JPH02234501A - Connection structure between strip line and coaxial connector - Google Patents
Connection structure between strip line and coaxial connectorInfo
- Publication number
- JPH02234501A JPH02234501A JP5451489A JP5451489A JPH02234501A JP H02234501 A JPH02234501 A JP H02234501A JP 5451489 A JP5451489 A JP 5451489A JP 5451489 A JP5451489 A JP 5451489A JP H02234501 A JPH02234501 A JP H02234501A
- Authority
- JP
- Japan
- Prior art keywords
- coaxial connector
- screw
- strip line
- microwave
- thread hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims abstract description 32
- 239000000919 ceramic Substances 0.000 claims abstract description 19
- 239000000758 substrate Substances 0.000 claims description 33
- 229910052751 metal Inorganic materials 0.000 claims description 13
- 239000002184 metal Substances 0.000 claims description 13
- 230000005540 biological transmission Effects 0.000 claims description 4
- 230000003071 parasitic effect Effects 0.000 abstract description 10
- 229920003002 synthetic resin Polymers 0.000 description 10
- 239000000057 synthetic resin Substances 0.000 description 10
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 3
- 239000004809 Teflon Substances 0.000 description 2
- 229920006362 Teflon® Polymers 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 238000010008 shearing Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
Landscapes
- Coupling Device And Connection With Printed Circuit (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、マイクロ波回路装置にかかわり、特にストリ
ップ線路と同軸コネクタの接続構造に関する．
第２図は、マイクロ波通信装置に広く使用されているマ
イクロ波回路装置の断面図である。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a microwave circuit device, and particularly to a connection structure between a strip line and a coaxial connector. FIG. 2 is a cross-sectional view of a microwave circuit device widely used in microwave communication devices.
第２図において、誘電体基板３の表面に、マイクロ波集
積回路４或いはマイクロ波伝送線路を形成してマイクロ
波回路を設け、このようなマイクロ波回路を、例えばア
ルミニウム等よりなる上部が開口した浅い箱型の金属ケ
ース１に所望数配列゛接続することで、増幅機能．周波
数変換機能等の所望の機能を備えたマイクロ波回路装置
が構成されている。In FIG. 2, a microwave circuit is provided by forming a microwave integrated circuit 4 or a microwave transmission line on the surface of a dielectric substrate 3, and such a microwave circuit is made of, for example, aluminum and has an open top. By connecting the desired number of arrays to the shallow box-shaped metal case 1, an amplification function can be achieved. A microwave circuit device is configured that has desired functions such as a frequency conversion function.
詳述すると、それぞれのマイクロ波回路間、及び同軸コ
ネクタ１０とマイクロ波回路とを接続するため、誘電体
基板３の表面に、端末が基板の側縁に達するストリップ
線路５を対向して設ける。Specifically, in order to connect each microwave circuit and to connect the coaxial connector 10 and the microwave circuit, strip lines 5 are provided facing each other on the surface of the dielectric substrate 3, the terminals of which reach the side edges of the substrate.
ストリップ線路５が同一直線上に位置するようにマイク
ロ波回路を底板１Ｂ上に配列し、それぞれの誘電体基板
３の裏面を底板１Ｂに密着させ、誘電体基板３の接地導
体と底板１Ｂとを導電性接着剤を用いて固着している．
そして、相対向するストリップ線路５の端末に、例えば
金線等の導体リボン６の端部を重畳し、熱圧着等して接
着し、導体リボン６をマイクロ波回路間の間隙に架橋し
て、隣接したマイクロ波回路同志を接続している．
また、金属ケース１の側壁ＩＡに同軸コネクタ１０を装
着し、その内導体１１をストリップ線路５の端末に重ね
半田付け接続することで、マイクロ波回路装置と外部装
置とを接続するようにしている。The microwave circuits are arranged on the bottom plate 1B so that the strip lines 5 are located on the same straight line, the back surface of each dielectric substrate 3 is brought into close contact with the bottom plate 1B, and the ground conductor of the dielectric substrate 3 and the bottom plate 1B are connected. It is fixed using conductive adhesive. Then, the ends of the conductor ribbons 6, such as gold wires, are superimposed on the ends of the opposing strip lines 5 and bonded by thermocompression, etc., and the conductor ribbons 6 are bridged in the gap between the microwave circuits. Connects adjacent microwave circuits. Further, a coaxial connector 10 is attached to the side wall IA of the metal case 1, and its inner conductor 11 is overlapped and soldered to the terminal of the strip line 5, thereby connecting the microwave circuit device and an external device. .
なお、金属ケースｌの開口面にカバー２を取付けて、マ
イクロ波回路をシールドしている。Note that a cover 2 is attached to the opening surface of the metal case l to shield the microwave circuit.
上述のように構成されたマイクロ波回路装置においては
、同軸コネクタｌＯとストリップ線路５との接続部にお
いて、同軸コネクタ１０に寄生容量が発生することに留
意しなければならない。In the microwave circuit device configured as described above, it must be noted that parasitic capacitance is generated in the coaxial connector 10 at the connection between the coaxial connector IO and the strip line 5.
〔従来の技術］
第３図は従来のストリップ線路と同軸コネクタの接続構
造を示す断面図である。[Prior Art] FIG. 3 is a sectional view showing a conventional connection structure between a strip line and a coaxial connector.
第３図において、図示省略したマイクロ波集積回路を有
する誘電体基板と、側壁ＩＡに装着した同軸コネクタ１
０とは、合成樹脂基板３０の表面に形成したスト゜リッ
プ線路５を介して接続されている゜．合成樹脂，基板３
０は、テフロン等の低誘電率（誘電率が２６５前後）の
合成樹脂板より構成され、その板厚は数百μ曽である．
そして、合成樹脂基板３０の表面には銅箔をエッチング
して、所定の特定インピーダンスのストリップ線路５を
設けてある．
このようなマイクロ波回路は、接着剤３２を用いて合成
樹脂基板３０の裏面を金属ケース１の底板１Ｂに密着し
た後に、ストリップ線路５の端末部に、同軸コネクタｌ
Ｏの内導体１１を重ね、半田３３で接着することで、ス
トリップ線路５と内導体１１とを接続している。In FIG. 3, a dielectric substrate having a microwave integrated circuit (not shown) and a coaxial connector 1 attached to the side wall IA are shown.
0 is connected via a strip line 5 formed on the surface of the synthetic resin substrate 30. Synthetic resin, substrate 3
0 is made of a synthetic resin plate with a low dielectric constant (dielectric constant of around 265) such as Teflon, and its thickness is several hundred microns. A strip line 5 having a predetermined specific impedance is provided on the surface of the synthetic resin substrate 30 by etching copper foil. Such a microwave circuit is constructed by attaching the back side of the synthetic resin substrate 30 to the bottom plate 1B of the metal case 1 using an adhesive 32, and then attaching a coaxial connector l to the terminal part of the strip line 5.
The strip line 5 and the inner conductor 11 are connected by overlapping the O inner conductors 11 and bonding them with solder 33.
同軸コネクタ１０は、円筒状の外部導体と、外部導体の
軸心を貫通する内導体１１とを、テフロン等の絶縁体ｌ
２で絶縁し、合成樹脂基板と整合がとれた同軸コネクタ
である。The coaxial connector 10 connects a cylindrical outer conductor and an inner conductor 11 that passes through the axis of the outer conductor with an insulator such as Teflon.
This is a coaxial connector that is insulated by 2 and matched with the synthetic resin board.
この際、内導体１１の先端は同軸コネクタの外部導体の
端面より突出して、ストリップ線路５に半田付けされて
いる．
したがって、内導体１１と底板１Ｂとの間に合成樹脂基
仮３０が介在して゜いることで、コンデンサとして作用
し、寄生容量が発生している。At this time, the tip of the inner conductor 11 protrudes from the end surface of the outer conductor of the coaxial connector and is soldered to the strip line 5. Therefore, the presence of the synthetic resin base 30 between the inner conductor 11 and the bottom plate 1B acts as a capacitor and generates parasitic capacitance.
しかし、この寄生容量は合成樹脂基板が低誘電率であり
、且つその板厚が比較的大きいので、容量が小さく整合
の劣化の要因に殆どならない。However, since the synthetic resin substrate has a low dielectric constant and is relatively thick, this parasitic capacitance is small and hardly causes a deterioration of matching.
（発明が解決しようとする課題〕
一方、マイクロ波回路の周波数帯域が１０ＧＨｚ以上に
なるに伴い、マイクロ波回路の小形化、伝送線路の低損
失化のために、誘電体基板として高誘電率（誘電率が９
．８）の例えばアルミナ等のセラミック基板が用いられ
る傾向にある。(Problems to be Solved by the Invention) On the other hand, as the frequency band of microwave circuits increases to 10 GHz or more, dielectric substrates with high dielectric constants ( Dielectric constant is 9
．． 8), for example, there is a tendency for ceramic substrates such as alumina to be used.
このようなセラミック基板を用いたマイクロ波回路を、
合成樹脂基板と整合のとれた同軸コネクタに接続すると
、寄生容量が大きいので接続部で整合がとれないという
問題点があった。A microwave circuit using such a ceramic substrate,
When connected to a coaxial connector that is matched with a synthetic resin board, there is a problem in that matching cannot be achieved at the connection part because of the large parasitic capacitance.
本発明はこのような点に鑑みて創作されたもので、低誘
電率の誘電体基板向けの同軸コネクタを、セラミック基
板を用いたマイクロ波回路に適用して整合をとることが
容易な、ストリップ線路と同軸コネクタの接続構造を提
供することを目的としている．
〔課題を解決するための手段〕
上記の目的を達成するために本発明は、第１図に例示し
たように、セラミック基板４０の表面にマイクロ波集積
回路或いはマイクロ波伝送線路を形成したマイクロ波回
路を、１つ或いは複数、金属ケース１に実装して、マイ
クロ波回路のストリップ線路５を、同軸コネクタ１０の
内導体１１に接続するよう構成したマイクロ波回路装置
において、内導体１１に半田付け接続するス｝ ＩＪッ
プ線路５の端末に対応して、内導体１１の直下の金属ケ
ースｌの底板１８部分に、ねじ孔５ｌを設ける．そして
、ねじ孔５ｌにねじ５０を螺着して、セラミック基板４
０の底面とねじ５０の上端面との間隙を、調整可能の構
成とする．
〔作 用〕
上述のねじ孔５ｌに対応するセラミック基板４０の裏面
部分には、接地導体層４１を設けない。The present invention was created in view of these points, and is a strip that can easily match a coaxial connector for a dielectric substrate with a low dielectric constant to a microwave circuit using a ceramic substrate. The purpose is to provide a connection structure between lines and coaxial connectors. [Means for Solving the Problems] In order to achieve the above object, the present invention provides a microwave integrated circuit or a microwave transmission line in which a microwave integrated circuit or a microwave transmission line is formed on the surface of a ceramic substrate 40, as illustrated in FIG. In a microwave circuit device configured such that one or more circuits are mounted on a metal case 1 and a strip line 5 of the microwave circuit is connected to an inner conductor 11 of a coaxial connector 10, the inner conductor 11 is soldered. Connecting step} A screw hole 5l is provided in the bottom plate 18 of the metal case l directly below the inner conductor 11, corresponding to the terminal of the IJ jump line 5. Then, the screw 50 is screwed into the screw hole 5l, and the ceramic substrate 4
The gap between the bottom surface of the screw 50 and the top surface of the screw 50 is adjustable. [Function] The ground conductor layer 41 is not provided on the back surface portion of the ceramic substrate 40 corresponding to the above-mentioned screw hole 5l.
したがって、内導体１１とねじ５０の上端面の間に、セ
ラミック基板と空隙が介在し、同軸コネクタに寄生容量
が発生する．
しかしこの間隙長は、ねじ５０を適宜に螺回することで
加減できる。したがって、寄生容量を充分に小さく調整
することが可能となり、ストリップ線路と同軸コネクタ
の接続部の整合が低下する恐れがない．
（実施例）
以下図を参照しながら、本発明を具体的に説明する．な
お、前図を通じて同一符号は同一対象物を示す。Therefore, a gap exists between the inner conductor 11 and the upper end surface of the screw 50 and the ceramic substrate, and a parasitic capacitance is generated in the coaxial connector. However, this gap length can be adjusted by turning the screw 50 appropriately. Therefore, it is possible to adjust the parasitic capacitance to a sufficiently small value, and there is no fear that the matching between the strip line and the coaxial connector will deteriorate. (Example) The present invention will be specifically explained below with reference to the figures. Note that the same reference numerals indicate the same objects throughout the previous figures.
第１図は本発明の一実施例の断面図であって、４０は、
高誘電率（誘電率が９．８）の例えばアルミナ等よりな
る、板厚が０．４ ｗａ−０．６ ａｍ程度の薄いセラ
ミック基板である．
セラミック基板４０の表面には所望のマイクロ波集積回
路４を吹け、さらにマイクロ波集積回路４の入出力線路
として、同軸コネクタ１０側の側縁に達する細幅の所定
の特定インピーダンスの、ストリップ線路（マイクロス
トリップ線路）５を設けてある。FIG. 1 is a sectional view of an embodiment of the present invention, and 40 is a sectional view of an embodiment of the present invention.
It is a thin ceramic substrate with a thickness of about 0.4 wa-0.6 am, made of alumina or the like with a high dielectric constant (9.8 dielectric constant). A desired microwave integrated circuit 4 is formed on the surface of the ceramic substrate 40, and as an input/output line of the microwave integrated circuit 4, a narrow strip line (with a predetermined specific impedance) reaching the side edge on the coaxial connector 10 side is formed. A microstrip line) 5 is provided.
また、ストリップ線路５の端末部に対応する部分を除い
た、セラミック基板４０の裏面の全面に、金を蒸着等し
て接地導体層４ｌとしてある。In addition, gold is deposited on the entire back surface of the ceramic substrate 40, excluding the portion corresponding to the terminal portion of the strip line 5, to form a ground conductor layer 4l.
一方、金属ケース１の側壁ＩＡに、所定の特定インピー
ダンスの同軸コネクタｌＯを装着し、同軸コネクタの外
部導体の端面より突出し内導体１１の先端の直下の底板
１Ｂ部分に、垂直に貫通するねじ孔５１を設けてある。On the other hand, a coaxial connector lO of a predetermined specific impedance is attached to the side wall IA of the metal case 1, and a screw hole protrudes from the end face of the outer conductor of the coaxial connector and penetrates vertically into the bottom plate 1B directly below the tip of the inner conductor 11. 51 are provided.
また、このねじ孔５ｌにねじ５０を螺着し、底板１Ｂの
下側からこのねじ５０を螺回することで、セラミック基
板４０の裏面とねじ５０の上端面間の間隙長を、所望に
調整し得るようにしてある．
そして、前述のストリップ線路５の上面が、同軸コネク
タｌＯＯ内導体１１の下面に接し、且つ一直線となるよ
うにセラミック基板４０を底板１Ｂ上に配列し、接地導
体層４１を底板１Ｂに密着させ、導電性接着剤４２を用
いてマイクロ波回路を金属ケース１に実装してある．
そしてさらに、内導体１１とストリップ線路５の端末を
、半田３３で接続固着してある．即ち、同軸コネクタ１
０に図示省略した同軸線路を接続することで、マイクロ
波回路装置と外部装置とを接続するようになっている．
上述のように接続部が構成されているので、内導体１１
と接地導体の役目を果たすねじ５０の上端面の間に、セ
ラミック基板４０と空隙が介在することで、寄生容量が
発生する．
しかし、この間隙長は，ねじ５０を適宜に螺回すること
で加減できる．即ち、寄生容量を充分に小さく調整する
ことが可能となり、ストリップ線路と同軸コネクタの接
続部での整合がとれる．〔発明の効果〕
以上説明したように本発明は、同軸コネクタとストリッ
プ線路との接続の下部の金属ケース部分に、ねじ孔とね
じ孔に螺着するねじとを設けたことにより、低誘電率の
誘電体基板向けの同軸コネクタと、セラミック基板に形
成したストリップ線路とを接続して、接続部の寄生容量
が調整可能となり、接続部のインピーダンスの整合がと
れるという、実用上で優れた効果がある．
４はマイクロ波集積回路、５はストリップ線路、６は導
体リボン、 １０は同軸コネクタ、１１は内導体
、 １２は絶縁体、３０は合成樹脂基板、
３３は半田、４０はセラミック基板、 ４１は接
地導体層、４２は導電性接着剤、 ５０はねじ、５
１はねじ孔をそれぞれ示す．In addition, by screwing a screw 50 into the screw hole 5l and turning the screw 50 from the bottom side of the bottom plate 1B, the gap length between the back surface of the ceramic substrate 40 and the upper end surface of the screw 50 can be adjusted as desired. It has been made possible to do so. Then, the ceramic substrates 40 are arranged on the bottom plate 1B so that the top surface of the strip line 5 mentioned above is in contact with the bottom surface of the inner conductor 11 of the coaxial connector lOO and is in a straight line, and the ground conductor layer 41 is brought into close contact with the bottom plate 1B. A microwave circuit is mounted on the metal case 1 using a conductive adhesive 42. Furthermore, the inner conductor 11 and the terminal of the strip line 5 are connected and fixed with solder 33. That is, coaxial connector 1
By connecting a coaxial line (not shown) to 0, the microwave circuit device and an external device are connected. Since the connection portion is configured as described above, the inner conductor 11
A parasitic capacitance is generated due to the presence of a gap between the ceramic substrate 40 and the upper end surface of the screw 50, which serves as a grounding conductor. However, this gap length can be adjusted by turning the screw 50 appropriately. In other words, it is possible to adjust the parasitic capacitance to a sufficiently small value, and matching can be achieved at the connection between the strip line and the coaxial connector. [Effects of the Invention] As explained above, the present invention provides a screw hole and a screw to be screwed into the screw hole in the lower metal case portion of the connection between the coaxial connector and the strip line, thereby achieving a low dielectric constant. By connecting a coaxial connector for a dielectric substrate with a strip line formed on a ceramic substrate, the parasitic capacitance of the connection part can be adjusted, and the impedance of the connection part can be matched, which is an excellent practical effect. be. 4 is a microwave integrated circuit, 5 is a strip line, 6 is a conductor ribbon, 10 is a coaxial connector, 11 is an inner conductor, 12 is an insulator, 30 is a synthetic resin substrate,
33 is solder, 40 is a ceramic substrate, 41 is a ground conductor layer, 42 is a conductive adhesive, 50 is a screw, 5
1 indicates each screw hole.
第１図は本発明の一実施例の断面図、
第２図はマイクロ波回路装置の断面図
第３図は従来例の断面図である。
図において、
１は金属ケース、 ３は誘電体基板、第 １
図
呼楚釆例の喀面図
第 ３ 図
マイクａｌｌ固路策１の剪面図
％ ２ 図FIG. 1 is a sectional view of an embodiment of the present invention, FIG. 2 is a sectional view of a microwave circuit device, and FIG. 3 is a sectional view of a conventional example. In the figure, 1 is a metal case, 3 is a dielectric substrate, and 1st
Figure 3 Shearing diagram of the example of the structure shown in Figure 3 Shearing diagram of the rigid road plan 1 % 2 Figure
Claims (1)
いはマイクロ波伝送線路を形成したマイクロ波回路を、
１つ或いは複数、金属ケース（１）に実装して、該マイ
クロ波回路のストリップ線路（５）を、同軸コネクタ（
１０）の内導体（１１）に接続するよう構成したマイク
ロ波回路装置において、 該内導体（１１）に半田付け接続する該ストリップ線路
（５）の端末に対応して、該金属ケース（１）の底板（
１Ｂ）部分にねじ孔（５１）を設け、該ねじ孔（５１）
にねじ（５０）を螺着して、該セラミック基板（４０）
の底面と該ねじ（５０）の上端面との間隙を、調整可能
としたことを特徴とするストリップ線路と同軸コネクタ
の接続構造。[Claims] A microwave circuit in which a microwave integrated circuit or a microwave transmission line is formed on the surface of a ceramic substrate (40),
One or more are mounted in a metal case (1) to connect the strip line (5) of the microwave circuit to a coaxial connector (
In the microwave circuit device configured to be connected to the inner conductor (11) of the metal case (10), the metal case (1) corresponds to the terminal of the strip line (5) that is soldered to the inner conductor (11) The bottom plate of (
A screw hole (51) is provided in the part 1B), and the screw hole (51)
Screw the screws (50) into the ceramic substrate (40).
A connection structure for a strip line and a coaxial connector, characterized in that the gap between the bottom surface of the screw (50) and the top end surface of the screw (50) is adjustable.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5451489A JPH02234501A (en) | 1989-03-07 | 1989-03-07 | Connection structure between strip line and coaxial connector |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5451489A JPH02234501A (en) | 1989-03-07 | 1989-03-07 | Connection structure between strip line and coaxial connector |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02234501A true JPH02234501A (en) | 1990-09-17 |
Family
ID=12972757
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5451489A Pending JPH02234501A (en) | 1989-03-07 | 1989-03-07 | Connection structure between strip line and coaxial connector |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02234501A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1154512A2 (en) * | 2000-05-09 | 2001-11-14 | Nec Corporation | Radio frequency circuit module on multi-layer substrate |
| JP2002521946A (en) * | 1998-07-31 | 2002-07-16 | レイセオン・カンパニー | High uniformity microstrip and deformed square ax interconnect |
| JP2010166276A (en) * | 2009-01-15 | 2010-07-29 | Fujitsu Optical Components Ltd | Substrate and package for high frequency |
| JP2012518963A (en) * | 2009-02-25 | 2012-08-16 | アルカテル−ルーセント | Mechanical and electrical connection device for coaxial cable for high-frequency signal transmission |
| JP2019160851A (en) * | 2018-03-08 | 2019-09-19 | 日本特殊陶業株式会社 | Wiring board and manufacturing method thereof |
-
1989
- 1989-03-07 JP JP5451489A patent/JPH02234501A/en active Pending
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002521946A (en) * | 1998-07-31 | 2002-07-16 | レイセオン・カンパニー | High uniformity microstrip and deformed square ax interconnect |
| EP1154512A2 (en) * | 2000-05-09 | 2001-11-14 | Nec Corporation | Radio frequency circuit module on multi-layer substrate |
| EP1154512A3 (en) * | 2000-05-09 | 2003-05-28 | Nec Corporation | Radio frequency circuit module on multi-layer substrate |
| US6661318B2 (en) | 2000-05-09 | 2003-12-09 | Nec Corporation | Radio frequency circuit module on multi-layer substrate |
| US6842093B2 (en) | 2000-05-09 | 2005-01-11 | Nec Corporation | Radio frequency circuit module on multi-layer substrate |
| US6847276B2 (en) | 2000-05-09 | 2005-01-25 | Nec Corporation | Radio frequency circuit module on multi-layer substrate |
| EP1936734A1 (en) * | 2000-05-09 | 2008-06-25 | NEC Corporation | Radio frequency circuit module on multi-layer substrate |
| JP2010166276A (en) * | 2009-01-15 | 2010-07-29 | Fujitsu Optical Components Ltd | Substrate and package for high frequency |
| JP2012518963A (en) * | 2009-02-25 | 2012-08-16 | アルカテル−ルーセント | Mechanical and electrical connection device for coaxial cable for high-frequency signal transmission |
| JP2019160851A (en) * | 2018-03-08 | 2019-09-19 | 日本特殊陶業株式会社 | Wiring board and manufacturing method thereof |
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