JPH0223540A - Optical pickup - Google Patents

Optical pickup

Info

Publication number
JPH0223540A
JPH0223540A JP63173350A JP17335088A JPH0223540A JP H0223540 A JPH0223540 A JP H0223540A JP 63173350 A JP63173350 A JP 63173350A JP 17335088 A JP17335088 A JP 17335088A JP H0223540 A JPH0223540 A JP H0223540A
Authority
JP
Japan
Prior art keywords
hole
terminals
printed circuit
circuit board
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP63173350A
Other languages
Japanese (ja)
Other versions
JP2638953B2 (en
Inventor
Hiroyuki Nakamura
裕行 中村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP63173350A priority Critical patent/JP2638953B2/en
Publication of JPH0223540A publication Critical patent/JPH0223540A/en
Application granted granted Critical
Publication of JP2638953B2 publication Critical patent/JP2638953B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means

Landscapes

  • Optical Head (AREA)

Abstract

PURPOSE:To automatically insert terminals of a semiconductor laser into a print substrate for a pickup by composing the print substrate out of a flexible print substrate which is lined with a reinforcement plate and making a hole part of the flexible substrate smaller than a hole part of the reinforcement plate or connecting three holes of the flexible substrate with slits. CONSTITUTION:A signal is recorded on a disk or a signal regenerated from the disk by the semiconductor laser 1, whereas the terminals 2a-2c from this laser 1 are electrically connected by the flexible print substrate 5 lined with the reinforcement plate 3. The hole 4 of the reinforcement plate 3 for inserting these terminals 2a-2c of the laser 1 and the hole 6 of the substrate 5 are constituted of one hole, where the hole 6 of the substrate 5 is made smaller than the hole 4 of the reinforcement plate 3 and abutted against the individual terminals 2a-2c of the laser 1 more than half a circumference respectively. Alternatively, individual holes 7a, 7b and 7c for soldering the terminals of the substrate 5 are connected by the slits 8a-8c, and hence the automatic insertion of the terminals 2a-2c is feasible.

Description

【発明の詳細な説明】 産業上の利用分野 本発明はディスクに光スポットを投影させて、光学的に
記録、再生を行なう光ピックアップに関するものである
。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to an optical pickup that performs optical recording and reproduction by projecting a light spot onto a disk.

従来の技術 光ピックアップの半導体レーザの端子を電気的に接続す
るために、従来からプリント基板がよく用いられている
。第６図は従来の構成を示すものであり、１は半導体レ
ーザ、９はプリント基板である。このプリント基板９に
は半導体レーザの端子２ａ、２ｂ、２ｃを挿入するため
の孔１０ａ。2. Description of the Related Art Printed circuit boards have been commonly used to electrically connect terminals of semiconductor lasers in optical pickups. FIG. 6 shows a conventional configuration, in which 1 is a semiconductor laser and 9 is a printed circuit board. This printed circuit board 9 has holes 10a for inserting semiconductor laser terminals 2a, 2b, and 2c.

１ｏｂ、１ｏＣが設けられている。また第６図は他の従
来例であるが、プリント基板９の孔１１は１つ孔で構成
されている。第７図、第８図に示すように端子２ａ、２
ｂ、２ｃを孔１０ａ、１０ｂ。1ob and 1oC are provided. Further, FIG. 6 shows another conventional example, in which the printed circuit board 9 has one hole 11. As shown in FIGS. 7 and 8, the terminals 2a and 2
b, 2c are holes 10a, 10b.

１０ｃもしくは孔１１に挿入後、端子２ａ、２ｂ。10c or after inserting into the hole 11, the terminals 2a and 2b.

２Ｃとパターンのランド部１２ａ、１２ｂ、　１２ａを
半田付することにより、電気的に接続を行なっている。Electrical connections are made by soldering 2C to the land portions 12a, 12b, 12a of the pattern.

発明が解決しようとする課題 これら従来例のうち第６図のものが最も良く用いられて
いるが、このような構成ではプリント基板９を半導体レ
ーザ１に自動機で挿入しようとした場合、３つの端子２
ａ、２ｂ、２ｃのピッチが１．４〜２ｆｆｌと小さいた
め、端子２ａ、　　２ｂ、　　２ｃと孔１０ａ、　　１
ｏｂ、１０ｃの位置合わせが非常に困難になってくる。Problems to be Solved by the Invention Among these conventional examples, the one shown in FIG. terminal 2
Since the pitch of a, 2b, 2c is as small as 1.4 to 2ffl, the terminals 2a, 2b, 2c and the holes 10a, 1
It becomes very difficult to align ob and 10c.

第６図はこのような欠点を解決しようとしたもので、３
つの端子２ａ、２ｂ、２ｃの円ピッチよりも孔１１を大
きくしておき、端子を挿入後、外側に少し押し広げて、
パターンのランド部１２ａ。Figure 6 is an attempt to solve these drawbacks, and shows 3
The holes 11 are made larger than the circular pitch of the three terminals 2a, 2b, 2c, and after inserting the terminals, push them outward a little,
Land portion 12a of the pattern.

１２ｂ、１２Ｃに半田付する構成になっている。It is configured to be soldered to 12b and 12C.

しかしながらこのような構成の場合、端子２ａ。However, in such a configuration, the terminal 2a.

２ｂ、２ｃとパターンのランド部との半田部分が、各端
子の半周以下になるため、組立後のストレスや、温度変
化によるヒートショックなどにより、半田付の信頼性が
著しく低下する。Since the solder portion between 2b and 2c and the land portion of the pattern is less than half the circumference of each terminal, the reliability of soldering is significantly reduced due to stress after assembly, heat shock due to temperature change, etc.

本発明は上記課題に鑑みて自動組立てが容易で信頼性の
ある光ピックアップを提供するものである。In view of the above problems, the present invention provides an optical pickup that is easy to assemble automatically and is reliable.

課題を解決するための手段 本発明のピックアップはプリント基板を、補強板を裏打
ちしたフレキシブルプリント基板で構成し、フレキシブ
ル基板の孔部を補強板の孔部より小さくするか、あるい
はフレキシブル基板の３つの孔をスリットで結ぶことに
より、２半導体レーザの端子をプリント基板へ自動挿入
が可能にしたものである。Means for Solving the Problems In the pickup of the present invention, the printed circuit board is composed of a flexible printed circuit board lined with a reinforcing plate, and the holes in the flexible board are made smaller than the holes in the reinforcing plate, or the three By connecting the holes with slits, the terminals of the two semiconductor lasers can be automatically inserted into the printed circuit board.

作用 に挿入する際は、１つ孔の場合と同様の容易さで自動挿
入が可能であり、かつ半田付の際は独立した３つの孔の
場合と同様の信頼性を得ることができる。When inserting into operation, automatic insertion is possible with the same ease as in the case of one hole, and when soldering, it is possible to obtain the same reliability as in the case of three independent holes.

実施例 第１図は本発明の一実施例を示すもので３は補強板、６
はフレキシブルプリント基板であシ、４゜６ばそれぞれ
の孔を示す。また、第２図は補強板３と、フレキシブル
プリント基板５が貼合わされた状態を示しており、点線
が補強板３の孔４、実線がフレキシブルプリント基板６
の孔ｅである。Embodiment FIG. 1 shows an embodiment of the present invention, in which 3 is a reinforcing plate and 6 is a reinforcing plate.
is a flexible printed circuit board, and 4°6 indicates each hole. Moreover, FIG. 2 shows a state in which the reinforcing plate 3 and the flexible printed circuit board 5 are bonded together, where the dotted line indicates the hole 4 of the reinforcing plate 3, and the solid line indicates the flexible printed circuit board 6.
This is hole e.

これらの孔と半導体レーザ１の端子２ａ、２ｂ。These holes and the terminals 2a and 2b of the semiconductor laser 1.

２Ｃは第２図に示す位置関係になっており、半導体レー
ザ１にフレキシブルプリント基板６を挿入させる時は、
少々位置精度がずれても、端子２ａ。2C has the positional relationship shown in FIG. 2, and when inserting the flexible printed circuit board 6 into the semiconductor laser 1,
Even if the positional accuracy is slightly off, terminal 2a.

２ｂ、２ｃが補強板３の孔４よりも内側にあれば、フレ
キシブルプリント基板６を押し広げて挿入することが可
能である。また挿入後は端子２ａ、２ｂ。If 2b and 2c are located inside the hole 4 of the reinforcing plate 3, the flexible printed circuit board 6 can be pushed out and inserted. Also, after insertion, terminals 2a and 2b.

２Ｃをそれぞれ孔ｅの了ａ、７ｂ、７ｃの位置まで押し
広げて半田付を行なう。これにより端子の半周以上、全
周近くまで半田付をすることが可能となり、従来例の第
８図と比べて半田付の信頼性を向上させることができる
。2C are expanded to positions a, 7b, and 7c of hole e, respectively, and soldered. This makes it possible to solder more than half the circumference of the terminal and nearly all the way around the terminal, making it possible to improve the reliability of soldering compared to the conventional example shown in FIG.

第３図は他の実施例であり、第４図は第２図同様、補強
板３とフレキシブルプリント基板５が貼合わされた状態
を示しケいる。FIG. 3 shows another embodiment, and like FIG. 2, FIG. 4 shows a state in which the reinforcing plate 3 and the flexible printed circuit board 5 are bonded together.

これは第２図のフレキシブル基板５の孔６が１つの孔で
構成されているのに対し、独立した３つの孔７ａ、７ｂ
、７ｃをスリット９ａ、　Ｂｂ、ａｃで結んだものであ
り、半日を端子の全周に回すことが可能である。While the hole 6 of the flexible substrate 5 in FIG. 2 is composed of one hole, this is made up of three independent holes 7a and 7b.
, 7c are connected by slits 9a, Bb, and ac, and it is possible to cover the entire circumference of the terminal in half a day.

以上のように本実施例によれば端子とプリント基板との
挿入が容易で、かつ半田付の信頼性の高い光ピックアッ
プが実現できる。As described above, according to this embodiment, it is possible to realize an optical pickup in which the terminals and the printed circuit board can be easily inserted and the soldering is highly reliable.

発明の効果 以上のように本発明は半導体１／−ザの端子に挿入する
プリント基板を補強板を裏打したフレキシブルプリント
基板で構成し、補強板とフレキシブル基板の乱形状を異
ならせることによシ、プリント基板の端子への自動挿Ｉ
＼が可能でかつ半田付の信頼性に優れた光ピックアップ
を実現することができる。Effects of the Invention As described above, the present invention comprises a printed circuit board to be inserted into the terminal of the semiconductor 1/-2 as a flexible printed circuit board lined with a reinforcing plate, and the irregular shapes of the reinforcing plate and the flexible printed circuit board are made different. , automatic insertion into printed circuit board terminals
＼It is possible to realize an optical pickup that is possible and has excellent soldering reliability.

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本発明の一実施例におけるフレキシブルプリン
ト法板の構成を示す分解斜視図、第２図は第１図でのフ
レキシブルプリント基板と補強板を貼合わせ、端子と孔
の位置関係を示した平面図、第３図は他の実施例におけ
る構成を示す分解斜視図、第４図は第３図でのフレキシ
ブルプリント基板と補強板を貼合わせた平面図、第６図
、第６図は従来例の構成を示す斜視図、第７図、第８図
はそれぞれ第５図、第６図における端子とパターンの半
田付状態を示した平面図である。 １・・・・・・半導体レーザ、２ａ、２ｂ、２ｃ・・・
・・・端子、３・・・・・・補強板、５・・・・・・フ
レキシブルプリント基板、４・・・・・・補強板の孔、
ｅ・・・・・・フレキシブルプリント基板の孔、７ａ、
　　７ｂ、　　了Ｃ・・・・・・フレキシブルプリント
基板の端子半田付部孔、８ａ、ｓｂ。 ８ｃ・・・・・・スリット。 代理人の氏名　弁理士　粟　野　重　孝　ほか１６第 図 と ｃ 第 図 ！ ｌＯβ 第 図 ！−半導、４＄、Ｉ、−ブ ？ユ、　ｚｂ、　２Ｃ−儒［子 ＺｃFig. 1 is an exploded perspective view showing the structure of a flexible printed board in an embodiment of the present invention, and Fig. 2 shows the positional relationship of terminals and holes when the flexible printed circuit board and reinforcing plate in Fig. 1 are bonded together. 3 is an exploded perspective view showing the structure of another embodiment, FIG. 4 is a plan view of the flexible printed circuit board and reinforcing plate bonded together in FIG. 3, and FIG. FIGS. 7 and 8 are perspective views showing the structure of the conventional example, and plan views showing the soldered states of the terminals and patterns in FIGS. 5 and 6, respectively. 1... Semiconductor laser, 2a, 2b, 2c...
Terminal, 3 Reinforcement plate, 5 Flexible printed circuit board, 4 Reinforcement plate hole,
e...... Hole of flexible printed circuit board, 7a,
7b, End C...Terminal soldering hole of flexible printed circuit board, 8a, sb. 8c...Slit. Name of agent: Patent attorney Shigetaka Awano et al.16 Figures and c Figures! lOβ Diagram! -Semiconductor, 4$, I, -Bu? Yu, zb, 2C-Confucian [child Zc

Claims (2)

【特許請求の範囲】[Claims] （１）ディスク上に信号を記録、あるいはディスク上の
信号を再生するための半導体レーザと、前記半導体レー
ザの端子を電気的に接続するための、補強板を裏打した
フレキシブルプリント基板とを備え、前記半導体レーザ
の端子を挿入する孔部が、補強板、フレキシブルプリン
ト基板共に一つ孔で構成されると共に、フレキシブルプ
リント基板の孔部が補強板の孔部より小さく、かつ半導
体レーザの個々の端子と半周以上で接することを特徴と
する光ピックアップ。(1) Equipped with a semiconductor laser for recording signals on a disk or reproducing signals on the disk, and a flexible printed circuit board lined with a reinforcing plate for electrically connecting terminals of the semiconductor laser, The hole into which the terminal of the semiconductor laser is inserted is one hole for both the reinforcing plate and the flexible printed circuit board, and the hole of the flexible printed circuit board is smaller than the hole of the reinforcing plate, and each terminal of the semiconductor laser has a single hole. An optical pickup that is characterized by being in contact with the . （２）ディスク上に信号を記録、あるいはディスク上の
信号を再生するための半導体レーザと、前記半導体レー
ザの端子を電気的に接続するための、補強板を裏打した
フレキシブルプリント基板とを備え、前記半導体レーザ
の端子を挿入する孔部が補強板は一つ孔、フレキシブル
プリント基板は端子数の孔で構成され、かつフレキシブ
ルプリント基板のそれぞれの孔が、スリットによって結
ばれていることを特徴とする光ピックアップ。(2) comprising a semiconductor laser for recording signals on a disk or reproducing signals on the disk, and a flexible printed circuit board lined with a reinforcing plate for electrically connecting terminals of the semiconductor laser; The reinforcing plate has one hole for inserting the terminal of the semiconductor laser, and the flexible printed circuit board has as many holes as the number of terminals, and each hole of the flexible printed circuit board is connected by a slit. optical pickup.
JP63173350A 1988-07-12 1988-07-12 Optical pickup Expired - Lifetime JP2638953B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63173350A JP2638953B2 (en) 1988-07-12 1988-07-12 Optical pickup

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63173350A JP2638953B2 (en) 1988-07-12 1988-07-12 Optical pickup

Publications (2)

Publication Number Publication Date
JPH0223540A true JPH0223540A (en) 1990-01-25
JP2638953B2 JP2638953B2 (en) 1997-08-06

Family

ID=15958787

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63173350A Expired - Lifetime JP2638953B2 (en) 1988-07-12 1988-07-12 Optical pickup

Country Status (1)

Country Link
JP (1) JP2638953B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140063168A1 (en) * 2012-08-28 2014-03-06 Katsuhiko Maeda Light-emitting substrate, method for manufacturing the same, optical writing device, and image forming apparatus
JP2014138049A (en) * 2013-01-16 2014-07-28 Ricoh Co Ltd Electronic circuit, light source device, and method for manufacturing electronic circuit

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140063168A1 (en) * 2012-08-28 2014-03-06 Katsuhiko Maeda Light-emitting substrate, method for manufacturing the same, optical writing device, and image forming apparatus
US9063455B2 (en) * 2012-08-28 2015-06-23 Ricoh Company, Limited Light-emitting substrate, method for manufacturing the same, optical writing device, and image forming apparatus
JP2014138049A (en) * 2013-01-16 2014-07-28 Ricoh Co Ltd Electronic circuit, light source device, and method for manufacturing electronic circuit
US9332655B2 (en) 2013-01-16 2016-05-03 Ricoh Company, Ltd. Electronic circuit, light source device, and method of manufacturing electronic circuit
CN103929881B (en) * 2013-01-16 2017-03-01 株式会社理光 The manufacture method of electronic circuit, light supply apparatuses and electronic circuit

Also Published As

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JP2638953B2 (en) 1997-08-06

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