JPH02239697A - Manufacture of circuit board - Google Patents
Manufacture of circuit boardInfo
- Publication number
- JPH02239697A JPH02239697A JP1060199A JP6019989A JPH02239697A JP H02239697 A JPH02239697 A JP H02239697A JP 1060199 A JP1060199 A JP 1060199A JP 6019989 A JP6019989 A JP 6019989A JP H02239697 A JPH02239697 A JP H02239697A
- Authority
- JP
- Japan
- Prior art keywords
- ceramic green
- sheet
- capacitor
- electrodes
- green sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 15
- 239000000919 ceramic Substances 0.000 claims abstract description 39
- 239000003990 capacitor Substances 0.000 claims abstract description 36
- 238000010304 firing Methods 0.000 claims abstract description 12
- 238000001035 drying Methods 0.000 claims abstract description 8
- 239000000758 substrate Substances 0.000 claims abstract description 6
- 238000010030 laminating Methods 0.000 claims abstract description 5
- 238000000034 method Methods 0.000 claims description 20
- 238000004806 packaging method and process Methods 0.000 abstract 1
- 239000003989 dielectric material Substances 0.000 description 8
- 239000000463 material Substances 0.000 description 6
- 238000004080 punching Methods 0.000 description 4
- 239000011230 binding agent Substances 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 239000005388 borosilicate glass Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000002002 slurry Substances 0.000 description 2
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 1
- 239000004327 boric acid Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000002241 glass-ceramic Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野］
本発明は，回路基板の製造方法に関し、特にコンデンサ
を内蔵したセラミック回路基板をセラミックグリーンシ
ートより製造する回路基板の製造方法に関するものであ
る．
［従来の技術１
従来、コンデンサを内蔵するセラミック回路基板を同時
焼成によって製造するには、第９図に示すように，電極
２ｌを印刷した一対のセラミックグリーンシート２２．
２３間にセラミックグリーンシートと同じ大きさの誘電
体シ一ト２４を挟んで積層した後、その積層体を一体焼
成する方法がある．
また，第ＩＯ図に示すように，電極２Ｉを印刷したセラ
ミックグリーンシート２３に誘電体層２５、２６を電極
より少し大きめの大きさで複数個印刷し，その上に、電
極層２ｌを印刷したセラミックグリーンシート２２を積
層し、一体焼成する方法がある．
［発明が解決しようとする問題点】
しかしながら、前者の方法では、回路基板の上面の回路
と下面の回路とが誘電体を挟んで交わる部分に浮遊容量
が生じ易い．
また，後者の方法では、積層して一体焼成した回路基板
２７には、第１１図に示すように、誘電体２５と隣の誘
電体２６との間に位置する回路基板２７の表面に凹み２
８が生じたり，第１２図に示すように、誘電体２５と隣
の誘電体２６との間にボイド２９が生じ、そのため誘電
体自身または電極２ｌの一部が剥離する現象が生じる欠
点があった。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a method for manufacturing a circuit board, and more particularly to a method for manufacturing a circuit board in which a ceramic circuit board with a built-in capacitor is manufactured from a ceramic green sheet. [Prior Art 1] Conventionally, in order to manufacture a ceramic circuit board with a built-in capacitor by simultaneous firing, a pair of ceramic green sheets 22.
There is a method in which a dielectric sheet 24 of the same size as the ceramic green sheet is sandwiched between the ceramic green sheets 23, and then the laminate is integrally fired. In addition, as shown in Figure IO, a plurality of dielectric layers 25 and 26 were printed on the ceramic green sheet 23 on which the electrodes 2I were printed, each having a slightly larger size than the electrodes, and an electrode layer 2L was printed on top of them. There is a method of laminating ceramic green sheets 22 and firing them together. [Problems to be Solved by the Invention] However, in the former method, stray capacitance is likely to occur at the portion where the circuit on the top surface of the circuit board and the circuit on the bottom surface intersect with a dielectric material in between. In addition, in the latter method, the circuit board 27 that is laminated and integrally fired has a recess 2 on the surface of the circuit board 27 located between the dielectric 25 and the adjacent dielectric 26, as shown in FIG.
As shown in FIG. 12, a void 29 is formed between the dielectric 25 and the adjacent dielectric 26, and as a result, the dielectric itself or a part of the electrode 2l peels off. Ta.
Ｅ問題点を解決するための手段１
本発明者等は、セラミックグリーンシートの一部をコン
デンサが形成する大きさに打抜き，その打抜き部分に誘
電体ペーストを充填すれば、上記のような欠点が排除で
きるとの知見を得て．本発明を完成させた．
すなわち，本発明の要旨は，コンデンサを内蔵する回路
基板の製造方法において、セラミックグリーンシートの
一部をコンデンサの形成される大きさに打抜き，該打抜
き部に誘電体ペーストを充填し、その両面に電極印刷さ
れたセラミックグリーンシートを積層して一体焼成して
コンデンサを形成させることを特徴とする回路基板の製
造方法にある．
本発明において，打抜かれたグリーンシ一トに誘電体ペ
ーストを充填して電極を取り付け、コンデンサ内蔵基板
を裂造するには各種の方法が可能である．すなわち、
（ａｌ セラミックグリーンシートの一部をコンデンサ
の形成される大きさに切抜いた後剥離フィルム上に置き
、打抜き部分に誘電体ペーストを充填し、乾燥した後こ
のシートを剥離フィルムから剥し，このシートとは別に
予め電極を印刷しスルーホール印刷した一対のセラミッ
クグリーンシートの間に前記誘電体を充填したシートを
配置して積層熱圧着し，一体焼成してコンデンサを形成
させる方法．
（ｂｌ電極を印刷しスルホール印刷したセラミックグリ
ーンシートの上に、一部をコンデンサが形成する大きさ
に打抜いたセラミフクグリーンシ一トを載せて積層圧着
し，この積層したシートの打抜き部分に誘電体ペースト
を充填し、乾燥した後，この積層したシートとは別に、
予め電極を印刷しスルホール印刷したセラミックグリー
ンシートをこの積層したシートに乗せて再度積層熱圧着
し，一体焼成してコンデンサを形成さる方法。Means for Solving Problem E 1 The inventors of the present invention have found that by punching out a portion of a ceramic green sheet to a size that will form a capacitor and filling the punched portion with dielectric paste, the above drawbacks can be overcome. I learned that it can be eliminated. The invention has been completed. That is, the gist of the present invention is to provide a method for manufacturing a circuit board incorporating a capacitor, in which a part of a ceramic green sheet is punched out to a size in which a capacitor is formed, the punched part is filled with dielectric paste, and both sides of the ceramic green sheet are punched out. A method of manufacturing a circuit board is characterized by laminating ceramic green sheets with printed electrodes and firing them together to form a capacitor. In the present invention, various methods can be used to fill a punched green sheet with dielectric paste and attach electrodes to fabricate a board with a built-in capacitor. That is, (al) Cut out a part of a ceramic green sheet to the size that will form a capacitor, place it on a release film, fill the punched part with dielectric paste, and after drying, peel off this sheet from the release film and place it on a release film. A method in which a sheet filled with the dielectric material is placed between a pair of ceramic green sheets on which electrodes are printed in advance and through holes are printed separately from the sheet, the sheets are laminated and thermocompressed, and the capacitor is formed by integral firing. (bl electrode A ceramic green sheet that has been partially punched out to a size that will form a capacitor is placed on top of the ceramic green sheet that has been printed with through-holes, and is laminated and pressure-bonded, and a dielectric paste is applied to the punched part of the laminated sheet. After filling and drying, apart from this laminated sheet,
A method in which a ceramic green sheet with electrodes printed in advance and through-hole printing is placed on this laminated sheet, laminated and thermocompressed again, and then integrally fired to form a capacitor.
（Ｃ）セラミックグリーンシートの一部をコンデンサが
形成する大きさに打抜き，このシートを剥離フィルム上
に置き、打抜き部分に誘電体ベストを充填し、乾燥した
後，このシートの上面と下面に電極を印刷し，焼成して
、コンデンサを形成させる方法
などがある。(C) A part of the ceramic green sheet is punched out to a size that will form a capacitor, this sheet is placed on a release film, the punched part is filled with dielectric vest, and after drying, electrodes are placed on the top and bottom surfaces of this sheet. There are methods such as printing and firing to form a capacitor.
本発明でグリーンシ一ト材料に用いられるセラミックと
しては、グリーンシ一ト多層積層法に用いられるもので
あれば任意のものが使用できるが、回路基板の焼成に際
して導体材料の選択幅があり、微細配線が可能な点から
焼成温度が８００〜ｔｏｏｏ℃の低温境結セラミックス
基板に用いられるものが好ましい．このような基板材１
４としては，例えばホウ珪酸ガラス等を含有するガラス
セラミックス系、アルミナにホウ珪酸ガラスを混合した
複合系セラミックス等がある．
誘電体としては特に限定はないが、グリーンシ一トのセ
ラミックスと焼成温度を合わせたものが用いられ、好ま
しくは基板と同様８００〜ｔｏｏｏ℃で焼成できる低温
境結タイブの誘電体が用いられる．
［実施例］
以下、本発明を実施例によって具体的に説明する．
なお、以下の実施例において、セラミックグリーンシー
トはアルミナとホウ酸ガラスを５０：５０（重量比）で
混ぜた粉末にバインダと溶剤を加えてスラリーとし、塗
工して作製した．
誘電体ペーストは，ＰｂｌＭｇ＋／ｓＮｂ＊ｚｓＪＯｓ
−ＰｂＴｉ０３−ＰｂＯ粉宋にビヒクルを加えて作製し
た．電極はＡｇ−Ｐｄｌｌ５％》粉末にビヒクルを加え
たぺ−ストを用いた．
実施例ｌ
第１図〜第４図は本発明の回路基板の製造方法の実施例
における工程を示す６
第１図（２）で、誘電体層を形成する厚さ０．３ｍＩ１
のセラミックグリーンシートｌの必要箇所にスルーホー
ル３を穿孔し，誘電体を充填する部分２を打抜いた．次
いでスルーホール３に導電体ぺ一ストを充填した後乾燥
した．
第２図で，乾燥されたグリーンシ一ト１を弗素樹脂から
なる剥離フイルム７上に置き，打抜きスペース２に誘電
体８のペーストを充填し、その状態で乾燥した後剥離フ
ィルムをはがした。As the ceramic used for the green sheet material in the present invention, any ceramic can be used as long as it is used in the green sheet multilayer lamination method, but there is a wide selection of conductor materials when firing the circuit board. A material used for low-temperature bonded ceramic substrates with a firing temperature of 800 to too much degree Celsius is preferable because fine wiring can be formed. Such a substrate material 1
Examples of 4 include glass-ceramics containing borosilicate glass, composite ceramics containing alumina and borosilicate glass, and the like. The dielectric material is not particularly limited, but a material with a firing temperature matching that of green sheet ceramics is used, and preferably a low-temperature bonding type dielectric material that can be fired at 800 to 800° C. like the substrate is used. [Examples] Hereinafter, the present invention will be specifically explained using examples. In the following examples, ceramic green sheets were prepared by adding a binder and a solvent to a powder mixture of alumina and boric acid glass at a ratio of 50:50 (weight ratio) to form a slurry, and coating the slurry. The dielectric paste is PblMg+/sNb*zsJOs
-PbTi03-PbO powder was prepared by adding vehicle. The electrode used was a paste made by adding a vehicle to Ag-Pdll 5% powder. Example 1 Figures 1 to 4 show steps in an example of the method for manufacturing a circuit board of the present invention 6 In Figure 1 (2), the thickness of the dielectric layer is 0.3 mI1.
Through-holes 3 were punched at the required locations in the ceramic green sheet 1, and portions 2 to be filled with dielectric material were punched out. Next, through holes 3 were filled with conductive paste and dried. In Fig. 2, a dried green sheet 1 was placed on a release film 7 made of fluororesin, a paste of a dielectric material 8 was filled in the punching space 2, and after drying in that state, the release film was peeled off. .
一方第１図（トｌ）に示すように，グリーンシ一トｌと
同材料を用いて形成した絶縁用の厚さ０．５一一のグリ
ーンシ一ト４に，必要な電極５及びスルーホール６を印
刷したものを、第ｌ図Ｔ１−２１に示すように，必要な
電極印刷を施した絶縁用のグリーンシ一ト９と共に、第
３図に示すようにそれぞれの電極面を誘電体に向けて、
誘電体層シ一ト１の両面に積層し、熱圧着した．
この積層体を脱バインダした後、８５０℃で１０分間一
体焼成し，第４図に示すコンデンサ内蔵回路基板を得た
．
実施例２
実施例１において、打ち抜きされた誘電体層グリーンシ
一トを剥離フィルム上に載せる代わりに、第５図に示す
ように電極印刷された絶縁層グＪ−ンシ一ト９の上に載
せ，打抜きスペース２に誘電体８を充填し、その上に電
極印刷された絶縁層グリーンシ一ト４を積層、熱圧着し
．以下同様に脱バインダし、８５０℃でｌＯ分間焼成を
行ないコンデンサ内蔵回路基板を得た。On the other hand, as shown in Fig. 1 (Tl), a green sheet 4 for insulation with a thickness of 0.5 mm is formed using the same material as green sheet 1, and the necessary electrodes 5 and through As shown in Figure T1-21, the holes 6 are printed, together with an insulating green sheet 9 on which the necessary electrodes are printed, and each electrode surface is covered with a dielectric material as shown in Figure 3. Towards
The dielectric layer was laminated on both sides of sheet 1 and bonded by thermocompression. After removing the binder from this laminate, it was integrally fired at 850°C for 10 minutes to obtain a circuit board with a built-in capacitor as shown in Fig. 4. Example 2 In Example 1, instead of placing the punched dielectric layer green sheet on the release film, it was placed on the insulating layer green sheet 9 on which the electrodes were printed, as shown in FIG. The punching space 2 is filled with a dielectric material 8, and an insulating layer green sheet 4 on which electrodes are printed is laminated and thermocompression bonded. Thereafter, the binder was removed in the same manner, and baking was performed at 850° C. for 10 minutes to obtain a circuit board with a built-in capacitor.
実施例３
実施例１で剥離フィルム上で誘電体を充填した後乾燥し
た誘電体層グリーンシ一トを用いて、その両面に電極印
刷し、第６図に示す電極付誘電体層を得、この両面に絶
縁層グリーンシ一トを積層し、８５０℃で１０分間焼成
してコンデンサ内蔵回路基板を得た．
このようにして作成したコンデンサを内蔵した回路基板
は、基板表面の凹凸はなく，誘電体層と電極間および誘
電体層と絶縁体層間の剥離は生じなかった．
以上の各実施例の方法を応用することにより、第７図に
示すような積層コンデンサや第８図に示すような多層コ
ンデンサを内蔵した多層回路基板を容易に製造できる．
［発明の効果］
本発明によると多数のコンデンサを基板内部に安定して
形成できるため，表面実装面積が広くとれ、実装密度が
向上する．Example 3 Using the dielectric layer green sheet filled with dielectric on a release film in Example 1 and dried, electrodes were printed on both sides to obtain a dielectric layer with electrodes as shown in FIG. Insulating green sheets were laminated on both sides of this and baked at 850°C for 10 minutes to obtain a circuit board with a built-in capacitor. The circuit board with built-in capacitors created in this way had no irregularities on the board surface, and no peeling occurred between the dielectric layer and the electrodes or between the dielectric layer and the insulator layer. By applying the methods of each of the above embodiments, it is possible to easily manufacture a multilayer circuit board incorporating a multilayer capacitor as shown in FIG. 7 or a multilayer capacitor as shown in FIG. [Effects of the Invention] According to the present invention, a large number of capacitors can be stably formed inside the board, so the surface mounting area can be increased and the mounting density can be improved.
第１図〜第４図は本発明の実施例のコンデンサ内蔵回路
基板の製造工程の説明図で，第５図及び第６図はそれぞ
れ他の方法の説明図である．第７図及び第８図は本発明
によって製造される多層のコンデンサを内蔵する回路基
板の断面図である．第９図〜第ｌＯ図は従来の製造法を
説明する断面図で、第１１図及び第１２図は従来法によ
り得られた基板の断面図である．
ｌ：誘電体層グリーンシ一ト
２：打抜きスペース
３．
：スルーホール
４．
：絶縁層グリーンシ一ト
：電極
：剥離シート
：誘電体
二回路基板1 to 4 are explanatory diagrams of the manufacturing process of a circuit board with a built-in capacitor according to an embodiment of the present invention, and FIGS. 5 and 6 are explanatory diagrams of other methods, respectively. 7 and 8 are cross-sectional views of a circuit board incorporating a multilayer capacitor manufactured according to the present invention. FIGS. 9 to 10 are cross-sectional views for explaining the conventional manufacturing method, and FIGS. 11 and 12 are cross-sectional views of a substrate obtained by the conventional method. l: Dielectric layer green sheet 2: Punching space 3. :Through hole 4. : Insulating layer green sheet : Electrode : Peeling sheet : Dielectric dual circuit board
Claims (4)
て、セラミックグリーンシートの一部をコンデンサの形
成される大きさに打抜き、該打抜き部に誘電体ペースト
を充填し、その両面に電極印刷されたセラミックグリー
ンシートを積層して一体焼成してコンデンサを形成させ
ることを特徴とする回路基板の製造方法。(1) In a method for manufacturing a circuit board with a built-in capacitor, a part of a ceramic green sheet is punched out to a size in which a capacitor is formed, the punched part is filled with dielectric paste, and electrodes are printed on both sides of the ceramic green sheet. A method for manufacturing a circuit board, characterized by laminating green sheets and integrally firing them to form a capacitor.
形成される大きさに切抜いた後剥離フィルム上に置き、
打抜き部分に誘電体ペーストを充填し、乾燥した後この
シートを剥離フィルムから剥し、このシートとは別に予
め電極を印刷しスルーホール印刷した一対のセラミック
グリーンシートの間に前記誘電体を充填したシートを配
置して積層熱圧着し、一体焼成してコンデンサを形成さ
せることを特徴とする回路基板の製造方法。(2) Cut out a part of the ceramic green sheet to a size that will form a capacitor, and then place it on a release film.
The punched part is filled with a dielectric paste, and after drying, this sheet is peeled off from the release film, and the dielectric is filled between a pair of ceramic green sheets on which electrodes are printed in advance and through holes are printed separately from this sheet. 1. A method for manufacturing a circuit board, characterized by arranging, laminating, thermocompression bonding, and integrally firing to form a capacitor.
グリーンシートの上に、一部をコンデンサの形成される
大きさに打抜いたセラミックグリーンシートを載せて積
層圧着し、この積層シートの打抜き部に誘電体ペースト
を充填し、乾燥した後、このシートとは別に予め電極を
印刷しスルーホール印刷したセラミックグリーンシート
をこの積層シートに載せて再度積層熱圧着し、一体焼成
してコンデンサを形成させることを特徴とする回路基板
の製造方法。(3) On top of the ceramic green sheet on which electrodes and through-holes have been printed, a ceramic green sheet with a part punched out to the size where a capacitor will be formed is placed and laminated and pressure-bonded, and the punched part of this laminated sheet is After filling with dielectric paste and drying, a ceramic green sheet with electrodes printed in advance and through-holes printed separately from this sheet is placed on this laminated sheet, laminated and thermocompressed again, and integrally fired to form a capacitor. A method for manufacturing a circuit board characterized by:
形成される大きさに打抜き、このシートを剥離フィルム
上に置き、打抜き部に誘電体ペーストを充填し、乾燥し
た後、このシートの上面と下面とに電極を印刷し、焼成
してコンデンサを形成させることを特徴とする回路基板
の製造方法。(4) Punch out a part of the ceramic green sheet to a size that will form a capacitor, place this sheet on a release film, fill the punched part with dielectric paste, and after drying, the top and bottom surfaces of this sheet A method for manufacturing a circuit board, which comprises printing electrodes on a substrate and firing the electrodes to form a capacitor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1060199A JPH02239697A (en) | 1989-03-13 | 1989-03-13 | Manufacture of circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1060199A JPH02239697A (en) | 1989-03-13 | 1989-03-13 | Manufacture of circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02239697A true JPH02239697A (en) | 1990-09-21 |
Family
ID=13135246
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1060199A Pending JPH02239697A (en) | 1989-03-13 | 1989-03-13 | Manufacture of circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02239697A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04299889A (en) * | 1990-12-17 | 1992-10-23 | Hughes Aircraft Co | Capacitor structure |
| JPH04313297A (en) * | 1990-12-17 | 1992-11-05 | Hughes Aircraft Co | Three-dimensional structure / substrate through multilayer resistance |
| US7243424B2 (en) | 2004-02-27 | 2007-07-17 | Tdk Corporation | Production method for a multilayer ceramic substrate |
-
1989
- 1989-03-13 JP JP1060199A patent/JPH02239697A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04299889A (en) * | 1990-12-17 | 1992-10-23 | Hughes Aircraft Co | Capacitor structure |
| JPH04313297A (en) * | 1990-12-17 | 1992-11-05 | Hughes Aircraft Co | Three-dimensional structure / substrate through multilayer resistance |
| US7243424B2 (en) | 2004-02-27 | 2007-07-17 | Tdk Corporation | Production method for a multilayer ceramic substrate |
| EP1581035A3 (en) * | 2004-02-27 | 2007-08-15 | TDK Corporation | Multilayer ceramic substrate and its production method |
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