JPH02297988A - Optical coupling system using optical semiconductor device - Google Patents
Optical coupling system using optical semiconductor deviceInfo
- Publication number
- JPH02297988A JPH02297988A JP63230944A JP23094488A JPH02297988A JP H02297988 A JPH02297988 A JP H02297988A JP 63230944 A JP63230944 A JP 63230944A JP 23094488 A JP23094488 A JP 23094488A JP H02297988 A JPH02297988 A JP H02297988A
- Authority
- JP
- Japan
- Prior art keywords
- optical
- semiconductor device
- optical semiconductor
- coupling system
- cap
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000003287 optical effect Effects 0.000 title claims abstract description 56
- 230000008878 coupling Effects 0.000 title claims abstract description 25
- 238000010168 coupling process Methods 0.000 title claims abstract description 25
- 238000005859 coupling reaction Methods 0.000 title claims abstract description 25
- 239000004065 semiconductor Substances 0.000 title claims description 39
- 239000013307 optical fiber Substances 0.000 abstract description 8
- 230000001808 coupling effect Effects 0.000 abstract 1
- 239000005357 flat glass Substances 0.000 abstract 1
- 238000012544 monitoring process Methods 0.000 abstract 1
- 238000007789 sealing Methods 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 6
- 239000011521 glass Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 235000014676 Phragmites communis Nutrition 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000001902 propagating effect Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0225—Out-coupling of light
- H01S5/02251—Out-coupling of light using optical fibres
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Semiconductor Lasers (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は光通信等に応用分野を持つ光半導体装置(特
に半導体レーザ)を用いた光結合系に関し、特に光半導
体装置のパッケージ構造に関するものである。[Detailed Description of the Invention] [Field of Industrial Application] This invention relates to an optical coupling system using an optical semiconductor device (particularly a semiconductor laser) which has application fields such as optical communications, and particularly relates to a package structure of an optical semiconductor device. It is.
第5図は例えば従来の半導体レーザダイオードを示す外
形図であり、図において1はレーザダイオードチップ、
2はモニタ用フォトダイオードチップ、3はキャップ、
4はガラス窓、5はステム、6はリードである。FIG. 5 is an outline drawing showing, for example, a conventional semiconductor laser diode, in which 1 is a laser diode chip;
2 is a monitor photodiode chip, 3 is a cap,
4 is a glass window, 5 is a stem, and 6 is a reed.
本発明は、かかる半導体レーザダイオード自身において
ではなく、これを適用した装置においてその効果を発揮
するものであり、以下これを適用した応用例の装置につ
いて説明する。The present invention exhibits its effects not in such a semiconductor laser diode itself but in a device to which the same is applied, and an application example device to which the same is applied will be described below.
第6図は第5図に示した半導体レーザダイオードを用い
て、レーザ光を光ファイバに導く光結合系を示す断面図
であり、図において7は集光性レンズ、8は光ファイバ
、9は上記集光性レンズ7、光ファイバ8を支持するボ
ディ、10は集光性レンズ7の位置を決めるビス、ll
aはレーザーダイオードチップ1より出射された光、l
lbは集光性レンズ7を出て光ファイバ8に入射しファ
イバを伝搬する光である。FIG. 6 is a sectional view showing an optical coupling system that guides laser light to an optical fiber using the semiconductor laser diode shown in FIG. 5. In the figure, 7 is a condensing lens, 8 is an optical fiber, and 9 is a A body that supports the condensing lens 7 and the optical fiber 8; 10 is a screw that determines the position of the condensing lens 7;
a is the light emitted from the laser diode chip 1, l
lb is light that exits the condensing lens 7, enters the optical fiber 8, and propagates through the fiber.
ここで光ファイバ8に入射する光11bはビス10によ
る集光性レンズ7の位置調整あるいはボディ9のキャン
プ3に対する位置調整などによって最適量に調整される
。またボディ9は位置決めされた後、YAG溶接などに
よりキャップ3に溶接固定される。Here, the light 11b incident on the optical fiber 8 is adjusted to an optimum amount by adjusting the position of the condensing lens 7 using the screw 10 or adjusting the position of the body 9 with respect to the camp 3. Further, after the body 9 is positioned, it is welded and fixed to the cap 3 by YAG welding or the like.
この様な応用においては、キャップ3は通常のレーザー
チップ1の気密封止のみならず、上記の様に光結合系を
構成する上で重要な支持台となる。In such an application, the cap 3 not only hermetically seals the laser chip 1 but also serves as an important support for constructing the optical coupling system as described above.
光半導体装置においてもその小型化は重要な一つの課題
であるが、第5図に示す従来の半導体レーザダイオード
を小型化した場合、第6図に示す光結合系において次の
問題点が発生する。Miniaturization of optical semiconductor devices is also an important issue, but when the conventional semiconductor laser diode shown in Figure 5 is miniaturized, the following problems occur in the optical coupling system shown in Figure 6. .
1) キャップの窓部(開口部)径が小さくなると、第
6図に示した様な光結合系を構成した際に、レンズ7の
調整可動領域が小さくなる。すなわち光結合特性が劣化
する。1) When the diameter of the window (opening) of the cap becomes smaller, the adjustment movable range of the lens 7 becomes smaller when an optical coupling system as shown in FIG. 6 is configured. In other words, the optical coupling characteristics deteriorate.
2)上記を防ぐために窓部径のみ従来と同じ寸法とすれ
ば、ガラス窓4との接着面積が小さくなり、気密特性が
劣化する。2) In order to prevent the above, if only the diameter of the window portion is made the same as the conventional size, the adhesive area with the glass window 4 becomes smaller and the airtightness deteriorates.
この発明は上記のような問題点を解消するためになされ
たもので、光半導体装置自身の気密特性を維持し、かつ
、光結合系の光結合特性を維持することのできる、小型
化された光半導体装置を用いた光結合系を得ることを目
的とする。This invention was made to solve the above problems, and is a miniaturized device that can maintain the airtightness of the optical semiconductor device itself and maintain the optical coupling characteristics of the optical coupling system. The purpose is to obtain an optical coupling system using an optical semiconductor device.
この発明に係る光半導体装置を用いた光結合系は、光半
導体装置のキャップの窓開口形成部の断面形状を、上方
ほど大きな開口を形成するテーバ状にし、レンズが該開
口に配置されるようにしたものである。In the optical coupling system using the optical semiconductor device according to the present invention, the cross-sectional shape of the window opening forming portion of the cap of the optical semiconductor device is tapered so that the opening becomes larger toward the top, and the lens is arranged in the opening. This is what I did.
この発明における光半導体装置を用いた光結合系では、
光半導体装置を小型にした場合でも、ガラス窓との接着
面積を十分確保でき、気密特性が維持される。また光結
合系を構成した際にもレンズの可動領域は十分確保され
、光結合特性も劣化しない。In the optical coupling system using the optical semiconductor device in this invention,
Even when the optical semiconductor device is downsized, a sufficient adhesive area with the glass window can be secured and airtightness can be maintained. Further, even when an optical coupling system is constructed, a sufficient movable area of the lens is ensured, and the optical coupling characteristics do not deteriorate.
以下、この発明の一実施例を図について説明する。 An embodiment of the present invention will be described below with reference to the drawings.
第1図は本発明の一実施例による光半導体装置を用いた
光結合系において用いる小型の半導体レーザダイオード
を示す外形図、第2図は第1図に示した半導体レーザを
用いた本発明の一実施例による光結合系を示す断面図で
あり、図において1はレーザダイオードチップ、2はモ
ニタ用フォトダイオードチップ、3は前記1.2を気密
封止し、かつ光結合系の支持台となるキャンプ、3bは
上方ほど大きな開口を形成するテーバ状に加工された窓
開口部、4はガラス窓、5は前記1〜4を支持するステ
ム、6は電極リード、7は集光性レンズ、8は光ファイ
バ、9は前記7.8を支持し、キャップ3へ溶接固定さ
れるボディ、10は集光性レンズ位置を決めるビス、l
laはレーザダイオード1より発射された光、llbは
集光性レンズ7を通って光ファイバ8に入射し伝搬する
光である。FIG. 1 is an outline drawing showing a small semiconductor laser diode used in an optical coupling system using an optical semiconductor device according to an embodiment of the present invention, and FIG. 1 is a sectional view showing an optical coupling system according to an embodiment, and in the figure, 1 is a laser diode chip, 2 is a monitor photodiode chip, and 3 is a support stand for the optical coupling system that hermetically seals the above 1.2. 3b is a tapered window opening that becomes larger toward the top; 4 is a glass window; 5 is a stem supporting 1 to 4; 6 is an electrode lead; 7 is a condensing lens; 8 is an optical fiber, 9 is a body that supports the above-mentioned 7.8 and is welded and fixed to the cap 3, 10 is a screw that determines the position of the condensing lens, l
la is the light emitted from the laser diode 1, and llb is the light that passes through the condensing lens 7, enters the optical fiber 8, and propagates.
光結合系の基本構成及び調整方法等は従来と全く同じで
あるが、キャップ3の窓開口形成部3bの断面形状を、
上方ほど大きな開口を形成するテーバ状としていること
により、光半導体装置が小型に設計された場合でも、
1)集光性レンズ7の調整可動領域は従来と同等に確保
でき、従来と同等の光結合特性を得ることができる。Although the basic configuration and adjustment method of the optical coupling system are exactly the same as before, the cross-sectional shape of the window opening forming portion 3b of the cap 3 is
By forming a tapered shape with a larger aperture toward the top, even if the optical semiconductor device is designed to be compact, 1) the adjustment movable area of the light-condensing lens 7 can be secured in the same way as in the past; binding properties can be obtained.
2) ガラス窓4とキャップ3の接着面積は従来と同等
に確保でき、従来と同等の気密特性を得ることができる
。2) The adhesion area between the glass window 4 and the cap 3 can be secured at the same level as before, and the same airtightness as before can be obtained.
という効果をもたらす。This brings about this effect.
なお上記実施例ではキャップ窓開口部3bをテーバ状と
した場合について示したが、これは第3図の本発明の他
の実施例に示すように上方ほど大きな開口を形成する階
段状であってもよく、また第4図の本発明のさらに他の
実施例に示すように下端部分が階段状となった階段状+
テーバ状であってもよい。In the above embodiment, the cap window opening 3b has a tapered shape, but as shown in another embodiment of the present invention shown in FIG. Alternatively, as shown in still another embodiment of the present invention shown in FIG.
It may be tabular.
また上記実施例では、光半導体装置として半導体レーザ
ダイオードを用いた場合について説明したが、この光半
導体装置としては半導体発光ダイオードや半導体受光素
子を用いた他の光半導体装置を用いてもよく、上記実施
例と同様の効果を奏する。Further, in the above embodiment, a case was explained in which a semiconductor laser diode was used as the optical semiconductor device, but other optical semiconductor devices using a semiconductor light emitting diode or a semiconductor light receiving element may be used as the optical semiconductor device. The same effects as in the embodiment are achieved.
以上のように、この発明によれば、光半導体装置を用い
た光結合系において、キャップの窓開口部を上方ほど大
きな開口を形成するテーバ状または階段状としたので、
装置を小型にした場合でも従来型と同等の光結合特性、
かつ気密特性が得られる効果がある。As described above, according to the present invention, in an optical coupling system using an optical semiconductor device, the window opening of the cap is formed into a tapered or stepped shape in which the opening becomes larger toward the top.
Even if the device is made smaller, the optical coupling characteristics are the same as the conventional type.
In addition, it has the effect of providing airtightness.
第1図はこの発明の一実施例において用いる光半導体装
置の外形図、第2図はこの発明の一実施例による光半導
体装置を用いた光結合系を示す断面図、第3図及び第4
図はこの発明の他の実施例及びさらに他の実施例におい
て用いる光半導体装置の外形図、第5図は従来の光半導
体装置の外形図、第6図は従来の光半導体装置を用いた
光結合系の一例を示す断面図である。
図において1はレーザダイオードチップ、2はモニタ用
フォトダイオードチップ、3はキャップ、3bは窓開口
形成部、4はガラス窓、5はステム、6はリード、7は
集光性レンズ、8は光ファイバ、9はボディ、10はビ
ス、llaは出射光、11bはファイバを伝搬する光で
ある。
なお図中同一符号は同−又は相当部分を示す。FIG. 1 is an outline diagram of an optical semiconductor device used in an embodiment of the present invention, FIG. 2 is a sectional view showing an optical coupling system using the optical semiconductor device according to an embodiment of the present invention, and FIGS.
The figure is an outline diagram of an optical semiconductor device used in other embodiments and still other embodiments of the present invention, Figure 5 is an outline diagram of a conventional optical semiconductor device, and Figure 6 is an outline diagram of an optical semiconductor device using a conventional optical semiconductor device. FIG. 3 is a cross-sectional view showing an example of a coupling system. In the figure, 1 is a laser diode chip, 2 is a monitor photodiode chip, 3 is a cap, 3b is a window opening forming part, 4 is a glass window, 5 is a stem, 6 is a lead, 7 is a condensing lens, and 8 is a light beam. 9 is a body, 10 is a screw, lla is an output light, and 11b is light propagating through the fiber. Note that the same reference numerals in the figures indicate the same or equivalent parts.
Claims (1)
素子の電極を外部に導出するステムと、該ステムに溶接
された該光半導体素子を気密封止するキャップとからな
る光半導体装置を用いた光結合系において、 上記光半導体装置のキャップの窓開口形成部の断面形状
は上方ほど大きな開口を形成するテーパ状または階段状
となっており、 上記光半導体装置からの光を集光するレンズが上記キャ
ップの窓開口形成部により形成される開口に配置されて
いることを特徴とする光半導体装置を用いた光結合系。(1) An optical semiconductor device consisting of an optical semiconductor element, a stem that supports the optical semiconductor element and leads the electrodes of the element to the outside, and a cap that is welded to the stem and hermetically seals the optical semiconductor element. In the optical coupling system using the optical semiconductor device, the cross-sectional shape of the window opening forming portion of the cap of the optical semiconductor device is tapered or stepped, forming a larger opening toward the top, and the light from the optical semiconductor device is condensed. An optical coupling system using an optical semiconductor device, characterized in that a lens is disposed in an aperture formed by a window aperture forming portion of the cap.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63230944A JPH02297988A (en) | 1988-09-14 | 1988-09-14 | Optical coupling system using optical semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63230944A JPH02297988A (en) | 1988-09-14 | 1988-09-14 | Optical coupling system using optical semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH02297988A true JPH02297988A (en) | 1990-12-10 |
Family
ID=16915755
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP63230944A Pending JPH02297988A (en) | 1988-09-14 | 1988-09-14 | Optical coupling system using optical semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH02297988A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5542018A (en) * | 1990-08-31 | 1996-07-30 | Kuhara; Yoshiki | Semiconductor laser device making use of photodiode chip |
JP2008153617A (en) * | 2006-11-21 | 2008-07-03 | Nichia Chem Ind Ltd | Semiconductor light-emitting device |
JP2009099633A (en) * | 2007-10-13 | 2009-05-07 | Nichia Corp | Semiconductor light emitting device |
JP2018037472A (en) * | 2016-08-30 | 2018-03-08 | 日亜化学工業株式会社 | Light-emitting device |
-
1988
- 1988-09-14 JP JP63230944A patent/JPH02297988A/en active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5542018A (en) * | 1990-08-31 | 1996-07-30 | Kuhara; Yoshiki | Semiconductor laser device making use of photodiode chip |
JP2008153617A (en) * | 2006-11-21 | 2008-07-03 | Nichia Chem Ind Ltd | Semiconductor light-emitting device |
JP2009099633A (en) * | 2007-10-13 | 2009-05-07 | Nichia Corp | Semiconductor light emitting device |
JP2018037472A (en) * | 2016-08-30 | 2018-03-08 | 日亜化学工業株式会社 | Light-emitting device |
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