JPH0226246A - Manufacture of steel plate for iron printed board - Google Patents
Manufacture of steel plate for iron printed boardInfo
- Publication number
- JPH0226246A JPH0226246A JP17491888A JP17491888A JPH0226246A JP H0226246 A JPH0226246 A JP H0226246A JP 17491888 A JP17491888 A JP 17491888A JP 17491888 A JP17491888 A JP 17491888A JP H0226246 A JPH0226246 A JP H0226246A
- Authority
- JP
- Japan
- Prior art keywords
- plating
- layer
- steel plate
- heat treatment
- alloying
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 title claims abstract description 46
- 229910052742 iron Inorganic materials 0.000 title claims abstract description 23
- 229910000831 Steel Inorganic materials 0.000 title claims abstract description 21
- 239000010959 steel Substances 0.000 title claims abstract description 21
- 238000004519 manufacturing process Methods 0.000 title claims description 5
- 238000007747 plating Methods 0.000 claims abstract description 97
- 238000010438 heat treatment Methods 0.000 claims abstract description 30
- 229910052718 tin Inorganic materials 0.000 claims abstract description 14
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 13
- 229910052725 zinc Inorganic materials 0.000 claims abstract description 12
- 229910000976 Electrical steel Inorganic materials 0.000 claims abstract description 10
- 238000000034 method Methods 0.000 claims description 10
- 229910052710 silicon Inorganic materials 0.000 claims 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 abstract description 28
- 238000005275 alloying Methods 0.000 abstract description 17
- 239000002184 metal Substances 0.000 abstract description 13
- 229910052751 metal Inorganic materials 0.000 abstract description 13
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract description 4
- 229910045601 alloy Inorganic materials 0.000 abstract description 4
- 239000000956 alloy Substances 0.000 abstract description 4
- 229910052681 coesite Inorganic materials 0.000 abstract description 2
- 229910052906 cristobalite Inorganic materials 0.000 abstract description 2
- 239000000377 silicon dioxide Substances 0.000 abstract description 2
- 235000012239 silicon dioxide Nutrition 0.000 abstract description 2
- 229910052682 stishovite Inorganic materials 0.000 abstract description 2
- 229910052905 tridymite Inorganic materials 0.000 abstract description 2
- 230000001070 adhesive effect Effects 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 36
- 238000001816 cooling Methods 0.000 description 6
- ZCDOYSPFYFSLEW-UHFFFAOYSA-N chromate(2-) Chemical compound [O-][Cr]([O-])(=O)=O ZCDOYSPFYFSLEW-UHFFFAOYSA-N 0.000 description 5
- 230000007797 corrosion Effects 0.000 description 4
- 238000005260 corrosion Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910019142 PO4 Inorganic materials 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 3
- 239000010452 phosphate Substances 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 241001163841 Albugo ipomoeae-panduratae Species 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000005238 degreasing Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 238000005554 pickling Methods 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 description 1
- 229920000298 Cellophane Polymers 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 1
- 239000004327 boric acid Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000010960 cold rolled steel Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 229910000765 intermetallic Inorganic materials 0.000 description 1
- 230000005389 magnetism Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
- 238000002203 pretreatment Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
- Motor Or Generator Frames (AREA)
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野］
本発明は、ＯＡ機器、ＡＶ機器等に使用される鉄系プリ
ント基板に適した鋼板の製造方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method of manufacturing a steel plate suitable for iron-based printed circuit boards used in OA equipment, AV equipment, etc.
［従来の技術］
ＯＡ機器、ＡＶ機器等に使用されるモーター用に、珪素
鋼板を基板とした鉄系プリント基板が使用されるように
なってきた。これは珪素鋼板に磁路を形成させるととも
に、モーターフレームとしての役割を担わせている。[Prior Art] Iron-based printed circuit boards made of silicon steel plates have come to be used for motors used in OA equipment, AV equipment, and the like. This allows the silicon steel plate to form a magnetic path and also serves as a motor frame.
従来から特開昭８１−１４２９３９号公報で珪素鋼板の
表面にＳｎ、Ｚｎ、Ｎｉ，Ｃｒ、Ｃｕ、／Ｊのうちから
一種、又は二種以上を５〜１５０ ｇ／ｄメッキしたプ
リント基板に適した鋼板が提供され、又、特開昭６１−
２４３１１９号公報、特開昭６３−２６３９８号公報、
特開昭６３−３５７４５号公報ではメッキ密着性向上を
目的として、前者では焼鈍前にメッキすること、前２者
、前３者ではメッキ前に鋼板表面の酸化層を除去するこ
とを各々提案している。Conventionally, JP-A-81-142939 discloses a method suitable for printed circuit boards in which the surface of a silicon steel plate is plated with 5 to 150 g/d of one or more of Sn, Zn, Ni, Cr, Cu, and /J. A steel plate was provided, and also,
No. 243119, Japanese Patent Application Laid-open No. 63-26398,
JP-A No. 63-35745 proposes, for the purpose of improving plating adhesion, that the former proposes plating before annealing, and the former 2 and 3 propose removing the oxidized layer on the surface of the steel sheet before plating. ing.
［発明が解決しようとする課題］
特開昭０１−２４１１１９号公報による提案では、メッ
キ量が最大１５０ｇ／ｎｆ（下限は５ｇ／ゴ）となって
いて、厚メッキによるコストの上昇を招くという欠点を
有している。次に特開昭８１−２４−３１１９号公報の
場合には、耐錆性向上に最も有効なＺｎメッキが適用出
来ない欠点がある。更に、特開昭８３−２８３９８号公
報、特開昭８３−３５７４５号公報では、酸化膜研削用
のブラックを新設することが必要であり、製造費用の増
大となる欠点を有している。[Problems to be Solved by the Invention] The proposal in JP-A-01-241119 specifies a maximum plating amount of 150 g/nf (lower limit is 5 g/nf), which has the drawback of increasing costs due to thick plating. have. Next, in the case of JP-A-81-24-3119, there is a drawback that Zn plating, which is most effective for improving rust resistance, cannot be applied. Furthermore, in Japanese Patent Application Laid-open Nos. 83-28398 and 1983-35745, it is necessary to newly install a black for grinding the oxide film, which has the disadvantage of increasing manufacturing costs.
本発明では、珪素鋼板を通常の条件、工程で製造したの
ち、安価な一般的メッキラインの前処理（脱脂、酸洗）
条件で、且つ薄メッキで、素地鋼板との密着性、耐錆性
に優れた鉄系プリント基板用鋼板を提供するものである
。In the present invention, silicon steel sheets are manufactured under normal conditions and processes, and then pre-treated (degreasing, pickling) on an inexpensive general plating line.
To provide a steel plate for iron-based printed circuit boards that is thinly plated under certain conditions and has excellent adhesion to a base steel plate and rust resistance.
［課題を解決するための手段］
本発明は５ｉ（１，５〜３．０％を含む珪素鋼板の表面
に、鋼板側からＮ１．Ｓｎ、Ｚｎの順序で全メッキ量が
１．０〜３０．Ｏｒ／ｒ＋ｆの重層メッキを行った後、
２００〜３５０℃の温度で短時間の加熱処理を行うこと
を特徴とする鉄系プリント基板用鋼板の製造方法であり
、重層メッキの順序が鋼板側からＳｎ。[Means for Solving the Problems] The present invention is based on the surface of a silicon steel plate containing 5i (1.5 to 3.0%), in which the total plating amount is 1.0 to 30% in the order of N1.Sn and Zn from the steel plate side. .After performing multilayer plating of Or/r+f,
This is a method for manufacturing a steel plate for iron-based printed circuit boards, characterized in that heat treatment is performed for a short time at a temperature of 200 to 350°C, and the order of multilayer plating is Sn from the steel plate side.
Ｎｉ、Ｚｎとするのが好ましい。It is preferable to use Ni or Zn.
以下詳細に説明する。This will be explained in detail below.
本発明において鋼板側から第−層にメッキする金属は、
素地鉄と比較的低温で合金化するＮ１、又はＳｎであり
、第二層には、第−層がＮ１の場合はＳｎを、Ｓｎの場
合はＮ１を引続きメッキする。次いで第三層としてＺｎ
メッキを施し、合金化の熱処理を施す。In the present invention, the metal plated from the steel plate side to the -th layer is:
The second layer is N1 or Sn, which alloys with the base iron at a relatively low temperature, and the second layer is plated with Sn if the second layer is N1, and is subsequently plated with N1 if the second layer is Sn. Then Zn as the third layer
Plating is applied and heat treatment for alloying is applied.
熱処理条件ξしては２００〜３５０℃で短時間である。The heat treatment conditions ξ are 200 to 350°C for a short time.
この合金化熱処理により、第−層のＮｉ，又はＳｎは、
ＳｉＯ２系酸化層を有する素地鉄と合金化し素地鉄との
密着性が向上するとともに、当然ながら、第二層のＳｎ
又はＮ１と、第三層に重層メッキされたＺｎとも合金化
し、耐錆性に優れた合金メッキ層が形成される。Through this alloying heat treatment, the Ni or Sn of the -th layer becomes
It is alloyed with the base iron having a SiO2-based oxide layer and improves the adhesion with the base iron, and as a matter of course, the Sn of the second layer
Alternatively, it is alloyed with N1 and Zn multilayer plated on the third layer, forming an alloy plating layer with excellent rust resistance.
次いで、必要に応じて、クロメート処理又は燐酸塩処理
等の後処理を施す。Then, if necessary, post-treatment such as chromate treatment or phosphate treatment is performed.
第１図はＮ １． Ｓ ｎ、 Ｚ ｎ重層メッキ（各々
のメッキ量は、Ｎ１１．０．ｓｎ ２．Ｏ，Ｚｎ １．
Ｏｇ／ｒｒ？）の断面説明図である。第２図（ａ）はそ
の状態に於けるＧＤＳ法によるメッキ深さ方向の分析結
果を示し、第２図（ｂ）は加熱処理後（３５０℃１０秒
）の同分析結果を示したものである。次に第３図及び第
４図（ａ） 、 （ｂ）はＳｎ，Ｎｉ，Ｚｎ重層メッキ
（Ｓｎ１．０゜Ｎｉ ２．０．Ｚｎ １．Ｏｇ／ｒｒｆ
） した場合の第１図、第２図と同様な結果を示してい
る。Figure 1 shows N1. S n, Z n multilayer plating (each plating amount is N11.0.sn 2.O, Zn 1.
Og/rr? ) is a cross-sectional explanatory diagram. Figure 2 (a) shows the analysis results in the plating depth direction using the GDS method in that state, and Figure 2 (b) shows the same analysis results after heat treatment (350°C for 10 seconds). be. Next, Figures 3 and 4 (a) and (b) show Sn, Ni, Zn multilayer plating (Sn1.0°Ni 2.0.Zn 1.Og/rrf
) The results shown in Figures 1 and 2 are similar to those shown in Figures 1 and 2.
当然ながら、熱処理の条件によって合金化の程度は異な
るが、本発明の範囲内の熱処理条件であれば、優れた素
地鉄との密着性、並びに耐錆性が確保される。Naturally, the degree of alloying varies depending on the heat treatment conditions, but as long as the heat treatment conditions are within the scope of the present invention, excellent adhesion to the base iron and rust resistance are ensured.
以下、発明の限定理由について詳しく説明する。The reasons for the limitations of the invention will be explained in detail below.
先ず、珪素鋼板のＳ１含有率を０．５〜３．０％に限定
したのは、０．５％以下では、磁路の形成が不充分で、
モーター用のプリント基板として不適当であるためであ
る。モーターの用途によっては、Ｓ１含有率が０．５％
未満でも使用可能ではあるが、この場合本発明の主要構
成要素である熱処理によるメッキ金属の素地鉄との合金
化処理をすることなく密着性が得られる。First, the reason why the S1 content of the silicon steel plate was limited to 0.5 to 3.0% is that if it is less than 0.5%, the formation of a magnetic path is insufficient.
This is because it is unsuitable as a printed circuit board for motors. Depending on the application of the motor, the S1 content may be 0.5%.
However, in this case, adhesion can be obtained without alloying the plating metal with the base iron by heat treatment, which is the main component of the present invention.
又、Ｓｔ含有率が３．０％を超えた場合は、Ｓｔ酸化物
層の厚みが厚く、本発明の熱処理を施してもメッキ金属
と素地鉄との合金化が不充分で、充分なメッキ密着性が
確保されない。In addition, if the St content exceeds 3.0%, the thickness of the St oxide layer is so thick that even if the heat treatment of the present invention is applied, alloying of the plating metal and the base iron will be insufficient, resulting in insufficient plating. Adhesion is not ensured.
次に、メッキ金属の限定理由について述べる。Next, the reason for limiting the plated metal will be described.
第−層、第二層のメッキ金属をＮ１又はＳｎとしたのは
、これら金属がいずれも比較的低温で鉄と合金化し易い
からである。そして第三層のメッキ金属としてＺｎを選
択したのは、第一、二層のメッキ金属であるＮ ｔ、
Ｓ ｎがいずれも、大気中においては鉄に対して電気化
学的に責で鉄を犠牲防食出来ず、長期間湿潤雰囲気に曝
された場合、メッキ欠陥部から赤錆が発生する等の不都
合が生ずる為、ＺｎとＳｎ、又はＮ１とＺｎとを合金化
する事でメッキ層の耐錆性を確保した。The reason why the plating metal of the first layer and the second layer is N1 or Sn is that these metals are easily alloyed with iron at a relatively low temperature. Zn was selected as the plating metal for the third layer because Nt, the plating metal for the first and second layers, was chosen as the plating metal for the third layer.
Both S and N are electrochemically sensitive to iron in the atmosphere and cannot protect iron from sacrificial corrosion, and if exposed to a humid atmosphere for a long period of time, problems such as red rust forming from plating defects will occur. Therefore, the rust resistance of the plating layer was ensured by alloying Zn and Sn or N1 and Zn.
この合金化処理で形成されるＺｎ、Ｎｉ，Ｓｎを含む合
金は、いずれもＮ１．Ｓｎの優れた耐蝕性（金属自体の
腐食減量が少ない）に加え、Ｚｎとの合金化で犠牲防食
能も付加されたことで、耐錆性（メッキ欠陥部又は切断
端面からの鉄の赤錆が少ない）が著しく改善され、薄メ
ッキでも優れた耐錆性が確保される。All alloys containing Zn, Ni, and Sn formed by this alloying process have N1. In addition to the excellent corrosion resistance of Sn (less corrosion loss of the metal itself), alloying with Zn also adds sacrificial anticorrosion ability, which improves rust resistance (red rust of iron from plating defects or cut edges is reduced). ) is significantly improved, and excellent rust resistance is ensured even with thin plating.
次に、メッキ量の限定範囲であるが、重層するメッキ金
属の全メッキ量を１〜３０ｇ／ｒｆとしたのは、１ ｚ
ｌｒｄ未満では通常にＮｉ、Ｓｎ、Ｚｎを単層、又は重
層メッキした場合に比べ合金化メッキの耐錆性が優れて
いるとは言え、プリント基板用の鋼板として耐錆性が不
足するからである。Next, regarding the limited range of plating amount, the reason why the total plating amount of overlapping plating metal was set to 1 to 30 g/rf was 1z
Although the rust resistance of alloyed plating is superior to that of single-layer or multi-layer plating of Ni, Sn, and Zn below lrd, the rust resistance is insufficient as a steel plate for printed circuit boards. be.
又、３０ｇ／ｒｄを超えると、合金化メッキ層が通常の
Ｎｉ、Ｓｎ、Ｚｎを単層又は重層メッキしたメッキ層に
比べ加工性に劣る為、プレス加工、打ち抜き加工時にメ
ッキ層の一部が剥離を生じるためである。即ち、合金化
メッキ層は一部金属間化合物を形成していると推定され
加工性に劣っている。In addition, if it exceeds 30 g/rd, the alloyed plating layer will have poor workability compared to the normal single-layer or multi-layer plating of Ni, Sn, and Zn. This is because peeling occurs. That is, it is presumed that the alloyed plating layer partially forms an intermetallic compound, resulting in poor workability.
このためメッキ層が薄い場合はなんら問題ないが、厚メ
ッキ（３０ｇ／ｒｒ？以上）となった場合、プレス打ち
抜き加工によりメッキ層の一部が剥離し、本発明の目的
とした素地鉄との優れたメッキ密着性が確保されない。For this reason, if the plating layer is thin, there will be no problem, but if the plating is thick (30 g/rr? or more), part of the plating layer will peel off during the press punching process, and the plated layer will not match with the base iron, which is the purpose of the present invention. Excellent plating adhesion cannot be ensured.
第５図は重層メッキの全メッキ量と耐錆性との関係との
一例を示したものである（重層メッキは、Ｎ１．Ｓｎ、
Ｚｎであり、熱処理条件は３００℃ＸＩＯ秒の一定条件
とした。評価方法は実施例に同じ）。Figure 5 shows an example of the relationship between the total plating amount and rust resistance of multilayer plating (multilayer plating is N1.Sn,
The material was Zn, and the heat treatment conditions were constant at 300° C. for 10 seconds. The evaluation method is the same as in the example).
本発明では、メッキ面について何ら規定していないが、
必要に応じて片面メッキ及び差厚メッキの適用を行うこ
とが出来る。即ち、プリント基板の裏面（Ｃｕ箔と反対
面）には優れた耐錆性を必要とするので厚メッキの適用
が好ましく、逆に絶縁樹脂・Ｃｕ箔積層面について密着
性のみが必要で耐錆性が不必要の場合は、その面に薄メ
ッキ又はクロメート処理等の後処理のみでもよい。Although the present invention does not specify any plating surface,
Single-sided plating and differential thickness plating can be applied as needed. In other words, the back side of the printed circuit board (the side opposite to the Cu foil) requires excellent rust resistance, so it is preferable to apply thick plating, whereas the insulating resin/Cu foil laminated side requires only adhesion and is rust resistant. If this is not necessary, the surface may be subjected to post-treatment such as thin plating or chromate treatment.
次に、熱処理条件の温度を２００℃以上としたのは、こ
の条件以下では、素地鉄との合金化並びに重層メッキの
合金化が充分で無くメッキ密着性、耐錆性が確保されな
いからである。Next, the reason why the temperature of the heat treatment condition was set to 200℃ or higher is that below this condition, alloying with the base iron and alloying of the multilayer plating will not be sufficient, and plating adhesion and rust resistance will not be ensured. .
温度を３５０℃以下としたのは、これ以上の熱処理によ
る合金化は、メッキ密着性、耐錆性の向上に寄与しない
ばかりか、過度の素地鉄との合金化により、むしろメッ
キ密着性が劣化すること、並びに過度な熱処理により、
メッキ表層の酸化が起こったり、珪素鋼板中に冷却後熱
歪が残り、磁性が劣化する等の障害が顕在化するためで
ある。勿論、経済的にも過度な熱処理は不都合である。The temperature was set below 350°C because alloying by heat treatment beyond this level will not only not contribute to improving plating adhesion and rust resistance, but also cause excessive alloying with the base iron, which will actually deteriorate plating adhesion. By doing so, as well as by excessive heat treatment,
This is because problems such as oxidation of the plating surface layer, thermal strain remaining in the silicon steel plate after cooling, and deterioration of magnetism become apparent. Of course, excessive heat treatment is economically disadvantageous.
尚、熱処理時間は極く短時間、例えば３〜３０秒が適当
である。The heat treatment time is suitably very short, for example 3 to 30 seconds.
次に加熱方法について、本発明では特に規定するもので
はなく、一般的に行われる熱風加熱、電気抵抗加熱（銅
帯に直接通電して加熱する）、誘導加熱等が適用可能で
ある。冷却条件についても特に規定するもので無く、処
理設備に適した冷却方法を適用すれば良い。例えば、水
スプレーによる急冷、冷風による冷却又はロールによる
冷却法等が適用出来る。Next, the heating method is not particularly specified in the present invention, and commonly used hot air heating, electric resistance heating (heating by directly applying electricity to the copper strip), induction heating, etc. can be applied. Cooling conditions are not particularly specified either, and a cooling method suitable for the processing equipment may be applied. For example, rapid cooling with water spray, cooling with cold air, cooling with rolls, etc. can be applied.
次に、メッキ後の後処理について、本発明では特に限定
しない。何故なら、一般的には、メッキ後の燐酸塩処理
又はクロメート処理で耐錆性が向上したり、有機樹脂と
の接着性が改善されることは良く知られており、必要に
応じて実施すればよい。Next, the present invention does not particularly limit the post-treatment after plating. This is because it is generally well known that phosphate treatment or chromate treatment after plating improves rust resistance and adhesion with organic resins, and should be carried out as necessary. Bye.
即ち、樹脂の種類によって後処理を施さないと所期の密
着性を確保出来ない場合、又は必要な耐錆性が確保され
ない場合に限り、後処理を実施すればよい。That is, post-treatment may be carried out only when the desired adhesion cannot be secured without post-treatment depending on the type of resin, or when the necessary rust resistance cannot be secured.
又、メッキ完了後長期間保管する場合、メッキ層表面に
酸化膜が生成するのでこうした場合もクロメート処理を
施すことは有効である。しかし、かかる後処理について
は、本発明の構成要素とは特に関係無〈従来の知見で、
必要に応じて適用すればよい。Furthermore, if the product is stored for a long period of time after completion of plating, an oxide film will form on the surface of the plating layer, so chromate treatment is also effective in such cases. However, such post-processing is not particularly related to the constituent elements of the present invention.
It can be applied as necessary.
［実 施 例コ
使用した珪素鋼板の成分を第１表に示した。比較材とし
ては通常の冷延鋼板を使用した。[Example 1] Table 1 shows the composition of the silicon steel plate used. A normal cold-rolled steel plate was used as a comparison material.
第 １ 表
次に、以下の条件でメッキ処理を行ってメッキ密着性、
並びに耐錆性を評価した結果を第２表に示した。Table 1 Next, plating was performed under the following conditions to determine plating adhesion,
Table 2 shows the results of evaluating the rust resistance.
（１） メッキ前処理
■脱脂−Ｎ ａ ＯＨ５０ｇ／Ｒ、８０℃の溶液中で、
陰極電解処理 １５Ａ／ｄ＋ｇ２Ｘ ２秒■酸洗・・・
Ｈ２ＳＯ４ＬＯＯＫ／（１，１５〜３０℃溶液中で、陰
極電解処理 １５Ａ／ｄａ２Ｘ ２秒（２）メッキ条件
■Ｓｎメッキ・・・
Ｓ ｎ ２”３０ｇ ／１ 、フェノールψスルホン酸
２００ｇ、Ｑ 、浴温４０℃
陰極電解処理：１５Ａ／ｄｉ２（通電時間はメッキ量で
異なる）
■Ｎ１メッキ・・・
Ｎｉ５０４８Ｈ２０２００ｇ／Ｎ 、Ｈ２ＳＯ４Ｌ５ｇ
／Ｉ） 、硼酸４０ｇ／（１，浴温４０℃
陰極電解処理： １５Ａ／ｄ＋ｇ２（通電時間はメッキ
量で異なる）
■Ｚｎメッキ・・・
ＺｎＳＯ４７Ｈ２０２００ｇ／ｊｌｌ 、Ｈ２Ｓｏ４Ｌ
５ｇ／ＩＩ 、浴温４０℃
陰極電解処理：１５Ａ／ｄａ２（通電時間はメッキｆｆ
ｉで異なる）
（３）熱処理条件
Ａ・・・１５０℃×２０秒（本発明の範囲外）Ｂ・・・
２００℃×２０秒（本発明の範囲）Ｃ・・・３００℃×
ｌθ秒（〃）
Ｄ・・・３５０℃×５秒（）
Ｅ・・・３７０℃×４０秒（本発明の範囲外）（４）後
処理
■クロメート処理・・・
ＣｒＯ３５０ｇ／（Ｊ 、Ｈ２ＳＯ４０，５ｇ／ρ陰極
電解処理： １５Ａ／ｄｏ＋２ ｘ ２秒■燐酸塩処理
・・・
日本パーカーライジング側製の処理浴
（Ｂ ｔ３０８０）溶液を使用
標準条件で処理した。(1) Pre-plating treatment - Degreasing - In a solution of NaOH 50g/R at 80℃,
Cathode electrolytic treatment 15A/d+g2X 2 seconds ■ Pickling...
H2SO4LOOK/(1, Cathode electrolytic treatment in 15-30℃ solution 15A/da2X 2 seconds (2) Plating conditions ■Sn plating... Sn 2"30g/1, phenol ψ sulfonic acid 200g, Q, bath temperature 40℃ Cathode electrolysis treatment: 15A/di2 (current application time varies depending on the amount of plating) ■N1 plating...Ni5048H20200g/N, H2SO4L5g
/I), Boric acid 40g/(1, Bath temperature 40℃ Cathode electrolytic treatment: 15A/d+g2 (Electrification time varies depending on the amount of plating) ■Zn plating... ZnSO47H20200g/jll, H2So4L
5g/II, bath temperature 40℃, cathode electrolytic treatment: 15A/da2 (current application time is plating ff
(3) Heat treatment conditions A...150°C x 20 seconds (outside the scope of the present invention) B...
200°C x 20 seconds (range of the present invention) C...300°C x
lθ seconds (〃) D...350°C x 5 seconds () E...370°C x 40 seconds (outside the scope of the present invention) (4) Post-treatment ■ Chromate treatment... CrO350g/(J, H2SO40, 5g/ρ Cathode electrolytic treatment: 15A/do+2 x 2 seconds ■ Phosphate treatment... A treatment bath (B t3080) solution manufactured by Nippon Parkerizing was used under the standard conditions used.
（１）耐 錆 性・・・
ＪＩＳ Ｚ−２７３１の条件で塩水噴霧試験を行い、１
２０時間後の鯖発生面積を評価した。(1) Rust resistance... A salt spray test was conducted under the conditions of JIS Z-2731.
The mackerel-infested area was evaluated after 20 hours.
（赤−赤錆 白−白錆）
（２） メッキ密着性・・・
メッキした鋼板を引っ張り試験機で１０％伸ばした後、
表面をセロテープにチバンＮ（ＬａＯ２）で剥離して密
着力を評価した。(Red - red rust, white - white rust) (2) Plating adhesion... After stretching the plated steel plate by 10% using a tensile tester,
The surface was peeled off with cellophane tape using Chiban N (LaO2) to evaluate the adhesion.
（◎−剥離全く無、〇−剥離５％未満、△−剥離１５％
未満、Ｘ−剥離１０％以上）（３）外 観・・・
色調、模様等を目視により評価した。(◎-No peeling at all, 〇-Less than 5% peeling, △-15% peeling
(3) Appearance: Color tone, pattern, etc. were visually evaluated.
（良−良好、不一不良）
第２表に示すように、記号１は、鋼板の８１含有量が０
．１％と少ない為に、熱処理をしなくてもメッキ層の密
着性は良好であるが、重層メ・ツキの合金化が行われて
いないので、Ｚｎの腐食生成物である白錆が全面に発生
している。記号４，７は、全メッキ量が本発明外の３１
．５ｇ／ｒｒｒと多くメッキ層の密着性が悪い。記号８
は、第三層のＺｎメ・ツキがないために、赤錆が全面に
発生している。記号９は、全メッキ量が本発明外の０．
９ｇ：／ｄと少ないために赤錆が広範囲に発生、記号１
１は、熱処理温度が本発明外の１５０℃と低いので、合
金化不充分で、全特性とも悪い。記号１４は、熱処理温
度が本発明外の３７０℃と高いので、メッキ層の合金化
が進み過ぎて耐錆性が悪い。記号１Ｂは、鋼板中の８１
含有率が本発明外の３，３％と多いために適正な熱処理
を施してもメッキ層と素地鉄との密着性が悪い。(Good - good, defective) As shown in Table 2, symbol 1 means that the 81 content of the steel plate is 0.
．． Since the amount is as low as 1%, the adhesion of the plating layer is good even without heat treatment, but since the multilayer plating is not alloyed, white rust, which is a corrosion product of Zn, is completely covered. It has occurred. Symbols 4 and 7 are 31 in which the total plating amount is outside the scope of the present invention.
．． The adhesion of the plating layer was poor at 5 g/rrr. symbol 8
Since there is no Zn coating on the third layer, red rust occurs all over the surface. Symbol 9 indicates that the total plating amount is 0.0, which is outside the scope of the present invention.
Red rust occurs over a wide area due to the small amount of 9g:/d, symbol 1
In No. 1, the heat treatment temperature was as low as 150° C., which is outside the scope of the present invention, so alloying was insufficient and all properties were poor. In the case of symbol 14, the heat treatment temperature is as high as 370° C., which is outside the scope of the present invention, so that the alloying of the plating layer progresses too much, resulting in poor rust resistance. Symbol 1B is 81 in the steel plate
Since the content is as high as 3.3%, which is outside the scope of the present invention, the adhesion between the plating layer and the base iron is poor even if proper heat treatment is performed.
これに対して、記号２． ３． ５． ６．１０．１２
゜１３、１５．１７．１８は、鋼板中のｓｉ含有率、重
層全メッキ量、及び熱処理条件の全てにおいて本発明の
範囲内にコントロールされたものであり、諸特性共に満
足すべきものである。On the other hand, symbol 2. 3. 5. 6.10.12
13, 15, 17, and 18, the Si content in the steel plate, the total amount of multilayer plating, and the heat treatment conditions were all controlled within the scope of the present invention, and all properties should be satisfied.
［発明の効果〕
本発明によれば、特定のメッキ金属を特定の順序で重層
メッキし、そして特定の熱処理条件で合金化処理を施す
ことにより、特殊なメッキ前処理を必要とせずに、メッ
キ密着性はもとより、薄メッキで耐錆性の優れたプリン
ト基板用鋼板が得られる。[Effects of the Invention] According to the present invention, by multi-layer plating specific plating metals in a specific order and performing alloying treatment under specific heat treatment conditions, plating can be achieved without the need for special plating pre-treatment. A steel plate for printed circuit boards with excellent adhesion, thin plating, and excellent rust resistance can be obtained.
第１図は重層メッキの断面説明図、第２図（ａ）。
（ｂ）は熱処理前後のＧＤＳ法によるメッキ深さ方向の
分析結果の一例を示す図表１．第３図、第４図（ａ）
、 （ｂ）は他の重層メッキに於ける断面説明図と分析
結果例を示す図表、第５図は重層メッキの全メッキ量と
密着性との関係を示す図表、第６図は重層メッキの全メ
ッキ量と耐錆性との関係を示す図表である。FIG. 1 is an explanatory cross-sectional view of multilayer plating, and FIG. 2(a). Figure 1 (b) shows an example of the analysis results in the plating depth direction by the GDS method before and after heat treatment. Figures 3 and 4 (a)
, (b) is a chart showing cross-sectional views and examples of analysis results in other multi-layer plating, Figure 5 is a chart showing the relationship between the total plating amount and adhesion of multi-layer plating, and Fig. 6 is a diagram showing the relationship between the total plating amount and adhesion of multi-layer plating. It is a chart showing the relationship between the total plating amount and rust resistance.
Claims (2)
板側からＮｉ，Ｓｎ，Ｚｎの順序で、全メッキ量が１．
０〜３０．０ｇ／ｍ＾２の重層メッキを行った後、２０
０〜３５０℃の温度で短時間の加熱処理を行うことを特
徴とする鉄系プリント基板用鋼板の製造方法。1. The surface of a silicon steel plate containing 0.5 to 3.0% Si is coated with Ni, Sn, and Zn in this order from the steel plate side, with a total plating amount of 1.
After multilayer plating of 0 to 30.0 g/m^2, 20
A method for manufacturing a steel plate for iron-based printed circuit boards, which comprises performing a short-time heat treatment at a temperature of 0 to 350°C.
ある請求項１に記載する方法。2. 2. The method according to claim 1, wherein the order of multilayer plating is Sn, Ni, and Zn from the steel plate side.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17491888A JPH0226246A (en) | 1988-07-15 | 1988-07-15 | Manufacture of steel plate for iron printed board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17491888A JPH0226246A (en) | 1988-07-15 | 1988-07-15 | Manufacture of steel plate for iron printed board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0226246A true JPH0226246A (en) | 1990-01-29 |
Family
ID=15986988
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17491888A Pending JPH0226246A (en) | 1988-07-15 | 1988-07-15 | Manufacture of steel plate for iron printed board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0226246A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6537143B1 (en) | 1999-06-22 | 2003-03-25 | Samsung Electronics Co., Ltd. | Pedestal of a load-cup which supports wafers loaded/unloaded onto/from a chemical mechanical polishing apparatus |
| WO2004068693A3 (en) * | 2003-01-24 | 2005-03-24 | Tecumseh Products Co | Brushless and sensorless dc motor control system with locked and stopped rotor detection |
| JP6052430B2 (en) * | 2014-01-28 | 2016-12-27 | 新日鐵住金株式会社 | Surface-treated steel sheet |
-
1988
- 1988-07-15 JP JP17491888A patent/JPH0226246A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6537143B1 (en) | 1999-06-22 | 2003-03-25 | Samsung Electronics Co., Ltd. | Pedestal of a load-cup which supports wafers loaded/unloaded onto/from a chemical mechanical polishing apparatus |
| US6860801B2 (en) | 1999-06-22 | 2005-03-01 | Samsung Electronics Co., Ltd. | Pedestal of a load-cup which supports wafers loaded/unloaded onto/from a chemical mechanical polishing apparatus |
| WO2004068693A3 (en) * | 2003-01-24 | 2005-03-24 | Tecumseh Products Co | Brushless and sensorless dc motor control system with locked and stopped rotor detection |
| JP6052430B2 (en) * | 2014-01-28 | 2016-12-27 | 新日鐵住金株式会社 | Surface-treated steel sheet |
| US10189229B2 (en) | 2014-01-28 | 2019-01-29 | Nippon Steel & Sumitomo Metal Corporation | Surface-treated steel sheet |
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