JPH02282070A - Electronic part carrier - Google Patents
Electronic part carrierInfo
- Publication number
- JPH02282070A JPH02282070A JP1105512A JP10551289A JPH02282070A JP H02282070 A JPH02282070 A JP H02282070A JP 1105512 A JP1105512 A JP 1105512A JP 10551289 A JP10551289 A JP 10551289A JP H02282070 A JPH02282070 A JP H02282070A
- Authority
- JP
- Japan
- Prior art keywords
- electronic
- container
- electronic component
- electronic components
- component carrier
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000463 material Substances 0.000 claims description 46
- 229920003002 synthetic resin Polymers 0.000 claims description 4
- 239000000057 synthetic resin Substances 0.000 claims description 4
- 230000003068 static effect Effects 0.000 abstract description 9
- 239000000969 carrier Substances 0.000 abstract description 2
- 238000010276 construction Methods 0.000 abstract 1
- 230000005611 electricity Effects 0.000 description 7
- 230000000694 effects Effects 0.000 description 5
- 238000005259 measurement Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- -1 polyethylene terephthalate Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 230000002265 prevention Effects 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
Landscapes
- Packages (AREA)
- Packaging Frangible Articles (AREA)
Abstract
Description
【発明の詳細な説明】
〔発明の目的〕
（産業上の利用分野）
本発明はＩＣ等の電子部品を包装して搬送する電子部品
搬送体に係り、とりわけ安定した取出しを行なうことが
でき、かつ電子部品を適切に保護することができる電子
部品搬送体に関する。[Detailed Description of the Invention] [Object of the Invention] (Industrial Field of Application) The present invention relates to an electronic component carrier for packaging and transporting electronic components such as ICs, and is particularly capable of performing stable removal. The present invention also relates to an electronic component carrier that can appropriately protect electronic components.
（従来の技術）
従来、ＩＣ等の電子部品を多数包装して搬送する合成樹
脂製の電子部品搬送体が知られている。(Prior Art) Conventionally, electronic component carriers made of synthetic resin are known that package and transport a large number of electronic components such as ICs.
この電子部品搬送体は、容器部と容器部上端開口のフラ
ンジ部とからなる底材と、底材のフランジ部上面にヒー
トシールされる平板状蓋材とを備え、容器部と蓋材とに
よってＩＣ等の電子部品を収納する収納空間が形成され
ている。また、容器部は多数の電子部品を包装できるよ
うに多数連続して設けられており、各容器部は容器部上
端開口のフランジ部によって連結されている。This electronic component carrier includes a bottom material consisting of a container part and a flange part at the top opening of the container part, and a flat lid material that is heat-sealed to the top surface of the flange part of the bottom material. A storage space is formed to store electronic components such as ICs. Moreover, a large number of container parts are provided in succession so that a large number of electronic components can be packaged, and each container part is connected by a flange part opened at the upper end of the container part.
このような構成からなる電子部品搬送体において、ＩＣ
等の電子部品は底材の各容器部内に配置され、その後底
祠のフランジ部に平板状蓋祠がヒートシールされて電子
部品が包装される。In the electronic component carrier having such a configuration, the IC
Electronic components such as the above are placed in each container portion of the bottom material, and then a flat plate-like lid cage is heat-sealed to the flange portion of the bottom cage to package the electronic components.
多数の電子部品を包装した電子部品搬送体は、製品組立
工場へ送られる。そして製品組立工場において、底材の
フランジ部から蓋材が剥離され、底材の各容器部内から
電子部品が連続的に取出される。そして外部に取出され
た電子部品について、実装作業等が行なわれる。An electronic component carrier packed with a large number of electronic components is sent to a product assembly factory. Then, in the product assembly factory, the lid material is peeled off from the flange portion of the bottom material, and the electronic components are successively taken out from inside each container portion of the bottom material. Then, mounting work and the like are performed on the electronic components taken out to the outside.
（発明が解決しようとする課題）
上述のように、電子部品を包装した電子部品搬送体は製
品組立て工場に送られ、ここで底材のフランジ部から蓋
材が剥離され底材の各容器部内から電子部品が連続的に
取出される。(Problems to be Solved by the Invention) As described above, the electronic component carrier that has packaged electronic components is sent to a product assembly factory, where the lid material is peeled off from the flange portion of the bottom material and the inside of each container portion of the bottom material is removed. Electronic components are continuously extracted from the
この場合、合成樹脂製の電子部品搬送体に静電気が帯電
していると、いくつかの不都合が生じる場合がある。In this case, if the electronic component carrier made of synthetic resin is charged with static electricity, some problems may occur.
すなわち、静電気の帯電により、底材の各容器部から電
子部品を取出す際、軽量の電子部品か底材に引張られて
容易に取出すことができない場合がある。また、静電気
の帯電により、電子部品搬送体内に包装された電子部品
が破損することも考えられる。That is, due to static electricity charging, when taking out electronic components from each container portion of the bottom material, there are cases where lightweight electronic components are pulled by the bottom material and cannot be easily taken out. Further, electronic components packaged within the electronic component carrier may be damaged due to static electricity charging.
本発明はこのような点を考慮してなされたものであり、
電子部品を保護するとともに安定した取出し作業を行な
うことができる電子部品搬送体を提供することを目的と
する。The present invention has been made in consideration of these points,
It is an object of the present invention to provide an electronic component carrier that can protect electronic components and perform stable removal work.
（課題を解決するための手段）
本発明は、連続して設けられた容器部と各容器部上端開
口を連結するフランジ部からなる底材と、この底材のフ
ランジ部上面にヒートシールされる甲板状蓋材とを備え
、前記容器部と前記蓋利とによって電子部品用の収納空
間を形成する合成樹脂製電子部品搬送体であって、前記
収納空間内面に静電防止層を設けたことを特徴としてい
る。(Means for Solving the Problems) The present invention provides a bottom material comprising a continuous container section and a flange section connecting the upper end opening of each container section, and a bottom material that is heat-sealed to the upper surface of the flange section of the bottom material. A synthetic resin electronic component carrier comprising a deck-shaped lid material and forming a storage space for electronic components by the container portion and the lid member, wherein an antistatic layer is provided on the inner surface of the storage space. It is characterized by
（作 用）
本発明によれば、収納空間内面に静電防１１１層を設け
たことにより、収納空間における静電気の帯電を確実に
防ｌＦ、することができる。(Function) According to the present invention, by providing the static electricity prevention layer 111 on the inner surface of the storage space, it is possible to reliably prevent static electricity from being charged in the storage space.
（実施例）
以下、図面を参照して本発明の実施例について説明する
。(Example) Hereinafter, an example of the present invention will be described with reference to the drawings.
第１図乃至第４図は本発明による電子部品搬送体の一実
施例を示す図である。このうち第１図は本発明による電
子部品搬送体を示す斜視図、第２図は第１図■−■線断
面図、第３図は蓋材１５の側断面図、第４図は静電防止
効果を示す図である。FIGS. 1 to 4 are diagrams showing an embodiment of an electronic component carrier according to the present invention. Of these, FIG. 1 is a perspective view showing an electronic component carrier according to the present invention, FIG. 2 is a sectional view taken along the line ■-■ in FIG. 1, FIG. 3 is a side sectional view of the lid 15, and FIG. It is a figure showing a prevention effect.
第１図および第２図において、電子部品搬送体１０は、
容器部１２と容器部上端開口のフランジ部１３とからな
る底材１１と、底材１１のフランジ部１３上面にヒート
シールされる平板状蓋材１５とを備えている。このうち
、底材１１の容器部１２と蓋材１５とによって電子部品
１７の収納空間１６が形成されている。In FIGS. 1 and 2, the electronic component carrier 10 is
It includes a bottom material 11 consisting of a container part 12 and a flange part 13 at the upper end opening of the container part, and a flat lid material 15 that is heat-sealed to the upper surface of the flange part 13 of the bottom material 11. Among these, a storage space 16 for electronic components 17 is formed by the container portion 12 of the bottom material 11 and the lid material 15.
容器部１２は多数の電子部品を包装できるように多数連
続して配設され、各容器部１２はフランジ部１３によっ
て互いに連結されている。A large number of container parts 12 are arranged in series so that a large number of electronic components can be packaged, and each container part 12 is connected to each other by a flange part 13.
次に底材１１および蓋材１５の材質について説明する。Next, the materials of the bottom material 11 and the lid material 15 will be explained.
容器部１２とフランジ部１３とからなる底祠１１は、例
えばポリスチレン（ＰＳ）、またはポリプロピン（Ｐ
Ｐ）等の板材を成形したものである。The bottom shell 11 consisting of the container part 12 and the flange part 13 is made of polystyrene (PS) or polypropyne (P), for example.
It is molded from a plate material such as P).
一方、蓋材１５は内面に静電防１Ｌ層が９１６されてお
り、第３図に示すような多層構造となっている。すなわ
ち、外側から順に配置されたポリエチレンテレフタレー
） （ＰＥＴ）２１／押出ポリエチレン（ＥＣＰＥ）２
１／シ一ル材２３／静電防止層２４の積層体からなって
いる。On the other hand, the lid material 15 has an electrostatic protection layer 916 on its inner surface, and has a multilayer structure as shown in FIG. That is, polyethylene terephthalate (PET) 21 / extruded polyethylene (ECPE) 2 arranged in order from the outside
It consists of a laminate of 1/sealing material 23/antistatic layer 24.
なお、蓋材１５はフランジ部１３上に２１幅（第１図り
、＋Ｉ、２）でシールされている。Note that the lid member 15 is sealed on the flange portion 13 with a width of 21 (first drawing, +I, 2).
次にこのような構成からなる本実施例の作用について説
明する。Next, the operation of this embodiment having such a configuration will be explained.
まず、底材１１の各容器部１２内にＩＣ等の゛電子部品
１７が配置され、その後底材１１のフランジ部１２上面
に平板状蓋材１５がヒートシールされ、このようにして
電子部品１７が電子部品搬送体１０に包装される。First, an electronic component 17 such as an IC is placed in each container portion 12 of the bottom material 11, and then a flat lid material 15 is heat-sealed to the top surface of the flange portion 12 of the bottom material 11. In this way, the electronic component 17 is packaged in the electronic component carrier 10.
続いて、電子部品１７を包装した電子部品搬送体１０が
製品組立工場へ送られ、底材１１のフランジ部１３から
蓋材１５が剥離され、底材１１の各容器部１２内から電
子部品が連続的に取出される。Subsequently, the electronic component carrier 10 with the electronic components 17 packaged therein is sent to a product assembly factory, the lid material 15 is peeled off from the flange portion 13 of the bottom material 11, and the electronic components are removed from each container portion 12 of the bottom material 11. taken out continuously.
本実施例によれば、蓋材１５の内面に静電防止層２４が
塗布されているので、収納室間１６内の静電気の帯電を
防止することができる。このため、収納空間１６内に収
納された電子部品１７の破損を確実に防止することがで
きる。また底材１１の各容器部１２から電子部品１７を
取出す際、電子部品１７が静電気によって底材１１に引
張られることなく容易に取出すことができる。According to this embodiment, since the antistatic layer 24 is applied to the inner surface of the lid member 15, it is possible to prevent static electricity from being charged in the storage space 16. Therefore, damage to the electronic components 17 stored in the storage space 16 can be reliably prevented. Furthermore, when taking out the electronic components 17 from each container section 12 of the bottom material 11, the electronic components 17 can be easily taken out without being pulled by the bottom material 11 due to static electricity.
（具体例） 次に本発明の具体例について説明する。(Concrete example) Next, specific examples of the present invention will be described.
蓋材１５に塗布する静電防止層２４として、スタテイサ
イド（（株）ＴＤＫ製）を用い、２００〜４００倍に希
釈してグラビア３０μ版で塗布した。As the antistatic layer 24 applied to the lid material 15, Statyside (manufactured by TDK Corporation) was used, diluted 200 to 400 times, and applied with a 30μ gravure plate.
この場合の表面抵抗を経時的にＷｌ定した。この測定結
果を静電防止効果として第４図に示す。The surface resistance in this case was determined by Wl over time. The measurement results are shown in FIG. 4 as the antistatic effect.
表面抵抗の測定は以下の条件のもとで行なった。The surface resistance was measured under the following conditions.
Ｏ測定器：ＴＲ−８６０１（アトパンテスト′ｆ１．）
Ｏ測定条件：測定温度 ２０〜３０℃
測定湿度 ５０〜５５％ＲＨ
Ｏサンプル保存条件：６０℃ ９０％ＲＨ第４図におい
て表面抵抗値を対数として表示した。O measuring device: TR-8601 (Atopan test 'f1.)
O measurement conditions: Measurement temperature: 20 to 30°C Measurement humidity: 50 to 55% RH O sample storage conditions: 60°C, 90% RH In FIG. 4, the surface resistance value is expressed as a logarithm.
第４図から明らかなように、１月以上経過しても表面抵
抗は１０”［Ω／口〕となり、十分静電防止効果を発揮
することが判明した。As is clear from FIG. 4, the surface resistance remained 10'' [Ω/mouth] even after more than one month had passed, and it was found that the antistatic effect was sufficiently exhibited.
なお、上記実施例において、収納室１６の内面のうち、
蓋材１５の内面に静電防止層２４を塗布した例を示した
が、これに限らず容器部１２の内面に塗布してもよい。In addition, in the above embodiment, among the inner surfaces of the storage chamber 16,
Although an example has been shown in which the antistatic layer 24 is applied to the inner surface of the lid member 15, the antistatic layer 24 is not limited thereto, and may be applied to the inner surface of the container portion 12.
また、静電防止層２４は塗布ではなく、例えば底材１１
へのねり込みにより設けてもよい。In addition, the antistatic layer 24 is not applied by coating, but for example, the antistatic layer 24 is applied to the bottom material 11.
It may also be provided by rolling it into.
以上説明したように、本発明によれば、収納空間内面に
静電防止層を設けたことにより、収納空間内に収納され
たＩＣ等の電子部品の破損を確実に防止することができ
るとともに、底材の各容器部内から電子部品を容易に取
出すことができる。As explained above, according to the present invention, by providing an antistatic layer on the inner surface of the storage space, it is possible to reliably prevent damage to electronic components such as ICs stored in the storage space, and Electronic components can be easily taken out from inside each container portion of the bottom material.
このため電子部品を安定かつ確実に包装することができ
、かつ電子部品の実装作業を確実に行なうことができる
。Therefore, electronic components can be packaged stably and reliably, and electronic component mounting work can be performed reliably.
第１図乃至第４図は本発明による電子部品搬送体の一実
施例を示す図であり、このうち第１図は電子部品搬送体
の部分斜視図、第２図は第１図■−■線断面図、第３図
は蓋材の側断面図、第４図は蓋材の静電防止効果を示す
図である。
１０・・・電子部品搬送体、１１・・・底材、１２・・
・容器部、１３・・・フランジ部、１５・・・蓋材、１
７・・・電子部品、２４・・・静電防止層。
、８２ 図
、８３ 図1 to 4 are diagrams showing one embodiment of an electronic component carrier according to the present invention, of which FIG. 1 is a partial perspective view of the electronic component carrier, and FIG. 2 is a partial perspective view of the electronic component carrier, and FIG. A line sectional view, FIG. 3 is a side sectional view of the lid material, and FIG. 4 is a diagram showing the antistatic effect of the lid material. 10... Electronic component carrier, 11... Bottom material, 12...
・Container part, 13... Flange part, 15... Lid material, 1
7...Electronic component, 24...Antistatic layer. , 82 fig., 83 fig.
Claims (2)
結するフランジ部からなる底材と、この底材のフランジ
部上面にヒートシールされる平板状蓋材とを備え、前記
容器部と前記蓋材とによって電子部品用の収納空間を形
成する合成樹脂製電子部品搬送体において、前記収納空
間内面に静電防止層を設けたことを特徴とする電子部品
搬送体。1. The bottom material includes a flange portion that connects the continuously provided container portions and the upper end opening of each container portion, and a flat lid material that is heat-sealed to the upper surface of the flange portion of the bottom material. An electronic component carrier made of synthetic resin that forms a storage space for electronic components with a lid material, characterized in that an antistatic layer is provided on the inner surface of the storage space.
とする電子部品搬送体。2. An electronic component carrier characterized in that an antistatic layer is provided on the inner surface of a lid material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1105512A JP2855444B2 (en) | 1989-04-25 | 1989-04-25 | Electronic component carrier |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1105512A JP2855444B2 (en) | 1989-04-25 | 1989-04-25 | Electronic component carrier |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02282070A true JPH02282070A (en) | 1990-11-19 |
| JP2855444B2 JP2855444B2 (en) | 1999-02-10 |
Family
ID=14409656
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1105512A Expired - Fee Related JP2855444B2 (en) | 1989-04-25 | 1989-04-25 | Electronic component carrier |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2855444B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0532288A (en) * | 1991-02-28 | 1993-02-09 | Sumitomo Bakelite Co Ltd | Cover tape for packaging chip type electronic component |
| CN104470824A (en) * | 2012-07-20 | 2015-03-25 | 3M创新有限公司 | Component carrier tape with uv radiation curable adhesive |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5929040U (en) * | 1982-08-13 | 1984-02-23 | 藤森工業株式会社 | IC electronic component storage belt |
| JPS59125899U (en) * | 1983-02-14 | 1984-08-24 | ロ−ム株式会社 | Wrapping strip for electronic parts |
-
1989
- 1989-04-25 JP JP1105512A patent/JP2855444B2/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5929040U (en) * | 1982-08-13 | 1984-02-23 | 藤森工業株式会社 | IC electronic component storage belt |
| JPS59125899U (en) * | 1983-02-14 | 1984-08-24 | ロ−ム株式会社 | Wrapping strip for electronic parts |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0532288A (en) * | 1991-02-28 | 1993-02-09 | Sumitomo Bakelite Co Ltd | Cover tape for packaging chip type electronic component |
| CN104470824A (en) * | 2012-07-20 | 2015-03-25 | 3M创新有限公司 | Component carrier tape with uv radiation curable adhesive |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2855444B2 (en) | 1999-02-10 |
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