JPH02266918A - Method for bonding plastic - Google Patents
Method for bonding plasticInfo
- Publication number
- JPH02266918A JPH02266918A JP1090027A JP9002789A JPH02266918A JP H02266918 A JPH02266918 A JP H02266918A JP 1090027 A JP1090027 A JP 1090027A JP 9002789 A JP9002789 A JP 9002789A JP H02266918 A JPH02266918 A JP H02266918A
- Authority
- JP
- Japan
- Prior art keywords
- plastic
- molded body
- laser beam
- plastic molded
- kaleidoscope
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004033 plastic Substances 0.000 title claims abstract description 60
- 229920003023 plastic Polymers 0.000 title claims abstract description 60
- 238000000034 method Methods 0.000 title claims description 22
- 238000005304 joining Methods 0.000 claims description 8
- 238000002844 melting Methods 0.000 claims description 4
- 230000008018 melting Effects 0.000 claims description 4
- 238000003466 welding Methods 0.000 abstract description 8
- 238000009826 distribution Methods 0.000 abstract description 6
- 239000002184 metal Substances 0.000 abstract description 3
- 229910052751 metal Inorganic materials 0.000 abstract description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract description 2
- 239000010931 gold Substances 0.000 abstract description 2
- 229910052737 gold Inorganic materials 0.000 abstract description 2
- 238000007747 plating Methods 0.000 abstract description 2
- 239000004606 Fillers/Extenders Substances 0.000 abstract 1
- 238000010521 absorption reaction Methods 0.000 description 11
- 239000000463 material Substances 0.000 description 8
- 230000031700 light absorption Effects 0.000 description 7
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- 230000003287 optical effect Effects 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 230000004927 fusion Effects 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000020169 heat generation Effects 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- 239000004926 polymethyl methacrylate Substances 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- 239000006229 carbon black Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000002925 chemical effect Effects 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000003760 hair shine Effects 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 210000003127 knee Anatomy 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000013557 residual solvent Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052714 tellurium Inorganic materials 0.000 description 1
- PORWMNRCUJJQNO-UHFFFAOYSA-N tellurium atom Chemical compound [Te] PORWMNRCUJJQNO-UHFFFAOYSA-N 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/01—General aspects dealing with the joint area or with the area to be joined
- B29C66/347—General aspects dealing with the joint area or with the area to be joined using particular temperature distributions or gradients; using particular heat distributions or gradients
- B29C66/3472—General aspects dealing with the joint area or with the area to be joined using particular temperature distributions or gradients; using particular heat distributions or gradients in the plane of the joint, e.g. along the joint line in the plane of the joint or perpendicular to the joint line in the plane of the joint
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
- B29C65/16—Laser beams
- B29C65/1629—Laser beams characterised by the way of heating the interface
- B29C65/1635—Laser beams characterised by the way of heating the interface at least passing through one of the parts to be joined, i.e. laser transmission welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
- B29C65/16—Laser beams
- B29C65/1629—Laser beams characterised by the way of heating the interface
- B29C65/1654—Laser beams characterised by the way of heating the interface scanning at least one of the parts to be joined
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
- B29C65/16—Laser beams
- B29C65/1687—Laser beams making use of light guides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/01—General aspects dealing with the joint area or with the area to be joined
- B29C66/05—Particular design of joint configurations
- B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
- B29C66/11—Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
- B29C66/112—Single lapped joints
- B29C66/1122—Single lap to lap joints, i.e. overlap joints
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/01—General aspects dealing with the joint area or with the area to be joined
- B29C66/342—Preventing air-inclusions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/40—General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
- B29C66/41—Joining substantially flat articles ; Making flat seams in tubular or hollow articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/90—Measuring or controlling the joining process
- B29C66/91—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Health & Medical Sciences (AREA)
- Electromagnetism (AREA)
- Toxicology (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
Abstract
Description
【発明の詳細な説明】
〔概要〕
プラスチック部材同士の接合方法に関し、位置精度がよ
く、また強い接着強度の接合を行うことを目的とし、
レーザ光の吸収が少ない第１のプラスチックよりなる成
形体と該第１のプラスチックに較べて格段に吸収が大き
な第２のプラスチックよりなる成形体とを当接し、レー
ザ光を第１のプラスチック成形体を通して第２のプラス
チック成形体を照射して照射位置のプラスチックを溶融
させると共に、該溶融熱により第１のプラスチックをも
溶融せしめ、両者を融着する接合方法において、該融着
をカライドスコープを通したレーザ光を使用してプラス
チックの接合方法を構成する。[Detailed Description of the Invention] [Summary] The purpose of this invention is to provide a molded body made of a first plastic that absorbs little laser light, with the aim of achieving a method of joining plastic members together with good positional accuracy and strong adhesive strength. and a molded body made of a second plastic which has a much higher absorption than the first plastic, and the laser beam is irradiated through the first plastic molded body to the second plastic molded body to determine the irradiation position. In the joining method, the plastic is melted and the first plastic is also melted by the melting heat, and the two are fused together, and the fusion is performed using a laser beam passed through a kaleidoscope. do.
本発明はプラスチック成形体同士の接合方法に関する。 The present invention relates to a method for joining plastic molded bodies together.
現在、合成樹脂には熱硬化性樹脂と熱可塑性樹脂とがあ
り、殆どあらゆる分野に使用されているが、熱硬化性樹
脂については、圧縮成形法（Ｃｏｌｌｐｒｅｓｓｉｏｎ
−ｍｏｌｄｉｎｇＬ ）ランスファ成形法（Ｔｒａｎ
ａｆｅｒ−ｍｏ１ｄｉｎｇＬ射出成形法（Ｉｎｊｅｃｔ
ｉｏｎ−＋ｗｏｌｄｉｎｇ） を注型性（Ｃａｓｔｉｎ
ｓ）など各種の成形法により成形品が作られて使用され
ている。Currently, there are two types of synthetic resins: thermosetting resins and thermoplastic resins, which are used in almost every field.
-moldingL) Transfer molding method (Tran
afer-moldingL injection molding method (Inject
Casting (ion-+wolding)
Molded products are made and used using various molding methods such as s).
こ−で、プラスチックは当初は耐熱性や耐湿性が劣るた
め高い信頼性を必要とする電子部品の構成材として使用
されなかったが、材料の改良によってセラミックスや金
属材料に置き代わって使用されるようになった。For this reason, plastics were initially not used as constituent materials for electronic components that required high reliability due to their poor heat resistance and moisture resistance, but as the materials improved, they were used to replace ceramics and metal materials. It became so.
例えば、高信頼性を必要とする回路部品や半導体部品の
パッケージングは当初、ガラス端子と金属ケースを用い
るハーメチックシール構造がとられていたが、現在では
殆どのものが樹脂モールド外装に置き代わっている。For example, packaging for circuit components and semiconductor components that require high reliability initially used a hermetic seal structure using glass terminals and metal cases, but now most of them are replaced with resin molded exteriors. There is.
また、合成樹脂は大部分の材料が透明体であることから
、ガラスに代わって成形体として使用されている場合が
多い。Furthermore, since most of the materials of synthetic resins are transparent, they are often used as molded bodies in place of glass.
例えば、光ディスクがこれに当たり、ガラスよりなるデ
ィスク基板の上に樹脂成形して案内溝（プリグループ）
を作り、この上に記録媒体を膜形成して製造する場合も
あるが、ポリメチルメタクリレート（略称ＰＭＭＡ）や
ポリカーボネート（略称ＰＣ）のように光吸収の少ない
透明樹脂を用いで案内溝の付いたディスク基板を注型法
により作り、この上に記録媒体を膜形成することが行わ
れている。For example, optical discs are covered with guide grooves (pre-groups) formed by resin molding on the glass disc substrate.
In some cases, a recording medium is manufactured by forming a film on the recording medium, but transparent resins with low light absorption such as polymethyl methacrylate (abbreviation PMMA) or polycarbonate (abbreviation PC) are used to create a recording medium with guide grooves. A disk substrate is produced by a casting method, and a recording medium is formed thereon as a film.
こ−で、光ディスクへの情報の記録と再生は透明なディ
スク基板を通して記録媒体にレーザ光を照射して行われ
るが、サンドインチ・タイプのものについては二枚のデ
ィスク基板を基板面を外側とし、プラスチックよりなる
セパレータを介し、一定の間隙をおいて位置精度よ（張
り合わせることが行われている。Information is recorded on and reproduced from an optical disk by irradiating the recording medium with a laser beam through a transparent disk substrate, but in the case of a sand-inch type, two disk substrates are used with the substrate side facing outward. They are pasted together with a certain gap between them with a certain degree of positional accuracy through a plastic separator.
このように二つのプラスチック成形品を位置精度よく接
合することは各種の分野で行われている。In this way, joining two plastic molded products with high positional accuracy is performed in various fields.
プラスチック成形品の接合には溶着、接着、超音波融着
などの方法が知られている。Methods such as welding, adhesion, and ultrasonic fusion are known for joining plastic molded products.
ニーで、溶着は被接合部材を溶剤を用いて溶解させるも
ので、接合部の寸法精度が正確でな（、また残留した溶
剤によって母材が溶ける場合がある。Knee welding involves melting the parts to be joined using a solvent, and the dimensional accuracy of the joint is not accurate (and the base material may melt due to residual solvent).
また、溶剤の揮発を伴うために作業環境を悪（すると云
う問題もある。There is also the problem that the working environment is made worse by the volatilization of the solvent.
また、接着は接着剤を使用するもので、光ディスクの場
合はテルル（Ｔｅ）などの記録媒体が接着剤によって腐
蝕されることがあり、また、一般に接着強度が弱く、湿
潤雰囲気中に置くと接着強度が急速に低下すると云う問
題がある。In addition, adhesive is used for adhesion, and in the case of optical discs, the recording medium, such as tellurium (Te), may be corroded by the adhesive, and the adhesive strength is generally weak, so if placed in a humid atmosphere, it will not adhere. There is a problem that the strength decreases rapidly.
また、超音波融着は接合面が大きな場合は均一な接合を
行うことができず、光ディスクの場合は直径５インチ程
度が限界となっている。Further, ultrasonic fusion cannot achieve uniform bonding if the bonding surface is large, and in the case of optical disks, the diameter is about 5 inches.
更に、この方法は振動を対象物に与えるために位置精度
が低下しやすい。Furthermore, since this method applies vibration to the object, positional accuracy tends to decrease.
これらの問題を解決する方法として発明者はレーザ光を
用いてプラスチック成形体同士を溶着する方法を提案し
ている。As a method to solve these problems, the inventor has proposed a method of welding plastic molded bodies together using laser light.
（特開昭６２−２１６７２９．昭和６２年９月２４日公
開）この方法は光吸収率の低いプラスチックスよりなる
第１のプラスチック成形体と光吸収率の高い第２のプラ
スチック成形体とを当接しておき、光吸収率の低い第１
のプラスチック成形体を通して光吸収率の高い第２のプ
ラスチック成形体との接合部をレーザ照射するものであ
る。(Japanese Unexamined Patent Publication No. 62-216729, published on September 24, 1986) This method consists of a first plastic molded body made of plastic with a low light absorption rate and a second plastic molded body with a high light absorption rate. the first one with low light absorption rate.
A laser beam is irradiated through the plastic molded body to the joint portion with a second plastic molded body having a high light absorption rate.
このようにすると、第２のプラスチック成形体はレーザ
光を吸収して発熱し、溶融するが、この発熱により接合
している第１のプラスチック成形体の表面の温度も上昇
して溶融することから接合が進行するものである。In this way, the second plastic molded body absorbs the laser beam, generates heat, and melts, but this heat generation also increases the temperature of the surface of the first plastic molded body to which it is joined, causing it to melt. Bonding progresses.
この方法によると、溶剤や接着剤など他の材料を使用せ
ず、また短時間に行われるため位置精度のよい接合を行
うことができる。According to this method, since other materials such as solvents and adhesives are not used and the process is performed in a short time, it is possible to perform bonding with high positional accuracy.
然し、この方法を実施する場合には、かなり大きなレー
ザスポット（例えば直径が１８．４鵬）を接合部に当て
一走査するが、この際にレーザスポット内のエネルギー
分布が均一でなく、中心が最もエネルギー密度が高いガ
ウス分布をとるために、接合部の中央の温度が高まり、
急激に蒸発するプラスチックによって中央部に気泡が生
じ易いことが問題であった。However, when implementing this method, a fairly large laser spot (for example, diameter 18.4 mm) is applied to the joint and scanned, but at this time, the energy distribution within the laser spot is not uniform, and the center In order to obtain a Gaussian distribution with the highest energy density, the temperature at the center of the junction increases,
The problem was that bubbles were likely to form in the center due to the rapidly evaporating plastic.
以上記したように発明者が提案しているレーザ溶着法は
プラスチック成形体を位置精度よく、且つ腐蝕など化学
的な影響を与えずに接合できるため優れた方法であるが
、レーザスポット内のエネルギー分布が均一でないため
に、照射位置の中心が極度に加熱され、そのため気泡の
発生を伴いやすいことが解決を要する問題である。As mentioned above, the laser welding method proposed by the inventor is an excellent method because it can join plastic molded objects with high positional accuracy and without chemical effects such as corrosion. The problem that needs to be solved is that because the distribution is not uniform, the center of the irradiation position is extremely heated, which is likely to be accompanied by the generation of bubbles.
上記の！ｉＢはレーザ光の吸収が少ない第１のプラスチ
ックよりなる成形体と、第１のプラスチックに較べて格
段に吸収が大きな第２のプラスチックよりなる成形体と
を当接し、レーザ光を第１のプラスチック成形体を通し
て第２のプラスチック成形体を照射して照射位置のプラ
スチックを溶融させると共に、この溶融熱により第１の
プラスチックをも溶融せしめ、両者を融着する接合方法
において、融着をカライドスコープを通したレーザ光を
使用して行うことにより解決することができる。above! In iB, a molded body made of a first plastic that absorbs less laser light and a molded body made of a second plastic that absorbs much more laser light than the first plastic are brought into contact with each other, and the laser beam is absorbed into the first plastic. A joining method in which the second plastic molded body is irradiated through the molded body to melt the plastic at the irradiation position, and the first plastic is also melted by this melting heat, and the two are fused together. This can be solved by using a laser beam that passes through.
本発明はレーザスポット内のエネルギー分布を均一にす
る方法として第１図に示すようなカライドスコープ（Ｋ
ａｌｅｉｄｏｓｃｏｐｅ）をレーザ照射装置に導入する
ものである。The present invention uses a kaleidoscope (K) as shown in FIG.
Aleidoscope) is introduced into the laser irradiation device.
こ＼で、 カライドスコープ１は円筒状の金属体の中央
部にレーザが通過する穴２を有し、穴２の壁面は金（＾
Ｕ）などの鍍金を施して鏡面になっているもので、入射
したレーザ光３を内部で多重反射をさせて均一なエネル
ギー分布とする装、置である。Here, the kaleidoscope 1 has a hole 2 in the center of the cylindrical metal body through which the laser passes, and the wall of the hole 2 is made of gold (^
It is a device that has a mirror surface by plating such as U), and makes the incident laser beam 3 undergo multiple reflections internally to achieve a uniform energy distribution.
第２図はこのカライドスコープ１を導入した本発明に係
るプラスチックの接合方法を示す斜視図である。FIG. 2 is a perspective view showing a method for joining plastics according to the present invention in which this kaleidoscope 1 is introduced.
図において、低吸収率のプラスチック成形体４を上に、
また高吸収率プラスチック成形体５を下にして正しく位
置決めして当接する。In the figure, the plastic molded body 4 with low absorption rate is placed on top,
Further, the high-absorption rate plastic molded body 5 is positioned correctly and brought into contact with each other.
こ−で、大部分のプラスチック材料は透明であって光吸
収率は低いのが通常であることから、光吸収率を高める
には色素や顔料とくに黒色或いは褐色のものを混入する
と効果的である。Since most plastic materials are usually transparent and have low light absorption, it is effective to mix dyes or pigments, especially black or brown ones, to increase the light absorption. .
そして、レーザ光１ｅから出射したレーザ光７はミラー
８で反射させた後、ビームエキスパンダとして働く凹レ
ンズ９と凸レンズ１０で整形し、平行光とした状態で本
発明にか−るカライドスコープ１に入射させてエネルギ
ー分布を均一にして後、対物レンズ１１により所定のス
ポット径として高吸収率プラスチック成形体５を照射す
るものであって、位置決めをした二枚の成形体４，５が
載置しである支持台を移行させて接合部をレーザ走査さ
せれば両者を溶着することができる。After the laser beam 7 emitted from the laser beam 1e is reflected by a mirror 8, it is shaped by a concave lens 9 and a convex lens 10, which serve as beam expanders, to form parallel light into a kaleidoscope 1 according to the present invention. After making the energy distribution uniform, the object lens 11 irradiates the high-absorptive plastic molded body 5 with a predetermined spot diameter, and the two positioned molded bodies 4 and 5 are placed. Both can be welded by moving the support base and scanning the joint with a laser beam.
すなわち、先に記したようにレーザ光は吸収が少ない低
吸収率プラスチック成形体４を通して高吸収率プラスチ
ック成形体５に所定のレーザスポットを当てると発熱に
より照射部のプラスチックが溶融し、この熱によりこれ
と接する低吸収率プラスチック成形体４も溶け、結果と
して両者が溶着すること−なる。That is, as mentioned above, when a laser beam shines a predetermined laser spot on the high absorption plastic molded body 5 through the low absorption plastic molded body 4 which has little absorption, the plastic in the irradiated area is melted by heat generation. The low absorption plastic molded body 4 in contact with this also melts, and as a result, the two are welded together.
低吸収率プラスチック成形体４として透明なアクリル板
を用い、また高吸収率プラスチック成形体５としてカー
ボンブラックを混入して黒色にしたアクリル板を使用し
た。A transparent acrylic plate was used as the low absorption plastic molded body 4, and an acrylic plate made black by mixing carbon black was used as the high absorption plastic molded body 5.
また、レーザ光源としてはパルスＮｄ−ＹＡＧレーザを
用い、パルス幅１鴎３．平均出力４００ Ｗ、パルスレ
ート１４０ ｐｐｓ、スポット径１８．５ｍｓ、溶接速
度２．８−７分の条件で照射を行い、両者を接合させた
。In addition, a pulsed Nd-YAG laser is used as the laser light source, and the pulse width is 1 and 3. Irradiation was performed under the conditions of an average output of 400 W, a pulse rate of 140 pps, a spot diameter of 18.5 ms, and a welding speed of 2.8-7 minutes to join the two.
溶接部をＲ微鏡で観察したところ、溶接部の総てに亙っ
て良好な溶接が行われており、気泡が発生していないこ
とが確認できた。When the welded part was observed with an R microscope, it was confirmed that good welding was performed throughout the welded part and that no air bubbles were generated.
次に、溶接部の気密性をヘリウム（Ｉｌｅ＞リークディ
テクタにより測定したところＩ Ｘｌ０−”ａｔｍ Ｉ
ＣＣ／Ｓ以下の高い気密性を有しており、また接合の
強さも母材と同程度であった。Next, the airtightness of the welded part was measured using a helium (Ile>leak detector).
It had a high airtightness equal to or lower than CC/S, and the bonding strength was also comparable to that of the base material.
本発明の実施によりレーザ光を走査してプラスチック成
形体の溶接を行う場合に気泡の発生を無くすることがで
き、これにより位置精度が良く且つ、母材と同程度の接
合強さをもつ接合を行ことが可能となる。By implementing the present invention, it is possible to eliminate the generation of air bubbles when welding plastic molded objects by scanning a laser beam, thereby achieving a bond with good positional accuracy and a bond strength comparable to that of the base material. It becomes possible to do this.
第１図はカライドスコープの断面図（Ａ）面図（Ｂ）、 第２図は本発明の実施法を示す斜視図、である。 図において、 １はカライドスコープ、 ２は穴、 ３はレーザ光、 ４は低吸収率プラスチック成形体、 ５は高吸収率プラスチック成形体、 である。 と Figure 1 is a cross-sectional view (A) and a side view (B) of the kaleidoscope. FIG. 2 is a perspective view showing a method of implementing the present invention. In the figure, 1 is kaleidoscope, 2 is hole, 3 is laser light, 4 is a low absorption plastic molded body; 5 is a high absorption rate plastic molded body; It is. and
Claims (1)
形体と該第１のプラスチックに較べて格段に吸収が大き
な第２のプラスチックよりなる成形体とを当接し、レー
ザ光を第１のプラスチック成形体を通して第２のプラス
チック成形体を照射して照射位置のプラスチックを溶融
させると共に、該溶融熱により第１のプラスチックをも
溶融せしめ、両者を融着する接合方法において、該融着
をカライドスコープを通したレーザ光を用いて行うこと
を特徴とするプラスチックの接合方法。A molded body made of a first plastic that absorbs less laser light and a molded body made of a second plastic that absorbs much more than the first plastic are brought into contact with each other, and the laser beam is applied to the first plastic molded body. In a joining method in which the second plastic molded body is irradiated through the radiator to melt the plastic at the irradiation position, the first plastic is also melted by the melting heat, and the two are fused together. A plastic bonding method characterized by using a laser beam that passes through the plastic.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1090027A JPH02266918A (en) | 1989-04-10 | 1989-04-10 | Method for bonding plastic |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1090027A JPH02266918A (en) | 1989-04-10 | 1989-04-10 | Method for bonding plastic |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02266918A true JPH02266918A (en) | 1990-10-31 |
Family
ID=13987196
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1090027A Pending JPH02266918A (en) | 1989-04-10 | 1989-04-10 | Method for bonding plastic |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02266918A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000294012A (en) * | 1999-04-12 | 2000-10-20 | Koito Mfg Co Ltd | Marker lamp for vehicle |
| JP2002067164A (en) * | 2000-08-28 | 2002-03-05 | Japan Science & Technology Corp | Method for bonding resin film by laser |
| JP2004195829A (en) * | 2002-12-19 | 2004-07-15 | Sumitomo Heavy Ind Ltd | Laser welding method and member to be welded |
| JP2005104132A (en) * | 2003-09-10 | 2005-04-21 | Fine Device:Kk | Method for joining fluorine resin material |
| EP1524096A3 (en) * | 2003-10-14 | 2008-03-19 | Denso Corporation | Resin mold and method for manufacturing the same |
| CN102107530A (en) * | 2010-12-30 | 2011-06-29 | 东莞市创普光电技术有限公司 | New method for welding plastics by metal laser welding machine |
-
1989
- 1989-04-10 JP JP1090027A patent/JPH02266918A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000294012A (en) * | 1999-04-12 | 2000-10-20 | Koito Mfg Co Ltd | Marker lamp for vehicle |
| JP2002067164A (en) * | 2000-08-28 | 2002-03-05 | Japan Science & Technology Corp | Method for bonding resin film by laser |
| JP2004195829A (en) * | 2002-12-19 | 2004-07-15 | Sumitomo Heavy Ind Ltd | Laser welding method and member to be welded |
| JP2005104132A (en) * | 2003-09-10 | 2005-04-21 | Fine Device:Kk | Method for joining fluorine resin material |
| EP1524096A3 (en) * | 2003-10-14 | 2008-03-19 | Denso Corporation | Resin mold and method for manufacturing the same |
| US7527760B2 (en) | 2003-10-14 | 2009-05-05 | Denso Corporation | Resin mold and method for manufacturing the same |
| CN102107530A (en) * | 2010-12-30 | 2011-06-29 | 东莞市创普光电技术有限公司 | New method for welding plastics by metal laser welding machine |
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