JPH0231781Y2 - - Google Patents
Info
- Publication number
- JPH0231781Y2 JPH0231781Y2 JP14386084U JP14386084U JPH0231781Y2 JP H0231781 Y2 JPH0231781 Y2 JP H0231781Y2 JP 14386084 U JP14386084 U JP 14386084U JP 14386084 U JP14386084 U JP 14386084U JP H0231781 Y2 JPH0231781 Y2 JP H0231781Y2
- Authority
- JP
- Japan
- Prior art keywords
- electrolytic capacitor
- resin
- chip
- type electrolytic
- opening
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000003990 capacitor Substances 0.000 claims description 34
- 229920005989 resin Polymers 0.000 claims description 16
- 239000011347 resin Substances 0.000 claims description 16
- 238000007789 sealing Methods 0.000 description 7
- 229910000679 solder Inorganic materials 0.000 description 3
- 238000001723 curing Methods 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 238000007598 dipping method Methods 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 230000008642 heat stress Effects 0.000 description 2
- 239000004641 Diallyl-phthalate Substances 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Ceramic Capacitors (AREA)
Description
【考案の詳細な説明】
〔産業上の利用分野〕
本考案は、内部に円筒状の空間を有する外装ケ
ースの該空間部分に円筒状の電解コンデンサを組
込み、外装ケースの開口部に樹脂を充填したチツ
プ形電解コンデンサに関するものである。[Detailed description of the invention] [Industrial application field] This invention incorporates a cylindrical electrolytic capacitor into the space of an exterior case that has a cylindrical space inside, and fills the opening of the exterior case with resin. This invention relates to a chip-type electrolytic capacitor.
先ず、第３図に示すように、外装ケース１の内
部に予め形成された円筒状の空間部１１に円筒状
の電解コンデンサ２は組込み、同電解コンデンサ
２から導出されたリード線２１ａ，２１ｂを折曲
加工したチツプ形電解コンデンサ３として、昭和
59年実用新案公告第3557号「チツプ形電解コンデ
ンサ」である。なお、電解コンデンサ２は、図示
省略の陽極箔と陰極箔とを電解紙であるセパレー
タを介して巻回したコンデンサ素子をゴム材など
による封口体２２と共に円筒状ケース２３内に組
込み、ケース２３の封口体２２の当接部分を絞り
加工２３ａし、ケース２３の開放端をカール加工
２３ｂしたもので、一般に市販されている類のも
のである。しかし、この構造のチツプ形電解コン
デンサ３では同チツプ形電解コンデンサ３のハン
ダデイツピング時あるいはリフロー時の熱ストレ
スに抗しきれずに封口体２２がケース２３から飛
び出たり、あるいは電解コンデンサとしての特性
劣化が生ずるという欠点がある。
First, as shown in FIG. 3, the cylindrical electrolytic capacitor 2 is assembled into a cylindrical space 11 previously formed inside the exterior case 1, and the lead wires 21a and 21b led out from the electrolytic capacitor 2 are connected to the cylindrical space 11. As a bent chip electrolytic capacitor 3, it was introduced in the Showa era.
1959 Utility Model Publication No. 3557 ``Chip type electrolytic capacitor''. The electrolytic capacitor 2 is constructed by incorporating a capacitor element in which an anode foil and a cathode foil (not shown) are wound through a separator made of electrolytic paper into a cylindrical case 23 together with a sealing body 22 made of a rubber material or the like. The abutting portion of the sealing body 22 is drawn 23a, and the open end of the case 23 is curled 23b, which are of the kind generally available on the market. However, in the chip type electrolytic capacitor 3 having this structure, the sealing body 22 may not be able to withstand the heat stress during solder dipping or reflowing of the chip type electrolytic capacitor 3, and the sealing body 22 may pop out from the case 23, or the characteristics as an electrolytic capacitor may deteriorate. There is a drawback that this occurs.
このような欠点を除去するものとして、第４図
に示すように電解コンデンサ２組込み後の外装ケ
ース１の開口部１２に樹脂４を充填し、硬化させ
たチツプ形電解コンデンサ３Ａがある。しかしな
がら、このようなチツプ形電解コンデンサ３Ａで
あつても上述したような熱ストレスに未だ抗しき
れず、充填した樹脂４のケース１内での剥離また
は外装ケース１内から外部に飛び出すことがしば
しば生じている。 In order to eliminate such defects, there is a chip type electrolytic capacitor 3A in which the opening 12 of the exterior case 1 after the electrolytic capacitor 2 is assembled is filled with resin 4 and then hardened, as shown in FIG. However, even such a chip type electrolytic capacitor 3A is still unable to withstand the above-mentioned thermal stress, and the filled resin 4 often peels off inside the case 1 or jumps out from inside the outer case 1. ing.
しかるに、本考案は上述したような欠点を除去
するために、電解コンデンサの絞り加工部分まで
も一体化されるように外装ケース内の樹脂を充填
するようにしたチツプ形電解コンデンサを提供す
るものである。
However, in order to eliminate the above-mentioned drawbacks, the present invention provides a chip-type electrolytic capacitor in which the exterior case is filled with resin so that even the drawing part of the electrolytic capacitor is integrated. be.
以下、第１図および第２図にもとづいて本考案
に係るチツプ形電解コンデンサ３Ｂの実施例を説
明する。
Hereinafter, an embodiment of a chip type electrolytic capacitor 3B according to the present invention will be described based on FIGS. 1 and 2.
外装ケース１はフエノール樹脂、エポキシ樹
脂、ジアリルフタレート樹脂、シリコーン樹脂な
どの熱硬化性樹脂、あるいはポリフエニレンサル
フアイド樹脂などの熱可塑性樹脂、さらにはセラ
ミツクス材などからなり、耐熱性を有するもの
で、その外観の形状は四角柱である。また、外装
ケース１はその内部に一方を開口部１２として円
筒状の空間部１１を有している。円筒状の空間部
１１に連設した開口部１２は空間部１１の直径よ
り幅の広い部分を有するように構成され、ここで
は角形として形成されているが、径大の円筒形で
も良い。 The exterior case 1 is made of a thermosetting resin such as phenol resin, epoxy resin, diallyl phthalate resin, or silicone resin, or thermoplastic resin such as polyphenylene sulfide resin, or ceramic material, and is heat resistant. , its external shape is a square prism. Moreover, the exterior case 1 has a cylindrical space 11 with one side as an opening 12 inside. The opening 12 connected to the cylindrical space 11 is configured to have a width wider than the diameter of the space 11, and although it is formed as a rectangular shape here, it may have a cylindrical shape with a large diameter.
このような外装ケース１の円筒状の空間部１１
内には、ほぼ同一径の電解コンデンサ２はその封
口体側を開口部１２に向けて組込まれる。この
時、電解コンデンサ２の絞り加工部分２３ａは開
口部１２に位置している。電解コンデンサ２の組
込まれた後の開口部１２には液状の樹脂４を充填
し、紫外線硬化、加熱硬化あるいは常温硬化手段
により硬化させる。なお、電解コンデンサ２から
の樹脂４を介した偏平形のリード線２１ａおよび
２１ｂは折曲加工され、外装ケース１の底面に形
成された溝１３ａ，１３ｂに位置される。 The cylindrical space 11 of such an exterior case 1
Inside, an electrolytic capacitor 2 having substantially the same diameter is assembled with its sealing body side facing the opening 12. At this time, the drawn portion 23a of the electrolytic capacitor 2 is located in the opening 12. After the electrolytic capacitor 2 is installed, the opening 12 is filled with liquid resin 4 and cured by ultraviolet curing, heat curing, or room temperature curing means. Note that the flat lead wires 21a and 21b from the electrolytic capacitor 2 through the resin 4 are bent and placed in grooves 13a and 13b formed on the bottom surface of the exterior case 1.
このようなチツプ形電解コンデンサ３Ｂによる
と、少なくとも240℃以上となるハンダデイツプ
時やリフロー時などの熱ストレスを受けることに
よつて起こる電解コンデンサ２の内圧の上昇に伴
う封口体２２のふくれを封口体側の樹脂４と絞り
加工部分側の樹脂４とで挾持し、抑圧することが
できるので、従来生じていた充填した樹脂４のケ
ース１内での剥離または外装ケース１内からの飛
び出しにもとづく不良品の発生を防止できるもの
である。したがつて耐熱性の優れたチツプ形電解
コンデンサ３Ｂを提供できるものである。
According to such a chip type electrolytic capacitor 3B, the swelling of the sealing body 22 caused by the increase in the internal pressure of the electrolytic capacitor 2 caused by the heat stress such as at least 240° C. or higher during solder dipping or reflowing can be prevented from forming on the sealing body side. Since the resin 4 on the outside and the resin 4 on the drawing part side can be held and suppressed, defective products caused by the filled resin 4 peeling off inside the case 1 or coming out from inside the outer case 1, which conventionally occur, can be suppressed. It is possible to prevent the occurrence of Therefore, it is possible to provide a chip type electrolytic capacitor 3B with excellent heat resistance.
因に、従来例であるチツプ形電解コンデンサ３
Ａと本考案に係るチツプ形電解コンデンサ３Ｂを
それぞれ100個用意し、浴温260℃のハンダ槽中に
５秒間浸漬した後の充填した樹脂の剥離あるいは
飛び出しによる不良品の発生は、従来例は32個で
あつたのに対して本考案では０個であつた。 Incidentally, the conventional chip type electrolytic capacitor 3
After preparing 100 chip type electrolytic capacitors A and 3B according to the present invention and immersing them in a solder bath at a bath temperature of 260°C for 5 seconds, the occurrence of defective products due to peeling or popping out of the filled resin has been avoided in the conventional example. While there were 32 pieces, in the present invention there were 0 pieces.
第１図は本考案に係るチツプ形電解コンデンサ
を示す正面図、第２図は第１図におけるＡ−Ａ線
部分断面図、第３図は第１の従来例を示す部分断
面図、第４図は第２の従来例を示す部分側断面
図。
図中、１……外装ケース、２……電解コンデン
サ、３，３Ａ，３Ｂ……チツプ形電解コンデン
サ、４……樹脂。
FIG. 1 is a front view showing a chip-type electrolytic capacitor according to the present invention, FIG. 2 is a partial cross-sectional view taken along line A-A in FIG. 1, FIG. 3 is a partial cross-sectional view showing the first conventional example, and FIG. The figure is a partial side sectional view showing a second conventional example. In the figure, 1...exterior case, 2...electrolytic capacitor, 3, 3A, 3B...chip type electrolytic capacitor, 4...resin.
Claims (1)
空間部に円筒状の電解コンデンサを組込み、外
装ケースの開口部に樹脂を充填したチツプ形電
解コンデンサにおいて、電解コンデンサの絞り
加工部分にも樹脂を充填するようにしたチツプ
形電解コンデンサ。 (2) 実用新案登録請求範囲(1)において、外装ケー
スの開口部は空間部の直径より幅の広い部分を
有することを特徴としたチツプ形電解コンデン
サ。[Scope of Claim for Utility Model Registration] (1) A chip-type electrolytic capacitor in which a cylindrical electrolytic capacitor is assembled in a cylindrical space pre-formed inside an outer case, and the opening of the outer case is filled with resin, A chip-type electrolytic capacitor in which the drawing part of the electrolytic capacitor is also filled with resin. (2) A chip-type electrolytic capacitor as claimed in claim (1) of the utility model registration, characterized in that the opening of the outer case has a width wider than the diameter of the space.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14386084U JPH0231781Y2 (en) | 1984-09-22 | 1984-09-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14386084U JPH0231781Y2 (en) | 1984-09-22 | 1984-09-22 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6159336U JPS6159336U (en) | 1986-04-21 |
| JPH0231781Y2 true JPH0231781Y2 (en) | 1990-08-28 |
Family
ID=30702151
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14386084U Expired JPH0231781Y2 (en) | 1984-09-22 | 1984-09-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0231781Y2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2829858B2 (en) * | 1988-04-01 | 1998-12-02 | 日本ケミコン株式会社 | Chip type capacitor and manufacturing method thereof |
| JP2551570Y2 (en) * | 1989-03-29 | 1997-10-22 | 日本ケミコン 株式会社 | Chip type capacitors |
-
1984
- 1984-09-22 JP JP14386084U patent/JPH0231781Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6159336U (en) | 1986-04-21 |
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