JPH0231802Y2 - - Google Patents
Info
- Publication number
- JPH0231802Y2 JPH0231802Y2 JP1985158095U JP15809585U JPH0231802Y2 JP H0231802 Y2 JPH0231802 Y2 JP H0231802Y2 JP 1985158095 U JP1985158095 U JP 1985158095U JP 15809585 U JP15809585 U JP 15809585U JP H0231802 Y2 JPH0231802 Y2 JP H0231802Y2
- Authority
- JP
- Japan
- Prior art keywords
- porous
- holes
- dielectric material
- boards
- intervening
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000003989 dielectric material Substances 0.000 claims description 33
- 239000011347 resin Substances 0.000 claims description 32
- 229920005989 resin Polymers 0.000 claims description 32
- -1 polytetrafluoroethylene Polymers 0.000 claims description 13
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 13
- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 13
- 239000012790 adhesive layer Substances 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 3
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 18
- 239000000853 adhesive Substances 0.000 description 9
- 230000001070 adhesive effect Effects 0.000 description 9
- 239000010410 layer Substances 0.000 description 7
- 230000000694 effects Effects 0.000 description 3
- 238000005187 foaming Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000001934 delay Effects 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
Description
【考案の詳細な説明】
［産業上の利用分野］
この考案は、複数のプリント板の間や、ある程
度多層化された複数の多層プリント板の間に挿入
される間挿誘電体に関し、更に詳しくは、信号伝
搬遅延時間の小さな、高速信号用プリント配線板
或いはプリント回路板を多層化するために用いる
間挿誘電体であり、これを用いることにより、信
号伝搬遅延時間の遅延を改善するものである。[Detailed description of the invention] [Industrial application field] This invention relates to an intervening dielectric inserted between multiple printed boards or between multiple multilayer printed boards that are multilayered to some extent. This is an intercalated dielectric material that has a small delay time and is used for high-speed signal printed wiring boards or multilayer printed circuit boards, and its use improves the signal propagation delay time.
［従来の技術］
IC或いはLSI技術の進歩に伴い、これらを用い
る電子機器においても、プリント回路板或いはプ
リント配線板自体の信号の高速化は実現されてい
る。しかしながら、特に近年に至り、多層化が賞
用されているので、多層プリント板においても信
号の高速化が要望されているが、その場合、多層
化される複数のプリント板間に挿入する間挿誘電
体が、信号伝搬の遅延の一つの因子として問題に
なつている。[Prior Art] With the progress of IC or LSI technology, even in electronic devices using these technologies, high-speed signals of printed circuit boards or printed wiring boards themselves have been realized. However, especially in recent years, multilayering has been gaining popularity, and there is a demand for higher signal speeds even in multilayer printed boards. Dielectric materials have become a problem as one factor in signal propagation delay.
特に、信号伝搬遅延時間の小さな、高速信号用
プリント配線板或いはプリント回路板を多層化す
るために用いる間挿誘電体はその影響が大きい。 In particular, this has a large effect on printed wiring boards for high-speed signals, which have a small signal propagation delay time, or on intervening dielectric materials used for multilayering printed circuit boards.
［考案が解決しようとする課題］
この点に鑑みこの考案は、間挿誘電体の介在に
よつても、信号伝搬の遅延を増大させることの無
い多層プリント板用間挿誘電体を提供することを
目的とする。[Problem to be solved by the invention] In view of this point, the object of this invention is to provide an intervening dielectric for a multilayer printed board that does not increase signal propagation delay even with the interposition of the intervening dielectric. With the goal.
［課題を解決するための手段］
このためこの考案によれば、複数のプリント板
間に挿入される間挿誘電体において、多数の貫通
穴を設けた四弗化エチレン樹脂製の貫通穴付き多
孔質間挿誘電体を用い、且つこの貫通穴付き多孔
質間挿誘電体の両面に、全面若しくは前記の貫通
穴の複数にそれぞれに充填せしめる接着層を設け
て形成したことを特徴とする多層プリント板用間
挿誘電体を構成する。[Means for Solving the Problem] Therefore, according to this invention, in an intervening dielectric inserted between a plurality of printed boards, a porous through-hole made of polytetrafluoroethylene resin with a large number of through-holes is provided. A multilayer print characterized in that it is formed using a porous intercalated dielectric material with through-holes, and an adhesive layer is provided on both sides of the porous intercalated dielectric material with through-holes, which fills the entire surface or a plurality of the through-holes. Constitutes an intervening dielectric for the plate.
この構成において、四弗化エチレン樹脂製の貫
通穴付き多孔質間挿誘電体として、延伸多孔質四
弗化エチレン樹脂や、発泡等による多孔質四弗化
エチレン樹脂等を用いれば、誘電率がさらに低く
なり伝搬遅延時間を増大させないばかりか、熱的
或いは化学的にも安定であるので好都合である。 In this configuration, if stretched porous tetrafluoroethylene resin or porous tetrafluoroethylene resin made by foaming etc. is used as the porous intercalated dielectric material with through holes made of tetrafluoroethylene resin, the dielectric constant can be increased. This is advantageous because it not only does not increase the propagation delay time but also is thermally or chemically stable.
［作用］
この考案によれば、複数のプリント板の間に
は、多数の貫通穴を設けた四弗化エチレン樹脂製
の貫通穴付き多孔質間挿誘電体が配されているた
め、間挿誘電体が多孔質である上に更に多数の貫
通穴を設けているので、その誘電率がプリント板
より充分低いものとなり多層プリント板用間挿誘
電体の介在によつても信号の伝搬遅延時間を増大
させることが無くなる。[Function] According to this invention, a porous intervening dielectric material with through holes made of polytetrafluoroethylene resin having a large number of through holes is disposed between a plurality of printed boards. Since it is porous and has a large number of through holes, its dielectric constant is sufficiently lower than that of the printed board, and even with the intervening dielectric material for multilayer printed boards, the signal propagation delay time is increased. There will be nothing left to do.
またこの考案において、多数の貫通穴を設けた
四弗化エチレン樹脂製の貫通穴付き多孔質間挿誘
電体とプリント板との結合保持のための接着層或
いは接着剤をこの貫通穴付き多孔質間挿誘電体の
表面の全面に設けることもできるし、また、この
接着層或いは接着剤をこの貫通穴付き多孔質間挿
誘電体の表面に点状に配し、特に周縁部のみに設
けるようにすれば、回路或いは配線部分近傍の誘
電率を増大させることが無く、信号伝搬遅延時間
を増大させることなく結合保持できるものもでき
る。 In addition, in this invention, an adhesive layer or adhesive for maintaining the bond between the porous intervening dielectric material made of polytetrafluoroethylene resin with many through holes and the printed board is applied to the porous material with through holes. It is possible to provide the adhesive layer or adhesive on the entire surface of the intercalated dielectric material, or it is possible to provide this adhesive layer or adhesive in dots on the surface of the porous intervening dielectric material with through holes, and in particular, to provide it only on the periphery. By doing so, it is possible to maintain coupling without increasing the dielectric constant near the circuit or wiring portion and without increasing the signal propagation delay time.
また、この場合、貫通穴の複数は接着剤が充填
されて点状に存在することにより、貫通穴付き多
孔質間挿誘電体のつぶれ防止の役割としても作用
する。 Furthermore, in this case, the plurality of through holes are filled with adhesive and exist in a dotted manner, which also serves to prevent the porous intercalated dielectric material with through holes from being crushed.
［実施例］
第１図はこの考案の一実施例による多層プリン
ト板用間挿誘電体を用いた多層プリント板１の縦
断面図である。[Embodiment] FIG. 1 is a longitudinal sectional view of a multilayer printed board 1 using an interposed dielectric material for a multilayer printed board according to an embodiment of this invention.
この多層プリント板１は、三枚のプリント板
２，３，４が、接着剤を含浸した多数の貫通穴を
設けた四弗化エチレン樹脂製の貫通穴付き多孔質
間挿誘電体５からなる多層プリント板用間挿誘電
体によつて接着結合保持され、プリント板４とプ
リント板６とは表面に接着剤７を点状に設けた多
数の貫通穴を設けた四弗化エチレン樹脂製の貫通
穴付き多孔質間挿誘電体８からなる多層プリント
板用間挿誘電体によつて接着結合されている。 This multilayer printed board 1 consists of three printed boards 2, 3, and 4 made of a porous intervening dielectric material 5 made of polytetrafluoroethylene resin and having many through holes impregnated with adhesive. The printed boards 4 and 6 are adhesively bonded and held together by intervening dielectrics for multilayer printed boards, and the printed boards 4 and 6 are made of tetrafluoroethylene resin and have numerous through holes with adhesive 7 dotted on their surfaces. They are adhesively bonded by a multilayer printed circuit board intervening dielectric material consisting of a porous intervening dielectric material 8 with through holes.
ここでプリント板２，３，４，６としては、信
号伝搬遅延時間の小さな、高速信号用プリント配
線板或いはプリント回路板を示し、例えば特願昭
59−72472号に記載の「四弗化エチレン樹脂層に
沿つて多孔質四弗化エチレン樹脂を備えるプリン
ト基板」や、特願昭59−83308号に記載の「導電
回路に沿つて延伸多孔質四弗化エチレン樹脂層を
設けてあるプリント基板」や、実願昭59−169574
号に記載の「導電回路層と、この導電回路層にそ
つて設けられる多孔質四弗化エチレン樹脂層と、
前記導電回路層と前記多孔質四弗化エチレン樹脂
層との間に設けられ、前記多孔質四弗化エチレン
樹脂より融点の低い弗素樹脂よりなる溶融接着層
とを備えるプリント基板」などの弗素樹脂系プリ
ント基板を好適に用いることができる。 Here, the printed boards 2, 3, 4, and 6 are printed wiring boards for high-speed signals or printed circuit boards with a small signal propagation delay time.
No. 59-72472, "Printed circuit board with porous polytetrafluoroethylene resin along the polytetrafluoroethylene resin layer," and Japanese Patent Application No. 59-83308, "Stretched porous resin along the conductive circuit.""Printed circuit board with a polytetrafluoroethylene resin layer" and Utility Application 169574
"A conductive circuit layer and a porous tetrafluoroethylene resin layer provided along this conductive circuit layer,"
A fluororesin such as a printed circuit board comprising a molten adhesive layer provided between the conductive circuit layer and the porous tetrafluoroethylene resin layer and made of a fluororesin having a melting point lower than that of the porous tetrafluoroethylene resin. A system printed circuit board can be suitably used.
また、四弗化エチレン樹脂製の貫通穴付き多孔
質間挿誘電体５，８としては、通常の多孔質四弗
化エチレン樹脂だけではなく、例えば特公昭51−
18991号公報に記載の方法によつて得られる延伸
多孔質四弗化エチレン樹脂を極めて好適に用いる
ことができる。その他、発泡等の手段によつて形
成された多孔質四弗化エチレン樹脂を好適に用い
ることができる。 In addition, as the porous intervening dielectric bodies 5 and 8 with through holes made of tetrafluoroethylene resin, not only ordinary porous tetrafluoroethylene resin but also, for example,
Stretched porous tetrafluoroethylene resin obtained by the method described in Japanese Patent No. 18991 can be used very suitably. In addition, porous tetrafluoroethylene resin formed by means such as foaming can be suitably used.
かくして、この四弗化エチレン樹脂製の貫通穴
付き多孔質間挿誘電体５，８が、プリント板２，
３，４，６の間に介在して場合でも、信号伝搬の
遅延を増大させることが無い多層プリント板１を
得ることができる。 In this way, the porous intervening dielectric bodies 5 and 8 made of tetrafluoroethylene resin are connected to the printed boards 2 and 8.
It is possible to obtain a multilayer printed board 1 that does not increase delay in signal propagation even when the multilayer printed circuit board 1 is interposed between 3, 4, and 6.
第２図は、多数の貫通穴を設けた四弗化エチレ
ン樹脂製の貫通穴付き多孔質間挿誘電体８の側面
図である。 FIG. 2 is a side view of a porous intervening dielectric material 8 made of tetrafluoroethylene resin with a large number of through holes.
この多数の貫通穴を設けた四弗化エチレン樹脂
製の貫通穴付き多孔質間挿誘電体８は、多孔質基
材に多数の貫通孔１１を更に設けてなり、周縁部
のみに例えば商品名「ルミフロン」等の弗素樹脂
系接着剤からなる点状接着剤７が設けられてい
る。このように周縁部のみで、しかも点状に接着
結合するようにすれば、プリント配線部や回路部
近傍の誘電率を高めることが無く、好適にプリン
ト板を接着結合することができる。 This porous intervening dielectric material 8 made of polytetrafluoroethylene resin having a large number of through holes is further provided with a large number of through holes 11 in the porous base material, and has a product name such as A dotted adhesive 7 made of a fluororesin adhesive such as "Lumiflon" is provided. If adhesive bonding is performed only at the peripheral edge portion and in a dotted manner in this way, the printed boards can be suitably adhesive bonded without increasing the dielectric constant near the printed wiring portion or the circuit portion.
第３図はこの考案による多層プリント板用間挿
誘電体の他の実施例を示す側面図である。 FIG. 3 is a side view showing another embodiment of the interposed dielectric material for a multilayer printed board according to this invention.
第３図に示す四弗化エチレン樹脂間製の貫通穴
付き多孔質間挿誘電体９からなる多層プリント板
用間挿誘電体の場合、四弗化エチレン樹脂間製の
多孔質基材に更に打ち抜きやレーザー加工による
多数の貫通穴１１を設け、その両面の全面に接着
層１０を設けた例が示されている。 In the case of the interlayer dielectric material for a multilayer printed board consisting of the porous intervening dielectric material 9 with through holes made between the polytetrafluoroethylene resin and the porous base material made from the polytetrafluoroethylene resin shown in FIG. An example is shown in which a large number of through holes 11 are provided by punching or laser processing, and an adhesive layer 10 is provided on the entire surface of both surfaces.
尚、この考案は上記実施例に限定されるもので
は無く、例えば、相互間に多数の貫通穴を設けた
四弗化エチレン樹脂製の貫通穴付き多孔質間挿誘
電体からなる多層プリント板用間挿誘電体を挟ん
だ複数のプリント板を他の絶縁板で挟んでボルト
締め支持したり、或いはまた多数の貫通穴を設け
た四弗化エチレン樹脂製の貫通穴付き多孔質間挿
誘電体からなる多層プリント板用間挿誘電体の表
面に両面テープ状接着層を設ける等、この考案の
思想の範囲内で種々変更実施することができる。 Note that this invention is not limited to the above-mentioned embodiments, and for example, it can be applied to a multilayer printed board made of a porous intervening dielectric material made of polytetrafluoroethylene resin and having a large number of through holes between each other. Multiple printed boards with intercalated dielectrics sandwiched between other insulating boards and supported by bolts, or porous interpolated dielectrics made of tetrafluoroethylene resin with many through holes. Various modifications can be made within the scope of the idea of this invention, such as providing a double-sided tape-like adhesive layer on the surface of an intervening dielectric material for a multilayer printed board consisting of the following.
［考案の効果］
この考案によれば、複数のプリント板や、ある
程度多層化された複数の多層プリント板の間に、
多数の貫通穴を設けた四弗化エチレン樹脂間製の
貫通穴付き多孔質間挿誘電体からなる多層プリン
ト板用間挿誘電体を挟んで多層化されるものであ
るので、プリント板の周囲が誘電率の低い多孔質
四弗化エチレン樹脂製の貫通穴付き多孔質間挿誘
電体で覆われて支持されることとなり、多孔質間
挿誘電体の介在によつても信号伝搬に不都合な遅
延を生ずることが無くなり、高速信号多層プリン
ト板の信頼性が高まり、実用上の効果大なるもの
がある。特に四弗化エチレン樹脂製の貫通穴付き
多孔質間挿誘電体として、延伸多孔質四弗化エチ
レン樹脂や、発泡等による多孔質四弗化エチレン
樹脂等を用いれば、誘電率がさらに低くなり、良
好な信号伝送が達せられるばかりか、化学的、物
理的にも安定であるので、信頼性の高い多層プリ
ント板が得られる。[Effect of the invention] According to this invention, between multiple printed boards or multiple multilayer printed boards that are multilayered to some extent,
Since it is multi-layered with a porous intervening dielectric material made of polytetrafluoroethylene resin having a large number of through holes in between, the surrounding area of the printed board is is covered and supported by a porous intervening dielectric material with through holes made of porous tetrafluoroethylene resin with a low dielectric constant. This eliminates delays, increases the reliability of high-speed signal multilayer printed circuit boards, and has great practical effects. In particular, if expanded porous tetrafluoroethylene resin or porous tetrafluoroethylene resin made by foaming etc. is used as the porous intercalated dielectric material with through holes made of tetrafluoroethylene resin, the dielectric constant can be further lowered. Not only does it achieve good signal transmission, but it is also chemically and physically stable, so a highly reliable multilayer printed board can be obtained.
第１図はこの考案の一実施例による多層プリン
ト板用間挿誘電体を用いた多層プリント板の縦断
面図、第２図及び第３図はそれぞれ、この考案の
異なる実施例による多層プリント板用間挿誘電体
の側面図である。
１：多層プリント板、２，３，４，６：プリン
ト板、８，９：貫通穴付き多孔質間挿誘電体、１
１：貫通穴。
FIG. 1 is a vertical cross-sectional view of a multilayer printed board using an intervening dielectric material for a multilayer printed board according to one embodiment of this invention, and FIGS. 2 and 3 are respective multilayer printed boards according to different embodiments of this invention. FIG. 3 is a side view of an interposed dielectric. 1: Multilayer printed board, 2, 3, 4, 6: Printed board, 8, 9: Porous intercalated dielectric material with through holes, 1
1: Through hole.
Claims (1)
おいて、多数の貫通穴を設けた四弗化エチレン樹
脂製の貫通穴付き多孔質間挿誘電体を用い、且つ
この貫通穴付き多孔質間挿誘電体の両面に、全面
若しくは前記の貫通穴の複数にそれぞれに充填せ
しめる接着層を設けて形成したことを特徴とする
多層プリント板用間挿誘電体。 In the intervening dielectric material inserted between a plurality of printed boards, a porous intervening dielectric material with through holes made of polytetrafluoroethylene resin having a large number of through holes is used, and this porous intervening material with through holes is used. An intervening dielectric for a multilayer printed board, characterized in that it is formed by providing adhesive layers on both sides of the dielectric to fill the entire surface or a plurality of the through holes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985158095U JPH0231802Y2 (en) | 1985-10-16 | 1985-10-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985158095U JPH0231802Y2 (en) | 1985-10-16 | 1985-10-16 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6265879U JPS6265879U (en) | 1987-04-23 |
| JPH0231802Y2 true JPH0231802Y2 (en) | 1990-08-28 |
Family
ID=31081259
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985158095U Expired JPH0231802Y2 (en) | 1985-10-16 | 1985-10-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0231802Y2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2551046B2 (en) * | 1987-11-02 | 1996-11-06 | 株式会社村田製作所 | Multilayer circuit board |
| JP2605306B2 (en) * | 1987-11-02 | 1997-04-30 | 株式会社村田製作所 | Multilayer circuit board |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5549430A (en) * | 1978-10-03 | 1980-04-09 | Kajima Corp | Caisson work system |
| JPS55133597A (en) * | 1979-04-06 | 1980-10-17 | Hitachi Ltd | Multilayer circuit board |
| JPS5819159A (en) * | 1981-07-23 | 1983-02-04 | Kiichiro Yagi | Power generating method by self buoyancy |
| JPS6249275B2 (en) * | 1983-10-07 | 1987-10-19 | Hokko Chem Ind Co |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6249275U (en) * | 1985-09-12 | 1987-03-26 |
-
1985
- 1985-10-16 JP JP1985158095U patent/JPH0231802Y2/ja not_active Expired
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5549430A (en) * | 1978-10-03 | 1980-04-09 | Kajima Corp | Caisson work system |
| JPS55133597A (en) * | 1979-04-06 | 1980-10-17 | Hitachi Ltd | Multilayer circuit board |
| JPS5819159A (en) * | 1981-07-23 | 1983-02-04 | Kiichiro Yagi | Power generating method by self buoyancy |
| JPS6249275B2 (en) * | 1983-10-07 | 1987-10-19 | Hokko Chem Ind Co |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6265879U (en) | 1987-04-23 |
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