JPH0233981Y2 - - Google Patents
Info
- Publication number
- JPH0233981Y2 JPH0233981Y2 JP1986071474U JP7147486U JPH0233981Y2 JP H0233981 Y2 JPH0233981 Y2 JP H0233981Y2 JP 1986071474 U JP1986071474 U JP 1986071474U JP 7147486 U JP7147486 U JP 7147486U JP H0233981 Y2 JPH0233981 Y2 JP H0233981Y2
- Authority
- JP
- Japan
- Prior art keywords
- heating
- parts
- soldering iron
- chip
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000010438 heat treatment Methods 0.000 claims description 72
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 52
- 238000005476 soldering Methods 0.000 claims description 28
- 229910052742 iron Inorganic materials 0.000 claims description 26
- 239000000758 substrate Substances 0.000 claims description 23
- 235000000396 iron Nutrition 0.000 claims description 7
- 229910000679 solder Inorganic materials 0.000 description 8
- 238000002844 melting Methods 0.000 description 4
- 230000008018 melting Effects 0.000 description 4
- 210000000078 claw Anatomy 0.000 description 3
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000005452 bending Methods 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
Description
【考案の詳細な説明】
（産業上の利用分野）
本考案は、把持部とヒータ部とヒータ部により
加熱される加熱部とを夫々備えた一対のコテから
成り、上記把持部を片手で握り締めたり緩めたり
することによつて、コテ先の両加熱部が互いに近
づいたり離れたりする構造の電子部品用半田コテ
に関し、詳しくは、四方向が半田づけされた電子
部品、例えば、IC等の各種チツプ部品やチツプ
キヤリア等を取外す際に用いる電子部品用半田コ
テに関する。[Detailed description of the invention] (Field of industrial application) The invention consists of a pair of irons each having a gripping part, a heater part, and a heating part heated by the heater part, and the gripping part is grasped with one hand. Regarding the soldering iron for electronic components, which has a structure in which both heating parts of the soldering iron tip approach or separate from each other by loosening or loosening the soldering iron, it can be used to solder various electronic components such as ICs that are soldered in four directions. This invention relates to a soldering iron for electronic components used when removing chip parts, chip carriers, etc.
（従来技術とその問題点）
四方向が半田づけされたチツプを取外す際に
は、一方の手でチツプ本体をピンセツト等で掴
み、他方の手で、先ず、チツプ本体の一方の半田
付部分にコテを当て、半田の溶解を待つて基板か
ら当該ピン列を引き外し、このピン列を引き離し
た状態を維持させるため、チツプ部品を基板との
間に金属片等の介在物を挿入しておいて、次のピ
ン列にコテを当てるという作業を、各ピン列毎に
繰り返して行き、最後に基板から引き外すという
面倒な作業が行なわれていた。(Prior art and its problems) When removing a chip that is soldered on all four sides, grasp the chip body with tweezers or the like with one hand, and use the other hand to first touch one soldered part of the chip body. Apply a soldering iron, wait for the solder to melt, and then remove the pin row from the board. In order to keep the pin row separated, insert an object such as a metal piece between the chip component and the board. The process involved repeating this process for each pin row by applying a soldering iron to the next pin row, and finally pulling it out from the board, a tedious task.
従来、かかる面倒な作業を容易ならしめるた
め、種々の工具が実開昭60−113877号、実開昭60
−160976号、実開昭57−93175号や実開昭59−
68668号公報等に提案されている。 Conventionally, various tools have been developed to make this troublesome work easier.
−160976, Utility Model No. 57-93175 and Utility Model Kai No. 59-
This is proposed in Publication No. 68668, etc.
この内、実開昭60−113877号の考案は、片手操
作で目的のチツプの四方を挟みつけるようにして
同時に四方の半田を溶解させてからチツプを摘ま
み上げる工具である。 Among these, the invention of Utility Model Application Publication No. 60-113877 is a tool that can be operated with one hand to pinch the target chip on all four sides, simultaneously melting the solder on all four sides, and then picking up the chip.
しかし、この工具では、チツプの四方を囲むた
めに２分されて直角に折り曲げられた２つの爪
が、出会い方向にその内角がＶ字状に開放する形
ににそれぞれ取付けられており、両方の爪が出合
うと、Ｖ字の両先端部が互いに衝突し合つて、四
角形を形成させる構成となつている。 However, with this tool, the two claws are divided into two and bent at right angles to surround the four sides of the chip, and the inner corners of the claws are attached to each other in a V-shape opening in the direction of meeting. When the claws meet, both ends of the V-shape collide with each other, forming a square.
従つて、この工具では、Ｖ字の両先端部が互い
に衝突し合つて形成される四角形よりも小さいチ
ツプ部品に使用することは不可能である。 Therefore, this tool cannot be used for chip parts smaller than the square formed by the two ends of the V-shape colliding with each other.
同様に、実開昭59−68668号の考案もまた、Ｖ
字の両先端部が互いに衝突し合つて形成される四
角形よりも小さいチツプ部品に使用することがで
きない。 Similarly, the invention of Utility Model Application Publication No. 59-68668 is also based on V
It cannot be used for chip parts that are smaller than the square formed by the two tips of the letters colliding with each other.
本考案は、かかる問題の解決を主たる目的とす
るものである。 The main purpose of the present invention is to solve this problem.
（問題解決の手段）
本考案の電子部品用半田コテは、
把持部とヒータ部とヒータ部により加熱される
加熱部とを夫々備えた一対のコテから成り、上記
把持部を片手で握り締めたり緩めたりすることに
よつて、コテ先の両加熱部が互いに近づいたり離
れたりする構造の電子部品用半田コテに於て、
上記加熱部には夫々目的物に当接させられる板
状の加熱片を設け、
該加熱片は、コテの長さ方向と平行でその平面
が他方の加熱片の平面と出会い方向に相対に配さ
れた基板部と、両基板部の互いに異なる端から出
会い方向に突出された突出板部とから成り、
把持部を握り締め、両加熱片が丁度出会つた際
には四角形が形成され、更に接近させて行くと、
夫々の突出板部が他方の基板部の端を擦り逃げて
行き、遂には、両基端部が互いに当接するよう上
記両加熱片の加熱部に対する取り付け位置を水平
方向であつて出会い方向とは直角の方向に僅かに
ずらせた構成としたこと、
を特徴とするものである。(Means for solving the problem) The soldering iron for electronic components of the present invention consists of a pair of soldering irons each having a gripping part, a heater part, and a heating part heated by the heater part, and the gripping part can be tightened or loosened with one hand. In a soldering iron for electronic components that has a structure in which both heating parts of the soldering iron tip approach or separate from each other by The heating piece is provided with a substrate part which is parallel to the length direction of the iron and whose plane is arranged opposite to the plane of the other heating piece in the direction in which it meets the plane of the other heating piece, and the heating piece projects from mutually different ends of the two substrate parts in the direction in which they meet. When the gripping portion is squeezed and the two heating pieces just meet, a square is formed, and as they are brought closer together,
Each of the protruding plate parts rubs against the edge of the other board part, and the mounting positions of the heating pieces to the heating part are set horizontally and away from the meeting direction so that both base end parts finally come into contact with each other. It is characterized by having a configuration slightly shifted in the right angle direction.
（作用）
コテの両把持部を片手で握り、チツプ部品を両
側面側から挟むように、左右の加熱片を出会わせ
て、チツプ部品の四方を囲む四角形を形成し、四
方向のピン列の半田づけ部分に同時に、当該加熱
片の当接辺を当てて熱を加えて半田を溶解させた
後、更に把持部を握り締めてチツプ部品を出会方
向に相対させた２つの基板部で確実に挟みつけ
て、そのまま基板から引き外す。(Function) Grip both grips of the iron with one hand, pinch the chip part from both sides, and bring the left and right heating pieces together to form a rectangle surrounding the chip part on all sides. At the same time, apply the contact side of the heating piece to the soldered part and apply heat to melt the solder, then tighten the grip and firmly hold the two board parts facing each other in the direction in which the chip components meet. Pinch it and pull it off the board.
又、両方の加熱片が丁度出会つて、一方の加熱
片の突出板部が他方の加熱片の基板部の端に近接
した状態で形成される四角形よりも小さいチツプ
部品に使用するに当つては、チツプ部品の相対す
る２辺毎に、両加熱片の基板部を当て四方の半田
を溶解させた後、更に把持部を握り締めてチツプ
部品を出会方向に相対させた２つの基板部で確実
に挟みつけ、そのまま基板から引き外す。 Also, when used for chip parts smaller than a square formed with both heating pieces exactly meeting and the protruding plate part of one heating piece being close to the edge of the substrate part of the other heating piece. After melting the solder on all four sides by applying the substrate parts of both heating pieces to each of the two opposing sides of the chip part, the grips are further tightened to make the chip parts face each other in the direction in which they meet. Pinch it firmly and pull it off the board.
（実施例）
以下、本考案を実施の一例を示す図面に基づい
て説明する。(Example) Hereinafter, the present invention will be explained based on drawings showing an example of implementation.
第１図及び第２図に於て、図中の符号１０ａ，
１０ｂは半田コテの加熱部、符号２０ａ，２０ｂ
は当該加熱部を支持し且つ当該加熱部を加熱させ
るヒータ部、符号３０ａ，３０ｂは更にヒータ部
を支持する把持部である。 In FIG. 1 and FIG. 2, the reference numeral 10a in the figure,
10b is the heating part of the soldering iron, symbols 20a and 20b
Reference numerals 30a and 30b indicate a heater section that supports and heats the heating section, and reference numerals 30a and 30b indicate gripping sections that further support the heater section.
本実施例の電子部品用半田コテは、加熱部１０
ａとヒータ部２０ａと把持部３０ａとから構成さ
れる一つの半田コテＡと、同じく、加熱部１０ｂ
とヒータ部２０ｂと把持部３０ｂとから構成され
る今一つの半田コテＢとの二つの半田コテＡ，Ｂ
を組合せて一対の半田コテとしたものである。 The soldering iron for electronic components of this embodiment has a heating part 10.
One soldering iron A is composed of a heater part 20a, a holding part 30a, and a heating part 10b.
and another soldering iron B consisting of a heater part 20b and a gripping part 30b, and two soldering irons A and B.
are combined to form a pair of soldering irons.
半田コテＡと半田コテＢとは、把持部３０ａと
把持部３０ｂとの後端側が軸３１で回動可能に枢
着されており、把持部３０ａと把持部３０ｂとの
間に介在させたスプリング３２によつて、コテ先
側の加熱部１０ａと加熱部１０ｂとが常時一定の
距離を置いて相対するよう付勢されている。 Soldering iron A and soldering iron B have a gripping part 30a and a gripping part 30b whose rear end sides are rotatably connected to a shaft 31, and a spring interposed between the gripping part 30a and the gripping part 30b. 32, the heating portion 10a and the heating portion 10b on the iron tip side are always urged to face each other at a constant distance.
従つて、両加熱部１０ａ，１０ｂは把持部３０
ａ，３０ｂを握り締めたり緩めたりするだけで、
近づいたり離れたりする。 Therefore, both heating parts 10a and 10b are attached to the grip part 30.
Just by tightening or loosening a and 30b,
approach or move away.
即ち、片手で握り締めると両加熱部１０ａ，１
０ｂは出会い、緩めると出会わせた両加熱部１０
ａ，１０ｂはスプリングによつて互いに離れる。 That is, when gripped with one hand, both heating parts 10a, 1
0b meets, and both heating parts 10 meet when loosened.
a and 10b are separated from each other by a spring.
図中の符号３３ａ，３３ｂは、把持部３０ａ，
３０ｂの相対する内側面から相手側方向に突出成
形したガイド片であつて、このガイド片３３ａ，
３３ｂは半田コテＡ，Ｂが軸３１を中心にして開
閉する際、先端の加熱部１０ａ，１０ｂの出会い
が一致するように案内している。 Reference numerals 33a and 33b in the figure indicate the gripping portion 30a,
The guide pieces 33a, 30b are formed to protrude from the opposing inner surfaces toward the other side.
33b guides the soldering irons A and B so that when they open and close around the shaft 31, the heating parts 10a and 10b at their tips meet.
即ち、ガイド片３３ａ，３３ｂは半田コテＡ，
Ｂの開閉動の際の軌跡を規制している。 That is, the guide pieces 33a, 33b are connected to the soldering iron A,
The locus of opening and closing movement of B is regulated.
実施例のガイド片３３ａ，３３ｂは、夫々２条
平行に成形してあり、これらのガイド片３３ａ，
３３ｂが互いに咬み合うように、例えば、２条の
ガイド片３３ａ，３３ｂの間に、他方のガイド片
３３ｂ，３３ａの一つの片部が嵌合するように咬
み合わせる（図示せず）。 The guide pieces 33a and 33b of the embodiment are each formed into two parallel strips, and these guide pieces 33a,
33b engage with each other, for example, one piece of the other guide pieces 33b, 33a fits between the two guide pieces 33a, 33b (not shown).
ヒータ部２０ａは、外筒のヒートパイプ２１に
内筒の加熱ヒータ２２を挿通した二重筒構造であ
り、内筒たる加熱ヒータ２２の加熱部１０ａ側の
開放端は外筒たるヒートパイプ２１の開放端より
若干内側に位置している。加熱部１０ａの基部は
このヒータ部２０ａの筒内に着脱可能に装着され
ている。 The heater part 20a has a double cylinder structure in which the heater 22 of the inner cylinder is inserted into the heat pipe 21 of the outer cylinder. It is located slightly inside the open end. The base of the heating section 10a is removably mounted within the cylinder of the heater section 20a.
尚、半田コテＢに於るヒータ部２０ｂの構造
は、半田コテＡに於るヒータ部２０ｂの構造と同
様である（図示せず）。 The structure of the heater section 20b in the soldering iron B is similar to the structure of the heater section 20b in the soldering iron A (not shown).
又、図中の符４０，４０はヒータ部２０ａ，２
０ｂと把持部３０ａ，３０ｂとの間に介在させた
断熱スペーサである。 In addition, symbols 40, 40 in the figure indicate heater parts 20a, 2.
This is a heat insulating spacer interposed between 0b and the gripping parts 30a and 30b.
第３図乃至第５図に於て、上記加熱部１０ａ，
１０ｂには夫々目的物たるチツプ部品の四方向の
側面に沿つて延在するピン列、即ち、半田づけ部
分の内、隣り合う２方向の半田づけ部分に対し
て、当接させられる平な板状の加熱片１１ａ，１
１ｂを夫々設けている。 In FIGS. 3 to 5, the heating section 10a,
10b is a flat plate that is brought into contact with the pin rows extending along the four sides of the target chip component, that is, the soldered parts in two adjacent directions among the soldered parts. shaped heating piece 11a, 1
1b are provided respectively.
上記の加熱片１１ａ，１１ｂは、何れも、コテ
の長さ方向と平行でその平面が他方の加熱片の平
面と出会い方向に相対に配された基板部１２ａ，
１２ｂと、両基板部１２ａ，１２ｂの互いに異な
る端から出会い方向に突出された突出板部１３
ａ，１３ｂとから成つている。 Each of the heating pieces 11a and 11b has a substrate portion 12a, which is parallel to the length direction of the iron and whose plane meets the plane of the other heating piece, and which is arranged opposite to the other heating piece in the direction.
12b, and a protruding plate portion 13 protruding from mutually different ends of both substrate portions 12a, 12b in the meeting direction.
a, 13b.
即ち、一方の加熱片１１ａは、隣り合う二方向
の半田づけ部分に、基板部１２ａと突出板部１３
ａとで形成されるＬ字型の下端縁が当接させられ
る。 That is, one heating piece 11a has a substrate part 12a and a protruding plate part 13 in the soldering parts in two adjacent directions.
The lower edge of the L-shape formed by a and a are brought into contact.
他方の加熱片１１ｂは、チツプ部品の四方向に
在る残りの隣り合う二方向の半田づけ部分に、基
板部１２ｂと突出板部１３ｂとで形成されるＬ字
型の下端縁が当接させられる。 The other heating piece 11b has an L-shaped lower edge formed by the base plate part 12b and the protruding plate part 13b in contact with the soldering parts in the remaining two adjacent directions in the four directions of the chip component. It will be done.
上記のように加熱片１１ａの基板部１２ａと、
加熱片１１ｂの基板部１２ｂとは、その平面が他
方の基板部１２ｂ，１２ａの平面と出会い方向に
互いに対面するように相対に配されて、夫々の加
熱部１０ａ，１０ｂに固定されている。 As described above, the substrate portion 12a of the heating piece 11a,
The substrate portion 12b of the heating piece 11b is fixed to the respective heating portions 10a, 10b so that its plane faces each other in the direction in which its plane meets the plane of the other substrate portion 12b, 12a.
この固定角度は、把持部３０ａ，３０ｂを同時
に握つて半田コテＡ，Ｂを握つて、両方の加熱片
１１ａ，１１ｂが出会つて四角形が形成される
際、即ち、目的物を囲んだ際に、平行となるよう
にしてある。 This fixed angle is determined when gripping parts 30a and 30b are gripped at the same time and soldering irons A and B are gripped and both heating pieces 11a and 11b meet to form a square, that is, when surrounding the object. , so that they are parallel.
又、目的物を囲んだ際、両突出板部１３ａ，１
３ｂは、相対する他方の基板部１２ａ，１２ｂと
衝突することなく、基板部１２ａ，１２ｂの側端
と擦れ違う位置関係となるよう両加熱片１１ａ，
１１ｂの夫々の加熱部１０ａ，１０ｂに対する固
定位置を、水平方向であつて出会い方向とは直角
の方向へ僅かにずらせている。 Also, when surrounding the object, both protruding plate parts 13a, 1
The heating pieces 11a, 3b are arranged so that the heating pieces 11a, 3b are in a positional relationship in which they rub against the side edges of the substrate parts 12a, 12b without colliding with the other opposing substrate parts 12a, 12b.
The fixing positions of the heating parts 11b relative to the respective heating parts 10a and 10b are slightly shifted in the horizontal direction and in the direction perpendicular to the meeting direction.
これによつて、把持部３０ａ，３０ｂを次第に
握り締めて行くと、両加熱片１１ａ，１１ｂが丁
度出会つた際には四角形が形成さら、更に握り締
めて行くと、夫々の突出板部１３ａ，１３ｂが他
方の基板部１２ａ，１２ｂの端を擦り逃げて行き
違い、遂には、両方の基板部１２ａ，１２ｂが正
面衝突するように当接してしまう。 As a result, when the gripping parts 30a and 30b are gradually tightened, a square is formed when both the heating pieces 11a and 11b just meet, and when the gripping parts are further tightened, the respective protruding plate parts 13a and 13b are formed. The two substrate parts 12a and 12b rub against each other, and end up coming into contact with each other in a head-on collision.
即ち、両方の基板部１２ａ，１２ｂによつて、
チツプ部品は、その両側から確実に挟持されるこ
とになる。 That is, by both substrate parts 12a and 12b,
The chip component will be securely clamped from both sides.
これを第５図について詳述すると、左右の加熱
片１１ａ，１１ｂを四角形に出会わせて、チツプ
部品４１の四方向に延びるピン列４２に当て、半
田づけされた部分を溶解した後、更に把持部３０
ａ，３０ｂを握り締めることにより両方の基板部
１２ａ，１２ｂでチツプ部品を確実に挟持し、そ
のまま基板から取り外すことができる。 To explain this in detail with reference to FIG. 5, the left and right heating pieces 11a and 11b are brought into contact with each other in a rectangular shape, and applied to the pin rows 42 extending in four directions of the chip component 41, and after melting the soldered part, the pieces are further gripped. Part 30
By tightening the grips a and 30b, the chip component can be securely held between both the board parts 12a and 12b, and can be removed from the board as it is.
更に、本実施例では、両方の加熱片１１ａ，１
１ｂが丁度出会つて、一方の加熱片１１ａ，１１
ｂの突出板部１３ａ，１３ｂが他方の加熱片１１
ａ，１１ｂの基板部１２ａ，１２ｂの端に近接し
た状態で形成される四角形よりも、更に小さい形
状のチツプ部品に対しても本考案を使用すること
ができる。 Furthermore, in this embodiment, both heating pieces 11a, 1
1b just meet and one heating piece 11a, 11
The protruding plate portions 13a and 13b of b are the other heating piece 11
The present invention can also be used for chip components having a smaller shape than the rectangular shape formed close to the ends of the substrate portions 12a and 12b of the substrate portions 12a and 11b.
この場合には、チツプ部品の相対する２辺毎
に、両加熱片１１ａ，１１ｂの基板部１２ａ，１
２ｂを当てて四方の半田を溶解させた後、更に把
持部３０ａ，３０ｂを握り締めてチツプ部品４１
を出会方向に相対させた２つの基板部１２ａ，１
２ｂで確実に挟みつけ、そのまま基板から引き外
すことによつて行なわれる。 In this case, the substrate portions 12a and 1 of both heating pieces 11a and 11b are placed on each two opposing sides of the chip component.
2b to melt the solder on all sides, further tighten the grips 30a and 30b to remove the chip part 41.
Two substrate parts 12a, 1 facing each other in the meeting direction
2b, and then pull it off from the board.
尚、本実施例では、第２図及び第３図に示すよ
うに、突出板部１３ａ，１３ｂの上端縁を突出方
向に向けて下り傾斜となるように形成して、突出
板部１３ａ，１３ｂが相対する他方の加熱部１０
ａ，１０ｂの下方を潜り抜けるように構成してあ
る。 In this embodiment, as shown in FIGS. 2 and 3, the upper edges of the protruding plate parts 13a and 13b are formed to be inclined downward in the protruding direction, so that the protruding plate parts 13a and 13b are The other heating section 10 facing
It is constructed so that it can pass under the points a and 10b.
第６図乃至第９図は、他の実施例を示すもので
ある。 6 to 9 show other embodiments.
この実施例は、上記の実施例と基本的に同じ構
成のもので、異なる点はＬ型の加熱片１１ａ，１
１ｂの下端縁を若干内側へ曲げて形成した突起縁
部１４を設けたことである。 This embodiment has basically the same configuration as the above embodiment, except that the L-shaped heating pieces 11a, 1
A protruding edge 14 formed by slightly bending the lower edge of 1b inward is provided.
この突起縁部１４を設けることによつて、第８
図及び第９図に示すように、半田づけ部分がチツ
プ部品４１の下に隠れているような場合でも、加
熱片１１ａ，１１ｂを半田づけ部分に容易に当接
することができる。 By providing this protruding edge 14, the eighth
As shown in FIG. 9 and FIG. 9, even if the soldered portion is hidden under the chip component 41, the heating pieces 11a, 11b can be easily brought into contact with the soldered portion.
又、チツプ部品４１を取り上げる際には、当該
突起縁部１４が引係りとして機能し、チツプ部品
４１の取り落しをより確実に防ぐことができる。 Further, when picking up the chip component 41, the protruding edge 14 functions as a catch, and the chip component 41 can be more reliably prevented from being dropped.
又、加熱片１１ａ，１１ｂがチツプ部品４１に
直接接触せず、例えば、リード線の先端部等に突
起縁部１４が接触するだけなので、チツプ部品４
１や基板に影響する熱ストレスをも軽減すること
ができる。 Furthermore, since the heating pieces 11a and 11b do not directly contact the chip component 41, and only the protruding edge 14 contacts the tip of the lead wire, for example, the chip component 4
It is also possible to reduce thermal stress that affects 1 and the substrate.
尚、上記２つの実施例では、何れも、電子部品
の取外しについて説明したが、取付け当つても本
考案の工具を用いることができる。 Incidentally, in both of the above two embodiments, explanation has been given regarding the removal of electronic components, but the tool of the present invention can also be used for attachment.
（考案の効果）
本考案によれば、コテの両把持部を片手で握
り、チツプ部品を両側面側から挟むように、左右
の加熱片を出会わせて、チツプ部品の四方を囲む
四角形を形成し、四方向のピン列の半田づけ部分
に同時に、当該加熱片の当接辺を当てて熱を加
え、同時に半田を溶解させた後、更に把持部を握
り締めてチツプ部品を出会方向に相対させた２つ
の基板部で確実に挟みつけ、そのまま基板から引
き外すことができる。(Effects of the invention) According to the invention, by gripping both grips of the iron with one hand and sandwiching the chip part from both sides, the left and right heating pieces meet to form a rectangle surrounding the chip part on all sides. Then, apply heat by applying the contact side of the heating piece to the soldered parts of the pin rows in four directions at the same time, melting the solder at the same time, and then tighten the grip further and move the chip parts relative to each other in the meeting direction. It can be reliably sandwiched between the two board parts and then removed from the board.
又、両方の加熱片が丁度出会つて、一方の加熱
片の突出板部が他方の加熱片の基板部の端に近接
した状態で形成される四角形よりも、更に小さい
チツプ部品に対しても本考案を使用することがで
きる。 Also, for chip parts that are smaller than the rectangle formed when both heating pieces exactly meet and the protruding plate part of one heating piece is close to the edge of the substrate part of the other heating piece. The invention can be used.
又、確実に挟みつけた状態で基板から引き外す
ことができるので、引き外しの途中で基板上に取
り落して、基板上の電子部品や配線等を損傷する
虞れがなく、取外し作業を迅速に行なうことがで
きる。 In addition, since it can be removed from the board while being securely clamped, there is no risk of it falling onto the board during removal and damaging the electronic components or wiring on the board, making the removal process faster. can be done.
又、半田づけの溶解度が不十分な部分が残つて
いたり、或いは、電子部品のピンやリード線等が
基板の孔に引かかつたりしていても、容易に引き
外しができる。 Furthermore, even if a portion of solder with insufficient solubility remains, or if a pin or lead wire of an electronic component is caught in a hole in the board, it can be easily removed.
更に又、本考案の工具は、上述のような取り外
しだけでなく、チツプ部品のピン列間の幅やピン
列の長さ等が異なる数種類の電子部品の取付に対
しても、１個の工具で使用することができる。 Furthermore, the tool of the present invention can be used not only for removal as described above, but also for the installation of several types of electronic components with different widths between pin rows of chip parts, lengths of pin rows, etc. It can be used in
図面は本考案の実施例を示すものにして、第１
図は平面図、第２図は側面図、第３図は一部拡大
平面図、第４図は一部拡大側面図、第５図は夫々
使用状態を示す拡大平面図である。第６図以下
は、他の実施例を示すものにして、第６図は一部
拡大平面図、第７図は一部拡大側面図、第８図及
び第９図は使用状態を示す説明図である。
１０ａ，１０ｂ……加熱部、１１ａ，１１ｂ…
…加熱片、１２ａ，１２ｂ……基板部（加熱片）、
１３ａ，１３ｂ……突出板部（加熱片）、１４…
…突起縁部、２０ａ，２０ｂ……ヒータ部、３０
ａ，３０ｂ……把持部、３１……軸、３２……ス
プリング、４１……チツプ（電子部品）、４２…
…ピン（リード線）。
The drawings show the embodiments of the present invention, and the drawings show the first embodiment.
2 is a side view, FIG. 3 is a partially enlarged plan view, FIG. 4 is a partially enlarged side view, and FIG. 5 is an enlarged plan view showing the state of use. Figure 6 and subsequent figures show other embodiments; Figure 6 is a partially enlarged plan view, Figure 7 is a partially enlarged side view, and Figures 8 and 9 are explanatory diagrams showing the state of use. It is. 10a, 10b... heating section, 11a, 11b...
...Heating piece, 12a, 12b...Substrate part (heating piece),
13a, 13b...Protruding plate portion (heating piece), 14...
...Protrusion edge, 20a, 20b...Heater part, 30
a, 30b...Gripper, 31...Shaft, 32...Spring, 41...Chip (electronic component), 42...
...Pin (lead wire).
Claims (1)
加熱部とを夫々備えた一対のコテから成り、上記
把持部を片手で握り締めたり緩めたりすることに
よつて、コテ先の両加熱部が互いに近づいたり離
れたりする構造の電子部品用半田コテに於て、 上記加熱部には夫々目的物に当接させられる板
状の加熱片を設け、 該加熱片は、コテの長さ方向と平行でその平面
が他方の加熱片の平面と出会い方向に相対に配さ
れた基板部と、両基板部の互いに異なる端から出
会い方向に突出された突出板部とから成り、 把持部を握り締め、両加熱片が丁度出会つた際
には四角形が形成され、更に接近させて行くと、
夫々の突出板部が他方の基板部の端を擦り逃げて
行き、遂には、両基板部が互いに当接するよう上
記両加熱片の加熱部に対する取り付け位置を水平
方向であつて出会い方向とは直角の方向に僅かに
ずらせた構成としたことを特徴とする電子部品用
半田コテ。[Scope of Claim for Utility Model Registration] It consists of a pair of irons each having a gripping part, a heater part, and a heating part heated by the heater part. In a soldering iron for electronic components having a structure in which both heating parts approach or separate from each other, each of the heating parts is provided with a plate-shaped heating piece that is brought into contact with the target object, and the heating piece is attached to the soldering iron. It consists of a substrate part parallel to the length direction of the heating piece and arranged opposite to each other in the direction in which its plane meets the plane of the other heating piece, and a protruding plate part protruding from mutually different ends of both substrate parts in the direction in which they meet, Grasp the grip and when both heating pieces meet exactly, a square will be formed, and as you bring them closer together,
Each of the protruding plate parts rubs against the edge of the other board part, and finally, the mounting positions of both heating pieces to the heating part are set horizontally and at right angles to the meeting direction, so that both board parts come into contact with each other. A soldering iron for electronic components characterized by having a configuration slightly shifted in the direction of.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986071474U JPH0233981Y2 (en) | 1986-05-13 | 1986-05-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986071474U JPH0233981Y2 (en) | 1986-05-13 | 1986-05-13 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62183972U JPS62183972U (en) | 1987-11-21 |
| JPH0233981Y2 true JPH0233981Y2 (en) | 1990-09-12 |
Family
ID=30914059
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986071474U Expired JPH0233981Y2 (en) | 1986-05-13 | 1986-05-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0233981Y2 (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10902939B2 (en) | 2017-01-10 | 2021-01-26 | Roswell Biotechnologies, Inc. | Methods and systems for DNA data storage |
| US11100404B2 (en) | 2017-10-10 | 2021-08-24 | Roswell Biotechnologies, Inc. | Methods, apparatus and systems for amplification-free DNA data storage |
| US11143617B2 (en) | 2017-05-09 | 2021-10-12 | Roswell Biotechnologies, Inc. | Binding probe circuits for molecular sensors |
| US11268123B2 (en) | 2017-04-25 | 2022-03-08 | Roswell Biotechnologies, Inc. | Enzymatic circuits for molecular sensors |
| US11371955B2 (en) | 2017-08-30 | 2022-06-28 | Roswell Biotechnologies, Inc. | Processive enzyme molecular electronic sensors for DNA data storage |
| US11624725B2 (en) | 2016-01-28 | 2023-04-11 | Roswell Blotechnologies, Inc. | Methods and apparatus for measuring analytes using polymerase in large scale molecular electronics sensor arrays |
| US11656197B2 (en) | 2017-01-19 | 2023-05-23 | Roswell ME Inc. | Solid state sequencing devices comprising two dimensional layer materials |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6120790Y2 (en) * | 1980-11-28 | 1986-06-21 | ||
| JPS5968668U (en) * | 1982-10-28 | 1984-05-09 | シャープ株式会社 | Handa “trowel” |
| JPS60113877U (en) * | 1984-01-06 | 1985-08-01 | 大宮化成株式会社 | removal tool |
| JPS60160976U (en) * | 1984-04-05 | 1985-10-25 | 株式会社ケンウッド | Multi-legged soldering iron for electrical parts |
-
1986
- 1986-05-13 JP JP1986071474U patent/JPH0233981Y2/ja not_active Expired
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11624725B2 (en) | 2016-01-28 | 2023-04-11 | Roswell Blotechnologies, Inc. | Methods and apparatus for measuring analytes using polymerase in large scale molecular electronics sensor arrays |
| US10902939B2 (en) | 2017-01-10 | 2021-01-26 | Roswell Biotechnologies, Inc. | Methods and systems for DNA data storage |
| US11656197B2 (en) | 2017-01-19 | 2023-05-23 | Roswell ME Inc. | Solid state sequencing devices comprising two dimensional layer materials |
| US11268123B2 (en) | 2017-04-25 | 2022-03-08 | Roswell Biotechnologies, Inc. | Enzymatic circuits for molecular sensors |
| US11143617B2 (en) | 2017-05-09 | 2021-10-12 | Roswell Biotechnologies, Inc. | Binding probe circuits for molecular sensors |
| US11371955B2 (en) | 2017-08-30 | 2022-06-28 | Roswell Biotechnologies, Inc. | Processive enzyme molecular electronic sensors for DNA data storage |
| US11100404B2 (en) | 2017-10-10 | 2021-08-24 | Roswell Biotechnologies, Inc. | Methods, apparatus and systems for amplification-free DNA data storage |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62183972U (en) | 1987-11-21 |
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