JPH02260686A - Electronic component fitting device - Google Patents

Electronic component fitting device

Info

Publication number
JPH02260686A
JPH02260686A JP8346489A JP8346489A JPH02260686A JP H02260686 A JPH02260686 A JP H02260686A JP 8346489 A JP8346489 A JP 8346489A JP 8346489 A JP8346489 A JP 8346489A JP H02260686 A JPH02260686 A JP H02260686A
Authority
JP
Japan
Prior art keywords
board
earth
earth pattern
electronic component
pattern section
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8346489A
Other languages
Japanese (ja)
Other versions
JP2658374B2 (en
Inventor
Atsushi Murase
篤 村瀬
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP1083464A priority Critical patent/JP2658374B2/en
Publication of JPH02260686A publication Critical patent/JPH02260686A/en
Application granted granted Critical
Publication of JP2658374B2 publication Critical patent/JP2658374B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0213Electrical arrangements not otherwise provided for
    • H05K1/0254High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages

Landscapes

  • Structure Of Printed Boards (AREA)
  • Elimination Of Static Electricity (AREA)

Abstract

PURPOSE:To protect an electronic component mounted on a board against damage due to static electricity by a method wherein a master earth pattern section is provided inside the peripheral edge of a board apart from it by a prescribed space, and two or more fine earth pattern sections are provided extending from the master earth pattern section to the peripheral edge of the board. CONSTITUTION:A master earth pattern section 1 is provided inside the peripheral edge of a printed board apart from it by a prescribed space, and two or more fine earth pattern sections 2 are provided extending from the master earth pattern section to the peripheral edge of the printed board. The master earth pattern section 1 is connected to a main body earth through an earth wire. By this setup, static electricity discharged through the gaps of an outer package is all discharged to the earth of the main body from the fine earth pattern sections 2 through the master earth pattern section 1 and the earth wire 3, so that an electronic component in a circuit can be protected against damage.

Description

【発明の詳細な説明】 産業上の利用分野 本発明は携帯用ラジオ受信機や小型ビデオカメラ等に用
いることができるプリント配線板等の電子部品吹付装置
に関する。
DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to an apparatus for spraying electronic components such as printed wiring boards that can be used for portable radio receivers, small video cameras, and the like.

従来の技術 近年の半導体を多く利用した電子機器は小型。Conventional technology In recent years, electronic devices that use many semiconductors are small.

軽量化が進み、屋外で多く利用する機会が多くなってき
ておシ人体又は人体衣服よりの静電気が機器に与える影
響も多くなってきている。
As devices become lighter and more frequently used outdoors, static electricity from the human body or human clothing is increasingly affecting devices.

以下、図面を参照しながら上述した従来のプリント板を
VTRの釦操作部に利用したものを例にとって説明する
Hereinafter, an example in which the conventional printed board described above is used as a button operation section of a VTR will be explained with reference to the drawings.

第3図はVTR釦操作部の外観図であシ、第4図(a)
 、 (b)は両面構造のプリント板を示す斜視図。
Figure 3 is an external view of the VTR button operation section, Figure 4 (a)
, (b) is a perspective view showing a printed board with a double-sided structure.

第5図は第3図の各釦・K押されてプリント配線板と接
触し導通するクリック板スイッチを示す平面図、第6図
はVTR釦操作部の組立て状態を示す断面図である。
FIG. 5 is a plan view showing a click board switch that comes into contact with a printed wiring board when the buttons K shown in FIG.

第3図において、4〜10は釦キーV11はスライドス
イッチキー、12は外装パネル、13はフレキシブルプ
リント板でVTR本体部との信号の伝達を行うためのも
のである。
In FIG. 3, button keys 4 to 10 are slide switch keys V11, 12 is an exterior panel, and 13 is a flexible printed board for transmitting signals with the VTR main body.

第4図で14〜2oは第3図の釦キー4〜1゜によって
押される第6図のクリック板スイッチ部36に配された
クリック板スイッチ28〜34との接点となる接点部分
である。21はスライドスイッチキー11の裏面に配さ
れ、第6図に示す導体ブラシ37によって導通する接点
である。接点部分14〜21は金メツキ又は炭素被膜で
保護されており腐食を防止している。22.24はプリ
ント板260表裏パターンを導通するスルホール、23
は第6図のクリック板スイッチ部28〜34と第4図の
プリント板との各信号を導通させる接合点で、第5図の
接合点36に対応して込る。この部分はハンダ熱圧着等
で接合されている。26はフレキシブルプリント板13
とプリント板26との信号を導通させる接合点である。
In FIG. 4, reference numerals 14 to 2o are contact portions that are pressed by the button keys 4 to 1° in FIG. 3 and are in contact with the click plate switches 28 to 34 arranged in the click plate switch section 36 in FIG. 6. Reference numeral 21 denotes a contact point arranged on the back surface of the slide switch key 11 and electrically connected by a conductor brush 37 shown in FIG. Contact portions 14-21 are protected with gold plating or carbon coating to prevent corrosion. 22. 24 are through holes that conduct the front and back patterns of the printed board 260, 23
is a junction point that connects each signal between the click board switch sections 28 to 34 of FIG. 6 and the printed board of FIG. 4, and corresponds to the junction point 36 of FIG. 5. This part is joined by solder thermocompression bonding or the like. 26 is a flexible printed board 13
This is a junction point that conducts signals between the board 26 and the printed board 26.

第6図は第3図の外装パネル部、第6図のクリック板ス
イッチ部、第4図のプリント板部が層状構造になって釦
操作部を形成してhるところを示すと共に第3図の一点
鎖線で切った断面図である。
6 shows how the exterior panel section shown in FIG. 3, the click board switch section shown in FIG. 6, and the printed board section shown in FIG. FIG.

釦8がクリック板スイッチ32を押しプリント板25上
の接点18と接触し、プリント板25とクリック板スイ
ッチ部a6とで信号が伝わることによりVTR本体部に
釦が押されたことが7レキシプ〜プリント板13をとお
して伝わるようになっている。
The button 8 presses the click board switch 32 and comes into contact with the contact point 18 on the printed board 25, and a signal is transmitted between the printed board 25 and the click board switch section a6, thereby indicating that the button has been pressed to the VTR main body. The signal is transmitted through the printed board 13.

なお、本操作部ユニットはVTR本体部分の外装部の一
部分として組込まれ、操作する人がこれによりVTRの
記録再生等の操作をすることになる。
The operation section unit is incorporated as a part of the exterior of the VTR main body, and the operator uses it to perform operations such as recording and playback of the VTR.

第7図は操作部がVTR本体部分の外装38に組みこま
れたものの断面図を示したものであり、第3図の二点鎖
線で切断した断面を示す。
FIG. 7 shows a cross-sectional view of the operation unit incorporated into the exterior 38 of the VTR main body, and shows a cross-section taken along the two-dot chain line in FIG.

外装バネA/12と、プリント板26と、クリック板ス
イッチ部36とは一体に組立てられた状態で外装38に
組みこまれている。
The exterior spring A/12, the printed board 26, and the click board switch section 36 are integrated into the exterior 38 in an assembled state.

発明が解決しようとする課題 しかしながら上記した従来の構成では、第7図に示す隙
間50を通して人体又は人体衣服に帯電した静電気(一
般には数KV〜十数KV)が第4図の矢印Aのようにプ
リント板25のエツジ部に近い信号ラインに放電すると
、それに導通する電子部品、特に半導体部品を破壊して
しまう可能性が高いという課題を有していた。
Problems to be Solved by the Invention However, in the conventional configuration described above, static electricity (generally several KV to tens of KV) charged on the human body or human clothing passes through the gap 50 shown in FIG. 7, as shown by arrow A in FIG. If a signal line is discharged to a signal line near the edge of the printed circuit board 25, there is a high possibility that electronic components, particularly semiconductor components, connected thereto will be destroyed.

本発明はかかる点に鑑み、このような外装部間の隙間よ
シ静電気が電気回路に放電しても回路内の電子部品が破
壊しない電子部品取付装置を提供するものである。
In view of this problem, the present invention provides an electronic component mounting device in which electronic components in the circuit will not be destroyed even if static electricity is discharged into the electrical circuit through the gap between the exterior parts.

課題を解決するための手段 上記課題を解決するために本発明は、基板の周縁から所
定量だけ内側の位置に配置された基幹アースパターン部
と、基幹アースパターン部から基板の周縁に向かって配
された複数個の微細なアースパターン部゛と(板パター
ン)を備えた構成よ)なるものである。
Means for Solving the Problems In order to solve the above-mentioned problems, the present invention provides a main earth pattern section disposed a predetermined amount inside from the periphery of the board, and a main ground pattern section disposed toward the periphery of the board from the main ground pattern section. It has a structure comprising a plurality of fine ground pattern parts and (plate patterns).

作  用 本発明は上記した構成により、仮にも外装隙間などから
静電気が基板に放電しても、基板周囲に配した基幹アー
スパターン部とさらに基幹アースパターン部より基板の
周縁まで配した微細なアースパターン(板パターン)に
よシ全でアースラインに放電しアース線をとおして本体
電源部に吸収されてしまうので電子部品の破壊を防ぐこ
とができる。
The present invention has the above-described configuration, so that even if static electricity is discharged to the board from an exterior gap, etc., the basic earth pattern placed around the board and the fine ground pattern placed from the basic ground pattern to the periphery of the board can be used. Because the pattern (board pattern) completely discharges to the ground line and is absorbed into the power supply section of the main body through the ground line, it is possible to prevent destruction of electronic components.

実施例 以下1本発明の一実施例の電子部品取付装置について図
面を参照しながら説明する。
Embodiment 1 An electronic component mounting apparatus according to an embodiment of the present invention will be described below with reference to the drawings.

第1図は本発明の〒実施例を示すものであシ、前述の第
4図(、)のプリント板に相当する要部平面図である。
FIG. 1 shows an embodiment of the present invention, and is a plan view of a main part corresponding to the printed board shown in FIG. 4 (2) described above.

プリント板周辺に基幹アースパターン部1を配しさらに
プリント板周縁(エツジ)に向って基幹アースパターン
部1より微細アースパターン(1板パターン)部2を配
している。また基幹アースパターン部1からはアース線
3を通して図示しない本体部のアースに接続されるよう
になっている。
A basic earth pattern part 1 is arranged around the printed board, and a fine earth pattern (one-board pattern) part 2 is further arranged from the basic earth pattern part 1 toward the edge of the printed board. Further, the basic ground pattern section 1 is connected to the ground of the main body section (not shown) through a ground wire 3.

なお、従来の構成と同一の要素については同一番号を付
与して説明を省略する。
Note that elements that are the same as those in the conventional configuration are given the same numbers and their explanations are omitted.

第2図は電子部品取付装置の要部拡大断面図である。FIG. 2 is an enlarged sectional view of the main parts of the electronic component mounting device.

図中、6は半田レジスト、4は回路パターンである。In the figure, 6 is a solder resist, and 4 is a circuit pattern.

以上のように本実施例によれば、電子部品取付装置の周
囲にアースラインを配線することにより、外装隙間よシ
放電する静電気は全てこの微細アースパターン部2より
基幹アースパターン部1、アース線3を通して本体アー
ス部に放電することで回路内の電子部品の破壊を防止す
ることができる。
As described above, according to this embodiment, by wiring the ground line around the electronic component mounting device, all the static electricity discharged through the exterior gap is transferred from the fine ground pattern section 2 to the basic ground pattern section 1 and the ground line. By discharging to the main body grounding part through 3, it is possible to prevent destruction of electronic components in the circuit.

なお第2図のようにプリント板には半田レジスト6が半
田のつかないところを覆っているためにアースパターン
をプリント板周縁部まで配しないと半田レジストが絶縁
の役目をして静電気がスムーズに放電しないものである
As shown in Figure 2, the solder resist 6 covers the parts of the printed board that cannot be soldered, so if the ground pattern is not placed all the way to the periphery of the printed board, the solder resist will act as an insulator and the static electricity will flow smoothly. It does not discharge electricity.

また、プリント板を周縁まで全てパターンを配すると、
プリント板を金型で型抜きするときのエツジのパリ、パ
ターン剥離等が発生する可能性が大きい。ゆえに第1図
のように基幹アースパターン部から微細アースパターン
部を周縁部分に向って放射状に配することでエツジのパ
リを極めて少なくすることができ、また型抜き精度も微
細アースパターン部をエッ′ジよシ充分のばしておけば
不要となるので、基幹アースパターン部と微細アースパ
ターン部によるアースパターン配線構成は有効である。
Also, if you arrange the pattern all the way to the periphery of the printed board,
When cutting a printed board with a mold, there is a high possibility that edge cracking, pattern peeling, etc. will occur. Therefore, by arranging the fine earth pattern parts radially from the basic earth pattern part to the peripheral part as shown in Figure 1, it is possible to extremely reduce edge cracks, and the die cutting accuracy can also be improved by arranging the fine earth pattern parts radially from the basic earth pattern part to the peripheral part. 'If it is extended sufficiently, it becomes unnecessary, so the earth pattern wiring configuration consisting of the basic earth pattern part and the fine earth pattern part is effective.

発明の効果 以上のように本発明によれば基板周囲に基幹アースパタ
ーン部を配し、さらに基幹アースパターン部よシ基板周
縁まで微細アースパターンを配することで基板周縁部よ
り放電する静電気をアースラインに吸収することができ
る。
Effects of the Invention As described above, according to the present invention, by arranging a basic ground pattern around the board and further arranging a fine ground pattern from the main ground pattern to the periphery of the board, static electricity discharged from the periphery of the board can be grounded. It can be absorbed into the line.

また、基板のパターン配線を工夫するだけであり、外装
の部分に別にアルミ箔等の配線を施したり信号ラインに
直列に抵抗を入れて静電気破壊防止をする必要がなく、
極めて有効な電子部品取付装置の破壊を防止することが
できる。
In addition, it is only necessary to devise the pattern wiring of the board, and there is no need to separately apply wiring such as aluminum foil to the exterior part or insert a resistor in series with the signal line to prevent electrostatic damage.
This is extremely effective in preventing destruction of the electronic component mounting device.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本発明の一実施例を示す電子部品取付装置の要
部平面図、第2図は同装置の要部断面図、第3図は釦操
作部の外観を示す斜視図、第4図は釦操作部の内部の両
面構造のプリント板を示す斜視図、第6図はクリック板
スイッチを示す平面図、第6図は釦操作部の分解断面図
、第7図は釦操作部と本体外装部の組込みを示した断面
図である。 1・・・・・・基幹アースパターン部、2・・・・・・
微細アースパターン(板パターン)部、3・・・・・・
アース線、4・・・・・・回路パターン、5・・・・・
・半田レジスト、25・・・・・・プリント板。 代理人の氏名 弁理士 粟 野 重 孝 ほか1名/ 
−一羞幹アースハ0ターン部 2− 説し間アースパターf呼 (腋ノザターシ) 第3図 第 図 (α) 第5図 第 図 第7図
FIG. 1 is a plan view of the main parts of an electronic component mounting device showing one embodiment of the present invention, FIG. 2 is a cross-sectional view of the main parts of the same device, FIG. The figure is a perspective view showing the double-sided printed board inside the button operation part, Figure 6 is a plan view showing the click board switch, Figure 6 is an exploded sectional view of the button operation part, and Figure 7 is the button operation part. FIG. 3 is a sectional view showing the assembly of the main body exterior part. 1... Basic earth pattern section, 2...
Fine earth pattern (plate pattern) part, 3...
Ground wire, 4...Circuit pattern, 5...
・Solder resist, 25...Printed board. Name of agent: Patent attorney Shigetaka Awano and 1 other person/
-Ichiaki trunk 0 turn part 2- Earth putter f call (armpit) Fig. 3 Fig. (α) Fig. 5 Fig. 7

Claims (1)

【特許請求の範囲】[Claims]  基板上に電子部品を搭載可能な電子部品取付装置であ
って、前記基板の周縁から所定量だけ内側の位置に配さ
れた基幹アースパターン部と、前記基幹アースパターン
部から前記基板の周縁に向かって配された複数個の微細
なアースパターン部とを備えたことを特徴とする電子部
品取付装置。
An electronic component mounting device capable of mounting electronic components on a board, the main earth pattern section being arranged at a position a predetermined amount inside from the periphery of the board, and the main ground pattern section extending from the main ground pattern section toward the periphery of the board. An electronic component mounting device characterized by comprising a plurality of fine ground pattern sections arranged in a manner similar to that of the first embodiment.
JP1083464A 1989-03-31 1989-03-31 Electronic component mounting device Expired - Fee Related JP2658374B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1083464A JP2658374B2 (en) 1989-03-31 1989-03-31 Electronic component mounting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1083464A JP2658374B2 (en) 1989-03-31 1989-03-31 Electronic component mounting device

Publications (2)

Publication Number Publication Date
JPH02260686A true JPH02260686A (en) 1990-10-23
JP2658374B2 JP2658374B2 (en) 1997-09-30

Family

ID=13803189

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1083464A Expired - Fee Related JP2658374B2 (en) 1989-03-31 1989-03-31 Electronic component mounting device

Country Status (1)

Country Link
JP (1) JP2658374B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006106822A (en) * 2004-09-30 2006-04-20 Toshiba Corp Card type electronic equipment
JP2008016004A (en) * 2006-07-04 2008-01-24 Orient Semiconductor Electronics Ltd Memory card with electrostatic discharge protection
US7948772B2 (en) 2006-07-04 2011-05-24 Orient Semiconductor Electronics Memory card with electrostatic discharge protection and manufacturing method thereof

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57142857U (en) * 1981-03-03 1982-09-07

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57142857U (en) * 1981-03-03 1982-09-07

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006106822A (en) * 2004-09-30 2006-04-20 Toshiba Corp Card type electronic equipment
JP4564321B2 (en) * 2004-09-30 2010-10-20 株式会社東芝 Card type electronic equipment
JP2008016004A (en) * 2006-07-04 2008-01-24 Orient Semiconductor Electronics Ltd Memory card with electrostatic discharge protection
JP4512577B2 (en) * 2006-07-04 2010-07-28 華泰電子股▲分▼有限公司 Memory card with electrostatic discharge protection
US7948772B2 (en) 2006-07-04 2011-05-24 Orient Semiconductor Electronics Memory card with electrostatic discharge protection and manufacturing method thereof

Also Published As

Publication number Publication date
JP2658374B2 (en) 1997-09-30

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