JPH02270210A - Insulated wire - Google Patents
Insulated wireInfo
- Publication number
- JPH02270210A JPH02270210A JP9042689A JP9042689A JPH02270210A JP H02270210 A JPH02270210 A JP H02270210A JP 9042689 A JP9042689 A JP 9042689A JP 9042689 A JP9042689 A JP 9042689A JP H02270210 A JPH02270210 A JP H02270210A
- Authority
- JP
- Japan
- Prior art keywords
- insulating layer
- peek
- insulated wire
- water
- insulation layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920005989 resin Polymers 0.000 claims abstract description 24
- 239000011347 resin Substances 0.000 claims abstract description 24
- 239000004020 conductor Substances 0.000 claims abstract description 15
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 36
- 239000004696 Poly ether ether ketone Substances 0.000 claims description 31
- 229920002530 polyetherether ketone Polymers 0.000 claims description 31
- 229920006395 saturated elastomer Polymers 0.000 claims description 13
- 239000004811 fluoropolymer Substances 0.000 claims 1
- 229920002313 fluoropolymer Polymers 0.000 claims 1
- 229920005573 silicon-containing polymer Polymers 0.000 claims 1
- -1 polyethylene Polymers 0.000 abstract description 17
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 11
- 239000004698 Polyethylene Substances 0.000 abstract description 11
- 238000009413 insulation Methods 0.000 abstract description 10
- 229920000573 polyethylene Polymers 0.000 abstract description 10
- 239000011248 coating agent Substances 0.000 abstract description 6
- 238000000576 coating method Methods 0.000 abstract description 6
- 229910000881 Cu alloy Inorganic materials 0.000 abstract description 2
- 239000004743 Polypropylene Substances 0.000 abstract description 2
- 239000000654 additive Substances 0.000 abstract description 2
- 229910052802 copper Inorganic materials 0.000 abstract description 2
- 239000010949 copper Substances 0.000 abstract description 2
- 239000000945 filler Substances 0.000 abstract description 2
- 239000000203 mixture Substances 0.000 abstract description 2
- 229920001155 polypropylene Polymers 0.000 abstract description 2
- 229920001187 thermosetting polymer Polymers 0.000 abstract description 2
- 229920001643 poly(ether ketone) Polymers 0.000 abstract 5
- JUPQTSLXMOCDHR-UHFFFAOYSA-N benzene-1,4-diol;bis(4-fluorophenyl)methanone Chemical compound OC1=CC=C(O)C=C1.C1=CC(F)=CC=C1C(=O)C1=CC=C(F)C=C1 JUPQTSLXMOCDHR-UHFFFAOYSA-N 0.000 description 27
- 238000007765 extrusion coating Methods 0.000 description 20
- 238000000034 method Methods 0.000 description 10
- 230000000052 comparative effect Effects 0.000 description 8
- 229920002050 silicone resin Polymers 0.000 description 8
- 238000010521 absorption reaction Methods 0.000 description 6
- 238000004132 cross linking Methods 0.000 description 5
- 230000007423 decrease Effects 0.000 description 5
- 229920002292 Nylon 6 Polymers 0.000 description 4
- 230000015556 catabolic process Effects 0.000 description 4
- 239000002033 PVDF binder Substances 0.000 description 3
- 229920001577 copolymer Polymers 0.000 description 3
- 229920001296 polysiloxane Polymers 0.000 description 3
- 229920002981 polyvinylidene fluoride Polymers 0.000 description 3
- 238000004804 winding Methods 0.000 description 3
- WSSSPWUEQFSQQG-UHFFFAOYSA-N 4-methyl-1-pentene Chemical compound CC(C)CC=C WSSSPWUEQFSQQG-UHFFFAOYSA-N 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 239000004810 polytetrafluoroethylene Substances 0.000 description 2
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 2
- BQCIDUSAKPWEOX-UHFFFAOYSA-N 1,1-Difluoroethene Chemical compound FC(F)=C BQCIDUSAKPWEOX-UHFFFAOYSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 229920006370 Kynar Polymers 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- 230000003712 anti-aging effect Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 125000000468 ketone group Chemical group 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
Landscapes
- Organic Insulating Materials (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は耐熱性が極めて良好なポリエーテルエーテル
ケトン（以下、ＰＥＥＫと略記する。）からなる絶縁層
を有する絶縁電線に関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to an insulated wire having an insulating layer made of polyether ether ketone (hereinafter abbreviated as PEEK) having extremely good heat resistance.
近時、極めて耐熱性の優れた絶縁Ｔｉ線として、ＰＥＥ
Ｋからなる絶縁層を有する絶縁電線が注目されている。Recently, PEE has been used as an insulated Ti wire with extremely high heat resistance.
An insulated wire having an insulating layer made of K is attracting attention.
これは、ｌ’ＥＥＫが３４０°Ｃ以上の高融点を有し、
かつ１００〜３００ ’Ｃの範囲の温度領域において優
れた熱安定性を有するためである。This is because l'EEK has a high melting point of 340°C or higher,
This is because it has excellent thermal stability in a temperature range of 100 to 300'C.
そして、このような絶縁電線は、導体上にＰＥＥＫを押
出被覆法によって被覆して絶縁層とする方法で製造され
ている。Such insulated wires are manufactured by coating a conductor with PEEK using an extrusion coating method to form an insulating layer.
しかしながら、このＰＥＥＫからなる絶縁層を有する電
線にあっては、ＰＥＥＫが極性基であるケトン基を持つ
ポリマーであるため、吸水性を示し、水中での使用や高
湿下での使用にあってはこの吸水によって初期の絶縁耐
力が維持できない不具合であった。However, electric wires with an insulating layer made of PEEK exhibit water absorption properties because PEEK is a polymer with ketone groups, which are polar groups, and cannot be used underwater or in high humidity environments. The problem was that the initial dielectric strength could not be maintained due to this water absorption.
また、ＰＥＥＫは剛直で硬質のポリマーであることから
電線としたときの可撓性に乏しくなるなどの欠点もあっ
た。Furthermore, since PEEK is a rigid and hard polymer, it also has drawbacks such as poor flexibility when used as an electric wire.
この発明では、導体にポリエーテルエーテルケトンから
なる絶縁層と、室温水中での平衡飽和水分量が１％以下
の樹脂からなる絶縁層を設けることによって、上記課題
を解決するようにした。In this invention, the above problems are solved by providing the conductor with an insulating layer made of polyetheretherketone and an insulating layer made of a resin whose equilibrium saturated water content in room temperature water is 1% or less.
以下、この発明の詳細な説明する。The present invention will be explained in detail below.
第１図はこの発明の絶縁電線の第１の例を示すもので、
図中符号１は銅、銅合金などからなる導体である。この
導体ｌは単線であっても撚線であってもよい。導体ｌ上
には、ＰＥＥＫからなる第１の絶縁層２が設けられてい
る。この第１の絶縁層２は、ＰＥＥＫあるいはこれに充
填剤、老化防止剤などの種々の添加剤を添加した組成物
を押出被覆法によって導体ｌ上に被覆したものである。FIG. 1 shows a first example of the insulated wire of the present invention.
Reference numeral 1 in the figure is a conductor made of copper, copper alloy, or the like. This conductor l may be a single wire or a twisted wire. A first insulating layer 2 made of PEEK is provided on the conductor l. The first insulating layer 2 is made by coating the conductor 1 with PEEK or a composition in which various additives such as fillers and anti-aging agents are added to the PEEK by an extrusion coating method.
このＰＥＥＫからなる第１の絶縁層２の厚さは、特に限
定されないが通常は０．０５〜２１１程度の範囲とされ
る。また、第１の絶縁層２のＰＥＥＫの結晶化の度合は
、絶縁電線としての可撓性がより要求される場合には結
晶化度をＯ〜１０％程度とし、耐薬品性がより要求され
る場合には結晶化度を２０〜３０％とすることが好まし
く、結晶化度の制御は押出被覆直後のＰ Ｅ Ｅ Ｋ被
膜を徐冷するかあるいは急冷するかによって簡単に行い
うる。The thickness of the first insulating layer 2 made of PEEK is not particularly limited, but is usually in the range of about 0.05 to 211 mm. In addition, the degree of crystallization of PEEK of the first insulating layer 2 is set to about 0 to 10% when flexibility as an insulated wire is required, and when chemical resistance is required more. In this case, the degree of crystallinity is preferably 20 to 30%, and the degree of crystallinity can be easily controlled by slowly or rapidly cooling the PEEK coating immediately after extrusion coating.
さらに、ＰＥＥＫの押出被覆時に導体の予熱を行うこと
も望ましい。Additionally, it is desirable to preheat the conductor during extrusion coating of PEEK.
このＰＥＥＫからなる第１の絶縁層２上には、第２の絶
縁層３が設けられている。この第２の絶縁層３は、室温
水中での平衡飽和水分量が１％以下の樹脂あるいは樹脂
組成物からなるものである。A second insulating layer 3 is provided on the first insulating layer 2 made of PEEK. This second insulating layer 3 is made of a resin or a resin composition having an equilibrium saturated water content of 1% or less in water at room temperature.
この室温水中での平衡飽和水分量が１％以下の条件を満
たす樹脂としては、例えばボレエチレン、ポリプロピレ
ン、フッ素樹脂、ポリ塩化ビニル、ポリ−４−メチルペ
ンテン−１などの熱可塑性樹脂やポリイ・ミド、ポリエ
ステル、シリコーン樹脂、などの熱硬化性樹脂がある。Examples of resins that satisfy the condition that the equilibrium saturated water content in water at room temperature is 1% or less include thermoplastic resins such as boreethylene, polypropylene, fluororesin, polyvinyl chloride, and poly-4-methylpentene-1, and polyimide. There are thermosetting resins such as polyester, silicone resin, etc.
これらの樹脂のなかでも、非親水性が高いシリコーン樹
脂およびフン素樹脂が特に好ましい。ここでのシリコー
ン樹脂としては、塗布焼付タイプのワニス状のものが好
ましく、フッ素樹脂としては、ポリ四フッ化エチレン、
ポリ三フッ化塩化エチレン、ポリフッ化ビニリデン、四
フッ化エチレンー六フッ化ポリプロピレン共重合体、フ
ッ化ビニリデン−六フン化ポリプロピレン共重合体、フ
ッ化ビニリデン−三フッ化塩化エチレン共重合体、ポリ
フッ化ビニルなどが用いられる。また、シリコーン樹脂
およびフッ素樹脂は耐熱性が優れることからこれを用い
ることよりＰＥＥＫの優れた耐熱性を損なうことがない
。Among these resins, highly non-hydrophilic silicone resins and fluorine resins are particularly preferred. The silicone resin used here is preferably a varnish type of paint-on-baking type, and the fluororesin is polytetrafluoroethylene, polytetrafluoroethylene,
Polyethylene trifluoride chloride, polyvinylidene fluoride, ethylene tetrafluoride-polypropylene hexafluoride copolymer, vinylidene fluoride-polypropylene hexafluoride copolymer, vinylidene fluoride-ethylene chloride trifluoride copolymer, polyfluoride Vinyl etc. are used. Furthermore, since silicone resins and fluororesins have excellent heat resistance, their use does not impair the excellent heat resistance of PEEK.
この平衡飽和水分量が１％を越えると絶縁電線の浸水に
よる絶縁１耐力の低下を十分に防止することができなく
なる。If this equilibrium saturated moisture content exceeds 1%, it will not be possible to sufficiently prevent the dielectric strength from decreasing due to water intrusion into the insulated wire.
第２の絶縁層３の形成方法としては、押出被覆法や塗布
焼付法が採用され、また架橋して用いることもできる。As a method for forming the second insulating layer 3, an extrusion coating method or a coating and baking method is adopted, and it can also be used after crosslinking.
架橋方法としては過酸化物熱等の架橋剤を配合して加熱
架橋する方法や、電子線照射架橋、シラン架橋が用いら
れる。また、これ以外の方法として、これら樹脂からな
るテープを作成し、これを巻回する方法、このテープに
融着層を形成したものを巻回する方法、粉末状樹脂が得
られるものでは粉体塗装法などを適用することができる
。この第２の絶縁層３の厚さは、特に限定されることは
ないが、第１の絶縁層２よりも厚くする必要はなく、通
常０．０１〜ｌ ｙｘ程度の範囲で選択される。As a crosslinking method, a method of blending a crosslinking agent such as peroxide heat and heating crosslinking, electron beam irradiation crosslinking, and silane crosslinking are used. Other methods include creating a tape made of these resins and winding it, winding this tape with a fusion layer formed on it, and methods that yield powdered resin. Painting methods etc. can be applied. The thickness of the second insulating layer 3 is not particularly limited, but it does not need to be thicker than the first insulating layer 2, and is usually selected within a range of about 0.01 to lyx.
このような構造の絶縁電線にあっては、第２の絶縁層３
が吸水性の小さい樹脂からなるものであるから、水中等
での使用に際してもＰＥＥＫからなる第１の絶縁層２が
吸水することがなく、耐水性が優れたものとなる。また
、２層構造の絶縁層であるため、ピンホール等の欠陥に
よる耐電圧の低下が防止でき、耐電圧特性も向上する。In an insulated wire having such a structure, the second insulating layer 3
Since it is made of a resin with low water absorption, the first insulating layer 2 made of PEEK does not absorb water even when used in water, and has excellent water resistance. Furthermore, since the insulating layer has a two-layer structure, a decrease in withstand voltage due to defects such as pinholes can be prevented, and withstand voltage characteristics are also improved.
またさらに、ＰＥＥＫからなる第１の絶縁層２の厚さを
結果的に薄くすることが可能となり、また第１と第２の
絶縁層２，３の界面が緩和層として機能するので、絶縁
電線としての可撓性も向上する。Furthermore, since the thickness of the first insulating layer 2 made of PEEK can be reduced as a result, and the interface between the first and second insulating layers 2 and 3 functions as a relaxation layer, the insulated wire It also improves flexibility.
第２図は、この発明の絶縁電線の第２の例を示すもので
、この例の絶縁電線では、導体１上に室温水中での平衡
飽和水分量が１％以下の樹脂からなる第２の絶縁層３が
設けられ、この第２の絶縁層３°上にＰＥＥＫからなる
第１の絶縁層２が設けられたちので、第１の例とは絶縁
層が逆転した構造となっている。このものではＰＥＥＫ
からなる第１の絶縁層２が外側に配されていることから
第１の絶縁層２がある程度吸水するが、第２の絶縁層３
は吸水性がほとんどないので、絶縁層全体としての吸水
による絶縁１耐圧の低下は防止でき、また第１と第２の
絶縁層２，３の間の界面が緩和層として機能するため、
可撓性も良好である。FIG. 2 shows a second example of the insulated wire of the present invention. The insulated wire of this example has a second layer on the conductor 1 made of a resin having an equilibrium saturated moisture content of 1% or less in water at room temperature. An insulating layer 3 is provided, and a first insulating layer 2 made of PEEK is provided 3 degrees above the second insulating layer, so that the structure is such that the insulating layers are reversed from those in the first example. In this one PEEK
Since the first insulating layer 2 consisting of
Since it has almost no water absorption, it is possible to prevent the insulation 1 breakdown voltage from decreasing due to water absorption in the entire insulation layer, and since the interface between the first and second insulation layers 2 and 3 functions as a relaxation layer,
It also has good flexibility.
第３図はこの発明の第３の例を示すもので、導体１上に
室温水中での平衡飽和水分量が１％以下の樹脂からなる
第２の絶縁層３が設けられ、この第２の絶縁層３上にＰ
ＥＥＫからなる第１の絶縁層２が設けられ、さらにこの
第１の絶縁層２上に室温水中飽和水分量が１％以下の樹
脂からなる第２の絶縁層３が設けられた３層構造のもの
である。FIG. 3 shows a third example of the present invention, in which a second insulating layer 3 made of a resin whose equilibrium saturated moisture content in water at room temperature is 1% or less is provided on the conductor 1. P on the insulating layer 3
A three-layer structure in which a first insulating layer 2 made of EEK is provided, and a second insulating layer 3 made of a resin whose saturated moisture content in room temperature water is 1% or less is further provided on the first insulating layer 2. It is something.
第４図は、第４の例を示すもので、この絶縁電線は第３
の例での最外層の第２の絶縁層３上にさらにＰＥＥＫか
らなる第１の絶縁層２を設け、この上にさらに室温水中
飽和水分量が１％以下の樹脂からなる第２の絶縁層３を
設けた５層構造のものである。Figure 4 shows a fourth example, in which this insulated wire is
A first insulating layer 2 made of PEEK is further provided on the second insulating layer 3 as the outermost layer in the example, and a second insulating layer 2 made of a resin having a saturated moisture content in room temperature water of 1% or less is further provided on this. It has a 5-layer structure with 3 layers.
これらの例にあっても同様に吸水による耐電圧の低下が
少なく、可撓性が良好であるなどの特長を有している。These examples also have features such as less reduction in withstand voltage due to water absorption and good flexibility.
（実施例１）
外径１．０實麓の軟銅線上に厚さ０．４１肩のＰＥＥＫ
からなる第１の絶縁層を押出被覆によって設け、この上
に厚さＯ，ｌｘｍのポリエチレン（メルトインデックス
０．２５）からなる第２の絶縁層を押出被覆によって設
けて絶縁電線を得た。(Example 1) PEEK with a thickness of 0.41 mm on annealed copper wire with an outer diameter of 1.0 mm
A first insulating layer made of polyethylene (melt index 0.25) with a thickness of 0.1 x m was provided thereon by extrusion coating to obtain an insulated wire.
（実施例２）
実施例１において、ポリエチレンに代えてポリ−４−メ
チ・ルペンテン−１を用いて同様に絶縁電線を得た。(Example 2) An insulated wire was obtained in the same manner as in Example 1 using poly-4-methyllupentene-1 instead of polyethylene.
（実施例３）
実施例１において、ポリエチレンに代えてシリコーン樹
脂（東芝シリコーン、ＴＳＲ１１６）を用い、これを塗
布、焼付する以外は同様にして絶縁電線を得た。(Example 3) An insulated wire was obtained in the same manner as in Example 1, except that a silicone resin (Toshiba Silicone, TSR116) was used instead of polyethylene, and this was applied and baked.
（実施例４）
外径１．０ｘ＊の軟銅線上に厚さＯ，ｌａｍのポリエチ
レン（メルトインデックス０．２５）からなる第２の絶
縁層を押出被覆によって設け、この上に厚さ０．４ｒｘ
ｙのＰＥＥＫからなる第１の絶縁層を押出被覆によって
設けて絶縁電線を得た。(Example 4) A second insulating layer made of polyethylene (melt index 0.25) with a thickness of 0.lam was provided on an annealed copper wire with an outer diameter of 1.0x* by extrusion coating, and a layer with a thickness of 0.4rx
A first insulating layer made of y PEEK was provided by extrusion coating to obtain an insulated wire.
（実施例５）
外径１．０＋ｕ＋の軟銅線上に厚さ０．３層肩の−ＰＥ
ＥＫからなる第１の絶縁層を押出被覆によって設け、こ
の上に厚さ０．１層ｍのポリエチレンからなる第２の絶
縁層を押出被覆によって設け、さらにこの上に厚さ０．
３ｘ＊のＰＥＥＫからなる第１の絶縁層を押出被覆によ
って設けて絶縁電線を得た。(Example 5) -PE with a thickness of 0.3 on an annealed copper wire with an outer diameter of 1.0+u+
A first insulating layer made of EK is provided by extrusion coating, a second insulating layer made of polyethylene with a thickness of 0.1 m is provided thereon by extrusion coating, and a second insulating layer made of polyethylene with a thickness of 0.1 m is provided on this by extrusion coating.
A first insulating layer of 3x* PEEK was applied by extrusion coating to obtain an insulated wire.
（実施例６）
実施例５において、ポリエチレンに代えてポリ−４−メ
チルペンテン−１を用いた以外は同様にして絶縁電線を
得た。(Example 6) An insulated wire was obtained in the same manner as in Example 5 except that poly-4-methylpentene-1 was used instead of polyethylene.
（実施例７）
実施例５において、ポリエチレンに代えてシリコーン樹
脂を用い、これを塗布、焼付する以外は同様にして絶縁
電線を得た。(Example 7) An insulated wire was obtained in the same manner as in Example 5, except that silicone resin was used instead of polyethylene, and this was applied and baked.
（実施例８）
外径ｌ、Ｏｘｘの軟銅線上に厚さ０．１ｊ！ｘのポリエ
チレンからなる第２の絶縁層と、厚さＯ，ｌ＋ｕ＋のＰ
ＥＥＫからなる第１の絶縁層とを交互にそれぞれ３層お
よび２層押出ｈａによって設けて絶縁電線とした。(Example 8) Thickness 0.1j on annealed copper wire with outer diameter l and Oxx! a second insulating layer made of polyethylene of x and P of thickness O,l+u+
A first insulating layer made of EEK was alternately provided by extruding three layers and two layers, respectively, to obtain an insulated wire.
（比較例１）
外径１．０Ｊ１１の軟銅線上に厚さ０．５＊ｘのＰＥＥ
Ｋからなる絶縁層を押出被覆によって設け、絶縁電線を
得た。(Comparative Example 1) PEE with a thickness of 0.5*x on an annealed copper wire with an outer diameter of 1.0J11
An insulating layer made of K was provided by extrusion coating to obtain an insulated wire.
（比較例２）
外径ｌｏａｍの軟銅線上に厚さ０．４ｘｘのＰＥＥＫか
らな・る第１の絶縁層を押出被覆によって設け、この上
に厚さＱ、ｌａｍのナイロン６からなる第２の絶縁層を
押出被覆によって設けて絶縁電線とした。(Comparative Example 2) A first insulating layer made of PEEK with a thickness of 0.4xx is provided on an annealed copper wire with an outer diameter of loam by extrusion coating, and a second insulating layer made of nylon 6 with a thickness of Q and lam is provided on top of this. An insulating layer was provided by extrusion coating to obtain an insulated wire.
（比較例３）
外径１．０ｍｍの軟銅線上に厚さＯ，ｌｘｚのナイロン
６からなる第２の絶縁層を押出被覆によって設け、この
上に厚さ０．４ＲＲのＰＥＥＫからなる第１の絶縁層を
押出被覆によって設けて絶縁電線を得た。(Comparative Example 3) A second insulating layer made of nylon 6 with a thickness of O.lxz was provided on an annealed copper wire with an outer diameter of 1.0 mm by extrusion coating, and a first insulating layer made of PEEK with a thickness of 0.4 RR was placed on top of this. An insulating layer was provided by extrusion coating to obtain an insulated wire.
これらの実施例１〜８および比較例１〜３で得られた絶
縁電線について、交流短時間破壊電圧、７０°Ｃの温水
に１ケ月浸水後の交流短時間破壊電圧および可撓性につ
いて検討した。可撓性は、絶縁電線を所定の太さのマン
ドレルに巻き付け、絶縁層に割れ、クラックを生じない
最小のマンドレルの径を絶縁電線の自己径（ｄ）の倍率
で示した。The insulated wires obtained in Examples 1 to 8 and Comparative Examples 1 to 3 were examined for AC short-time breakdown voltage, AC short-time breakdown voltage and flexibility after being immersed in hot water at 70°C for one month. . Flexibility was measured by winding an insulated wire around a mandrel of a predetermined thickness, and expressing the minimum mandrel diameter that does not cause cracks in the insulating layer as a magnification of the self-diameter (d) of the insulated wire.
結果を第１表に示す。The results are shown in Table 1.
以 下 余 白
第 １ 表
第１表から明らかなように、この発明の絶縁電線は耐電
圧特性および可撓性が良好でかつ浸水後の耐電圧の低下
度合が少ないことがわかる。また、平衡飽和水分量が１
％より高い樹脂（ナイロン６）からなる第２の絶縁層を
有するものでは、浸水による耐電圧の低下を十分に防止
することができないことがわかる。As is clear from Table 1, the insulated wire of the present invention has good withstand voltage characteristics and flexibility, and the degree of decrease in withstand voltage after immersion in water is small. In addition, the equilibrium saturated water content is 1
It can be seen that with a second insulating layer made of a resin (nylon 6) having a resin (nylon 6) higher than 10%, it is not possible to sufficiently prevent a decrease in withstand voltage due to water intrusion.
（実施例９）
外径１．Ｑｘｘの軟銅線上に厚さ０．５ｘｍの［’ＥＥ
Ｋからなる第１の絶縁層を押出被覆で設け、この上に厚
さ０．１＊＊のポリフッ化ビニリデン（三菱油化「カイ
ナー」）を押出被覆して第２の絶縁層を設けて絶縁電線
を得た。(Example 9) Outer diameter 1. 0.5xm thick ['EE
A first insulating layer made of K is provided by extrusion coating, and a second insulating layer is provided on this by extrusion coating polyvinylidene fluoride (Mitsubishi Yuka "Kynar") with a thickness of 0.1**. Got the wire.
（実施例１０）
実施例９において、ポリフッ化ビニリデン（７）厚さを
０．２ｘｍとした以外は同様にして絶縁電線を得た。(Example 10) An insulated wire was obtained in the same manner as in Example 9 except that the thickness of polyvinylidene fluoride (7) was changed to 0.2 x m.
（実施例１１）
外径１．０＋ｘの軟銅線上に厚さ０．５！度のＰＥＥＫ
からなる第１の絶縁層を押出被覆して設け、この上に厚
さ０．１１ｍのシリコーン４ｆｉ４脂（信越シリコーン
ｒＫＲ２７２Ｊ）を塗布焼付して第２の絶縁層を設けて
絶縁電線を得た。(Example 11) Thickness 0.5 on annealed copper wire with outer diameter 1.0+x! Degree of PEEK
A first insulating layer consisting of was extruded and coated, and a second insulating layer was formed by coating and baking silicone 4fi4 resin (Shin-Etsu Silicone rKR272J) with a thickness of 0.11 m on this to obtain an insulated wire.
（実施例１２）
実施例１１において、シリコーン樹脂の厚さを０．２１
１とした以外は同様にして絶縁電線を得た。(Example 12) In Example 11, the thickness of the silicone resin was changed to 0.21
An insulated wire was obtained in the same manner except that the value was changed to 1.
（比較例４）
外径１．０１３１１の軟銅線上にＰＥＥＫからなる厚さ
０．６ｍｍの絶縁層を押出被覆によって設けて絶縁電線
を得た。(Comparative Example 4) An insulated wire was obtained by providing an insulating layer made of PEEK with a thickness of 0.6 mm on an annealed copper wire with an outer diameter of 1.01311 mm by extrusion coating.
（比較例５）
比較例５において、Ｐ Ｅ Ｅ Ｋからなる絶縁層の厚
さを０．７ｘｘとした以外は同様にして絶縁電線を得た
。(Comparative Example 5) An insulated wire was obtained in the same manner as in Comparative Example 5, except that the thickness of the insulating layer made of PEEK was changed to 0.7xx.
これら実施例９〜１２および比較例４，５で得られた絶
縁電線について、交流短時間破壊電圧、７０°Ｃの温水
に１ケ月浸水後の交流短時間数＊電圧および浸水後のＰ
ＥＥＫからなる絶縁層の吸水量を求めた。Regarding the insulated wires obtained in Examples 9 to 12 and Comparative Examples 4 and 5, AC short-time breakdown voltage, AC short-time number * voltage after being immersed in hot water at 70°C for one month, and P after being immersed in water
The amount of water absorbed by the insulating layer made of EEK was determined.
結果を第２表に示す。The results are shown in Table 2.
以下余白
第 ２ 表
第２表から明らかなように、この発明の絶縁電線は浸水
後においても耐電圧の低下の度合が微かである。As is clear from Table 2, the withstand voltage of the insulated wire of the present invention slightly decreases even after being immersed in water.
以上説明したように、この発明の絶縁電線は導体にポリ
エーテルエーテルケトンからなる絶縁層と、室温水中で
の平衡飽和水分量が１％以下の樹脂からなる絶縁層を設
けたものであるので、電気絶縁耐力が良好で、可撓性に
富み、しかも浸水による電気絶縁耐力の低下も微かであ
るなどの効果を有する。As explained above, the insulated wire of the present invention has a conductor provided with an insulating layer made of polyetheretherketone and an insulating layer made of a resin whose equilibrium saturated moisture content in water at room temperature is 1% or less. It has good electrical dielectric strength, is highly flexible, and has the advantage that the electrical dielectric strength decreases only slightly due to water immersion.
また、室温水中の平衡水分量が１％以下の樹脂としてシ
リコーン樹脂あるいはフッ素樹脂を用いるものでは、Ｐ
ＥＥＫの優れた耐熱性を損なうことなく耐水性を高める
ことができる。In addition, if silicone resin or fluororesin is used as the resin whose equilibrium moisture content in room temperature water is 1% or less, P
Water resistance can be increased without impairing the excellent heat resistance of EEK.
第１図ないし第４図は、いずれもこの発明の絶縁電線の
例を示す概略断面図である。
１・・・・・・導体、
２・・・・・・第１の絶縁層、
３・・・・・・第２の絶縁層。1 to 4 are schematic cross-sectional views showing examples of the insulated wire of the present invention. 1... Conductor, 2... First insulating layer, 3... Second insulating layer.
Claims (3)
層と、室温水中での平衡飽和水分量が１％以下の樹脂か
らなる絶縁層を設けたことを特徴とする絶縁電線。(1) An insulated wire characterized in that a conductor is provided with an insulating layer made of polyetheretherketone and an insulating layer made of a resin whose equilibrium saturated moisture content in water at room temperature is 1% or less.
脂がフッ素系ポリマーである請求項（１）記載の絶縁電
線。(2) The insulated wire according to claim 1, wherein the resin having an equilibrium saturated water content of 1% or less in room temperature water is a fluoropolymer.
シリコーン系ポリマーである請求項（１）記載の絶縁電
線。(3) The insulated wire according to claim 1, wherein the resin having an equilibrium saturated moisture content of 1% in room temperature water is a silicone polymer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9042689A JPH02270210A (en) | 1989-04-10 | 1989-04-10 | Insulated wire |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9042689A JPH02270210A (en) | 1989-04-10 | 1989-04-10 | Insulated wire |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02270210A true JPH02270210A (en) | 1990-11-05 |
Family
ID=13998280
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9042689A Pending JPH02270210A (en) | 1989-04-10 | 1989-04-10 | Insulated wire |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02270210A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102010040038A1 (en) * | 2010-08-31 | 2012-03-01 | Siemens Aktiengesellschaft | Electronic component such as electric cable, has outer dielectric sheet which is partially in contact with inner dielectric sheet, and primary dielectric material possesses larger dielectric constant than secondary dielectric material |
| US20130335181A1 (en) * | 2011-01-27 | 2013-12-19 | Korea Hydro & Nuclear Power Co., Ltd. | Coil assembly for a control rod driver having improved thermal resistance, and method for manufacturing the same |
| JP2018512093A (en) * | 2015-01-30 | 2018-05-10 | ビクトレックス マニュファクチャリング リミテッドＶｉｃｔｒｅｘ Ｍａｎｕｆａｃｔｕｒｉｎｇ Ｌｉｍｉｔｅｄ | Insulated conductor |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5830219B2 (en) * | 1973-11-23 | 1983-06-28 | イ−エムエフ コ−ポレ−シヨン | Seat ocrysouchi |
| JPS6316794B2 (en) * | 1979-05-17 | 1988-04-11 | Nippon Electric Co |
-
1989
- 1989-04-10 JP JP9042689A patent/JPH02270210A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5830219B2 (en) * | 1973-11-23 | 1983-06-28 | イ−エムエフ コ−ポレ−シヨン | Seat ocrysouchi |
| JPS6316794B2 (en) * | 1979-05-17 | 1988-04-11 | Nippon Electric Co |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102010040038A1 (en) * | 2010-08-31 | 2012-03-01 | Siemens Aktiengesellschaft | Electronic component such as electric cable, has outer dielectric sheet which is partially in contact with inner dielectric sheet, and primary dielectric material possesses larger dielectric constant than secondary dielectric material |
| US20130335181A1 (en) * | 2011-01-27 | 2013-12-19 | Korea Hydro & Nuclear Power Co., Ltd. | Coil assembly for a control rod driver having improved thermal resistance, and method for manufacturing the same |
| US9564265B2 (en) * | 2011-01-27 | 2017-02-07 | Korea Hydro & Nuclear Power Co., Ltd. | Coil assembly for a control rod driver having improved thermal resistance, and method for manufacturing the same |
| EP2669896A4 (en) * | 2011-01-27 | 2017-05-10 | Korea Hydro&Nuclear Power Co. Ltd | Coil assembly for a control rod driver having improved thermal resistance, and method for manufacturing same |
| JP2018512093A (en) * | 2015-01-30 | 2018-05-10 | ビクトレックス マニュファクチャリング リミテッドＶｉｃｔｒｅｘ Ｍａｎｕｆａｃｔｕｒｉｎｇ Ｌｉｍｉｔｅｄ | Insulated conductor |
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