JPH02263769A - Ceramic parts and its bonding method - Google Patents
Ceramic parts and its bonding methodInfo
- Publication number
- JPH02263769A JPH02263769A JP8608489A JP8608489A JPH02263769A JP H02263769 A JPH02263769 A JP H02263769A JP 8608489 A JP8608489 A JP 8608489A JP 8608489 A JP8608489 A JP 8608489A JP H02263769 A JPH02263769 A JP H02263769A
- Authority
- JP
- Japan
- Prior art keywords
- ceramic
- bonding
- joint
- composition
- particles
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 title claims abstract description 41
- 238000000034 method Methods 0.000 title claims description 19
- 229910052581 Si3N4 Inorganic materials 0.000 claims abstract description 17
- 239000000203 mixture Substances 0.000 claims abstract description 17
- 239000011856 silicon-based particle Substances 0.000 claims abstract description 8
- 238000010438 heat treatment Methods 0.000 claims abstract description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims abstract 3
- 238000005304 joining Methods 0.000 claims description 8
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical group N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 8
- 239000002245 particle Substances 0.000 claims description 7
- 239000012298 atmosphere Substances 0.000 claims description 3
- 229910010293 ceramic material Inorganic materials 0.000 claims 1
- 229910001873 dinitrogen Inorganic materials 0.000 claims 1
- 238000005245 sintering Methods 0.000 abstract description 4
- 238000005238 degreasing Methods 0.000 abstract description 3
- 239000011230 binding agent Substances 0.000 abstract description 2
- 229910052757 nitrogen Inorganic materials 0.000 abstract description 2
- 239000012299 nitrogen atmosphere Substances 0.000 abstract description 2
- 238000010304 firing Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 230000007423 decrease Effects 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- SOGAXMICEFXMKE-UHFFFAOYSA-N Butylmethacrylate Chemical compound CCCCOC(=O)C(C)=C SOGAXMICEFXMKE-UHFFFAOYSA-N 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 150000004767 nitrides Chemical class 0.000 description 2
- 238000005121 nitriding Methods 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229910052593 corundum Inorganic materials 0.000 description 1
- 239000012153 distilled water Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000001272 pressureless sintering Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000011863 silicon-based powder Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 229910001845 yogo sapphire Inorganic materials 0.000 description 1
Landscapes
- Ceramic Products (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、高強度であり、高温安定性に優れたセラミッ
ク部品及びその結合方法に関する。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a ceramic component having high strength and excellent high temperature stability, and a method for joining the same.
（従来の技術）
高強度であり、高温安定性に優れたセラミックスとして
、窒化珪素等が知られており、エンジン部品等として利
用されている。該窒化珪素は複雑な形状に焼結すること
が容易ではないので、複数の部材を作成した後、結合す
ることにより１つの部品とする方法が知られている。(Prior Art) Silicon nitride and the like are known as ceramics that have high strength and excellent high-temperature stability, and are used for engine parts and the like. Since it is not easy to sinter silicon nitride into a complicated shape, a method is known in which a plurality of members are created and then joined together to form a single part.
例えば、
■：窒化物セラミックスからなる部材間に、金属酸化物
を原料とする結合材を介在させ加熱・急冷し、窒化物セ
ラミックス相互間を酸窒化物ガラス層で結合する窒化物
セラミックス相互の結合方法が特開昭６２−２２６８６
７号公報に記載されている。For example, ■: A bonding material made of metal oxide is interposed between members made of nitride ceramics, heated and rapidly cooled, and the nitride ceramics are bonded with an oxynitride glass layer. The method is JP-A No. 62-22686.
It is described in Publication No. 7.
■：ｒ予め焼成したセラミックス製凸部材を、焼成前の
内径が前記凸部材の外径より大きく、かつ焼成後の内径
が前記外径より小さくなるように選定した焼成前のセラ
ミックス製凹部材に挿入し、この状態で焼成を行なって
前記凸部材と前記凹部材を結合することを特徴とするセ
ラミック部材の結合方法１が、特開昭６３−２４８７７
８号公報に記載されている。■:r A pre-fired ceramic convex member is attached to an unfired ceramic concave member selected such that the inner diameter before firing is larger than the outer diameter of the convex member and the inner diameter after firing is smaller than the outer diameter. A method 1 for joining ceramic members is disclosed in Japanese Patent Laid-Open No. 63-24877, which is characterized in that the convex member and the concave member are joined by inserting the convex member and firing the concave member in this state.
It is described in Publication No. 8.
■；「合金箔をろう材として用い、メタライジングする
ことなく、セラミックを結合することを特徴とするセラ
ミックの結合方法Ｊが、特開昭６３−２０１０７０号公
報に記載されている。(2) ``Ceramic bonding method J, which uses alloy foil as a brazing material to bond ceramics without metallizing, is described in JP-A-63-201070.
■：’５ｉｓＮ４を主成分とするセラミックの結合に際
し、結合部分に４４μ以下のＳｉ粉末と樹脂との混合物
を介在させ、窒化性ガスτ囲気下１２００〜１５００℃
の温度範囲で、結合部分の４４μ以下のＳｔ粒粉末窒化
せしめ、連続的なＳ ｔ ３ Ｎ ４結合で結合するこ
とを特徴とするＳｉ３Ｎ４を主成分とするセラミックの
結合方法Ｊが、特開昭６０−１７１２７３号公報に記載
されている。■: When bonding ceramics mainly composed of '5isN4, a mixture of Si powder of 44μ or less and resin is interposed in the bonded part, and the temperature is 1200 to 1500℃ under an atmosphere of nitriding gas τ.
A bonding method J for ceramics containing Si3N4 as a main component, which is characterized by nitriding St grain powder of 44μ or less in the bonding area and bonding by continuous S t 3 N 4 bonding in a temperature range of It is described in 60-171273.
（発明が解決しようとする課題）
このような従来の結合方法の内、■については、ガラス
転移点である８００℃以上の高温度下では結合部の酸窒
化物ガラス層の強度が著しく低下するという問題がある
。(Problems to be Solved by the Invention) Among these conventional bonding methods, regarding (1), the strength of the oxynitride glass layer at the bonding portion decreases significantly at high temperatures of 800° C. or higher, which is the glass transition point. There is a problem.
■については、凸部材と凹部材との境界面に空隙が残存
するため、結合強度が低下し、かつ一定しないという問
題がある。Regarding (2), there is a problem that the bonding strength is reduced and not constant because a gap remains at the interface between the convex member and the concave member.
■については、結合部が合金箔であるため高温強度が低
く、また、熱伝導率が上昇するので断熱エンジン等の断
熱性が要求される箇所には使用できないという問題があ
る。Regarding (2), since the bonding part is made of alloy foil, the high temperature strength is low, and the thermal conductivity increases, so there is a problem that it cannot be used in places where heat insulation is required, such as in adiabatic engines.
■については、上記■〜■よりは高温での結合強度が優
れているが、該結合強度はセラミック母材と５ｔ３Ｎ、
どの結合力のみにより得ており、満足すべき強度レベル
には達していないという問題がある。Regarding (), the bonding strength at high temperatures is superior to the above-mentioned (■ to ■), but the bonding strength is 5t3N with the ceramic base material.
There is a problem in that the bonding force is obtained only by which bonding force, and the strength level that is satisfactory is not reached.
（課題を解決するための手段）
本発明は、上記の点に鑑みてなされたもので、高強度で
あり、かつ高温においても結合強度が低下せず、断熱性
に優れたセラミック部品及びその結合方法を提供しよう
とするものである。(Means for Solving the Problems) The present invention has been made in view of the above-mentioned points, and provides ceramic components and bonding thereof that have high strength, do not reduce bonding strength even at high temperatures, and have excellent heat insulation properties. It is intended to provide a method.
次に、本発明のセラミック部品及びその結合方法につい
て図を用いて詳細に説明する。Next, the ceramic component and the method for joining the same according to the present invention will be explained in detail using the drawings.
第１図（ａ）、（ｂ）、（Ｃ）及び（ｄ）は本発明によ
るセラミック部品の結合方法を示す図であり、特に第１
図（ｄ）は本発明によるセラミ・ンク部品を示す図であ
る。FIGS. 1(a), (b), (C) and (d) are diagrams showing a method of joining ceramic parts according to the present invention, and in particular, the first
Figure (d) shows a ceramic ink component according to the invention.
１は高強度であり高温安定性に１量れたセラミックス、
例えは窒化珪素（以下５ｉ３Ｎ４）からなる円板であり
、結合部３に面する結合面には凹部１１が刻設されてい
る。２も同じ＜Ｓｉ、ｓ４等からなる円筒であり、結合
面には凹部２１が刻設されている。第１図（ａ）に示す
ごとく、該円板１と円筒２とを互いの結合面が対向し、
空隙である結合部３を形成する位置に保持する。1 is a ceramic with high strength and high temperature stability;
For example, it is a disk made of silicon nitride (hereinafter referred to as 5i3N4), and a recess 11 is carved in the joint surface facing the joint part 3. 2 is also a cylinder made of the same <Si, s4, etc., and a recess 21 is carved in the joint surface. As shown in FIG. 1(a), the disk 1 and the cylinder 2 are arranged so that their joint surfaces face each other,
It is held at a position where a joint portion 3, which is a gap, is formed.
次に、第１図（ｂ）に示すごとく、Ｓｉ粒子を含有する
組成物５を結合部３に注入する。Next, as shown in FIG. 1(b), a composition 5 containing Si particles is injected into the joint 3.
次に、該組成物５に外部から加圧し、結合部３、凹部１
１及び凹部２１全体に充填するとともに、Ｓｉ粒子相互
間の距離を縮少し粒子密度を増加させる。Next, the composition 5 is pressurized from the outside, and the joint part 3 and the recessed part 1 are
1 and the recesses 21, the distance between the Si particles is reduced, and the particle density is increased.
次に、結合部３に組成物５が充填された円板１及び円筒
２とを脱脂炉中で加熱し、組成物３に含まれているバイ
ンダを揮発除去した後、Ｎ２ガスの雰囲気中で焼成する
ことにより、組成物３内に含まれているＳｉ粒子を反応
焼結Ｓｉ３Ｎ４に変化させ、円板１及び円筒２とを結合
する。Next, the disk 1 and the cylinder 2 whose joint part 3 is filled with the composition 5 are heated in a degreasing furnace to volatilize and remove the binder contained in the composition 3, and then placed in an N2 gas atmosphere. By firing, the Si particles contained in the composition 3 are changed into reactive sintered Si3N4, and the disk 1 and cylinder 2 are bonded together.
通常の加圧焼結法では焼成時に体積が約２０％収縮する
が、反応焼結では体積収縮は殆ど認められないため、円
板１及び円筒２と反応焼結Ｓｉ、Ｎ、どの間に剥離等に
よる空間が発生せず、よって強固に結合される。また、
反応焼結Ｓｉ、Ｎ４が凹部１１及び凹部２１内に充填さ
れているため、円板１と円筒２との結合強度は、円板１
及び円筒２と反応焼結Ｓｉ３Ｎ４との吸着力に、反応焼
結３ｉ３Ｎ４の剪断応力が加わり、より強固な結合力と
なる。In the normal pressure sintering method, the volume shrinks by about 20% during firing, but in reaction sintering, almost no volume shrinkage is observed, so there is no peeling between the disk 1 and cylinder 2 and the reaction sintered Si and N. Therefore, there is no space created due to etc., and the connection is strong. Also,
Since the reaction sintered Si and N4 are filled in the recesses 11 and 21, the bonding strength between the disk 1 and the cylinder 2 is equal to that of the disk 1.
The shear stress of the reaction sintered 3i3N4 is added to the adsorption force between the cylinder 2 and the reaction sintered Si3N4, resulting in a stronger bonding force.
さらに、反応焼結Ｓｉ、Ｎ４は焼結助材を含有しないの
で、高温度下においても強度が低下しない。Furthermore, since reactive sintered Si and N4 do not contain sintering aids, their strength does not decrease even under high temperatures.
尚、高断熱性が要求される場合には、反応焼結５ｉｓＮ
４を母材とし、該反応焼結５ｉｓＮａ中にＳｔ、Ｎ、よ
り熱伝導率が小である他のセラミックス粒子を分散させ
るとよい。In addition, if high heat insulation properties are required, reaction sintered 5isN
It is preferable that St, N, and other ceramic particles having lower thermal conductivity are dispersed in the reaction sintered 5isNa using 4 as a base material.
（作用）
本発明のセラミック部品及びその結合方法は、セラミッ
クス相互を、高強度であり高温安定に結合するので、従
来一体部量として焼結成型できない複雑な形状で、高強
度及び高温安定性が要求される部品を提供できる。(Function) The ceramic parts and the joining method thereof of the present invention bond ceramics together with high strength and high temperature stability. We can provide the parts you require.
（実施例）
実施例
第１図に示す円板１及び円筒２の肉厚は共に５ｍｍであ
り、円板１の直径はφ４０ｍｍ、円筒２の長さは３０ｍ
ｍ、材質は共に常圧焼結法で作製した気孔率２％以下の
Ｓｉ３Ｎ４である。(Example) The wall thickness of both the disc 1 and the cylinder 2 shown in Example Fig. 1 is 5 mm, the diameter of the disc 1 is φ40 mm, and the length of the cylinder 2 is 30 m.
m and the material are Si3N4 with a porosity of 2% or less, both made by a pressureless sintering method.
円板１及び円筒２の結合面の端部から１．５ｍｍの位置
に幅３ｍｍ、深さ１．５ｍｍの溝（凹部１１及び２１）
を刻設す′る。そして、円板１及び円筒２を第１図（ａ
）に示すごとく幅２ｍｍの結合部３を狭窄して保持する
。A groove with a width of 3 mm and a depth of 1.5 mm (recesses 11 and 21) is located 1.5 mm from the end of the joint surface of the disk 1 and cylinder 2.
engraved. Then, the disk 1 and the cylinder 2 are shown in Figure 1 (a
), the joint portion 3 having a width of 2 mm is narrowed and held.
次に該結合部に、Ｓｔ粒子７０ｖｏ１％・メタクリル酸
ブチル２０ｖｏＩＬ％・蒸留水１０ｖｏｕ％からなる組
成物５を注入する。Next, a composition 5 consisting of 70 vol% St particles, 20 vol% butyl methacrylate, and 10 vol% distilled water is injected into the joint.
そして、該組成物５をプレス機ピストン６により３２Ｍ
Ｐａで圧入する。Then, the composition 5 was applied to 32M using the press piston 6.
Press in with Pa.
次に、脱脂炉中にて、４５０℃まで加熱した後、約２．
０ＭＰａのＮ２雰囲気中で反応焼成し、結合部３のＳｉ
粒子を反応焼結Ｓｉ３Ｎ４に変化させ、結合層７を形成
する。Next, after heating to 450°C in a degreasing furnace, about 2.
Reaction firing is performed in a N2 atmosphere of 0 MPa, and the Si of the joint part 3 is
The particles are transformed into reactively sintered Si3N4 to form a bonding layer 7.
該工程により得られたＳｉ３Ｎ４部品の底面（円板１）
に荷重を与え、破壊する際の応力を、室温から高温度ま
でについて測定した結果を第２図に示す。Bottom surface (disk 1) of the Si3N4 part obtained by this process
Figure 2 shows the results of applying a load to the specimen and measuring the stress at which it breaks at temperatures ranging from room temperature to high temperature.
図に示すごとく、本実施例による部品の強度は室温から
１３００℃に至るまで変化しないことが確認された。As shown in the figure, it was confirmed that the strength of the component according to this example did not change from room temperature to 1300°C.
また、円筒２と結合層６との境界面における界面微構造
をＳＥＭで観察したところ、円筒２と結合層６とは空隙
なしに結合されていることが確認された。Furthermore, when the interface microstructure at the interface between the cylinder 2 and the bonding layer 6 was observed by SEM, it was confirmed that the cylinder 2 and the bonding layer 6 were bonded without any voids.
比較例
実施例で使用したものと同一の円板及び円筒の一方の結
合面に、Ａ１１２０３等の酸化物を含むベーストを塗布
した後、他方の結合面と合わせ、１５００℃で３時間加
熱し結合する。該工程により得られた部品を実施例と同
じ条件で破壊時の応力を測定した結果を第２図に示す。Comparative Example After applying baset containing an oxide such as A11203 to one bonding surface of the same disk and cylinder as used in the example, it was combined with the other bonding surface and heated at 1500°C for 3 hours to bond. do. FIG. 2 shows the results of measuring the stress at break of the parts obtained through this process under the same conditions as in the examples.
図に示すごとく、室温から６００℃までは実施例以上の
強度を有するが、８００℃以上になるとＡｌ２Ｏ３等の
酸化物がガラス層に変化するため強度が著しく低下する
。As shown in the figure, the strength is greater than that of the example from room temperature to 600°C, but when the temperature exceeds 800°C, the strength decreases significantly because oxides such as Al2O3 change into a glass layer.
以上、本発明の実施例について説明したが、本発明の精
神から逸れないかぎりで、種々の異なる実施例は容易に
構成できるから、本発明は前記特許請求の範囲において
記載した限定以外、特定の実施例に制約されるものでは
ない。Although the embodiments of the present invention have been described above, various different embodiments can be easily constructed without departing from the spirit of the present invention. The invention is not limited to the examples.
（発明の効果）
以上説明したように、本発明によれば、セラミックス相
互を、高強度であり高温安定に結合するので、従来一体
部量として焼結成型できない複雑な形状で、高強度及び
高温安定性が要求されるセラミック部品及びその結合方
法を提供できる。(Effects of the Invention) As explained above, according to the present invention, ceramics are bonded to each other in a high-strength and high-temperature stable manner. It is possible to provide ceramic parts that require stability and a method for joining them.
第１図（ａ）、（ｂ）、（Ｃ）及び（ｄ）は、本発明に
よるセラミック部品の結合方法を示す図であり、特に第
１図（ｄ）は本発明によるセラミック部品を示す図、第
２図は、実施例及び比較例についての破壊応力と温度と
の関係を示す図である。
１・・・円板、２・・・円筒、５・・・組成物、７・・
・結合層、１１・・・凹部、１２・・・凹部。
特許出頭大 株式会社いす×セラミックス研究所代 理
人 弁理士 辻 實第１
図
（ｂ）
（、Ｃ）
（ｃｌ）
（Ｌり・ｉＬｕ Ｓ；、ｑＮ４）1(a), (b), (C) and (d) are diagrams showing a method of joining ceramic components according to the present invention, particularly FIG. 1(d) is a diagram showing a ceramic component according to the present invention. , FIG. 2 is a diagram showing the relationship between fracture stress and temperature for Examples and Comparative Examples. 1... Disc, 2... Cylinder, 5... Composition, 7...
- Bonding layer, 11... recess, 12... recess. Patent Appearance Isu Co., Ltd. x Ceramics Research Institute Agent Patent Attorney Minoru Tsuji 1 Figure (b) (, C) (cl) (Lli・iLu S;, qN4)
Claims (6)
直方向の突起及び凹部の内の少なくとも一方を有する複
数個のセラッミクス製部材と、該セラッミクス製部材の
結合面間を充填結合するセラミックスの反応焼結体から
なる結合層とにより構成されることを特徴とするセラミ
ック部品。(1) A plurality of ceramic members having at least one of protrusions and recesses in a direction perpendicular to the direction of stress acting after bonding on the bonding surfaces, and a ceramic material that fills and bonds between the bonding surfaces of the ceramic members. and a bonding layer made of a reaction sintered body.
であることを特徴とする請求項（１）記載のセラミック
部品。(2) The ceramic component according to claim (1), wherein the ceramic constituting the bonding layer is silicon nitride.
とは異種のセラミック粒子を含有することを特徴とする
請求項（２）記載のセラミック部品。(3) The ceramic component according to claim (2), wherein the ceramic constituting the bonding layer contains ceramic particles different from silicon nitride.
素の熱伝導率より小であることを特徴とする請求項（３
）記載のセラミック部品。(4) Claim (3) characterized in that the thermal conductivity of the different types of ceramic particles is lower than the thermal conductivity of silicon nitride.
) Ceramic parts listed.
方向の突起及び凹部の内の少なくとも一方を有する複数
個のセラッミクス製部材を互いの結合面が所定間隙隔て
て対向する位置に配設するステップと、該所定間隙及び
結合面の凹部に、珪素粒子を含有する組成物を加圧充填
するステップと、結合面間に該組成物を充填したセラッ
ミクス製部材を窒素ガスの雰囲気中で加熱し、結合面間
に充填された組成物に含有される珪素粒子を反応焼結窒
化珪素に変化せしめるステップとを有することを特徴と
するセラミック部品の結合方法。(5) A plurality of ceramic members each having at least one of protrusions and recesses in a direction perpendicular to the direction of stress acting after bonding are placed on the bonding surfaces at positions where the bonding surfaces face each other with a predetermined gap. a step of filling a composition containing silicon particles under pressure into the predetermined gap and the recess of the bonding surface; and heating the ceramic member filled with the composition between the bonding surfaces in a nitrogen gas atmosphere. and converting silicon particles contained in the composition filled between the bonding surfaces into reactive sintered silicon nitride.
ラミック粒子を含有することを特徴とする請求項（５）
記載のセラミック部品の結合方法。(6) Claim (5), wherein the composition contains ceramic particles having a lower thermal conductivity than silicon nitride.
Method of joining ceramic parts described.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8608489A JPH02263769A (en) | 1989-04-05 | 1989-04-05 | Ceramic parts and its bonding method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8608489A JPH02263769A (en) | 1989-04-05 | 1989-04-05 | Ceramic parts and its bonding method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02263769A true JPH02263769A (en) | 1990-10-26 |
Family
ID=13876840
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8608489A Pending JPH02263769A (en) | 1989-04-05 | 1989-04-05 | Ceramic parts and its bonding method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02263769A (en) |
-
1989
- 1989-04-05 JP JP8608489A patent/JPH02263769A/en active Pending
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