JPH02234369A - Circuit component - Google Patents
Circuit componentInfo
- Publication number
- JPH02234369A JPH02234369A JP1053578A JP5357889A JPH02234369A JP H02234369 A JPH02234369 A JP H02234369A JP 1053578 A JP1053578 A JP 1053578A JP 5357889 A JP5357889 A JP 5357889A JP H02234369 A JPH02234369 A JP H02234369A
- Authority
- JP
- Japan
- Prior art keywords
- board
- contact
- flux
- terminal
- shielding body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000004907 flux Effects 0.000 abstract description 41
- 239000012212 insulator Substances 0.000 abstract description 18
- 238000005476 soldering Methods 0.000 abstract description 7
- 239000000758 substrate Substances 0.000 abstract description 7
- 230000000630 rising effect Effects 0.000 abstract description 6
- 230000008595 infiltration Effects 0.000 abstract description 4
- 238000001764 infiltration Methods 0.000 abstract description 4
- 239000011111 cardboard Substances 0.000 abstract 1
- 238000010438 heat treatment Methods 0.000 abstract 1
- 239000011295 pitch Substances 0.000 abstract 1
- 238000003780 insertion Methods 0.000 description 28
- 230000037431 insertion Effects 0.000 description 28
- 239000011347 resin Substances 0.000 description 12
- 229920005989 resin Polymers 0.000 description 12
- 238000000034 method Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 4
- 239000010408 film Substances 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 238000007789 sealing Methods 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000007429 general method Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
Landscapes
- Coupling Device And Connection With Printed Circuit (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Multi-Conductor Connections (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は電気回路及び電気素子を搭載する印刷配線板
（以下基板と称す）に実装半田付されるコネクタなどの
回路部品に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to circuit components such as connectors that are mounted and soldered to printed wiring boards (hereinafter referred to as "boards") on which electric circuits and electric elements are mounted.
従来基板に挿入実装されるコネクタは，第３図から第１
１１図に示す形状を呈していた。第３図から第８図にお
いて，ロ１は各ローズ形雄タイプのインシュレータで．
（２）はベローズ形接触子雄端子， （３ａ）は接触子
雄端子（２）の基板挿入端子，｛４｝はベローズ形雌タ
イプのインシュレータ．（５）はベローズ形接Ｍ−１１
ｉ子． （５ｂ）は接触子雌端子（５）の基板挿入端子
を表す。また，第９図から第１１図において（６）はビ
ンコンタクト形のインシュレータ，（７）はピン形接触
子雄端子， （３ｃ）はピン形接触子雄端子（７）の基
板挿入端子，（８）はソケットコンタクト形インシュレ
ータ，（９》はビン形接触子雄端子（７）と嵌合する為
の挿入穴，Ｈはソケット接触子， （＋ａ）は員ソケッ
ト接触子の基板挿入端子である。第１２図から第１６図
において．ａυは基板に基板挿入端子（３ａ）〜（３ｄ
）を挿入する挿入穴（スルーホール）を表す。Conventional connectors that are inserted and mounted on the board are shown in Figures 3 to 1.
It had the shape shown in Figure 11. In Figures 3 to 8, B1 is each rose-shaped male type insulator.
(2) is a bellows-type contact male terminal, (3a) is a board insertion terminal for the contactor male terminal (2), and {4} is a bellows-type female insulator. (5) is bellows type M-11
i child. (5b) represents the board insertion terminal of the contact female terminal (5). In addition, in FIGS. 9 to 11, (6) is a bottle contact type insulator, (7) is a pin type contact male terminal, (3c) is a board insertion terminal of the pin type contact male terminal (7), ( 8) is a socket contact type insulator, (9》) is an insertion hole for fitting the bottle type contact male terminal (7), H is a socket contact, and (+a) is a board insertion terminal for a socket contact. .In Figures 12 to 16, aυ indicates board insertion terminals (3a) to (3d) on the board.
) represents the insertion hole (through hole) for inserting.
ａのは基板であり，α漕はフラツクスを表す。（１４の
矢印はフラツクス浸入経路を表す。（ｌ！９はフラツク
スの汚れである。顧はフラツクス上り防止用の空間，α
ηは空間（ＩｌＧを作る為の突起である。＜１８は樹脂
液を注入するデイスペンサ．Ｑ！Ｊは基板挿入端子（３
ａ）〜（３ｄ）を１１１ ， ＋４） ｊ（６１ ，
（８）のインシュレータに挿入するコンタクトホールを
表す。A represents the substrate, and α represents the flux. (The arrow at 14 represents the flux infiltration route.
η is a space (a protrusion for making IlG). <18 is a dispenser for injecting resin liquid. Q!J is a board insertion terminal (3
a) to (3d) as 111, +4) j(61,
(8) represents the contact hole inserted into the insulator.
次に動作について説明する。第３図は雄コネク夕外観図
であり．接触子雄端子｛２｝はインシュレータ＋１３に
第５図に示すごとく組立られてお夛．第４図は雌コネク
タ外観図であシ，接触子雌端子（５）はインシュレータ
（４）に第６図Ｋ示すごとく組立られている。第５図，
第６図は各々第３図．第４図のＡ−Ａ断面，Ｂ−８断面
を表す。第３図の雄コネクタと第４図の雌コネクタは互
いに嵌合し，嵌合した時のＡ−Ａ断面，Ｂ−Ｂ断面を第
７図に表す。Next, the operation will be explained. Figure 3 is an external view of the male connector. The contactor male terminal {2} is assembled to the insulator +13 as shown in FIG. FIG. 4 is an external view of the female connector, and the contact female terminal (5) is assembled to the insulator (4) as shown in FIG. 6K. Figure 5,
Figure 6 is the same as Figure 3. The AA cross section and the B-8 cross section in FIG. 4 are shown. The male connector shown in FIG. 3 and the female connector shown in FIG. 4 fit into each other, and FIG. 7 shows cross sections taken along line AA and line BB when they are fitted.
ここで接触子雄端子（２）と接触子雌端子（５）は互い
に押し合うようにして接触する。その様子を拡大したの
が第８図で接触子雄端子（２）の接触面（２ａ）と接触
子雌端子（５）の接触点（５ａ）が接触している。Here, the contact male terminal (2) and the contact female terminal (5) are pressed against each other and come into contact with each other. FIG. 8 shows an enlarged view of this situation, where the contact surface (2a) of the contact male terminal (2) and the contact point (5a) of the contact female terminal (5) are in contact.
（２＋ ， （１５１の接触子形状はベローズ形状と称
し板バネから成シ立っている。従って接触面（２ａ）と
接触点（５ａ）の接触圧力を弱く設定出来る為多極コネ
クタの挿抜が容易である。(2+, (The contact shape of 151 is called a bellows shape and is made of a leaf spring. Therefore, the contact pressure between the contact surface (2a) and the contact point (5a) can be set weakly, making it easy to insert and remove a multi-pin connector. It is.
一万，第Ｓ−，第１０図に示すピン形接触雄端子｛７｝
とソケット接触子Ｑｌは第１１図に示すごとくビン形接
触雄端子（７）にソケット接触子α呻の突起（１０ａ）
がエッジ状に接触し接触圧力が強い。従つて挿抜力を犠
性にして接触信頼性を重視する場合に多く用いられる形
状である。第３図，第４図の組合せ及び第９図，第１０
図の組合せのいずれのコネクタも基板挿入部は第１２図
に示すごとく基板挿入端子（３ａ）〜（３ｄ）のピッチ
が極少になると第１３図に示す様に千鳥配列にして端子
ピッチを大きくとっている。10,000, S-, pin-type contact male terminal shown in Fig. 10 {7}
As shown in Fig. 11, the socket contact Ql has a protrusion (10a) of the socket contact α on the bottle-shaped male contact terminal (7).
are in edge-like contact and the contact pressure is strong. Therefore, this shape is often used when contact reliability is emphasized at the expense of insertion/extraction force. Combination of Figures 3 and 4 and Figures 9 and 10
In any of the connector combinations shown in the figure, the board insertion part is arranged in a staggered arrangement as shown in Fig. 13 to increase the terminal pitch when the pitch of the board insertion terminals (3a) to (3d) becomes extremely small as shown in Fig. 12. ing.
従来のコネクタは以上の様な構成になっているが，次に
コネクタを基板に実装しフラックスを塗布する半田付工
程について説明する。第１４図はペローズ形コネクタを
基板ｒ１ｚに挿入し半田付前工程のフラツクス塗布図を
表す。半田付は半田浴槽に表面浸漬するが半田上夛を良
くする為に２ラツクスを塗布する。第１４図はフラツク
ス塗布の一般的方法として泡沫状のフラツクスｉｌｌを
使用する。Conventional connectors have the above-mentioned configuration.Next, we will explain the soldering process of mounting the connector on the board and applying flux. FIG. 14 shows a diagram of flux application in the pre-soldering process after inserting the Perows type connector into the board r1z. For soldering, the surface is immersed in a solder bath, but 2 lux is applied to improve solder coverage. FIG. 14 shows the use of a foamy flux illumination as a general method of flux application.
その際フラツクス峙は表面張力が小さい為，基板Ｑ３に
設けられたスルホールａυから基板挿入端子（３ａ）
， （３ｂ）に治って矢印のごとく毛細管現象によって
フラツクス上昇経路αくを伝わり上昇する。At that time, since the surface tension of the flux is small, the board insertion terminal (3a) is inserted from the through hole aυ provided on the board Q3.
, (3b), the flux rises along the upward flux path α due to capillary action as shown by the arrow.
そうすると接触子表面に付着し第８図の接触面（２ａ）
と接触点（５ａ）の間に７ラツクス０の膜が付き絶縁膜
となシ電気的接触不良となる。通常半田付工程の後に７
ラックス洗浄工程を通すが．フラツクス膜が多すぎると
容易に洗浄出きずに上記不良を起こすことになる。Then, it will adhere to the surface of the contact, and the contact surface (2a) in Figure 8
A film of 7 lux 0 is present between the contact point (5a) and the insulating film, resulting in poor electrical contact. Normally after the soldering process 7
It goes through the lux cleaning process. If there is too much flux film, it will not be easily washed out and the above-mentioned defects will occur.
第１５図はピン，ソケット形コネクタの場合であるが，
第１４図と同じ原理でフラックス膜付着の様相を図に示
したものである。Figure 15 shows the case of a pin and socket type connector.
This figure shows the state of flux film adhesion based on the same principle as FIG. 14.
以上の様に２ラツクス上昇の対策として従来には第１４
図の突起鰭を高くして空間Ｑｅを大きくとる事が毛細管
現象を阻止する方法としてとられて来た。しかし電子製
品が増々高密度化して来る傾向にあ夛．空間翰を大きく
する事は時流に逆行する事になり現実的でなくなって来
ている。As mentioned above, as a countermeasure against the 2 lux increase, the 14th
A method to prevent capillary phenomenon has been to increase the height of the protrusive fin shown in the figure to increase the space Qe. However, the trend of electronic products becoming increasingly dense is increasing. Increasing the size of the space is going against the times and is becoming unrealistic.
従ってその対応策として第１６図に示すごとくコンタク
トホールａ９をデイスペンサー鱈で樹脂剤を封入する方
法も一部でとられている。しかしながら（３ａ）〜（３
ｄ）の基板挿入端子間隔が小さい為，封止するのが困難
である事と樹脂剤の粘性によって接触子内部に流入する
危険もあり，あまシ効果を出していない状況にある。Therefore, as a countermeasure to this problem, some methods have been taken in which the contact hole a9 is filled with a resin using a dispenser as shown in FIG. However, (3a) to (3
In d), since the spacing between the board insertion terminals is small, it is difficult to seal, and there is a risk that the viscosity of the resin may flow into the inside of the contact, so it is not effective.
また．フラツクスの侵入を防止するｔめ．次のような従
来の技術も存在している。第１７図は，特開昭６０−１
８９９０に開示されたものの一例である。図において．
ＩＩυはスルーホール，０３ハｔ”板，（財）は弾性樹
脂，＠は回路パターンである。弾性樹脂Ｑ４は，回路部
品の端子がスルーホールＱυに挿入されるまではスルー
ホールＩの孔全体をおおっておシ，端子をここに圧入す
ると弾性樹脂ｃ！４が破れて端子が挿入可能となる。そ
して，フラツクスを塗布する際は，この弾性樹脂＠がフ
ラツクス侵入の防止役をはたすものである。Also. To prevent flux from entering. The following conventional techniques also exist. Figure 17 is JP-A-60-1
This is an example of what was disclosed in No. 8990. In the figure.
IIυ is a through hole, 03hat” board, (Foundation) is an elastic resin, @ is a circuit pattern.The elastic resin Q4 covers the entire hole of the through hole I until the terminal of the circuit component is inserted into the through hole Qυ. If you cover it and press the terminal in here, the elastic resin C!4 will break and the terminal can be inserted.And when applying flux, this elastic resin will prevent flux from entering. be.
このようにすると，弾性樹脂Ｑ４がおおうべきスルーホ
ールｌｌＩＪを基板α２上から，選択する必要がある。In this case, it is necessary to select the through hole llIJ to be covered with the elastic resin Q4 from the substrate α2.
また，弾性樹脂＠がおおうべき範囲，形状もまちまちに
なるなどの問題がある。In addition, there are problems such as the range and shape that the elastic resin should cover vary.
１次，第１８図は特開昭５９−９８５８５に示されたも
のの一例であり．Ｉ１υはスルーホール，ｕ３は基板，
＠は金属箔から形成された回路パターン，＠は基板任邊
と回路パターン（ハ）を接着している弾性接［ＩＪ．＊
ｌはスルーホールａυの径より小さい径をもつ弾性接着
剤（ハ）の小径孔である。回路基板をこのように構成し
，回路部品の端子をスルーホールＩに挿入すると弾性接
着剤＠の小径孔ｃｌυによりフラツクスの上昇を阻止す
ることができる。Figure 1 and Figure 18 are examples of what was shown in Japanese Patent Application Laid-Open No. 59-98585. I1υ is a through hole, u3 is a board,
＠ is a circuit pattern formed from metal foil, ＠ is an elastic bond [IJ. *
l is a small diameter hole of the elastic adhesive (c) having a diameter smaller than the diameter of the through hole aυ. When the circuit board is constructed in this manner and the terminals of the circuit components are inserted into the through holes I, the rise of flux can be prevented by the small diameter holes clυ of the elastic adhesive @.
この場合は，スルーホールａυと小径孔Ｑυの径が異な
るため．打ち抜き作業が複雑になる。In this case, the diameters of the through hole aυ and the small diameter hole Qυ are different. The punching work becomes complicated.
従来のコネクタは以上の′ように構成されているので，
フラツクス汚染を防止するのは困難で汚れた物を必要以
上に洗浄する事が必要で工数増大をまねいているなどの
問題点があう友。Conventional connectors are configured as shown above, so
It is difficult to prevent flux contamination, and it is necessary to clean dirty items more than necessary, which increases man-hours.
また，回路基板のスルーホールを弾性樹脂でおおつ九り
，弾性接着剤で小径にしたりする場合でも，基板の製作
工程の複雑化，コストアップをまねくという欠点があっ
た。まｔ，基板に弾性体を具備している為，半田付時に
基板が直接半田に接し，基板が半田温度と同等に加熱さ
れ基板が膨張し，それにつれて弾性体の膨張をきたす。Furthermore, even when the through-holes of the circuit board are covered with elastic resin and made smaller in diameter with elastic adhesive, there is a drawback that the manufacturing process of the circuit board becomes complicated and the cost increases. Furthermore, since the board is equipped with an elastic body, the board comes into direct contact with the solder during soldering, and the board is heated to the same temperature as the soldering temperature, causing the board to expand and the elastic body to expand accordingly.
それに抗するように弾性体の部品端子挿入穴が縮少する
事は不可能で端子挿入部分に微少すき間が生じフラツク
ス浸入をき九すなどの問題があつ危。It is impossible for the component terminal insertion hole of the elastic body to shrink to resist this, and there is a risk that problems such as a slight gap will be created in the terminal insertion part, which will prevent flux from penetrating.
この発明は上記のような問題点を解消する几めになされ
たもので，特別な処理をほどこさない基板を用いたフラ
ツクス塗布においてフラツクスが上昇しないような回路
部品を得る事を目的とする。This invention has been devised to solve the above-mentioned problems, and its purpose is to obtain a circuit component in which flux does not increase during flux application using a substrate that is not subjected to any special treatment.
この発明に係る回路部品は基板挿入端子にゴム状の伸縮
性のある遮へい体を圧入もしくは接着しフラツクス上昇
を防止したものである。In the circuit component according to the present invention, a rubber-like elastic shield is press-fitted or bonded to the board insertion terminal to prevent flux from rising.
この発明における回路部品は．ゴム状の遮へい体によっ
て基板挿入端子を包み込みフラツクス上昇するすき間を
密封する作用を呈する。The circuit components in this invention are. The rubber-like shielding body wraps around the board insertion terminal and has the effect of sealing the gap where flux rises.
そして，このゴム状の遮へい体は基板に固定されている
ものではなく，回路部品側に弾性遮へい体を具備する為
，基板の加熱膨張とは無関係で，熱により回路部品が具
備する弾性遮へい体と挿入端子との間に微少すき間は発
生しない。This rubber-like shield is not fixed to the circuit board, but is provided with an elastic shield on the circuit component side, so it is unrelated to the thermal expansion of the circuit board, and the elastic shield of the circuit component is affected by heat. There is no slight gap between the terminal and the insertion terminal.
以下，この発明の一実施例を図について説明する。第１
図において．（自）はゴム状の板でフラツクス上昇を遮
へいする絶縁性の遮へい体である。その他，第３図から
第１６図と同一番号は同一または相当部分を表す〇
次に動作について説明する。回路部品の胴部゜となるコ
ネクタインシュレータ１１１ ， ＋４１に挿入されて
いる接触子端子１２） ， ＋５１は基板Ｑ３に挿入す
る挿入端子（３ａ） ，（ｓｂ）を突出している。一方
インシュレータｆｉ＋ ， （４１の基板Ｑ３に接する
部分は突起恨ηが出ている。挿入端子（５ａ），（３ｂ
）のピッチに係合した切込みを有するゴム状の遮へい体
（至）を有し，挿入端子（３ａ） ， （３ｂ）に圧大
してや夛インシュレータｉｌ＋ ， ＋４３両端の突起
ａηの間に密着させる。挿入端子（３ａ） ，（３ｂ）
に係合した切込みは針状のもので切り込みを入れただけ
で中空穴を明けたものではない。従って挿入端子（３ａ
） ， （３ｂ）に圧入すると挿入端子に密着しすき間
を持たない。従って第２図に示すように，基板Ｑ３に挿
入しフラツクス浴に浸漬してもフラツクスａ３はスルー
ホールαυ内迄．矢印のごとくフラツクス上昇経路Ｉを
上昇するが，遮へい体翰に妨げられ接触子端子（２１
， （５）迄上昇する事はない。An embodiment of the present invention will be described below with reference to the drawings. 1st
In the figure. (Self) is an insulating shield made of a rubber-like plate that blocks the rise in flux. In addition, the same numbers as in FIGS. 3 to 16 represent the same or corresponding parts. Next, the operation will be explained. The contact terminals 12), +51 inserted into the connector insulators 111, +41, which form the body of the circuit component, protrude insertion terminals (3a), (sb) to be inserted into the board Q3. On the other hand, the parts of the insulators fi+, (41) in contact with the board Q3 have protrusions η. The insertion terminals (5a), (3b
) has a rubber-like shield (to) having a notch that engages with the pitch of the insulators (3a) and (3b), and is compressed onto the insertion terminals (3a) and (3b) and is brought into close contact between the protrusions aη at both ends of the insulators il+ and +43. Insertion terminal (3a), (3b)
The notch that engaged with was needle-like and was just a notch, not a hollow hole. Therefore, the insertion terminal (3a
), (3b), it will fit tightly to the insertion terminal without leaving any gaps. Therefore, as shown in FIG. 2, even if it is inserted into the substrate Q3 and immersed in a flux bath, the flux a3 will reach the inside of the through hole αυ. The flux ascends along the upward path I as shown by the arrow, but it is blocked by the shielding body and the contact terminal (21
, it will not rise to (5).
遮へい体■は圧入だけで充分その効果を発揮するが．さ
らに信頼性を増す為に挿入端子（３ａ），（３ｂ）との
保合面を接着剤で封止すればより効果的である。The shielding body ■ can be sufficiently effective just by being press-fitted. Furthermore, in order to increase reliability, it is more effective to seal the retaining surfaces with the insertion terminals (3a) and (3b) with an adhesive.
このように回路部品側に遮へい体囚を設けてフラツクス
の浸入を防止する場合は，フランクスの浸入を防止する
ことが重要な回路部品にのみ遮へい体翰をほどこし．さ
ほど問題とならない回路部品には遮へい体をほどこさな
いという取捨選択が容易にできる。九とえば，上記実施
例のコネクタなどは，端子が密集しているうえ．他のコ
ネクタとの接触が大事なため．遮へい体の使用が奨励さ
れるべきものである。When installing a shield on the circuit component side to prevent flux infiltration in this way, apply the shield only to circuit components where it is important to prevent flux infiltration. It is easy to choose not to provide shielding to circuit components that do not pose much of a problem. For example, the connectors of the above embodiments have terminals crowded together. Because contact with other connectors is important. The use of shielding should be encouraged.
なお上記実施例では，突起ａＤによシ回路部品の胴部で
あるインシュレータｔｔ＋ ． （４１と基板Ｑ邊の間
につくられた空間αｅに絶縁遮へい板を配置する例を示
Ｅ７たが，回路部品によってはこのような空間αｅかな
い場合もある。その場合でも，回路部品の端子に絶縁遮
へい体を密着すればよい。密着によ夛絶縁遮へい板は端
子からはずれることがまく，回路部品の移動時や基板α
ａへの挿入時に，脱落することもなく，通常通りのオペ
レーションで組立て．アセンブリができる。また，空間
ａＩ１はフラツクスの上昇防止のために設けられたもの
であるが，この実施例のように遮へい体翰を空間ａｄに
配置すれば従来のコネクタの形状．外観をなんら変更す
ることなく利用することができる。また，従来は空間＋
ＩＩを広くとることが．フラツクス上昇をよル防止でき
たのに対して，ｆｌへい体四を用いることによシ窒間（
自）を狭くすることができる。たとえば遮へい体翰を薄
膜状に形成できれば空間（至）はほ望必要なくなシ，よ
シ小さなコネクタを作製することができる。また．上記
実施例では，コネクタの場合を示したが．空間ＤＩが存
在しない抵抗，コンデンサ，ＩＣチップなどその他の回
路部品の場合でもよい。In the above embodiment, the projection aD is connected to the insulator tt+. which is the body of the circuit component. (E7 shows an example in which an insulating shield plate is placed in the space αe created between 41 and the side of the board Q, but depending on the circuit component, such a space αe may not exist. Even in that case, The insulating shield can be placed in close contact with the terminal.Due to close contact, the insulating shield may easily come off from the terminal, and when moving circuit components or touching the board α.
When inserted into A, it did not fall off and was assembled using normal operations. Can be assembled. Also, although the space aI1 is provided to prevent flux from rising, if the shielding body is placed in the space ad as in this embodiment, the shape of the conventional connector can be achieved. It can be used without changing the appearance in any way. In addition, conventionally space +
It is possible to take a wide range of II. While we were able to prevent the flux from rising, the use of fl shields prevented the flux from rising (
) can be narrowed. For example, if the shielding body can be formed into a thin film, there will be no need for space, and a much smaller connector can be manufactured. Also. In the above example, the case of a connector was shown. Other circuit components such as resistors, capacitors, and IC chips that do not have a space DI may also be used.
また，上記実施例では，ゴム状の絶縁性遮へい体の場合
を示したが．端子に密着できる弾性を有する材質のもの
であればよい。また，形状も板状に限られるものではな
く，円形状，球状，円柱状のものでもよい。さらに，ひ
とつの遮へい体翰で多数の端子に密着している必要はな
く，ひとつの遮へい体四でひとつ以上の端子に密着して
いればよい。そして，ひとつの遮へい体（自）で複数の
端子に密着する場合は，遮へい体翰は絶縁体でなければ
ならないが，ひとつの遮へい体翰がひとつの端子にしか
密着しない場合は．絶縁体である必要はないが．他の部
品や基板の他の回路パターンとの接触の危険があるため
．この場合でも絶縁体でおることが望ましい。Furthermore, in the above example, the case of a rubber-like insulating shield was shown. Any material may be used as long as it has elasticity that allows it to come into close contact with the terminal. Moreover, the shape is not limited to a plate shape, but may be circular, spherical, or cylindrical. Furthermore, it is not necessary that one shielding body be in close contact with a large number of terminals; it is sufficient that one shielding body 4 be in close contact with one or more terminals. If one shielding body (self) is in close contact with multiple terminals, the shielding body must be an insulator, but if one shielding body (self) is in close contact with only one terminal. It doesn't have to be an insulator. There is a risk of contact with other parts or other circuit patterns on the board. Even in this case, it is desirable to use an insulator.
以上のようにこの発明によれば，回路部品の基板に挿入
する端子に遮へい体を圧入もしくは接着する事によ夛．
７シックス浴に浸漬してもフラツクスが上昇してこない
ので，組立工数を削減でき信頼性の高いものが得られる
効果がある。また，遮へい体を回路部品側に設けること
により，基板側に設けるよ）容品にフランクスの侵入防
止が達成できる効果がある。As described above, according to the present invention, the shielding body is press-fitted or bonded to the terminal inserted into the board of the circuit component.
Since the flux does not rise even when immersed in the 76 bath, the number of assembly steps can be reduced and a highly reliable product can be obtained. In addition, by providing the shield on the circuit component side, it is possible to prevent franks from entering the container (as compared to providing the shield on the board side).
第１図はこの発明の一実施例によるコネクタを示す基板
挿入側から見た外観斜視図，
第２図はこの発明に係るコネクタを基板に挿入しフラツ
クス浴に浸漬した時の断面図８第３図は従来のコネクタ
のべローズタイプの雄側コネクタ斜視図．
第４図は同雌側斜視図．
第５図は第３図のＡ−Ａ断面図，
第６図は第４図のＢ−Ｂ断面図，
第１図は第３図と第４図のコネクタを嵌合した時の断面
図，
第８図は第７図の接触子の拡大図，
第９図はピンコンタクトタイプの雄側コネクタ外観斜視
図，
第１０図は同ソケットコネクタ外観斜視図．第１１図は
第９図と第１０図のコネクタを嵌合．した時の断面図，
第１２図はコネクタの基板に挿入する挿入端子側から見
た外観斜視図，
第１３図は基板のスルーホールの位置関係を表す図，
第１４図は従来のコネクタを基板に挿入してフラツクス
浴に浸漬した時の７ラックス上り経路を示す図，
第１５図にビンコンタクト形状のコネクタのフラックス
上夛経路を示す図，
第１ｓ図はフラックス上り防止例の従来例として樹脂封
正方法を示す図，
第１１図はフラックス上シ防止例の従来例としてスルー
ホールを弾性樹脂でおおった基板を示す図，
第１８図はフラツクス上シ防止例の従来例としてスルー
ホールよシ小径の小径孔をもつ基板を示す図である。
ｉｌ＋ ， （４１ ．（６１ ， ＜８１・・・イン
シュレータ， （２１ ，（５）・・・接触子端子＃
（３ａ），（３ｂ），（５ｃ），（３ｄ） −・・基板
挿入端子，ａ１）・・・スルーホール．ａＸ８・・・基
板，ｆｌト・フラックス，Ｉ・・・フラックス上昇経路
． （１！９゜・・フラックス汚れ，Ｑｌｌ９・・・空
間
．ａη・・・突起，翰・・・遮へい体。FIG. 1 is an external perspective view of a connector according to an embodiment of the present invention, seen from the board insertion side. FIG. 2 is a sectional view of the connector according to the present invention inserted into a board and immersed in a flux bath. The figure is a perspective view of a conventional bellows-type male connector. Figure 4 is a perspective view of the female side. Figure 5 is a cross-sectional view taken along line A-A in Figure 3, Figure 6 is a cross-sectional view taken along line B-B in Figure 4, Figure 1 is a cross-sectional view when the connectors in Figures 3 and 4 are fitted together, Figure 8 is an enlarged view of the contact shown in Figure 7, Figure 9 is an external perspective view of the pin contact type male connector, and Figure 10 is an external perspective view of the same socket connector. Figure 11 shows the connectors shown in Figures 9 and 10 mated together. Figure 12 is a perspective view of the external appearance of the connector as seen from the insertion terminal side inserted into the board, Figure 13 is a diagram showing the positional relationship of the through holes in the board, and Figure 14 is a diagram of the conventional connector inserted into the board. Fig. 15 is a diagram showing the flux build-up path of a bottle contact-shaped connector, and Fig. 1s is a conventional example of preventing flux build-up using resin. Figure 11 shows a board with through-holes covered with elastic resin as a conventional example of preventing flux over-shielding, and Figure 18 shows a conventional example of through-holes and sealing as an example of preventing flux over-shielding. FIG. 3 is a diagram illustrating a substrate having a small diameter hole. il+, (41.(61, <81... Insulator, (21, (5)... Contact terminal #
(3a), (3b), (5c), (3d) --- Board insertion terminal, a1) ---Through hole. aX8...Substrate, flux, I...Flux rising path. (1!9°...Flux stain, Qll9...Space. aη...Protrusion, ridge...Shielding body.
Claims (1)
れる端子とこの端子の一端を保持する胴部を有する回路
部品において，印刷配線板に半田付けされたとき回路部
品の胴部と印刷配線板の間にくるように端子の周囲に密
着して回路部品側に保持された遮へい体を備えたことを
特徴とする回路部品。In a circuit component that has a terminal that is inserted into a hole in a printed wiring board and soldered to the printed wiring board, and a body that holds one end of this terminal, the body of the circuit component and the printed wiring board when soldered to the printed wiring board. A circuit component characterized by comprising a shield held on the circuit component side in close contact with the periphery of a terminal so as to be located between wiring boards.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1053578A JPH02234369A (en) | 1989-03-06 | 1989-03-06 | Circuit component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1053578A JPH02234369A (en) | 1989-03-06 | 1989-03-06 | Circuit component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02234369A true JPH02234369A (en) | 1990-09-17 |
Family
ID=12946717
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1053578A Pending JPH02234369A (en) | 1989-03-06 | 1989-03-06 | Circuit component |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02234369A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH067165U (en) * | 1992-06-30 | 1994-01-28 | ミツミ電機株式会社 | connector |
| JPH10302927A (en) * | 1997-04-24 | 1998-11-13 | Aipetsukusu:Kk | Manufacture of connector |
| JP2010003811A (en) * | 2008-06-19 | 2010-01-07 | Fujitsu Ltd | Printed board unit, and electronic component |
-
1989
- 1989-03-06 JP JP1053578A patent/JPH02234369A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH067165U (en) * | 1992-06-30 | 1994-01-28 | ミツミ電機株式会社 | connector |
| JPH10302927A (en) * | 1997-04-24 | 1998-11-13 | Aipetsukusu:Kk | Manufacture of connector |
| JP2010003811A (en) * | 2008-06-19 | 2010-01-07 | Fujitsu Ltd | Printed board unit, and electronic component |
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