JPH02249905A - Peak position detecting method - Google Patents
Peak position detecting methodInfo
- Publication number
- JPH02249905A JPH02249905A JP7061289A JP7061289A JPH02249905A JP H02249905 A JPH02249905 A JP H02249905A JP 7061289 A JP7061289 A JP 7061289A JP 7061289 A JP7061289 A JP 7061289A JP H02249905 A JPH02249905 A JP H02249905A
- Authority
- JP
- Japan
- Prior art keywords
- image
- shape
- inspected
- peak position
- slit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims description 5
- 230000003287 optical effect Effects 0.000 claims abstract description 8
- 239000004065 semiconductor Substances 0.000 abstract description 10
- 238000003384 imaging method Methods 0.000 description 8
- 238000001514 detection method Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 210000003127 knee Anatomy 0.000 description 1
Landscapes
- Length Measuring Devices By Optical Means (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、３次元形状の検出方法に関し、特に形状ピー
ク位置の検出方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a method for detecting a three-dimensional shape, and particularly to a method for detecting a shape peak position.
従来の装置は、特開昭６１−０９７５０５号公報に記載
のように、１組の光切断検出器から成る検出ヘッドを一
方向に移動走査することにより。A conventional device, as described in Japanese Patent Application Laid-Open No. 61-097505, uses a detection head consisting of a set of light-cutting detectors to move and scan in one direction.
対象物上の照明光のスポットを走査して、スポットの走
査ラインに゛沿っての形状を測定するようになっていた
。The spot of illumination light on the object was scanned and the shape of the spot along the scanning line was measured.
（発明が解決しようとする課題〕
上記従来技術は、被検査物の形状ピーク位置の検出につ
いて配慮されておらず、被検査物の形状ピーク位置を検
出するためには、スポット光を２次元的に走査して形状
を検出する必要があり、多大な検出時間を必要とする問
題があった。(Problems to be Solved by the Invention) The above-mentioned conventional technology does not take into consideration the detection of the shape peak position of the object to be inspected, and in order to detect the shape peak position of the object to be inspected, it is necessary to There was a problem in that it required a large amount of detection time to detect the shape.
本発明は、形状ピーク位置を短時間に検出することを目
的としている。The present invention aims to detect shape peak positions in a short time.
上記目的を達成するために、２組のスリット光を用いた
光切断検出器を直交させることにより、２次元方向のピ
ーク位置の検出を同時に行うようにしたものである。In order to achieve the above object, two sets of light cutting detectors using slit light are arranged orthogonally to each other, so that peak positions in two-dimensional directions can be detected simultaneously.
スリット光を用いた光切断検出器を直交させることによ
り、各々の検出器はスリット光の直交点を中心として直
交方向の高さ形状を同時に検出することができる。従っ
て、互いにスリット光の位置を検出した光切断形状上形
状のピーク位置になるように、スリット光の位置あるい
は被検査物の位置を移動させることで、形状のピーク位
置を検出することができる。By arranging the light-cutting detectors using slit lights orthogonally, each detector can simultaneously detect the height shape in the orthogonal directions centered on the orthogonal point of the slit lights. Therefore, the peak position of the shape can be detected by moving the position of the slit light or the position of the object to be inspected so that the position of the slit light becomes the peak position of the shape on the light-cut shape where the positions of the slit lights are detected.
以下、本発明の一実施例について図面を用いて説明する
。An embodiment of the present invention will be described below with reference to the drawings.
第１図は、実施例の構成を示すものである。被検査物１
は山形形状をもつ物体である。光学系は、互いに光軸上
、被検査物１の表面で直交する２つの光切断検出光学系
Ａ、Ｂから成る。Ａ系の半導体レーザ２から発行された
光は、集光レンズ３でスリット状にスリット４に集光さ
れ、さらに結像レンズ５で被検査物１の表面にスリット
形状の像を結像する。その像を撮像カメラ６で取り込み
、処理装置１０に画像Ａデータとして送る。同様にＢ系
の撮像カメラ１６から画像Ａと直交する画像Ｂデータが
処理装置１０に送られる。FIG. 1 shows the configuration of an embodiment. Inspection object 1
is an object with a chevron shape. The optical system consists of two light cutting detection optical systems A and B that are perpendicular to each other on the optical axis and on the surface of the object 1 to be inspected. The light emitted from the A-system semiconductor laser 2 is condensed into a slit-shaped slit 4 by a condensing lens 3, and further formed into a slit-shaped image on the surface of the object to be inspected 1 by an imaging lens 5. The image is captured by the imaging camera 6 and sent to the processing device 10 as image A data. Similarly, image B data orthogonal to image A is sent from the B-system imaging camera 16 to the processing device 10.
第２図に画像Ａの検出例、第３図に画像Ｂ、の検出例を
示す。FIG. 2 shows an example of detection of image A, and FIG. 3 shows an example of detection of image B.
第２図中点線で示した縦のスリット像は、半導体レーザ
２を消灯させ、半導体レーザ１２を点灯した時の像で直
交するスリット像の位置を示す６一方、実線で示した横
方向のスリット像は、半導体レーザ２を点灯し、半導体
レーザ１２を消灯した時の像で、被検査物１の光切断像
を示す。光切断像上、高さを示すＺが最大となるＹｌと
、直光スリット像位置Ｙ。との差ｄｙより、Ｙ方向の形
状ピーク位置と現検出位置とのずれｄｙがわかる。同様
に、第３図の画像Ｂのｄχより、Ｘ方向の形状ピーク位
置と現検出位置とのずれｄχがわかる。The vertical slit image shown by the dotted line in FIG. 2 is an image obtained when the semiconductor laser 2 is turned off and the semiconductor laser 12 is turned on, and shows the position of the orthogonal slit image6. On the other hand, the horizontal slit image shown by the solid line The image is an image obtained when the semiconductor laser 2 is turned on and the semiconductor laser 12 is turned off, and shows a light section image of the object to be inspected 1. On the optically sectioned image, Yl where Z indicating the height is maximum and the direct light slit image position Y. The deviation dy between the shape peak position and the current detected position in the Y direction can be determined from the difference dy between the shape peak position and the current detection position. Similarly, the deviation dχ between the shape peak position and the current detected position in the X direction can be seen from dχ in image B in FIG.
第１図中で、処理装置１０は被検査物１の所定領域の形
状ピーク位置を求める為、検出位置が所定領域となるよ
うに、ステージＸ２１．ステージＹ２２を移動させる。In FIG. 1, in order to determine the shape peak position of a predetermined region of the object to be inspected 1, the processing device 10 moves the stage X21. Move stage Y22.
次に半導体レーザ２のみ点灯し、撮像カメラ６および撮
像カメラ１６の画像を取り込む、次に、半導体レーザ２
を消灯させ、半導体レーザ１２のみを点灯し、撮像カメ
ラ６および撮像カメラ１６の画像を取り込む。Next, only the semiconductor laser 2 is turned on, and images from the imaging camera 6 and the imaging camera 16 are captured.
is turned off, only the semiconductor laser 12 is turned on, and images from the imaging camera 6 and the imaging camera 16 are captured.
第４図に、各々取り込んだ画像例を示す。画像Ａｌ、Ｂ
ｌは半導体レーザ２のみ点灯した像であり、画像Ａ２．
Ｂ２は半導体レーザ２のみ点灯した像である。FIG. 4 shows examples of each captured image. Images Al, B
1 is an image in which only the semiconductor laser 2 is lit, and image A2.
B2 is an image in which only the semiconductor laser 2 is lit.
次に、画像Ａ１よりＺ方向の光切断線の最大値をＹの値
を走査して、画像上のピーク位置座標（Ｙ□、Ｚ□）を
求める。次に、画像Ａ２よりＹ方向の光切断線の平均値
を、Ｚの値を走査して画像上のＹ方向の検出位置Ｙ。を
求める。次にｄｙ＝ＹニーＹ０よりｄｙを算出する。同
様に、画像Ｂ２．Ｂ１よりｄχを算出する。ｄχ、ｄｙ
を算出した後、ステージＸ２１およびステージＹ２２に
対して、実寸法換算した移動指令を処理装置１０から発
行し、被検査物１のＸＹ位置を移動させ、再び上記動作
を繰り返してさらにｄχ＋ ｄｙを求める。通常、この
時点でｄχ＋ ｄｙの大きさは許容値内になる等である
が、許容値以上の場合は再び同じ動作をくり返す。Next, the maximum value of the light section line in the Z direction is scanned for the Y value from the image A1 to obtain the peak position coordinates (Y□, Z□) on the image. Next, from the image A2, the average value of the light section line in the Y direction and the Z value are scanned to determine the detected position Y in the Y direction on the image. seek. Next, dy is calculated from dy=Y knee Y0. Similarly, image B2. Calculate dχ from B1. dχ, dy
After calculating, the processing device 10 issues a movement command converted to the actual size to the stage . Normally, at this point, the magnitude of dχ+dy is within a tolerance value, etc., but if it is greater than the tolerance value, the same operation is repeated again.
ｄχ 、ｄｙがほぼ０になる時のＸ、Ｙ座標及び検出し
た光切断像ピーク位置ｚ４が被検査物１の形状ピーク位
置として検出することができる。The X and Y coordinates and the detected light section image peak position z4 when dχ and dy become approximately 0 can be detected as the shape peak position of the inspected object 1.
本発明によれば、被検査物の形状ピーク位置を２次元方
向に検出できるので、短時間に形状ピーク位置を検出す
ることができる。According to the present invention, since the shape peak position of the object to be inspected can be detected in two-dimensional directions, the shape peak position can be detected in a short time.
また、本発明により、コントラストの良い位置決めマー
クを作れないセラミック材料等の被検査物に対して、表
面の形状を利用した位置決め方法を提供することができ
る。Further, according to the present invention, it is possible to provide a positioning method using the surface shape of an object to be inspected, such as a ceramic material, on which a positioning mark with good contrast cannot be made.
第１図は、本発明の一実施例の全体示す構成図、第２図
、第３図および第４図は、検出画像例を示す図である。
１・・・被検査物。
４．１４・・・スリット、
６．１６・・・撮像カメラ。
１０・・・処理装置。
晃２０
第５目
第４目FIG. 1 is an overall configuration diagram of an embodiment of the present invention, and FIGS. 2, 3, and 4 are diagrams showing examples of detected images. 1...Object to be inspected. 4.14...Slit, 6.16...Imaging camera. 10... Processing device. Ko 20 5th item 4th item
Claims (1)
形状検出器を光軸上互いに直交させることにより被検査
物の立体形状のピーク位置を検出する方法。1. A method of detecting the peak position of the three-dimensional shape of the object to be inspected by arranging two sets of light-cutting shape detectors, each consisting of a slit-shaped light source and a photodetector, orthogonal to each other on the optical axis.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7061289A JPH02249905A (en) | 1989-03-24 | 1989-03-24 | Peak position detecting method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7061289A JPH02249905A (en) | 1989-03-24 | 1989-03-24 | Peak position detecting method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02249905A true JPH02249905A (en) | 1990-10-05 |
Family
ID=13436593
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7061289A Pending JPH02249905A (en) | 1989-03-24 | 1989-03-24 | Peak position detecting method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02249905A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07141689A (en) * | 1993-11-15 | 1995-06-02 | Nec Corp | Method of setting transmission hole for laser spot and optical head device using it |
| JP2014119361A (en) * | 2012-12-18 | 2014-06-30 | Mitsubishi Electric Corp | Surface defect detection device and surface defect detection method |
-
1989
- 1989-03-24 JP JP7061289A patent/JPH02249905A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07141689A (en) * | 1993-11-15 | 1995-06-02 | Nec Corp | Method of setting transmission hole for laser spot and optical head device using it |
| JP2014119361A (en) * | 2012-12-18 | 2014-06-30 | Mitsubishi Electric Corp | Surface defect detection device and surface defect detection method |
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