JPH02258879A - Masking tape - Google Patents
Masking tapeInfo
- Publication number
- JPH02258879A JPH02258879A JP8102489A JP8102489A JPH02258879A JP H02258879 A JPH02258879 A JP H02258879A JP 8102489 A JP8102489 A JP 8102489A JP 8102489 A JP8102489 A JP 8102489A JP H02258879 A JPH02258879 A JP H02258879A
- Authority
- JP
- Japan
- Prior art keywords
- tape
- porous
- melt adhesive
- masking
- hot
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000000873 masking effect Effects 0.000 title claims description 32
- 239000004831 Hot glue Substances 0.000 claims abstract description 18
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 9
- 230000035699 permeability Effects 0.000 claims abstract description 6
- 239000000463 material Substances 0.000 claims description 22
- 239000005871 repellent Substances 0.000 claims description 2
- 238000007747 plating Methods 0.000 abstract description 10
- -1 polyethylene Polymers 0.000 abstract description 8
- 229920001343 polytetrafluoroethylene Polymers 0.000 abstract description 6
- 239000004810 polytetrafluoroethylene Substances 0.000 abstract description 6
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 abstract description 5
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 abstract description 5
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 abstract description 5
- 239000004698 Polyethylene Substances 0.000 abstract description 3
- 229920000573 polyethylene Polymers 0.000 abstract description 3
- 229920000642 polymer Polymers 0.000 abstract description 3
- 239000011148 porous material Substances 0.000 abstract description 3
- 238000002844 melting Methods 0.000 abstract description 2
- 230000008018 melting Effects 0.000 abstract description 2
- 239000000758 substrate Substances 0.000 abstract 3
- 239000011248 coating agent Substances 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
- 239000005038 ethylene vinyl acetate Substances 0.000 abstract 1
- 238000010438 heat treatment Methods 0.000 abstract 1
- 238000002156 mixing Methods 0.000 abstract 1
- 239000004033 plastic Substances 0.000 abstract 1
- 229920003023 plastic Polymers 0.000 abstract 1
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 abstract 1
- 230000001070 adhesive effect Effects 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 229910000679 solder Inorganic materials 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 5
- 229920000181 Ethylene propylene rubber Polymers 0.000 description 4
- 229920006272 aromatic hydrocarbon resin Polymers 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000010355 oscillation Effects 0.000 description 4
- 239000002985 plastic film Substances 0.000 description 4
- 229920006255 plastic film Polymers 0.000 description 4
- 238000005476 soldering Methods 0.000 description 4
- 239000007788 liquid Substances 0.000 description 3
- 239000004743 Polypropylene Substances 0.000 description 2
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 150000003505 terpenes Chemical class 0.000 description 2
- 235000007586 terpenes Nutrition 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 235000013405 beer Nutrition 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 229920006244 ethylene-ethyl acrylate Polymers 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000012943 hotmelt Substances 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000005373 porous glass Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
Landscapes
- Adhesive Tapes (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明はブザーの生産、ＩＣチップ材のメツキ、ＩＣチ
ップ材を組込んだプリント基板の生産等に用いる新規な
構造を有するマスキングテープに関する。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a masking tape having a novel structure used in the production of buzzers, plating of IC chip materials, production of printed circuit boards incorporating IC chip materials, etc.
（従来の技術）
ブザー−？ＩＣチップ材をメツキする場合にはメツキネ
要部をマスキングしなければならず、またＩＣチップ材
をプリント基板に実装する場合には洗浄工程、デイツプ
半田工程を経るため、その際の液侵入を防止するためマ
スキングすることがある０
かようなマスキングテープとしては、合成紙やプラスチ
ックフィルムを基材とし、この基材の片面に感圧性粘着
剤を塗布したものが知られている。(Prior art) Buzzer? When plating IC chip materials, the main parts of the plating must be masked, and when mounting IC chip materials on a printed circuit board, a cleaning process and dip soldering process are required, so liquid intrusion is prevented during this process. 0 As such masking tapes, there are known masking tapes that use synthetic paper or plastic film as a base material and coat one side of this base material with a pressure-sensitive adhesive.
（発明が解決しようとする課題）
ところで、最近は生産ラインのスピードアップが計られ
ており、そのため各工程の温度は高く設定される傾向が
ある。(Problem to be Solved by the Invention) Recently, production lines have been sped up, and therefore the temperature of each process tends to be set high.
上記マスキングをブザーの音生発生穴やＩＣチップ材の
凹部に施した場合、生産ラインの温度を高くすると、穴
や凹部の空気が熱膨張し、その膨張力によりマスキング
テープの部分的な剥離を生じ、テープ剥離部からメツΦ
液が侵入してマスキング部にメツキが施されたり、マス
キング部に半田が施されたりして、不良品が発生するこ
とがあつた０
従って、本発明はマスキング部の空気が熱膨張しても、
その膨張力によっては剥離し難いマスキングテープを提
供することを目的とする。When the above masking is applied to the sound generation hole of the buzzer or the recess of the IC chip material, when the temperature of the production line is raised, the air in the hole or recess expands thermally, and the expansion force causes the masking tape to partially peel off. Φ from the tape peeled part.
The liquid may enter the masking area and the masking area may be plated or soldered, resulting in defective products. Therefore, the present invention is designed to prevent the thermal expansion of air in the masking area. ,
An object of the present invention is to provide a masking tape that is difficult to peel off depending on its expansion force.
（課題を解決するための手段）
本発明に係るマスキングテープは、撥水性テープ基材の
所定部が溌水性と通気性を有する多孔質部とされ、且つ
該テープ基材の片面の少なくとも端縁部に常温で粘着性
を有するホットメルト接着剤が設けられて成るものであ
る。(Means for Solving the Problems) In the masking tape according to the present invention, a predetermined portion of a water-repellent tape base material is a porous portion having water repellency and air permeability, and at least one edge of one side of the tape base material is a porous portion having water repellency and air permeability. A hot-melt adhesive that is tacky at room temperature is provided on the part.
以下１図面を参照しながら本発明の詳細な説明する。第
１図において、１は撥水性を有するテープ基材であり、
ポリエチレン、ポリプロピレン、ポリエチレンテレフタ
レート、ポリイミド、フッ素樹脂等のプラスチックフィ
ルム、金属箔あるいはこれらの積層体から成る。The present invention will be described in detail below with reference to one drawing. In FIG. 1, 1 is a tape base material having water repellency;
It consists of a plastic film made of polyethylene, polypropylene, polyethylene terephthalate, polyimide, fluororesin, etc., metal foil, or a laminate thereof.
このテープ基材１の略中央部には打抜部２が設けられ、
この打抜部２上にはポリテトラフルオロエチレン（以下
、ＰＴＦＥと称す）、ポリエチレン、ポリプロピレン等
の溌水性と通気性を有するグラスチック多孔質フィルム
が接合され、多孔質部３が形成されている。多孔質部３
を形成するための多孔質フィルムとしては、撥水性と通
気性の観点から、その孔径を約０．０１〜１０μｍ５気
孔率全約３０〜９５％に設定したものが好ましいもので
ある。かような多孔質フィルムは市販品を用いることが
でき、またＰＴＦＥ多孔質フィルムは特公昭５８−２５
３３２号公報、特公和５１−１８９９１号公報、特公昭
４２−１３５６０号公報等に記載された方法によって得
ることができる。A punched portion 2 is provided approximately in the center of this tape base material 1,
A porous glass film having water repellency and air permeability such as polytetrafluoroethylene (hereinafter referred to as PTFE), polyethylene, or polypropylene is bonded onto the punched portion 2 to form a porous portion 3. . Porous part 3
From the viewpoints of water repellency and air permeability, the porous film for forming the film is preferably one having a pore size of about 0.01 to 10 μm5 and a total porosity of about 30 to 95%. Commercially available products can be used for such porous films, and PTFE porous films are available from Japanese Patent Publication No. 58-25.
It can be obtained by the methods described in Japanese Patent Publication No. 332, Japanese Patent Publication No. 51-18991, Japanese Patent Publication No. 42-13560, etc.
本発明においては、更にテープ基材１の片面の少すくト
も端縁部にホットメルト接着剤４が設けられる。In the present invention, a hot-melt adhesive 4 is further provided on one side of the tape base material 1 at a slight edge.
このホットメルト接着剤４は常温で粘着性を有し且つ加
熱により溶融して接着性を発揮するものを用いる。常温
粘着性を有するホットメルト接着剤を用いることによシ
、マスキングテープを常温でブザーやＩＣチップ材等に
貼着でき、作業性が良好となる。常温粘着性は２０ ｆ
／１０ｆｆ幅以上とするのが好適である。The hot melt adhesive 4 used is one that is sticky at room temperature and melts when heated to exhibit adhesive properties. By using a hot-melt adhesive that is adhesive at room temperature, the masking tape can be attached to a buzzer, IC chip material, etc. at room temperature, resulting in good workability. Room temperature tack is 20 f
It is preferable to set the width to /10ff or more.
かような常温粘着性ホットメルト接着剤は、エチレン−
酢酸ビニル共重合体、エチレン−エチルアクリレート共
重合体、エチレン−プロピレンゴム等のポリマーに、ロ
ジン系樹脂（ロジン、ロジンエステル）、テルペン系樹
脂（テルペン、ロジンフェノール）、芳香族炭化水素樹
脂等の粘着付与剤を配合して得ることができる。粘着付
与剤の配合量はポリマーと粘着付与剤の合計量中に占る
割合が１５〜７５重量％となるよう設定する。粘着付与
剤が少な過ぎると常温粘着性に劣り、多過ぎるとテープ
が不要になった際の剥離時に加熱すると糸引き現象を生
じ剥離作業がし難くなる。Such cold-tack hot melt adhesives are ethylene-
In addition to polymers such as vinyl acetate copolymer, ethylene-ethyl acrylate copolymer, and ethylene-propylene rubber, rosin resin (rosin, rosin ester), terpene resin (terpene, rosin phenol), aromatic hydrocarbon resin, etc. It can be obtained by adding a tackifier. The amount of the tackifier is set so that the proportion of the polymer and tackifier in the total amount is 15 to 75% by weight. If the amount of tackifier is too small, the tackiness at room temperature will be poor, and if it is too large, stringing will occur if the tape is heated during peeling when it is no longer needed, making the peeling process difficult.
なお、第１図においてはホットメルト接着剤をテープ基
材の端縁部全周に設けたが、この接着剤の形成面積は広
くでき、例えばテープ基材の片面において、打抜き部具
外の全面に形成することもできる。In Fig. 1, the hot melt adhesive is applied all around the edge of the tape base material, but the adhesive can be formed over a wider area.For example, on one side of the tape base material, the entire surface outside the punched part It can also be formed into
第２図はマスキングテープの使用例を示し、ブザー等の
対象物品５の凹部６上にマスキングテープがホットメル
ト接着剤４によって仮着されている。この仮着状態で、
メツキ浴あるいは半田浴中に浸漬すると、ホットメルト
接着剤４は浴温により溶融して強固に対象物品に接着し
、マスキング機能を発揮し、メツキネ要部へのメツキ液
の浸入を阻止し、またマスキング部への半田の付着を阻
止する。また、凹部６において熱膨張した空気は、テー
プ基材１に設けられた多孔質部３から排出されるの・で
、空気の熱膨張力がマスキングテープに作用するような
ことがなく、空気の熱膨張力に起因するテープの不用意
な剥離は生じない。かくしてメツキ作業や半田作業は確
実に行なわれるのである０
マスキングテープはメツキ作業ヤ半田作業の終った後、
メツキ浴、半田浴から取り出した後、温かいうちならば
容易に引き剥すことができる。このマスキングテープは
多孔質部を有しているため、ブザーの発振音穴部をマス
キングしたような場合、メツキ作業、半田作業後に引き
剥さず、そのまま残置しても、ブザーの発振音レベルを
阻害するようなことがない。従って、このテープを該穴
部への雨水、チリ等の侵入に対する保護材として使用す
ることもできる。FIG. 2 shows an example of the use of masking tape, in which the masking tape is temporarily attached onto a recess 6 of a target article 5 such as a buzzer using a hot melt adhesive 4. In this temporary state,
When immersed in a plating bath or a solder bath, the hot melt adhesive 4 melts due to the bath temperature and firmly adheres to the object, exhibits a masking function, prevents the plating liquid from entering the main parts of the plating, and Prevents solder from adhering to the masking area. In addition, since the air thermally expanded in the recess 6 is discharged from the porous portion 3 provided in the tape base material 1, the thermal expansion force of the air does not act on the masking tape, and the air Inadvertent peeling of the tape due to thermal expansion forces does not occur. In this way, plating and soldering work can be done reliably.
After removing it from the plating bath or soldering bath, it can be easily peeled off while it is still warm. This masking tape has a porous part, so if you mask the buzzer's oscillation sound hole, you can leave it as it is without peeling it off after plating or soldering. There is no obstruction. Therefore, this tape can also be used as a protective material against rainwater, dust, etc. entering the hole.
本発明においては多孔質プラスチックフィルムをテープ
基材として用いることができる。第３図はその一例を示
し、長尺の多孔質プラスチックフィルムから成るテープ
基材１の片面にホットメルト接着剤４を設けるに際し、
所定間隔毎にホットメルト接着剤非形成部を設け、これ
を多孔質部３として利用したマスキングテープである。In the present invention, a porous plastic film can be used as the tape base material. FIG. 3 shows an example of this, in which hot melt adhesive 4 is provided on one side of tape base material 1 made of a long porous plastic film.
This is a masking tape in which hot-melt adhesive-free areas are provided at predetermined intervals and are used as porous areas 3.
この長尺マスキングテープは多孔質部間で切断して使用
することができる。This long masking tape can be used by cutting it between the porous parts.
（実施例）
以下、実施例により本発明を更に詳細に説明する０
実施例
厚さ５０μｍ、孔径３μｍ１気孔率９０％の長尺ＰＴＦ
Ｅ多孔質フィルムの片面に、厚さ５０μｍの常温粘着性
ホットメルト接着剤を塗布し、マスキングテープ（試料
１）を得た。(Example) Hereinafter, the present invention will be explained in more detail with reference to Examples.0 Example: Long PTF with thickness of 50 μm, pore diameter of 3 μm, and porosity of 90%.
E A 50 μm thick room temperature adhesive hot melt adhesive was applied to one side of the porous film to obtain a masking tape (sample 1).
ホットメルト接着剤としては、エチレン−プロピレンゴ
ム（融点８５ ’Ｃ） ７０重量部と粘着付与剤として
の芳香族炭化水素樹脂（三井石油化学工業社製、商品名
ベトロジン）３０重量部の混合物を用いた。As a hot melt adhesive, a mixture of 70 parts by weight of ethylene-propylene rubber (melting point 85'C) and 30 parts by weight of an aromatic hydrocarbon resin (manufactured by Mitsui Petrochemical Industries, Ltd., trade name Vetrozin) as a tackifier was used. there was.
ｔｉＰＴＦＥフィルムへのホットメルト接着剤の塗布に
際しては、直径３Ｈの接着剤非形成部を２０ｊＥｌ１間
隔で設け、これを多孔質部とした。従って、マスキング
テープの構造は第３図と同じである。When applying the hot melt adhesive to the tiPTFE film, adhesive-free areas with a diameter of 3H were provided at intervals of 20jEl1, and these were used as porous areas. Therefore, the structure of the masking tape is the same as that shown in FIG.
更に、これとは別にエチレン−プロピレンゴムと粘着付
与剤としての芳香族炭化水素樹脂との混合割合を第１表
のように設定する以外は試料１と同様にして５種類のマ
スキングテープ（試料２〜６）を得た。なお、第１表に
おいてはエチレンープロピレンゴムをＡと、芳香族炭化
水素樹脂ｔＢと表示する。Furthermore, apart from this, five types of masking tapes (Sample 2 ~6) was obtained. In Table 1, ethylene-propylene rubber is indicated as A and aromatic hydrocarbon resin tB.
これらマスキングテープの特性を下記要領で測定および
観察し、得られた結果をｗｃ１表に示す。The characteristics of these masking tapes were measured and observed in the manner described below, and the results are shown in Table wc1.
なお、エチレン−プロピレンゴム９０重量部に対し、芳
香族炭化水素樹脂１０重量部を配合すること以外は試料
１と同様にして得たマスキングテープ（試料７）、およ
び厚さ１００μｍのポリエチレンテレフタレートフィル
ムの片面に厚さ３０μｍの感圧性粘着剤層を設けた市販
マスキングテープ（試料８）のデータを比較例として示
す。In addition, a masking tape (Sample 7) obtained in the same manner as Sample 1 except that 10 parts by weight of aromatic hydrocarbon resin was blended with 90 parts by weight of ethylene-propylene rubber, and a polyethylene terephthalate film with a thickness of 100 μm. Data for a commercially available masking tape (Sample 8) having a 30 μm thick pressure sensitive adhesive layer on one side is shown as a comparative example.
ＪＪＳ Ｃ２１０７に準じてステンレス板にゴムロー
ルを用い荷重２ Ａｑで貼り付け、引張速度３００ｘｎ
ｘ ／ ｇ 、温度２５±２°Ｃの条件で１８０６ビー
リン出し、温かいうちにマスキングテープを引き剥し、
その作業性を判定した。In accordance with JJS C2107, apply a rubber roll to a stainless steel plate with a load of 2 Aq, and a tensile speed of 300xn.
x / g, temperature 25 ± 2 ° C, put out the 1806 beer line, peel off the masking tape while it is still warm,
The workability was evaluated.
第１表中の「Ｏ」は糸引きを生ずることなく容易に引き
剥しできたことを、「Δ」はやや糸引きを生じたことを
各々示している。In Table 1, "O" indicates that the strip could be easily peeled off without stringing, and "Δ" indicates that some stringing occurred.
第 １ 表
るのに用いたＰＴＦＥ多孔質フィルムの片面全面に各組
成のホットメルト接着剤を塗布したものを作成して用い
た。First, hot melt adhesives of various compositions were coated on one side of the porous PTFE film used in the first display.
マスキングテープを圧電ブザーの発振音穴部上に５００
ｆのロールを用いて仮着し、２７０“Ｃの半田浴中に２
０秒間浸漬して取り出し、テープの剥れの有無を目視に
より観察した。サンプル数を１０個とし、剥れの生じた
個数を示した。Place 500mm masking tape on the oscillation sound hole of the piezoelectric buzzer.
Temporarily attach it using a roll of f, and put it in a solder bath of 270"C.
The tape was immersed for 0 seconds and then taken out, and the presence or absence of peeling of the tape was visually observed. The number of samples was 10, and the number of samples with peeling is shown.
耐半田浴性試験と同様にしてマスキングテープを仮着し
た圧電ブザーを半田浴中に浸漬して取り更に、試料１に
ついて耐半田浴性試験終了後にマスキングテープを残置
したままの状態およびマスキングテープを引き剥した状
態で、発振音レベルを周波数０．３ＫＨｚで測定したと
ころ、いずれも１０９ｄＢであり、テープを残置しても
発振音レベルを阻害しない仁とが確認された。In the same manner as the solder bath resistance test, a piezoelectric buzzer with masking tape temporarily attached was immersed in a solder bath. When the oscillation sound level was measured at a frequency of 0.3 KHz with the tape removed, it was 109 dB, confirming that even if the tape remained, the oscillation sound level would not be affected.
（発明の効果）
本発明は上記のように構成されておシ、撥水性と通気部
を有する多孔質部を設けたので、熱膨張した空気を排出
でき、マスキング部からの剥離を生じ難いテープを提供
できるばかりでなく、接着剤として常温粘着性ホットメ
ルト接着剤を用いたので、対象物品への貼着も容易であ
る特徴を有する。(Effects of the Invention) The present invention is configured as described above, and since a porous part having water repellency and a ventilation part is provided, thermally expanded air can be discharged, and the tape is difficult to peel off from the masking part. In addition, since a hot-melt adhesive with room-temperature tackiness is used as the adhesive, it can be easily attached to the target article.
第１図は本発明に係るマスキングテープの実例を示す平
面図、第２図は第１図に示すテープの使用例を示す一部
切欠断面図、第３図は本発明の他の実例を示す一部切欠
背面図である。
１・・・テープ基材 ３・・・多孔質部４・・
・ホットメルト接着剤
／−−−テーフ゛羞本不
１２乙 −−−オ、づ／）２〉（）叶柑ノＪ３−一一ラ
几賀卸Fig. 1 is a plan view showing an example of the masking tape according to the present invention, Fig. 2 is a partially cutaway sectional view showing an example of the use of the tape shown in Fig. 1, and Fig. 3 is a plan view showing another example of the present invention. It is a partially cutaway rear view. 1...Tape base material 3...Porous part 4...
・Hot melt adhesive/---Tape 12 Otsu---O, Zu/) 2>() Kano Kanno J3-11 La Kaga Wholesale
Claims (1)
孔質部とされ、且つ該テープ基材の片面の少なくとも端
縁部に常温で粘着性を有するホットメルト接着剤が設け
られて成るマスキングテープ。A predetermined portion of the water-repellent tape base material is a porous portion having water repellency and air permeability, and at least an edge portion of one side of the tape base material is provided with a hot-melt adhesive that is sticky at room temperature. Masking tape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8102489A JPH02258879A (en) | 1989-03-30 | 1989-03-30 | Masking tape |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8102489A JPH02258879A (en) | 1989-03-30 | 1989-03-30 | Masking tape |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02258879A true JPH02258879A (en) | 1990-10-19 |
Family
ID=13734910
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8102489A Pending JPH02258879A (en) | 1989-03-30 | 1989-03-30 | Masking tape |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02258879A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0719701U (en) * | 1993-09-13 | 1995-04-07 | 東京メガネ製造株式会社 | Anti-fog seal |
| WO2003028972A1 (en) | 2001-09-28 | 2003-04-10 | Yamauchi Corporation | Cushioning material for hot pressing and process for producing the same |
| JP2009167271A (en) * | 2008-01-15 | 2009-07-30 | Nitto Denko Corp | Adhesive tape for masking and method for producing sputtering target |
| JP2013144804A (en) * | 2013-03-22 | 2013-07-25 | Nitto Denko Corp | Adhesive tape for masking |
| CN110938386A (en) * | 2018-09-25 | 2020-03-31 | 上海和辉光电有限公司 | Film packaging structure protective film and film removing method thereof |
| CN111572108A (en) * | 2020-06-19 | 2020-08-25 | 创斯(广州)科技发展有限公司 | Two-in-one material for attaching environment-friendly hot melt adhesive film of mask |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5711757B2 (en) * | 1976-11-16 | 1982-03-06 | ||
| JPS61248793A (en) * | 1985-04-26 | 1986-11-06 | Yoshino Kasei Kk | Preparation of masking film |
-
1989
- 1989-03-30 JP JP8102489A patent/JPH02258879A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5711757B2 (en) * | 1976-11-16 | 1982-03-06 | ||
| JPS61248793A (en) * | 1985-04-26 | 1986-11-06 | Yoshino Kasei Kk | Preparation of masking film |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0719701U (en) * | 1993-09-13 | 1995-04-07 | 東京メガネ製造株式会社 | Anti-fog seal |
| WO2003028972A1 (en) | 2001-09-28 | 2003-04-10 | Yamauchi Corporation | Cushioning material for hot pressing and process for producing the same |
| JP2009167271A (en) * | 2008-01-15 | 2009-07-30 | Nitto Denko Corp | Adhesive tape for masking and method for producing sputtering target |
| JP2013144804A (en) * | 2013-03-22 | 2013-07-25 | Nitto Denko Corp | Adhesive tape for masking |
| CN110938386A (en) * | 2018-09-25 | 2020-03-31 | 上海和辉光电有限公司 | Film packaging structure protective film and film removing method thereof |
| CN111572108A (en) * | 2020-06-19 | 2020-08-25 | 创斯(广州)科技发展有限公司 | Two-in-one material for attaching environment-friendly hot melt adhesive film of mask |
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