JPH02278896A - Cooling system for electronic devices - Google Patents

Cooling system for electronic devices

Info

Publication number
JPH02278896A
JPH02278896A JP10131889A JP10131889A JPH02278896A JP H02278896 A JPH02278896 A JP H02278896A JP 10131889 A JP10131889 A JP 10131889A JP 10131889 A JP10131889 A JP 10131889A JP H02278896 A JPH02278896 A JP H02278896A
Authority
JP
Japan
Prior art keywords
devices
plates
electronic devices
flows
branching
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10131889A
Other languages
Japanese (ja)
Inventor
Yoshiaki Ota
太田　好昭
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP10131889A priority Critical patent/JPH02278896A/en
Publication of JPH02278896A publication Critical patent/JPH02278896A/en
Pending legal-status Critical Current

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  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

PURPOSE:To improve cooling effect by providing a branch plate for branching an upward refrigerant flow to electronic device sides of stages, and convection guide plates for guiding the branched refrigerant flows toward the devices of the stages. CONSTITUTION:Electronic devices 4 are arranged in upper and lower rows in a frame M, air flows 7, 9 directed upward are formed by upper and lower fans 6, 10 of the frame M to cool the devices 4, 11. In this case, in order to sufficiently perform air flows 8, 12, 13 to the devices 4, 11, branching plates 1-3 are arranged in a plurality of upper and lower rows to be mounted. ln order to raise the cooling effects of the devices 11 of upper stage, the lengths of the plates 1-3 are so set as to satisfy l1<l2<l3. The flows 13, 12 branched by the plates 1-3 pass a convection guide plate 5 to be formed at opposite side to the flows 7, 9, and efficiently cool the devices 4, 11. Thus, since the refrigerant flow is forcibly sorted to the devices by the branching plates, the air cooling effect of the devices can be improved.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は電子機器類の冷却方式に関する。[Detailed description of the invention] [Industrial application field] The present invention relates to a cooling method for electronic equipment.

〔従来の技術〕[Conventional technology]

従来、この種の冷却方式は第２図に示すように。 Conventionally, this type of cooling method is shown in Figure 2.

機枠Ｍ内に電子機器類４，４を上下に配列し、上下各部
のファン１．２により機枠Ｍの下部から上部に流れる冷
媒流３，８を形成し、対流誘導板５により電子機器類４
，４に向けて誘導冷却していた。Electronic devices 4, 4 are arranged vertically in the machine frame M, and the fans 1.2 in the upper and lower parts form refrigerant flows 3, 8 flowing from the bottom to the top of the machine frame M, and the convection guide plate 5 allows the electronic devices to Class 4
, 4 was being inductively cooled.

〔発明が解決しようとする課題〕[Problem to be solved by the invention]

上述した従来の冷却方式は被冷却装置の外部の空気の流
れに対し、空気取入れ口から入る空気の流れが比較的少
なくなり、十分な冷却効果が得られないという欠点があ
った。The above-mentioned conventional cooling method has the disadvantage that the flow of air entering through the air intake port is relatively small compared to the flow of air outside the device to be cooled, and a sufficient cooling effect cannot be obtained.

本発明の目的は前記課題を解決した電子機器類の冷却方
式を提供することにある。An object of the present invention is to provide a cooling method for electronic equipment that solves the above problems.

〔課題を解決するための手段〕[Means to solve the problem]

前記目的を達成するため１本発明は上下複数段に配列し
た電子機器類を上方に流れる冷媒により冷却する電子機
器類の冷却方式において、上方への冷媒流を各段の電子
機器類側に各々分流する分流板と、分流板にて分流され
た冷媒流を各段の電子機器類に向けて誘導する対流誘導
板とを有するものである。In order to achieve the above object, the present invention provides a cooling method for electronic devices in which electronic devices arranged in multiple stages above and below are cooled by a refrigerant flowing upward, in which the upward refrigerant flow is directed to the electronic devices in each step. It has a flow divider plate that divides the flow, and a convection guide plate that guides the refrigerant flow divided by the flow divider plate toward electronic equipment at each stage.

〔実施例〕〔Example〕

次に本発明について図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.

第１図は本発明の一実施例を示す構成図である。FIG. 1 is a block diagram showing an embodiment of the present invention.

図において１機枠Ｍ内に電子機器類４，４・・・を上下
に配列し１機枠Ｍの上部及び下部のファン６．１０によ
り、上方に向かう空気の流れ７．９を形成し。In the figure, electronic devices 4, 4, . . . are arranged vertically within a single machine frame M, and fans 6.10 at the upper and lower parts of the single machine frame M form an upward air flow 7.9.

電子機器類４，１１．１１の冷却を行う、このとき、各
電子機器類４，１１．１１への空気の流れ８，１２．１
３を十分に行うため１分流板１，２．３を上下に複数段
配列して取付ける。The electronic devices 4, 11.11 are cooled. At this time, the air flow 8, 12.1 to each electronic device 4, 11.11 is performed.
In order to sufficiently carry out step 3, the flow divider plates 1, 2.3 are arranged in multiple stages vertically and installed.

本図の例では、上段の電子機器類１１の冷却効果を上げ
るため１分流板１，２．３の長さをＩＩｓ　＜　Ｑｔ　
＜　Ｑｓに設定しである０分流板１，２．３にて分流し
た気流１３、１２は対流誘導板５を通り、気流７，９と
反対側に形成され、電子機器類４，１１を能率良く冷却
する。In the example shown in this figure, in order to increase the cooling effect of the electronic equipment 11 on the upper stage, the length of the flow divider plates 1 and 2.3 is set so that IIs < Qt
The airflows 13 and 12 divided by the flow divider plates 1 and 2.3, which are set to Cool well.

本実施例では分流板１，２．３を空気の流れ７，９に対
し斜めに配列したが、直角に配設しても良い。In this embodiment, the flow divider plates 1, 2.3 are arranged diagonally with respect to the air flows 7, 9, but they may be arranged at right angles.

〔発明の効果〕〔Effect of the invention〕

以上説明したように、本発明は分流板にて冷媒流を強制
的に電子機器類に振り向けるので、電子機器類の空冷効
果を向上できる効果を有する。As explained above, since the present invention forcibly directs the refrigerant flow to electronic devices using the flow divider plate, it has the effect of improving the air cooling effect of electronic devices.

【図面の簡単な説明】[Brief explanation of drawings]

第°１図は本発明の一実施例を示す構成図、第２図は従
来例を示す構成図である。 １．２．３・・・分流板　　　　４．１１・・・電子機
器類５・・・対流誘導板 ６．１０・・・ファンFIG. 1 is a block diagram showing an embodiment of the present invention, and FIG. 2 is a block diagram showing a conventional example. 1.2.3...Broadcast plate 4.11...Electronic equipment 5...Convection induction plate 6.10...Fan

Claims (1)

【特許請求の範囲】[Claims] （１）上下複数段に配列した電子機器類を上方に流れる
冷媒により冷却する電子機器類の冷却方式において、上
方への冷媒流を各段の電子機器類側に各々分流する分流
板と、分流板にて分流された冷媒流を各段の電子機器類
に向けて誘導する対流誘導板とを有することを特徴とす
る電子機器類の冷却方式。(1) In a cooling method for electronic devices in which electronic devices arranged in multiple stages above and below are cooled by refrigerant flowing upward, a flow divider plate that divides the upward refrigerant flow to the electronic devices in each stage, and a flow divider are used. A cooling method for electronic equipment, comprising a convection guide plate that guides a refrigerant flow divided by the plate toward electronic equipment at each stage.
JP10131889A 1989-04-20 1989-04-20 Cooling system for electronic devices Pending JPH02278896A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10131889A JPH02278896A (en) 1989-04-20 1989-04-20 Cooling system for electronic devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10131889A JPH02278896A (en) 1989-04-20 1989-04-20 Cooling system for electronic devices

Publications (1)

Publication Number Publication Date
JPH02278896A true JPH02278896A (en) 1990-11-15

Family

ID=14297464

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10131889A Pending JPH02278896A (en) 1989-04-20 1989-04-20 Cooling system for electronic devices

Country Status (1)

Country Link
JP (1) JPH02278896A (en)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5613552A (en) * 1994-07-13 1997-03-25 Nippondenso Co., Ltd. Cooling apparatus using boiling and condensing refrigerant
US6222729B1 (en) 1998-07-28 2001-04-24 Nec Corporation Electronic device cooling system having guides for guiding a flow of the air evenly
JP2008159747A (en) * 2006-12-22 2008-07-10 Kurogane Kosakusho Ltd Electronic device housing apparatus
WO2008084632A1 (en) * 2007-01-10 2008-07-17 Ntt Electronics Corporation Electronic unit
JP2008198877A (en) * 2007-02-15 2008-08-28 Kurogane Kosakusho Ltd Electronic equipment housing apparatus
JP2009147113A (en) * 2007-12-14 2009-07-02 Nec Corp Rack for electronic equipment
JP2013509155A (en) * 2009-10-26 2013-03-07 アルストム・テクノロジー・リミテッド Cooling device for cooling medium voltage switchgear by using a heat pipe that is energized
WO2013080356A1 (en) * 2011-12-01 2013-06-06 富士通株式会社 Rack for electronic equipment, and information processing device
JP2014127023A (en) * 2012-12-26 2014-07-07 Hitachi Systems Ltd Inter-rack-row capping device for air conditioning system
JP2015094537A (en) * 2013-11-13 2015-05-18 日本電信電話株式会社 Method for determining parameters of current plate

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5613552A (en) * 1994-07-13 1997-03-25 Nippondenso Co., Ltd. Cooling apparatus using boiling and condensing refrigerant
US6222729B1 (en) 1998-07-28 2001-04-24 Nec Corporation Electronic device cooling system having guides for guiding a flow of the air evenly
JP4713458B2 (en) * 2006-12-22 2011-06-29 株式会社くろがね工作所 Electronic device storage device
JP2008159747A (en) * 2006-12-22 2008-07-10 Kurogane Kosakusho Ltd Electronic device housing apparatus
WO2008084632A1 (en) * 2007-01-10 2008-07-17 Ntt Electronics Corporation Electronic unit
JP2008198877A (en) * 2007-02-15 2008-08-28 Kurogane Kosakusho Ltd Electronic equipment housing apparatus
JP2009147113A (en) * 2007-12-14 2009-07-02 Nec Corp Rack for electronic equipment
JP2013509155A (en) * 2009-10-26 2013-03-07 アルストム・テクノロジー・リミテッド Cooling device for cooling medium voltage switchgear by using a heat pipe that is energized
WO2013080356A1 (en) * 2011-12-01 2013-06-06 富士通株式会社 Rack for electronic equipment, and information processing device
CN103959925A (en) * 2011-12-01 2014-07-30 富士通株式会社 Rack for electronic equipment, and information processing device
JPWO2013080356A1 (en) * 2011-12-01 2015-04-27 富士通株式会社 Electronic equipment rack and information processing apparatus
US9814161B2 (en) 2011-12-01 2017-11-07 Fujitsu Limited Electronic device rack and information processing apparatus
JP2014127023A (en) * 2012-12-26 2014-07-07 Hitachi Systems Ltd Inter-rack-row capping device for air conditioning system
JP2015094537A (en) * 2013-11-13 2015-05-18 日本電信電話株式会社 Method for determining parameters of current plate

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