JPH02305402A - Resistor and manufacture thereof - Google Patents
Resistor and manufacture thereofInfo
- Publication number
- JPH02305402A JPH02305402A JP1127038A JP12703889A JPH02305402A JP H02305402 A JPH02305402 A JP H02305402A JP 1127038 A JP1127038 A JP 1127038A JP 12703889 A JP12703889 A JP 12703889A JP H02305402 A JPH02305402 A JP H02305402A
- Authority
- JP
- Japan
- Prior art keywords
- resistor
- electrode
- insulating substrate
- substrate
- insulated substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 4
- 239000000758 substrate Substances 0.000 claims abstract description 34
- 238000005245 sintering Methods 0.000 claims abstract description 6
- 239000000463 material Substances 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 239000011810 insulating material Substances 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 239000012212 insulator Substances 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 8
- 230000017525 heat dissipation Effects 0.000 abstract description 6
- 239000000853 adhesive Substances 0.000 abstract description 4
- 230000001070 adhesive effect Effects 0.000 abstract description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 abstract description 3
- 238000000034 method Methods 0.000 abstract description 3
- 230000006378 damage Effects 0.000 abstract description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 230000015556 catabolic process Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Non-Adjustable Resistors (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は電子機器の小形化、薄形化に寄与する電子部品
の一種であるチップ抵抗器などの角形の抵抗器及びその
製造法に関するものである。[Detailed Description of the Invention] Industrial Application Field The present invention relates to a rectangular resistor such as a chip resistor, which is a type of electronic component that contributes to the miniaturization and thinning of electronic devices, and a method for manufacturing the same. .
従来の技術
従来、この種の抵抗器は第１０図に示すような構成であ
った。第１０図において、１はアルミナなどの絶縁基板
であり、２はメタルグレーズ系などの抵抗体、３は銀グ
レーズ系などの電極であった。Prior Art Conventionally, this type of resistor has had a configuration as shown in FIG. In FIG. 10, 1 is an insulating substrate made of alumina or the like, 2 is a resistor made of metal glaze or the like, and 3 is an electrode made of silver glaze or the like.
発明が解決しようとする課題
このような従来の構成では、抵抗体は実動作時ジュール
熱により発熱するため、高い電力を必要とする時は、そ
の抵抗器表面の温度を下げないと抵抗器を取り付けた電
子機器回路の取付基板をこがして絶縁破壊を起こすため
、抵抗器の表面温度を下げる方法として、抵抗器自体を
大きくし面積当りの温度を下げるか、多数個の抵抗器を
使用するかの手段を取らねばならないという課題があっ
た。Problems to be Solved by the Invention In such a conventional configuration, the resistor generates heat due to Joule heat during actual operation, so when high power is required, the resistor surface temperature must be lowered. In order to burn the mounting board of the installed electronic device circuit and cause dielectric breakdown, the method of lowering the surface temperature of the resistor is to make the resistor itself larger to lower the temperature per area, or to use a large number of resistors. The problem was that we had to take the following measures.
本発明は、このような課題を解決するもので、抵抗器の
表面温度を下げることを特徴とする特許である。The present invention solves this problem, and is a patent that is characterized by lowering the surface temperature of a resistor.
課題を解決するだめの手段
この課題を解決するために、本発明は、絶縁基板上に形
成された抵抗体上にさらに別の絶縁基板を接合したもの
である。Means for Solving the Problems In order to solve the problems, the present invention has another insulating substrate bonded onto the resistor formed on the insulating substrate.
作用
この構成により、接合された絶縁基板が、抵抗体の発熱
を吸収しそして放熱するため、抵抗器の表面温度が下が
ることとなる。Effect: With this configuration, the bonded insulating substrate absorbs and radiates heat generated by the resistor, so that the surface temperature of the resistor decreases.
実施例
第１図、第２図及び第３図は、本発明の一実施例による
抵抗器を示す図で、アルミナ基板等の絶縁基板１１上に
メタルグレーズ系の絶縁基板に接着力のある抵抗体１２
と銀グレーズ系の絶縁基板に接着力のある電極１３とを
７００〜８７０℃で焼結形成した後、さらにその抵抗体
１２と電極１３上に放熱を目的とした絶縁基板１４′ｔ
ｈ再焼結することにより接合して形成された鬼のである
。抵抗体１２や電極１３は絶縁基板１４とも接着力があ
り、再焼結により絶縁基板１４が接合されることとなる
。Embodiment FIGS. 1, 2, and 3 are diagrams showing a resistor according to an embodiment of the present invention, in which a resistor with adhesive strength is placed on an insulating substrate 11 such as an alumina substrate and a metal glaze-based insulating substrate. body 12
After sintering and forming an electrode 13 with adhesive strength on a silver glaze-based insulating substrate at 700 to 870°C, an insulating substrate 14't for the purpose of heat dissipation is further placed on the resistor 12 and electrode 13.
It is formed by joining by re-sintering. The resistor 12 and the electrode 13 have adhesive strength to the insulating substrate 14, and the insulating substrate 14 is bonded to the insulating substrate 14 by resintering.
以上のように、本実施例によれば、抵抗体の両面に絶縁
基板が接合されることとなるため、放熱効果が著しく向
上し抵抗器の表面温度が下がり、高い電力での使用が可
能となり、電子機器回路の取付基板の破壊もなくすこと
ができる。６．４ｆｆｌｌｌＸ３．２朋の角形の抵抗器
に１Ｗを印加した場合、本実施例によれば約２０°Ｃの
表面温度を下げることができた。As described above, according to this example, since the insulating substrate is bonded to both sides of the resistor, the heat dissipation effect is significantly improved, the surface temperature of the resistor is lowered, and use with high power is possible. Also, destruction of the mounting board of the electronic device circuit can be avoided. When 1W was applied to a 6.4ffllll x 3.2mm square resistor, the surface temperature could be lowered by about 20°C according to this example.
なお一実施例において抵抗体１２にメタルグレーズ系材
料、電極１３に銀グレーズ系材料を用いたが、樹脂系材
料でも同じ効果が得られ、絶縁基板１１と放熱目的の絶
縁基板１４にホーロー基板等を用いても同じ効果が得ら
れる。In one embodiment, a metal glaze-based material was used for the resistor 12 and a silver glaze-based material was used for the electrode 13, but the same effect could be obtained with a resin-based material. The same effect can be obtained by using
第４図、第５図には絶縁材料１６を用いて絶縁基板１１
と放熱目的の絶縁基板１４を接合した例を示しており、
第１図の実施例と同じ効果があり、さらには端面部を絶
縁することが可能となり、抵抗器として耐電圧特性が向
上するという利点が加わる。In FIGS. 4 and 5, an insulating substrate 11 using an insulating material 16 is shown.
An example is shown in which an insulating substrate 14 for heat dissipation is bonded to
It has the same effect as the embodiment shown in FIG. 1, and has the additional advantage that it becomes possible to insulate the end face portion, and the withstand voltage characteristics as a resistor are improved.
第６図、第７図には電極部を広く抵抗器重量を軽くする
ことを目的とした例を示し、抵抗体２上にだけ放熱目的
の絶縁基板を設けた例である。従来より高い電力で使用
が可能という利点は変わりない。FIGS. 6 and 7 show an example in which the electrode portion is widened and the weight of the resistor is reduced, and an insulating substrate for heat dissipation is provided only on the resistor 2. The advantage of being able to use higher power than before remains the same.
以上の実施例において抵抗体と電極が同一面で形成され
ているが、第８図、第９図に示すように、抵抗器の使用
が容易になるように側面電極１６を形成してもよい。In the above embodiments, the resistor and the electrodes are formed on the same surface, but as shown in FIGS. 8 and 9, side electrodes 16 may be formed to facilitate the use of the resistor. .
発明の効果
以上のように本発明によれば、放熱用絶縁基板を設ける
ことにより、■抵抗器を高い電力で使用することが可能
である、■同じ電力においては抵抗器を小形化すること
が可能である、■絶縁面が抵抗体上に形成されるので、
耐電圧特性が向上する、■従来と同じ材料の使用が可能
で経済的である、■従来と同じ製造工程を使用すること
が可能で経済的である、という効果が得られる。Effects of the Invention As described above, according to the present invention, by providing an insulating substrate for heat dissipation, it is possible to: ■ use the resistor at high power; and ■ make it possible to downsize the resistor at the same power. Possible, ■Since the insulating surface is formed on the resistor,
The following effects can be obtained: 1. It is possible to use the same materials as in the past and it is economical; 2. It is possible to use the same manufacturing process as in the past and it is economical.
第１図は本発明の一実施例による抵抗器の斜視図、第２
図は第１図の断面図、第３図は第１図の内部パターンを
示す平面図、第４図は本発明の他の実施例による抵抗器
の斜視図、第５図は第４図の内部パターンを示す平面図
、第６図、第７図。
Ｍ８図及び第９図はそれぞれ本発明の他の実施例による
抵抗器の斜視図、第１０図は従来の抵抗器の斜視図であ
る。
１１．１４・・・・・・絶縁基板、１２・・・・・・抵
抗体、１３・・・・・・電極、１５・・・・・・絶縁材
料、１６・・・・・側面電極。
代理人の氏名 弁理士 粟 野 重 孝 ほか１名第１
図
第３図
第４図
第５図
Ｉど
第６図FIG. 1 is a perspective view of a resistor according to an embodiment of the present invention, and FIG.
3 is a plan view showing the internal pattern of FIG. 1, FIG. 4 is a perspective view of a resistor according to another embodiment of the present invention, and FIG. 5 is a sectional view of FIG. 4. FIGS. 6 and 7 are plan views showing internal patterns; FIGS. FIG. M8 and FIG. 9 are perspective views of resistors according to other embodiments of the present invention, and FIG. 10 is a perspective view of a conventional resistor. 11.14... Insulating substrate, 12... Resistor, 13... Electrode, 15... Insulating material, 16... Side electrode. Name of agent: Patent attorney Shigetaka Awano and 1 other person 1st
Figure 3 Figure 4 Figure 5 Figure I Figure 6
Claims (5)
器。(1) A resistor with an electrode and a resistor arranged between two insulating substrates.
電極と抵抗体を形成した抵抗器。(2) A resistor in which two insulating substrates are bonded together using an insulating material, and an electrode and a resistor are formed inside the substrate.
抗体上にのみ抵抗材料を用いて絶縁基板を接合してなる
抵抗器。(3) A resistor in which an electrode and a resistor are formed on an insulating substrate, and an insulating substrate is bonded using a resistive material only on the resistor.
，２または３記載の抵抗器。(4) Claim 1 in which the electrode is provided on the side surface which is an extension of the electrode part.
, 2 or 3.
脂系の材料の電極と抵抗体あるいは絶縁体を焼結形成し
た後、再焼結により別の一枚の絶縁基板をはり合わせる
抵抗器の製造法。(5) After sintering and forming electrodes and resistors or insulators made of metal glaze or resin materials on one insulating substrate, another insulating substrate is bonded by re-sintering to create a resistor. Manufacturing method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1127038A JPH02305402A (en) | 1989-05-19 | 1989-05-19 | Resistor and manufacture thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1127038A JPH02305402A (en) | 1989-05-19 | 1989-05-19 | Resistor and manufacture thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02305402A true JPH02305402A (en) | 1990-12-19 |
Family
ID=14950103
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1127038A Pending JPH02305402A (en) | 1989-05-19 | 1989-05-19 | Resistor and manufacture thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02305402A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008258387A (en) * | 2007-04-04 | 2008-10-23 | Mitsubishi Materials Corp | Thin-film thermistor and manufacturing method thereof |
| JP2008258386A (en) * | 2007-04-04 | 2008-10-23 | Mitsubishi Materials Corp | Thin-film thermistor and manufacturing method thereof |
| JP2017063126A (en) * | 2015-09-25 | 2017-03-30 | 三菱マテリアル株式会社 | Manufacturing method for resistor, and resistor |
| US10418157B2 (en) | 2015-10-30 | 2019-09-17 | Vishay Dale Electronics, Llc | Surface mount resistors and methods of manufacturing same |
| US10438729B2 (en) | 2017-11-10 | 2019-10-08 | Vishay Dale Electronics, Llc | Resistor with upper surface heat dissipation |
-
1989
- 1989-05-19 JP JP1127038A patent/JPH02305402A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008258387A (en) * | 2007-04-04 | 2008-10-23 | Mitsubishi Materials Corp | Thin-film thermistor and manufacturing method thereof |
| JP2008258386A (en) * | 2007-04-04 | 2008-10-23 | Mitsubishi Materials Corp | Thin-film thermistor and manufacturing method thereof |
| JP2017063126A (en) * | 2015-09-25 | 2017-03-30 | 三菱マテリアル株式会社 | Manufacturing method for resistor, and resistor |
| US10418157B2 (en) | 2015-10-30 | 2019-09-17 | Vishay Dale Electronics, Llc | Surface mount resistors and methods of manufacturing same |
| US10438729B2 (en) | 2017-11-10 | 2019-10-08 | Vishay Dale Electronics, Llc | Resistor with upper surface heat dissipation |
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