被加工物（６）を照射し、この照射部を蒸
発または溶融させて除去することにより切断する。In the diagram of the principle of laser cutting in Figure 6, the laser oscillator (
1) Reflects the laser beam (2) emitted from vL (3)
The laser beam (2) is refracted by the laser beam and focused by the condenser lens (4), and the workpiece (6) is irradiated with an assist gas (5) such as O or N2, and the irradiated part is evaporated or melted. Cut by letting and removing.
以上のように、レーザ切断は熱による加工であるので、
被切断材料の物理的な性質や熱化学的な性質によって切
断性能が影響され、表１に示されているように、例えば
皮、木、布、紙、エポキシ樹脂などの有機材料やこれら
を含む複合材料などは、−数的に切断性能が良好でない
とされている。As mentioned above, since laser cutting is a process using heat,
Cutting performance is influenced by the physical and thermochemical properties of the material to be cut, and as shown in Table 1, for example, organic materials such as leather, wood, cloth, paper, epoxy resin, etc. Composite materials are said to have numerically poor cutting performance.
［発明が解決しようとする課題］
上述のように、レーザ切断加工は被切断材料の切断部を
蒸発または溶融させて除去する熱加工であるため、被加
工物によっては切断面が著しく変質・変色するものがあ
る。例えば、ガラスエポキシ樹脂のような被加工物の場
合は、加工後の切断面に被加工物の蒸発による凝集物が
付着して真黒になり、この付着物を容易に除去できない
などの問題がある。[Problems to be Solved by the Invention] As mentioned above, laser cutting is a thermal process that removes the cut portion of the material to be cut by evaporating or melting it, so depending on the workpiece, the cut surface may be significantly altered or discolored. There is something to do. For example, in the case of workpieces such as glass epoxy resin, there are problems such as agglomerates from the evaporation of the workpiece adhere to the cut surface after processing, resulting in a pitch black color, which cannot be easily removed. .
この発明はこのような課題を解消するために行なわれた
もので、被加工物の加工部の変質・変色を抑制して良好
な切断面が得られるレーザ加工方法およびこの方法の実
施のために使用するレーザ加工装置を得ることを目的と
する。This invention was made to solve these problems, and it provides a laser processing method that suppresses deterioration and discoloration of the processed part of the workpiece and obtains a good cut surface, and a method for implementing this method. The purpose is to obtain a laser processing device for use.
［課題を解決するための手段］
この発明に係るレーザ加工方法は、被加工物とレーザビ
ームの照射点とを相対的に移動させて被加工物を切断す
ると共に、被加工物の切断経路の全体または一部にさら
にレーザビームを照射するようにしたものである。[Means for Solving the Problems] The laser processing method according to the present invention cuts the workpiece by relatively moving the workpiece and the irradiation point of the laser beam, and also cuts the workpiece by moving the workpiece and the laser beam irradiation point relatively. The whole or a part of it is further irradiated with a laser beam.
また、この発明に係るレーザ加工装置は、レーザ発振器
と、このレーザ発振から出射したレーザビームを反射さ
せて集光レンズに導き、この集光レンズで集光されたレ
ーザビームを被加工物に照射する複数の光学系とを備え
、これら光学系のうち少なくとも１つの光学系は被加工
物に対してレーザビームを垂直に照射して切断し、他の
光学系は上記光学系による切断経路にレーザビームを照
射するようにしたものである。Further, the laser processing apparatus according to the present invention includes a laser oscillator, a laser beam emitted from the laser oscillation, which is reflected and guided to a condenser lens, and a workpiece is irradiated with the laser beam condensed by the condenser lens. At least one of these optical systems irradiates the workpiece with a laser beam perpendicularly to cut it, and the other optical system irradiates the workpiece with a laser beam along the cutting path by the optical system. It is designed to irradiate a beam.
さらに、この発明に係るレーザ加工装置は、レーザ発振
器と、先端部にノズル孔を有し上記レーザ発振器から出
射したレーザビームを集光する集光レンズが設けられた
加工ヘッドと、この加工ヘッド又は集光レンズを被加工
物の切断方向に振動させる手段とを設けたものである。Furthermore, the laser processing apparatus according to the present invention includes a laser oscillator, a processing head provided with a condensing lens having a nozzle hole at the tip and condensing a laser beam emitted from the laser oscillator, and the processing head or A means for vibrating the condensing lens in the cutting direction of the workpiece is provided.
［作 用］
この発明によるレーザ加工方法は、最初にレーザビーム
を照射した切断部にさらにレーザビームを照射すること
により、最初のレーザビームの照射によって切断部に付
着した被加工物の蒸発による凝集物を除去するようにし
たものである。[Function] In the laser processing method according to the present invention, by further irradiating the cut portion that has been irradiated with the laser beam first, the workpiece that has adhered to the cut portion due to the first laser beam irradiation is agglomerated by evaporation. It is designed to remove objects.
また、この発明に係るレーザ加工装置においては、第１
のレーザビームを照射した切断部に被加工物の蒸発によ
る凝集物が付着しても、切断経路に照射される他のレー
ザビームによって切断部に付着した凝集物を除去する。Further, in the laser processing apparatus according to the present invention, the first
Even if aggregates due to evaporation of the workpiece adhere to the cut section irradiated with the laser beam, the aggregates attached to the cut section are removed by another laser beam irradiated onto the cutting path.
さらに、この発明によるレーザ加工装置においては、加
工ヘッド又は集光レンズを振動させながら切断方向へ振
幅するレーザビームの照射と、逆方向へ振幅する再照射
との繰り返し動作によって、切断部への凝集物の付着を
抑制する。Further, in the laser processing apparatus according to the present invention, the laser beam is irradiated with an amplitude in the cutting direction while vibrating the processing head or the condensing lens, and the laser beam is re-irradiated with an amplitude in the opposite direction. Prevents adhesion of objects.
［実施例］
以下、この発明の一実施例を図について説明する。第１
図はレーザ切断方法の説明図、第２図は非金属材料の切
断時の変質・変色状態の一例を示す説明図である。図に
おいて、（１）〜（６）は従来例で示した第５図におけ
る同一符号の部分と同一または相当部分であるので、重
複する構成説明は省略する。両図において、（７）は切
断経路、（８）は切断方向を示す矢印、（９）はレーザ
ビーム（２）と被加工物（６）との相対移動方向、（１
１）は切断前面、（■２）は加工時に被加工物（６）よ
り生じる蒸発ガス、（１３）は蒸発ガス（１２）が切断
面に付着した凝集物である。[Example] Hereinafter, an example of the present invention will be described with reference to the drawings. 1st
The figure is an explanatory diagram of a laser cutting method, and FIG. 2 is an explanatory diagram showing an example of a state of deterioration and discoloration during cutting of a nonmetallic material. In the figure, parts (1) to (6) are the same as or equivalent to the parts with the same reference numerals in FIG. 5 shown in the conventional example, so a redundant explanation of the structure will be omitted. In both figures, (7) is the cutting path, (8) is an arrow indicating the cutting direction, (9) is the relative movement direction between the laser beam (2) and the workpiece (6), and (1
1) is the front surface of the cut, (2) is the evaporated gas generated from the workpiece (6) during processing, and (13) is the aggregate of the evaporated gas (12) attached to the cut surface.
第１図に示すようにレーザ発振器（１）より出射するレ
ーザビーム（２）を反射鏡（３）によって屈折させ、集
光レンズ（４）で集光したレーザビーム（２）を照射し
ながら、被加工物（６）とレーザビーム（２）照射点と
を相対的に移動させて被加工物（６）を切断する。通常
のレーザ切断では、切断経路に沿って１回ビームが照射
されれば切断加工は終了するが、被加工物（６）が紙、
エポキシ樹脂やこれらの被合材料などの非金属材料の場
合は、表１に示すように切断時に被加工物（６）より生
じる蒸発物が上下および切断部後方へ急激に膨張し、温
度の低下とともに凝集して後方の切断面に付着する。As shown in Fig. 1, a laser beam (2) emitted from a laser oscillator (1) is refracted by a reflecting mirror (3), and while irradiating the laser beam (2) focused by a condensing lens (4), The workpiece (6) is cut by relatively moving the workpiece (6) and the laser beam (2) irradiation point. In normal laser cutting, the cutting process ends when the beam is irradiated once along the cutting path, but if the workpiece (6) is paper or
In the case of non-metallic materials such as epoxy resins and these mating materials, as shown in Table 1, the evaporated material generated from the workpiece (6) during cutting rapidly expands upward and downward and toward the rear of the cut area, causing a decrease in temperature. It also aggregates and adheres to the cut surface at the rear.
そこで、切断の終了後に再度切断経路（７）に沿ってレ
ーザ光（２）を照射すると、付着していた凝集物は照射
エネルギによって剥離して除去され、またこの照射によ
る被加工物（６）より発生する蒸発物は少なく、かつ上
下、前後方に拡散し、後方の切断面にあらたに付着する
凝集物はほとんどないので、変色の少ない良質な切断面
が得られる。Therefore, when the laser beam (2) is irradiated again along the cutting path (7) after the cutting is completed, the adhered aggregates are peeled off and removed by the irradiation energy, and the workpiece (6) due to this irradiation is Fewer evaporated substances are generated, and they are diffused vertically, front and back, and there are almost no aggregates newly attached to the rear cut surface, resulting in a high-quality cut surface with little discoloration.
なお、上述の実施例では切断後に全体または一部を同一
切断経路で再度レーザビーム（２）を照射する場合につ
いて説明したが、切断中または完全に切断してしまう前
に再照射するようにしてもよく、また切断後に同一切断
経路から若干オフセットして最初の切断経路より少し内
側を再度照射したり、オフセット量を２回目、３回目と
繰り返し、回数とともに小さくするようにして照射すれ
ば、さらに高品質な切断面が得られる。In addition, in the above embodiment, the case where the laser beam (2) is irradiated on the whole or part of the laser beam (2) again in the same cutting path after cutting has been explained, but it is preferable to re-irradiate the laser beam (2) during cutting or before it is completely cut. Also, after cutting, you can slightly offset the same cutting path and irradiate a little inside of the first cutting path again, or repeat the offset amount for the second and third times, decreasing the amount as the number of times increases. A high quality cut surface can be obtained.
第３図はこの発明に係るレーザ加工装置の実施例の構成
図である。図において、（１）はレーザ発振器、（２）
はレーザビーム、（３ａ）はレーザビーム（２）の進行
方向に対して４５°の角度で配設され、レーザビーム（
２）の一部は反射し、一部は透過する部分反射鏡、（３
ｂ）は部分反射鏡（３ａ）の後方に、これより深い角度
（４５’十α）で配設された反射鏡である。（１５）は
加工ヘッドで、上部には集光レンズ（４）が設けられ、
下部には切断方向の前方に第１のノズル孔（１６）が、
また後方に第２のノズル孔（１６ａ）が設けられており
、側部にはアシストガスを吹き付けるためのノズル孔（
５）が設けられている。FIG. 3 is a configuration diagram of an embodiment of the laser processing apparatus according to the present invention. In the figure, (1) is a laser oscillator, (2)
is a laser beam, (3a) is arranged at an angle of 45° to the traveling direction of the laser beam (2), and the laser beam (
Partially reflective mirror that reflects part of (2) and transmits part of (3)
b) is a reflecting mirror disposed behind the partial reflecting mirror (3a) at a deeper angle (45'+α). (15) is a processing head, and a condensing lens (4) is provided at the top.
At the bottom, a first nozzle hole (16) is provided at the front in the cutting direction.
A second nozzle hole (16a) is provided at the rear, and a nozzle hole (16a) for spraying assist gas is provided at the side.
5) is provided.
上記のような装置において、レーザ切断では被加工物（
６）に集光したレーザビームを照射しつつ、被加工物（
８）とレーザビームとを相対的に移動させて被加工物を
切断する。通常のレーザ加工装置では、切断経路（７）
に沿ってレーザビームが照射され、切断プロセスは完了
するのであるが、前述のように被切断物が紙、エポキシ
、ベークライト、複合材料などの非金属材料の場合には
、切断面の変質・変色が激しく、このままでは実用上問
題がある。In the above-mentioned equipment, the workpiece (
6) While irradiating the focused laser beam on the workpiece (
8) and the laser beam are moved relatively to cut the workpiece. In normal laser processing equipment, the cutting path (7)
The laser beam is irradiated along the line and the cutting process is completed, but as mentioned above, if the object to be cut is a non-metallic material such as paper, epoxy, Bakelite, or composite materials, the cut surface may change in quality or discoloration. is severe, and there is a practical problem if left as is.
そこで、本実施例においては、第１のレーザビーム（２
ａ）を被加工物（６）に対して垂直に照射して切断を行
ない、その後に第１のレーザビーム（２ａ）によって形
成された切断面に、第２のレーザビーム（２ｂ）を第１
のレーザビーム（２ａ）に対して斜めに第１のレーザビ
ーム（２ａ）と同一の集光レンズ（４）に入射させるこ
とにより、第１のレーザビーム（２ａ）と異なる位置に
集光するようにしたものである。これにより加工ヘッド
（１５）が大型になるのを防ぎ、光学部品などの消耗部
品の点数の増加も抑さえたので、従来と同一の構成の加
工光学系を使用することができ、安価な装置が得られる
。Therefore, in this embodiment, the first laser beam (2
a) perpendicularly to the workpiece (6) to perform cutting, and then a second laser beam (2b) is applied to the cut surface formed by the first laser beam (2a).
By making the laser beam (2a) obliquely enter the same condensing lens (4) as the first laser beam (2a), the laser beam (2a) can be focused at a different position than the first laser beam (2a). This is what I did. This prevents the machining head (15) from becoming larger and also suppresses the increase in the number of consumable parts such as optical parts, making it possible to use the machining optical system with the same configuration as before, resulting in an inexpensive device. is obtained.
また、レーザ照射点にアシストガスを吹き付けるための
ノズル孔（５）を第１のレーザビーム（２ａ）用と第２
のレーザビーム（２ｂ）用とで独立して設けると共に、
第２のレーザビーム（２ｂ）用のノズル孔＜１ｅａ）の
径を第１のレーザビーム（２ａ）のノズル孔（１６）の
径と同じか又は大きく形成すれば、第２のレーザビーム
（２ｂ）用のノズル（ｌｅａ）からも十分な流速および
流量のアシストガスが噴出するので、レーザビームの再
照射の効果が増幅されて、さらに、切断面の高品質化が
可能となる。In addition, nozzle holes (5) for spraying assist gas onto the laser irradiation point are provided for the first laser beam (2a) and for the second laser beam (2a).
and separately provided for the laser beam (2b),
If the diameter of the nozzle hole (<1ea) for the second laser beam (2b) is formed to be the same as or larger than the diameter of the nozzle hole (16) for the first laser beam (2a), the second laser beam (2b Since the assist gas is ejected from the nozzle (lea) at a sufficient flow rate and flow rate, the effect of re-irradiation with the laser beam is amplified, and furthermore, it becomes possible to improve the quality of the cut surface.
第４図はこの発明の他の実施例の構成図である。FIG. 4 is a block diagram of another embodiment of the present invention.
この実施例においては、レーザ発振器（ｌａ）、レーザ
ビーム（２ａ）、反射鏡（３ａ）、集光レンズ（４ａ）
、アシストガスのノズル孔（５ａ）によって構成される
第１のレーザビーム照射部（１０ａ）は被加工物（８）
の切断方向の前方に配置され、同様な構成のレーザ発振
器（ｉｂ）〜アシストガスのノズル孔（５ｂ）からなる
第２のレーザビーム照射部（ｔａｂ）は切断方向の後方
に配置されている。In this example, a laser oscillator (la), a laser beam (2a), a reflecting mirror (3a), a condensing lens (4a)
, the first laser beam irradiation part (10a) constituted by the assist gas nozzle hole (5a) is directed to the workpiece (8).
A second laser beam irradiation section (tab) consisting of a laser oscillator (ib) and an assist gas nozzle hole (5b) having a similar configuration is arranged at the rear in the cutting direction.
このような第１、第２のレーザビーム照射部（１０ａ）
、 （１０ｂ）と被加工物（８）とを相対的に移動さ
せながら、先ず第１のレーザビーム照射部（１０ａ）に
よる照射によって被加工物（６）を切断し、移動にとも
なってこの切断経路を第２のレーザビーム照射部（１０
ｂ）が再照射する。Such first and second laser beam irradiation parts (10a)
(10b) and the workpiece (8), the workpiece (6) is first cut by irradiation by the first laser beam irradiation unit (10a), and as it moves, the workpiece (6) is cut. The path is connected to the second laser beam irradiation unit (10
b) Re-irradiation.
以上の動作により、第１のレーザビーム照射部（１０ａ
）による切断時に発生した被加工物（６）よりの蒸発物
が冷却して切断面に付着した凝集物は、第２のレーザビ
ーム照射部（１０ｂ）による再照射によって除去される
。By the above operation, the first laser beam irradiation section (10a
) The aggregates adhering to the cut surface due to cooling of the evaporated material from the workpiece (6) generated during cutting by the laser beam irradiator (10b) are removed by re-irradiation by the second laser beam irradiator (10b).
なお、上述の説明では、第１、第２のレーザビーム（２
ａ） 、（２ｂ）の照射のために２つのノズル孔（ｌｅ
ａ）、（１６ｂ）をそれぞれ独立して設けた例を示した
が、例えば小判状のノズル孔を設け、第１、第２のレー
ザビーム（２ａ） 、 （２ｂ）を同一のノズル孔より
照射するようにしてもよい。Note that in the above explanation, the first and second laser beams (2
Two nozzle holes (le
Although we have shown an example in which laser beams a) and (16b) are provided independently, for example, an oval-shaped nozzle hole is provided and the first and second laser beams (2a) and (2b) are irradiated from the same nozzle hole. You may also do so.
また、第３図、第４図の実施例では、何れも２つの光学
系を設けた場合を示したが３つ以上の光学系を並設して
もよい。Further, in the embodiments shown in FIGS. 3 and 4, two optical systems are provided, but three or more optical systems may be provided in parallel.
第５図はこの発明によるレーザビーム加工装置のさらに
他の実施例の構成図で、（１）〜（８）は第１図の同一
符号の部分と同一または相当部分である。（１５）は加
工ヘッド、（１Ｂ）はノズル孔、（１７）は例えば回転
カム機ＦＭを用いて加工ヘッド（１５）を被加工物（６
）の切断方向へ振動させ、ノズル孔（１６）より照射す
るレーザビーム（２）の照射点を振動させる振動装置で
ある。FIG. 5 is a block diagram of still another embodiment of the laser beam processing apparatus according to the present invention, in which portions (1) to (8) are the same as or corresponding to the portions with the same reference numerals in FIG. 1. (15) is a processing head, (1B) is a nozzle hole, and (17) is a processing head (15) using a rotary cam machine FM, for example.
) in the cutting direction, and vibrates the irradiation point of the laser beam (2) irradiated from the nozzle hole (16).
このような切断方向へ振動するレーザビーム（２）の照
射点と、被加工物（６）とを相対的に移動して切断加工
を行う場合、例えば振幅５ＩＩＩＩＢで１００Ｈｚ程度
の周波数で振動させると、１．５ ｍ＋／ｗｉｎ程度の
速度で切断できるので、１／１００ＳＥＣ程度の周期内
において、切断方向へ振幅するレーザビーム（２）の照
射により切断と逆方向へ振幅する再照射が行なわれ、被
加工物（６）より発生する蒸発物の凝集の付着を抑制し
て、変色のない良質の切断面が得られる。When performing cutting by relatively moving the irradiation point of the laser beam (2) vibrating in the cutting direction and the workpiece (6), for example, if the laser beam (2) vibrates at an amplitude of 5IIIB and a frequency of about 100Hz, Since cutting can be performed at a speed of about 1.5 m+/win, re-irradiation is performed within a period of about 1/100 SEC by irradiation with the laser beam (2) that oscillates in the cutting direction and oscillates in the opposite direction to the cutting. By suppressing adhesion of agglomerates of evaporated matter generated from the workpiece (6), a high-quality cut surface without discoloration can be obtained.
なお、上述の実施例では加工ヘッド（１５）全体を振動
させる場合を示したが、ノズル孔（１６）を小判状にし
て、集光レンズ（４）の部分のみを振動させるようにす
ると、振動部分が軽量化して振幅や振動周波数を大きく
することにより、切断速度を高めることができる。In the above embodiment, the entire processing head (15) is vibrated, but if the nozzle hole (16) is made into an oval shape and only the condensing lens (4) is vibrated, the vibration can be reduced. The cutting speed can be increased by reducing the weight of the parts and increasing the amplitude and vibration frequency.
［発明の効果］
以上説明したように、この発明によれば、最初のレーザ
ビームの照射によって被加工物を切断し、この切断終了
後に同一切断経路にさらにレーザビームを照射するよう
にしたので、切断時に被加工物より生じた蒸発物による
切断面の凝集物の除去ができる。[Effects of the Invention] As explained above, according to the present invention, the workpiece is cut by the first laser beam irradiation, and after the cutting is completed, the same cutting path is further irradiated with the laser beam. It is possible to remove aggregates on the cut surface due to evaporated matter generated from the workpiece during cutting.
また、被加工物の切断方向に対して複数のレーザビーム
照射点を設け、これらの照射点と被加工物との相対的移
動によって、１回の移動により切断とこの切断による切
断面への再照射を行うように構成したので、短時間の加
工により切断面に付着する凝集物を除去することができ
る。In addition, multiple laser beam irradiation points are provided in the cutting direction of the workpiece, and by moving these irradiation points and the workpiece relative to each other, it is possible to cut the workpiece and redirect it to the cut surface with a single movement. Since the structure is configured to perform irradiation, aggregates adhering to the cut surface can be removed by processing in a short time.
さらに、被加工物の切断方向に加工ヘッドを振動させる
機構を設け、レーザビーム照射点を振動させながら、切
断とこの切断による切断面への再照射とを繰り返して行
うように構成したので、切断面への凝集物の付着を抑制
することができる。Furthermore, a mechanism was installed to vibrate the processing head in the cutting direction of the workpiece, and the laser beam irradiation point was vibrated to repeatedly cut and reirradiate the cut surface due to this cutting. It is possible to suppress the adhesion of aggregates to the surface.
以上のように、この発明によれば、切断時に発生する被
加工物の蒸発物により切断面に付着する凝集物を、レー
ザビームの再照射によって除去あるいは抑制できるので
、高品質の切断面が得られる効果がある。As described above, according to the present invention, it is possible to remove or suppress aggregates that adhere to the cut surface due to evaporation of the workpiece generated during cutting by reirradiating the laser beam, so that a high-quality cut surface can be obtained. It has the effect of
第１図はこの発明に係るレーザ加工方法の説明図、第２
図はレーザ切断加工時の切断部の状態を示す斜視図、第
３図、第４図及び第５図はこの発明に係るレーザ加工装
置の実施例を示す模式図、第６図は通常のレーザ切断加
工を説明するための説明図である。
図において、（２）はレーザビーム、（２ａ）は第１の
レーザビーム、（２ｂ）は第２のレーザビーム、（４）
は集光レンズ、（６）は被加工物、（７）は切断経路、
（８）は切断方向、（９）は相対移動方向、（１５）は
加工ノズル、（１７）は振動装置である。
なお、図中同一符号は同一または相当部分を示す。FIG. 1 is an explanatory diagram of the laser processing method according to the present invention, and FIG.
The figure is a perspective view showing the state of the cutting part during laser cutting, FIGS. 3, 4, and 5 are schematic diagrams showing an embodiment of the laser processing apparatus according to the present invention, and FIG. 6 is a typical laser cutting machine. It is an explanatory view for explaining cutting processing. In the figure, (2) is the laser beam, (2a) is the first laser beam, (2b) is the second laser beam, (4)
is a condensing lens, (6) is a workpiece, (7) is a cutting path,
(8) is the cutting direction, (9) is the relative movement direction, (15) is the processing nozzle, and (17) is the vibration device. Note that the same reference numerals in the figures indicate the same or corresponding parts.
Claims (3)
動させて上記被加工物を切断すると共に、上記被加工物
の切断経路の全体または一部にさらにレーザビームを照
射することを特徴とするレーザ加工方法。(1) Cutting the workpiece by relatively moving the workpiece and the laser beam irradiation point, and further irradiating the entire or part of the cutting path of the workpiece with the laser beam. Characteristic laser processing method.
ーザビームを反射させて集光レンズに導き、この集光レ
ンズで集光されたレーザビームを被加工物に照射する複
数の光学系とを備え、これら光学系のうち少なくとも１
つの光学系は被加工物に対してレーザビームを垂直に照
射して切断し、他の光学系は上記光学系による切断経路
にレーザビームを照射することを特徴とするレーザ加工
装置。(2) Equipped with a laser oscillator and a plurality of optical systems that reflect the laser beam emitted from the laser oscillation, guide it to a condenser lens, and irradiate the workpiece with the laser beam focused by the condenser lens. , at least one of these optical systems
A laser processing apparatus characterized in that one optical system irradiates a workpiece with a laser beam perpendicularly to cut the workpiece, and the other optical system irradiates the cutting path of the workpiece with a laser beam.
ーザ発振器から出射したレーザビームを集光する集光レ
ンズが設けられた加工ヘッドと、この加工ヘッド又は集
光レンズを被加工物の切断方向に振動させる手段とを備
えたことを特徴とするレーザ加工装置。(3) A processing head equipped with a laser oscillator, a condensing lens having a nozzle hole at the tip and condensing the laser beam emitted from the laser oscillator, and using this processing head or condensing lens on the workpiece. A laser processing device characterized by comprising: means for vibrating in a cutting direction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63183659A JPH0234291A (en) | 1988-07-25 | 1988-07-25 | Method and device for laser beam processing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63183659A JPH0234291A (en) | 1988-07-25 | 1988-07-25 | Method and device for laser beam processing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0234291A true JPH0234291A (en) | 1990-02-05 |
Family
ID=16139682
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63183659A Pending JPH0234291A (en) | 1988-07-25 | 1988-07-25 | Method and device for laser beam processing |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0234291A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2009074140A2 (en) * | 2007-12-11 | 2009-06-18 | Trumpf Werkzeugmaschinen Gmbh + Co. Kg | Method for the keyhole-free laser fusion cutting using leading and trailing laser beams |
| JP2022023852A (en) * | 2018-01-29 | 2022-02-08 | バイストロニック レーザー アクチェンゲゼルシャフト | Optical device for shaping electromagnetic wave beam and use thereof, beam treatment device and use thereof, and beam treatment method |
-
1988
- 1988-07-25 JP JP63183659A patent/JPH0234291A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2009074140A2 (en) * | 2007-12-11 | 2009-06-18 | Trumpf Werkzeugmaschinen Gmbh + Co. Kg | Method for the keyhole-free laser fusion cutting using leading and trailing laser beams |
| DE102007059987A1 (en) * | 2007-12-11 | 2009-07-02 | Trumpf Werkzeugmaschinen Gmbh + Co. Kg | Method for keyhole-free laser fusion cutting by means of leading and trailing laser beams |
| WO2009074140A3 (en) * | 2007-12-11 | 2009-11-26 | Trumpf Werkzeugmaschinen Gmbh + Co. Kg | Method for the keyhole-free laser fusion cutting using leading and trailing laser beams |
| US8941029B2 (en) | 2007-12-11 | 2015-01-27 | Trumpf Werkzeugmaschinen Gmbh + Co. Kg | Methods and systems for keyhole-free laser fusion cutting |
| DE102007059987B4 (en) * | 2007-12-11 | 2015-03-05 | Trumpf Werkzeugmaschinen Gmbh + Co. Kg | Method for keyhole-free laser fusion cutting by means of leading and trailing laser beams |
| JP2022023852A (en) * | 2018-01-29 | 2022-02-08 | バイストロニック レーザー アクチェンゲゼルシャフト | Optical device for shaping electromagnetic wave beam and use thereof, beam treatment device and use thereof, and beam treatment method |
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