JPH0231876B2 - - Google Patents
Info
- Publication number
- JPH0231876B2 JPH0231876B2 JP58078744A JP7874483A JPH0231876B2 JP H0231876 B2 JPH0231876 B2 JP H0231876B2 JP 58078744 A JP58078744 A JP 58078744A JP 7874483 A JP7874483 A JP 7874483A JP H0231876 B2 JPH0231876 B2 JP H0231876B2
- Authority
- JP
- Japan
- Prior art keywords
- mold
- case
- wall
- thermoplastic plastic
- parison
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229920001169 thermoplastic Polymers 0.000 claims description 29
- 230000013011 mating Effects 0.000 claims description 14
- 238000004519 manufacturing process Methods 0.000 claims description 11
- 238000000071 blow moulding Methods 0.000 claims description 5
- 238000000034 method Methods 0.000 claims description 5
- 238000003860 storage Methods 0.000 claims description 4
- 239000012530 fluid Substances 0.000 claims description 3
- 238000005304 joining Methods 0.000 claims description 3
- 239000004033 plastic Substances 0.000 description 7
- 229920003023 plastic Polymers 0.000 description 7
- -1 polyethylene Polymers 0.000 description 6
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 239000004416 thermosoftening plastic Substances 0.000 description 4
- 239000004698 Polyethylene Substances 0.000 description 3
- 239000004743 Polypropylene Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229920000573 polyethylene Polymers 0.000 description 3
- 229920001155 polypropylene Polymers 0.000 description 3
- 229910001369 Brass Inorganic materials 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 2
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 239000010951 brass Substances 0.000 description 2
- 239000012792 core layer Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 239000012815 thermoplastic material Substances 0.000 description 1
Landscapes
- Casings For Electric Apparatus (AREA)
- Calculators And Similar Devices (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Description
【発明の詳細な説明】
［産業上の利用分野］
本発明は、パーソナルコンピユータ、ワードプ
ロセツサ、電気・電子計測器、電子楽器等を収納
する電磁波シールド性に特にすぐれた電子機器等
のケース、およびその製造方法に関するものであ
る。[Detailed Description of the Invention] [Industrial Field of Application] The present invention provides a case for electronic equipment, etc., which has particularly excellent electromagnetic shielding properties for housing personal computers, word processors, electrical/electronic measuring instruments, electronic musical instruments, etc. and its manufacturing method.
［従来の技術］
一般に、パーソナルコンピユータ、ワードプロ
セツサ、電気・電子計測器、電子楽器等の電子機
器は、その構成回路素子等から電磁波を出して外
部機器に電磁波障害を及ぼし、また、これらの電
子機器は外部から電磁波の影響を受けやすいの
で、そのケースとしては電磁波シールド性を備え
たものが要求される。[Prior Art] Generally, electronic devices such as personal computers, word processors, electrical/electronic measuring instruments, and electronic musical instruments emit electromagnetic waves from their constituent circuit elements, causing electromagnetic interference to external devices. Since electronic devices are easily affected by electromagnetic waves from the outside, their cases are required to have electromagnetic shielding properties.
従来、電磁波シールド性を備えた電子機器のケ
ースとしては、実開昭58−25098号公報に記載さ
れているものが知られている。 BACKGROUND ART Conventionally, as a case for an electronic device having electromagnetic shielding properties, the one described in Japanese Utility Model Application Publication No. 58-25098 is known.
［発明が解決しようとする課題］
ところで、上記公報に記載されている電子機器
のケースの構成は、プラスチツクで形成されたス
キン層内に電磁遮蔽効果を有するコア層を内装し
たものであるから、ケースが本体と蓋体からな
り、それらを合わせて収納部が構成されるもので
は、第５図に示すように、ケースの本体１０１と
蓋体１０２の合わせ面に、それらの肉厚を合わせ
た幅ｄだけコア層１０３の無い電磁波シールドが
全く施されない部分が生じ、その電磁波シールド
性を有しない部分から波長の極く短い電磁波が外
部に漏れてしまい、電子機器等の電磁波障害を完
全に防止することができないという問題点が指摘
されていた。[Problems to be Solved by the Invention] By the way, the configuration of the case of the electronic device described in the above publication is such that a core layer having an electromagnetic shielding effect is contained within a skin layer formed of plastic. If the case consists of a main body and a lid, and the storage section is constructed by combining them, as shown in FIG. There is a part with no electromagnetic shielding provided by the core layer 103 by the width d, and electromagnetic waves with very short wavelengths leak to the outside from the part that does not have electromagnetic shielding properties, completely preventing electromagnetic interference from electronic devices, etc. The problem was pointed out that it was not possible to do so.
本発明は、かかる問題点に鑑み、プラスチツク
の中空２重壁構造の本体と蓋体からなり、それら
を合わせて収納部が形成されるものであつても、
本体あるいは蓋体の如きケース部材のケース合わ
せ面の電磁波シールドを完全にし、もつて、波長
の極く短い電磁波よる電磁波障害を完全に防止す
ることができる電子機器等のケースおよびその製
造方法を提供することを目的とするものである。 In view of this problem, the present invention is made of a plastic hollow double-walled body and a lid, and even if they are combined to form a storage section,
To provide a case for electronic equipment, etc., which can completely shield the case mating surfaces of case members such as the main body or lid, and thereby completely prevent electromagnetic interference caused by electromagnetic waves with extremely short wavelengths, and a method for manufacturing the same. The purpose is to
［課題を解決するための手段］
本発明は、上記目的を達成するため、次の技術
的手段を採用した。すなわち、それは、
熱可塑性プラスチツクをブロー成形して中空２
重壁構造に形成された本体あるいは蓋体の如きケ
ース部材を合わせて収納部が形成されるケースで
あつて、電磁波シールド性の付与された熱可塑性
プラスチツクの内壁と、ブロー比の高い熱可塑性
プラスチツクの外壁とで構成され、内壁と外壁の
境界をケース合わせ面の外側周縁に形成したこと
を特徴とする電子機器等のケースであり、
一方の半円体が電磁波シールド性の付与された
熱可塑性プラスチツクからなり、他方の半円体が
ブロー比の高い熱可塑性プラスチツクからなる可
塑化状態のパリスンを押し出す第１工程、
凸形キヤビテイを有する一方の金型と凹形キヤ
ビテイを有する他方の金型からなる分割形式の一
対の金型を開き、一方の半円体を一方の金型の凸
形キヤビテイ側に、かつ他方の半円体が他方の金
型の凹形キヤビテイ側に位置させるとともに、一
方の半円体と他方の半円体との境界部を一方の金
型および他方の金型のキヤビテイ縁部より外方に
位置させる第２工程、
分割形式の一対の金型を閉じてパリスンを一対
の金型のキヤビテイ縁部で把持する第３工程、
パリスン内に圧力流体を導入して、パリスンを
一方の金型の凸形キヤビテイと他方の金型の凹形
キヤビテイの形状に沿うように膨張させることに
より、電磁波シールド性の付与された熱可塑性プ
ラスチツクの内壁と、ブロー比の高い熱可塑性プ
ラスチツクの外壁を成形するとともに、内壁と外
壁の接合境界をケースの合わせ面の外側周縁に形
成する第４工程、
の各工程を順に経て製造されることを特徴とする
電子機器等のケースの製造方法である。[Means for Solving the Problems] In order to achieve the above object, the present invention employs the following technical means. That is, it is made by blow molding thermoplastic to form a hollow 2
A case in which a storage section is formed by combining case members such as a main body or a lid formed with a heavy wall structure, and the inner wall is made of thermoplastic plastic with electromagnetic shielding properties and thermoplastic plastic with a high blow ratio. This is a case for electronic equipment, etc., characterized in that the boundary between the inner wall and the outer wall is formed at the outer periphery of the case mating surface, and one semicircle is made of thermoplastic material with electromagnetic shielding properties. A first step of extruding a parison in a plasticized state made of plastic, the other half of which is made of thermoplastic with a high blow ratio, from one mold having a convex cavity and the other mold having a concave cavity. A pair of split molds are opened, one semicircle is positioned on the convex cavity side of one mold, the other semicircle is located on the concave cavity side of the other mold, and one The second step is to position the boundary between the semicircular body and the other semicircular body outward from the cavity edges of one mold and the other mold, and close the pair of split molds to form a parison. The third step is to grip the parison by the cavity edges of the pair of molds, and by introducing pressure fluid into the parison, the parison is forced to conform to the shape of the convex cavity of one mold and the concave cavity of the other mold. By expanding it, an inner wall of thermoplastic plastic with electromagnetic shielding properties and an outer wall of thermoplastic plastic with a high blow ratio are formed, and the joining boundary between the inner wall and outer wall is formed at the outer periphery of the mating surface of the case. A method for manufacturing a case for an electronic device, etc., characterized in that the case is manufactured through the following steps in order: a fourth step;
［作 用］
本発明に係る電子機器等のケースは、前記のよ
うに構成されているので、中空２重壁構造に形成
された本体と蓋体の如きケース部材の合わせ面
で、ケース部材の電磁波シールド性の付与された
内壁がともに密接し、本体と蓋体の如きケース部
材のケース合わせ面の電磁波シールドが完全に施
される。このため、収納する電子機器等が波長の
極く短い電磁波を出すものであつても、その電磁
波による障害が完全に防止される。[Function] Since the case of the electronic device or the like according to the present invention is configured as described above, the case member is formed at the mating surface of the main body formed in the hollow double wall structure and the case member such as the lid. The inner walls provided with electromagnetic shielding properties are brought into close contact with each other, and the mating surfaces of the case members such as the main body and the lid are completely shielded from electromagnetic waves. Therefore, even if the electronic equipment or the like to be housed emits electromagnetic waves with extremely short wavelengths, interference caused by the electromagnetic waves is completely prevented.
そして、本発明に係る電子機器等のケースの製
造方法によれば、上記構成のケースが容易に製造
されるうえ、内壁を構成する熱可塑性プラスチツ
クに対して外壁を構成する熱可塑性プラスチツク
を高いブロー比のものとし、それらを各半円体と
したパリスンを押し出してブロー成形するので、
内外壁ともに肉厚の均一なケースが得られる。 According to the method of manufacturing a case for an electronic device or the like according to the present invention, a case having the above structure can be easily manufactured, and the thermoplastic plastic forming the outer wall is heated to a higher degree than the thermoplastic plastic forming the inner wall. The parisons are extruded and blow molded into semicircular shapes, so
A case with uniform wall thickness can be obtained on both the inner and outer walls.
［実施例］ 本発明の実施例を図面を参照して説明する。[Example] Embodiments of the present invention will be described with reference to the drawings.
第１図において、１はパーソナルコンピユータ
のケースであつて、このケース１は、本体２と蓋
体３からなり、本体２と蓋体３はヒンジ４によつ
て開閉自在に連設されていて、本体２と蓋体３は
合わせ面PLで接合状態に閉じられる構造となつ
ている。５はラツチ、６はラツチ受凸起である。
７はパーソナルコンピユータ８のキーボード、表
示部等の操作パネルである。 In FIG. 1, 1 is a case of a personal computer, and this case 1 consists of a main body 2 and a lid 3, and the main body 2 and the lid 3 are connected to each other by a hinge 4 so as to be openable and closable. The main body 2 and the lid 3 are structured to be closed in a joined state at a mating surface PL. 5 is a latch, and 6 is a latch receiving protrusion.
Reference numeral 7 denotes an operation panel such as a keyboard and a display section of the personal computer 8.
上記ケース１は、第２図に示すように、本体２
および蓋体３ともにブロー成形により中空２重壁
構造に構成されており、それぞれ内壁９は電磁波
シールド性の付与された熱可塑性プラスチツクで
構成され、外壁１０は電磁波シールド性の付与さ
れないブロー比の高い熱可塑性プラスチツクで構
成されている。そして、内壁９と外壁１０の境界
は、合わせ面PLの外側周縁に位置しており、本
体２と蓋体３の合わせ面PLでは本体２と蓋体１
０の内壁９が密接して、その部分の電磁波シール
ドが完全に施される。 The case 1 has a main body 2 as shown in FIG.
Both the lid body 3 and the lid body 3 have a hollow double-walled structure by blow molding, and the inner wall 9 is made of thermoplastic plastic with electromagnetic shielding properties, and the outer wall 10 is made of thermoplastic plastic with electromagnetic shielding properties and has a high blow ratio. Constructed of thermoplastic. The boundary between the inner wall 9 and the outer wall 10 is located at the outer periphery of the mating surface PL.
The inner wall 9 of 0 is in close contact with each other, and that part is completely shielded from electromagnetic waves.
次に前記本発明に係るケース１をブロー成形に
よつて製造する方法について説明する。 Next, a method for manufacturing the case 1 according to the present invention by blow molding will be described.
第３図および第４図に示すように、１１，１２
は分割形式の一対の金型であり、一方の金型１１
は凸形キヤビテイａを、他方の金型１２は凹形キ
ヤビテイｂを有しているものである。 As shown in FIGS. 3 and 4, 11, 12
are a pair of split-type molds, one of which is mold 11.
The mold 12 has a convex cavity a, and the other mold 12 has a concave cavity b.
この分割形式の一対の金型１１，１２を用いて
本発明に係るケース１を製造するには、まず、そ
れぞれの押出機（図示せず）で電磁波シールド性
の付与された熱可塑性プラスチツクおよび電磁波
シールド性の付与されないブロー比の高い熱可塑
性プラスチツクを溶融混練し、それぞれの押出機
に接続された押出ダイ（図示せず）内で接合し
て、一方の半円体１３ａが電磁波シールド性の付
与された熱可塑性プラスチツクからなり、かつ他
方の半円体１３ｂが電磁波シールド性の付与され
ないブロー比の高い熱可塑性プラスチツクからな
る可塑化状態のパリスン１３を押し出す。次い
で、凸形キヤビテイａを有する一方の金型１１と
凹形キヤビテイｂを有する他方の金型１２からな
る分割形式の一対の金型を開き、押し出したパリ
スン１３をその一方の半円体１３ａを一方の金型
１１の凸形キヤビテイａ側に、かつ他方の半円体
１３ｂを他方の金型１２の凹形キヤビテイｂ側に
配置させるとともに、一方の半円体１３ａと他方
の半円体１３ｂとの境界部を一方の金型１１およ
び他方の金型１２のキヤビテイ縁部ｃより外方に
位置させ、分割形式の一対の金型１１，１２を閉
じてパリスン１３を一対の金型のキヤビテイ縁部
ｃで把持する状態とする。なお、この把持状態と
するには、パリスン１３を予備的に膨らませるプ
リブロー、または大口径のパリスンを押し出す手
段によつて行われる。 In order to manufacture the case 1 according to the present invention using the pair of split molds 11 and 12, first, each extruder (not shown) is used to make a thermoplastic plastic with electromagnetic shielding properties and a Thermoplastic plastics with a high blow ratio that do not provide shielding properties are melt-kneaded and joined in extrusion dies (not shown) connected to respective extruders, so that one semicircular body 13a has electromagnetic shielding properties. The parison 13 is extruded in a plasticized state, and the other semicircular body 13b is made of a thermoplastic having a high blow ratio and is not provided with electromagnetic wave shielding properties. Next, a pair of split molds consisting of one mold 11 having a convex cavity a and the other mold 12 having a concave cavity b are opened, and the extruded parison 13 is separated into one semicircular body 13a. The semicircular body 13b is arranged on the convex cavity a side of one mold 11 and the concave cavity b side of the other mold 12, and the one semicircular body 13a and the other semicircular body 13b The boundary between the molds 11 and 12 is located outward from the cavity edge c of the mold 11 and the other mold 12, and the pair of split molds 11 and 12 are closed to insert the parison 13 into the cavity of the pair of molds. It is in a state where it is gripped by the edge c. Note that this gripping state is achieved by a pre-blow that preliminarily inflates the parison 13 or by means of pushing out a large-diameter parison.
次に、金型１１，１２で囲まれたパリスン１３
内に圧縮空気等の圧力流体を導入して、パリスン
１３を一方の金型１１の凸形キヤビテイａと他方
の金型１２の凹形キヤビテイｂの形状に沿うよう
に膨張させ、電磁波シールド性の付与された熱可
塑性プラスチツクの内壁９と、電磁波シールド性
の付与されないブロー比の高い熱可塑性プラスチ
ツクの外壁１０を成形するとともに、内壁９と外
壁１０の接合境界をケースの合わせ面の外側周縁
に形成した本体２が得られる。蓋体３も本体２と
同様の工程で成形され、第２図に示すように同構
成のものが得られる。 Next, the parison 13 surrounded by the molds 11 and 12
A pressure fluid such as compressed air is introduced into the interior of the mold 11 to expand the parison 13 along the shapes of the convex cavity a of one mold 11 and the concave cavity b of the other mold 12, thereby achieving electromagnetic shielding properties. The provided inner wall 9 of thermoplastic plastic and the outer wall 10 of thermoplastic plastic with a high blow ratio that is not provided with electromagnetic shielding properties are molded, and the joining boundary between the inner wall 9 and the outer wall 10 is formed at the outer periphery of the mating surfaces of the case. A main body 2 is obtained. The lid 3 is also molded in the same process as the main body 2, and has the same structure as shown in FIG.
なお、第１図に示すように、本体２と蓋体３が
ヒンジ４で一体に連設されたケース１とするに
は、パリスンの押出方向の略中間を金型内の突起
により圧縮薄肉化してヒンジを形成するととも
に、ヒンジの両側に位置するパリスンを膨張させ
ることにより、本体２と蓋体３を成形すればよい
（特公昭49−18748号公報参照）。 As shown in Fig. 1, in order to obtain a case 1 in which the main body 2 and the lid 3 are integrally connected by a hinge 4, the approximately middle part of the parison in the extrusion direction is compressed and thinned by a protrusion in the mold. The main body 2 and the lid 3 may be formed by forming a hinge and expanding the parisons located on both sides of the hinge (see Japanese Patent Publication No. 49-18748).
内壁９を構成する電磁波シールド性の付与され
た熱可塑性プラスチツクは、ポリエチレン、ポリ
プロピレン、ポリアミド、ABS樹脂等のブロー
成形可能なプラスチツクに、フアイバー、フレー
クまたはパウダー状のカーボン、鉄、黄銅または
アルミニウムを混合してなる材料、あるいは、プ
ラスチツク自体が電磁波シールド性を有する材料
である。例えば、熱可塑性プラスチツク（例え
ば、ポリエチレン、ポリプロピレン等のポリオレ
フイン）100重量部に対し、太さ50〜160μ、長さ
１〜４mmの鉄、黄銅またはアルミニウム繊維を10
〜40重量部混合してなる材料を用いるのが、押出
機混錬性、ダイ内接合性、ブロー成形性および電
磁波シールド特性上好ましい。なお、その材料の
体積固有抵抗値は１Ω・cm以下、好ましくは１×
10-2Ω・cm以下である。 The electromagnetic shielding thermoplastic plastic that constitutes the inner wall 9 is a blow-moldable plastic such as polyethylene, polypropylene, polyamide, ABS resin, etc. mixed with fiber, flake, or powdered carbon, iron, brass, or aluminum. or plastic itself is a material that has electromagnetic shielding properties. For example, for 100 parts by weight of thermoplastic plastic (e.g., polyolefin such as polyethylene or polypropylene), add 10 parts of iron, brass, or aluminum fiber with a thickness of 50 to 160 μm and a length of 1 to 4 mm.
It is preferable to use a material obtained by mixing up to 40 parts by weight in terms of extruder kneading properties, in-die bondability, blow moldability, and electromagnetic shielding properties. In addition, the volume resistivity value of the material is 1Ω・cm or less, preferably 1×
10 -2 Ω・cm or less.
また、外壁１０を構成する電磁波シールド性の
付与されないブロー比の高い熱可塑性プラスチツ
クは、ポリエチレン、ポリプロピレン、ポリアミ
ド、ABS樹脂等のブロー成形可能なプラスチツ
クであつて可塑化状態の伸性にすぐれたものであ
り、灰色、赤色、青色、黄色等、黒色以外の顔料
を混合してなるものが外観特性の面において好ま
しい。なお、この電磁波シールド性の付与されな
いブロー比の高い熱可塑性プラスチツクの体積固
有抵抗値は105〜1020Ω・cmである。 In addition, the thermoplastic plastic with a high blow ratio that is not provided with electromagnetic shielding properties and which constitutes the outer wall 10 is a blow moldable plastic such as polyethylene, polypropylene, polyamide, ABS resin, etc., and has excellent extensibility in a plasticized state. From the viewpoint of appearance characteristics, it is preferable to use a mixture of pigments other than black, such as gray, red, blue, and yellow. Note that the volume resistivity value of this thermoplastic plastic with a high blow ratio that is not provided with electromagnetic shielding properties is 10 5 to 10 20 Ω·cm.
以上説明した本発明に係る電子機器等のケース
の製造方法によれば、第１図および第２図に示し
たように、本体２と蓋体３の合わせ面PLでは本
体２と蓋体３の内壁９が密接して、その部分の電
磁波シールドが完全に施されるケース１が容易に
製造されるうえ、内壁９を構成する熱可塑性プラ
スチツクに対して外壁１０を構成する熱可塑性プ
ラスチツクを高いブロー比のものとし、それらを
各半円体としたパリスンを押し出してブロー成形
するので、内外壁９，１０ともに肉厚の均一なケ
ースが得られる。 According to the method of manufacturing a case for an electronic device or the like according to the present invention described above, as shown in FIGS. 1 and 2, the mating surface PL of the main body 2 and the lid 3 is The case 1 in which the inner wall 9 is in close contact with each other and the area is completely shielded from electromagnetic waves can be easily manufactured, and the thermoplastic plastic forming the outer wall 10 can be blow-blown to a higher degree than the thermoplastic plastic forming the inner wall 9. Since the semicircular parisons are extruded and blow molded, a case with uniform wall thickness for both the inner and outer walls 9 and 10 can be obtained.
［発明の効果］
本発明に係る電子機器等のケースによれば、プ
ラスチツクの中空２重壁構造の本体あるいは蓋体
の如きケース部材からなり、それらを合わせて収
納部が形成されるものであつても、本体あるいは
蓋体の如きケース部材のケース合わせ面の電磁波
シールドを完全にして、波長の極く短い電磁波よ
る電磁波障害を完全に防止することができる効果
が得られる。[Effects of the Invention] According to the case for electronic equipment or the like according to the present invention, the case is made of a case member such as a hollow double-walled plastic main body or a lid body, and the housing section is formed by combining these case members. Even if the case mating surface of the case member such as the main body or the lid is completely shielded from electromagnetic waves, electromagnetic interference caused by electromagnetic waves with extremely short wavelengths can be completely prevented.
さらに、本発明に係る電子機器等のケースの製
造方法によれば、本体あるいは蓋体の如きケース
部材のケース合わせ面の電磁波シールドを完全に
して、波長の極く短い電磁波よる電磁波障害を完
全に防止することができる電子機器等のケースを
容易に得ることができるうえ、内外壁ともに肉厚
の均一なケースを得ることができる。 Further, according to the method of manufacturing a case for an electronic device, etc. according to the present invention, the electromagnetic wave shielding of the case mating surface of the case member such as the main body or the lid is completely completed, and electromagnetic interference caused by electromagnetic waves with extremely short wavelengths is completely prevented. It is possible to easily obtain a case for an electronic device or the like that can prevent the above-mentioned damage, and also to obtain a case with uniform wall thickness on both the inner and outer walls.
第１図は本発明に係る電子機器等のケースの斜
視図、第２図は第１図の要部断面図、第３図およ
び第４図は本発明に係る電子機器等のケースをブ
ロー成形により製造する工程を示す金型の横断面
図であつて、第３図は開かれた金型間にパリスン
を配置した態様を示し、第４図は金型を閉じてパ
リスン膨らませた態様を示している。第５図は従
来の電子機等のケースを示す一部の縦断面図であ
る。
１…電子機器等のケース、２…本体、３…蓋
体、９…内壁、１０…外壁、１１，１２…一対の
金型、ａ…凸形キヤビテイ、ｂ…凹形キヤビテ
イ、１３…パリスン、１３ａ…その一方の半円
体、１３ｂ…他方の半円体、PL…合わせ面。
FIG. 1 is a perspective view of a case for an electronic device, etc. according to the present invention, FIG. 2 is a sectional view of the main part of FIG. 1, and FIGS. 3 and 4 are blow molding of a case for an electronic device, etc. according to the present invention. FIG. 3 is a cross-sectional view of a mold showing the manufacturing process, in which FIG. 3 shows a state in which a parison is placed between the opened molds, and FIG. 4 shows a state in which the mold is closed and the parison is inflated. ing. FIG. 5 is a longitudinal sectional view of a part of a case of a conventional electronic device. DESCRIPTION OF SYMBOLS 1... Case for electronic equipment, etc., 2... Main body, 3... Lid, 9... Inner wall, 10... Outer wall, 11, 12... Pair of molds, a... Convex cavity, b... Concave cavity, 13... Parison, 13a...one semicircle, 13b...the other semicircle, PL...mating surface.
Claims (1)
２重壁構造に形成された本体あるいは蓋体の如き
ケース部材を合わせて収納部が形成されるケース
であつて、電磁波シールド性の付与された熱可塑
性プラスチツクの内壁と、ブロー比の高い熱可塑
性プラスチツクの外壁とで構成され、内壁と外壁
の境界をケース合わせ面の外側周縁に形成したこ
とを特徴とする電子機器等のケース。 ２ 一方の半円体が電磁波シールド性の付与され
た熱可塑性プラスチツクからなり、他方の半円体
がブロー比の高い熱可塑性プラスチツクからなる
可塑化状態のパリスンを押し出す第１工程、 凸形キヤビテイを有する一方の金型と凹形キヤ
ビテイを有する他方の金型からなる分割形式の一
対の金型を開き、一方の半円体を一方の金型の凸
形キヤビテイ側に、かつ他方の半円体が他方の金
型の凹形キヤビテイ側に位置させるとともに、一
方の半円体と他方の半円体との境界部を一方の金
型および他方の金型のキヤビテイ縁部より外方に
位置させる第２工程、 分割形式の一対の金型を閉じてパリスンを一対
の金型のキヤビテイ縁部で把持する第３工程、 パリスン内に圧力流体を導入して、パリスンを
一方の金型の凸形キヤビテイと他方の金型の凹形
キヤビテイの形状に沿うように膨張させることに
より、電磁波シールド性の付与された熱可塑性プ
ラスチツクの内壁と、ブロー比の高い熱可塑性プ
ラスチツクの外壁を成形するとともに、内壁と外
壁の接合境界をケースの合わせ面の外側周縁に形
成する第４工、 の各工程を順に経て製造されることを特徴とする
電子機器等のケースの製造方法。[Scope of Claims] 1. A case in which a storage portion is formed by combining case members such as a main body or a lid body formed into a hollow double-walled structure by blow molding thermoplastic plastic, which has electromagnetic shielding properties. A case for electronic equipment, etc., comprising an inner wall made of a thermoplastic plastic and an outer wall made of a thermoplastic plastic with a high blow ratio, the boundary between the inner wall and the outer wall being formed at the outer periphery of a case mating surface. 2. The first step is to extrude the parison in a plasticized state, in which one semicircle is made of thermoplastic plastic with electromagnetic shielding properties and the other semicircular body is made of thermoplastic plastic with a high blow ratio. A pair of split-type molds consisting of one mold with a concave cavity and the other mold with a concave cavity are opened, one semicircle is placed on the convex cavity side of one mold, and the other semicircle is placed on the convex cavity side of one mold. is located on the concave cavity side of the other mold, and the boundary between one semicircle and the other semicircle is located outward from the cavity edges of one mold and the other mold. The second step is to close the pair of split-type molds and hold the parison at the cavity edges of the pair of molds.The third step is to introduce pressure fluid into the parison to shape the parison into the convex shape of one of the molds. By expanding the mold to follow the shape of the cavity and the concave cavity of the other mold, an inner wall of thermoplastic plastic with electromagnetic shielding properties and an outer wall of thermoplastic plastic with a high blow ratio are formed. A method for manufacturing a case for an electronic device, etc., characterized in that the manufacturing method comprises sequentially performing the following steps: a fourth step of forming a joining boundary between the outer wall and the outer wall of the case at the outer periphery of the mating surface of the case.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58078744A JPS59204299A (en) | 1983-05-04 | 1983-05-04 | Case of electronic device or the like |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58078744A JPS59204299A (en) | 1983-05-04 | 1983-05-04 | Case of electronic device or the like |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59204299A JPS59204299A (en) | 1984-11-19 |
| JPH0231876B2 true JPH0231876B2 (en) | 1990-07-17 |
Family
ID=13670392
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58078744A Granted JPS59204299A (en) | 1983-05-04 | 1983-05-04 | Case of electronic device or the like |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59204299A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20160084769A (en) * | 2015-01-06 | 2016-07-14 | 주식회사 삼육오엠씨네트웍스 | Remote control available exercise system |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60140796A (en) * | 1983-12-27 | 1985-07-25 | シャープ株式会社 | Electronic device unit using conductive plastic frame |
| JPS6350096A (en) * | 1986-08-20 | 1988-03-02 | フアナツク株式会社 | Cubicle for electronic equipment |
| JPH0745794Y2 (en) * | 1989-10-27 | 1995-10-18 | 大日本印刷株式会社 | IC card socket |
| JP2015046464A (en) * | 2013-08-28 | 2015-03-12 | 株式会社オートネットワーク技術研究所 | Housing for electrical equipment of automobile, and electrical equipment of automobile |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5825098B2 (en) * | 1974-03-22 | 1983-05-25 | ロ−ム アンド ハ−ス カンパニ− | Polyene Kabinyl Foam Fragile Polyene Kabinyl Foam Oshidashihou Oyobi Fragile Polyene Kabinyl Foam |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5825098U (en) * | 1981-08-12 | 1983-02-17 | 株式会社東芝 | electronic equipment housing |
-
1983
- 1983-05-04 JP JP58078744A patent/JPS59204299A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5825098B2 (en) * | 1974-03-22 | 1983-05-25 | ロ−ム アンド ハ−ス カンパニ− | Polyene Kabinyl Foam Fragile Polyene Kabinyl Foam Oshidashihou Oyobi Fragile Polyene Kabinyl Foam |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20160084769A (en) * | 2015-01-06 | 2016-07-14 | 주식회사 삼육오엠씨네트웍스 | Remote control available exercise system |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59204299A (en) | 1984-11-19 |
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