JPH02224900A - Heat insulating device for hot plate in hot press - Google Patents
Heat insulating device for hot plate in hot pressInfo
- Publication number
- JPH02224900A JPH02224900A JP4878089A JP4878089A JPH02224900A JP H02224900 A JPH02224900 A JP H02224900A JP 4878089 A JP4878089 A JP 4878089A JP 4878089 A JP4878089 A JP 4878089A JP H02224900 A JPH02224900 A JP H02224900A
- Authority
- JP
- Japan
- Prior art keywords
- plate
- heat insulating
- hot
- heat
- plates
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000919 ceramic Substances 0.000 claims abstract description 4
- 238000000034 method Methods 0.000 claims description 2
- 238000007731 hot pressing Methods 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 abstract description 24
- 238000007906 compression Methods 0.000 abstract description 4
- 230000006835 compression Effects 0.000 abstract description 4
- 238000000465 moulding Methods 0.000 abstract description 4
- 230000003247 decreasing effect Effects 0.000 abstract description 3
- 239000012530 fluid Substances 0.000 abstract 2
- 230000000630 rising effect Effects 0.000 abstract 2
- 238000009413 insulation Methods 0.000 description 7
- 229910010293 ceramic material Inorganic materials 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 238000003754 machining Methods 0.000 description 4
- 230000001174 ascending effect Effects 0.000 description 2
- 239000010720 hydraulic oil Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 239000010425 asbestos Substances 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 239000004568 cement Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007907 direct compression Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B30—PRESSES
- B30B—PRESSES IN GENERAL
- B30B15/00—Details of, or accessories for, presses; Auxiliary measures in connection with pressing
- B30B15/06—Platens or press rams
- B30B15/062—Press plates
- B30B15/064—Press plates with heating or cooling means
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Press Drives And Press Lines (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は被圧締物を熱板間に挿入し、加熱・圧締するこ
とにより所定のプレス成形を行うためのホットプレスに
係り、特に最上段熱板と上盤の間及び最下段熱板と可動
盤の闇に断熱構造を備えたものに関する。Detailed Description of the Invention (Field of Industrial Application) The present invention relates to a hot press for performing predetermined press forming by inserting an object to be pressed between hot plates and heating and pressing it. It relates to a heat insulating structure between the top heating plate and the upper plate and between the bottom heating plate and the movable plate.
（従来の技術）
従来からホットプレスの最上段熱板と上盤の間及び最下
段熱板と可動盤の間には格子を設け、該格子の枠内に該
格子より僅かに厚い断熱板を配設する断熱構造がとられ
てきた。そして断熱板として通常へミツト板と呼ばれる
石綿セメント板（以後へミツト板という）が多く用いら
れてきた。(Prior art) Traditionally, a lattice has been provided between the top heating plate and the upper plate of a hot press, and between the bottom heating plate and the movable plate, and a heat insulating plate slightly thicker than the lattice is placed within the frame of the lattice. A heat-insulating structure has been adopted. Asbestos cement boards (hereinafter referred to as Hemits boards), commonly called Hemits boards, have been often used as heat insulating boards.
（発明が解決しようとする課題）
しかしながら最近ではプレス時において高温加熱及び高
い平行精度を要求する成形品が増加している。このため
断熱構造全体としての断熱効果を上げるとともに、該断
熱構造にあって直接圧締力を受ける断熱部材の厚さや平
行の精度を向上させ且つ圧縮変形量を極力小さく押さえ
る必要にせまられてきた。また断熱板の耐熱温度そのも
のも被圧締物の成形温度が４５０℃を越えるような場合
にはへミツト板では限界となってくる。(Problems to be Solved by the Invention) Recently, however, there has been an increase in the number of molded products that require high temperature heating and high parallelism accuracy during pressing. For this reason, it has become necessary to increase the insulation effect of the insulation structure as a whole, improve the thickness and parallelism accuracy of the insulation members in the insulation structure that receive direct compression force, and keep the amount of compressive deformation as small as possible. . In addition, the heat resistance temperature of the heat insulating plate itself reaches its limit when the molding temperature of the material to be pressed exceeds 450°C.
（課題を解決するための手Ｒ）
本発明はかかる事情を背景として為されたものであって
、上盤に対する可動盤の近接作動に基づいて、該上盤と
可動盤との闇に配設された熱板間に挿入した被圧締物を
加熱圧締するホットプレスに於いて、該上盤と可動盤に
それぞれ熱板を固定する際、熱板からの熱を遮断するた
め該上盤と可動盤のそれぞれの熱板の間に平行な間隔を
維持するように複数のセラミック短柱状の断熱受圧部材
を設けたものであり、必要に応じて上盤と可動盤のそれ
ぞれの熱板の間又は上盤と可動盤のいずれかの熱板の間
に輻射熱を防止するための、断熱受圧部材の位置決め穴
を有する１又は複数の位置決め断熱部材を設け、さらに
前記位置決め断熱部材を格子の枠内に配設可能としたも
のである。(Method R for Solving the Problems) The present invention has been made against the background of the above circumstances, and based on the proximity operation of the movable plate to the upper plate, the movable plate is disposed in the darkness between the upper plate and the movable plate. In a hot press that heats and presses an object to be pressed that is inserted between heated hot plates, when fixing the hot plates to the upper plate and the movable plate, the upper plate is used to cut off the heat from the hot plate. A plurality of ceramic short column-shaped heat insulating pressure receiving members are provided to maintain parallel spacing between the heating plates of the upper plate and the movable plate, and as necessary between the heating plates of the upper plate and the movable plate or the upper plate. and one or more positioning heat insulating members having positioning holes for the heat insulating pressure receiving member to prevent radiant heat between the heat plate and the movable platen, and furthermore, the positioning heat insulating member can be arranged within the frame of the lattice. This is what I did.
（作 用）
最上段熱板の上面と上盤の下面の間にあって、該最上段
熱板の上表面全体にわたって設けた位置決め断熱部５材
が最上段熱板から上盤への輻射及び対流による伝熱を断
ち、且つ該位置決め断熱部材より厚さが厚く直接圧締力
を受ける断熱受圧部材を前記位置決め断熱部材に所定数
遊嵌若しくは挿嵌する構成が伝導による伝熱ｉ′ｌ：従
来のへミツト板の略全面当り方式の２／３程度に減少せ
しめる。(Function) The positioning heat insulating part 5 material, which is located between the upper surface of the uppermost heating plate and the lower surface of the upper plate and is provided over the entire upper surface of the uppermost heating plate, prevents radiation and convection from the uppermost heating plate to the upper plate. Heat transfer by conduction i′l: A configuration in which a predetermined number of heat-insulating pressure-receiving members that are thicker than the positioning heat-insulating member and receive a direct clamping force are loosely fitted or inserted into the positioning heat-insulating member to cut off heat transfer. It is reduced to about 2/3 of the system in which the hemit plate is hit almost on the entire surface.
また断熱受圧部材にセラミック材を用いることにより、
従来のへミツト板に比へて圧縮変形量が１／４程度とな
り、厚さ・平行度等の加工精度も２〜３倍程度（例えば
厚さムラを０．１ｍＩＴ′から０゜０５ｍ″＋）に容易
に上げることができるので、ブレス圧締時において断熱
受圧部材の圧縮部分と非圧縮部分の圧縮変形量の差が小
さく自身の厚さ・平行度の高い精度とあいまって該断熱
受圧部材が被圧締物を全面にわたって均等に圧締可能な
らしめるように作用するのである０以上は最下段熱板の
下面と可動盤の上面の間にあっても全く同様であり説明
を詳略する。In addition, by using ceramic material for the heat-insulating pressure-receiving member,
The amount of compressive deformation is about 1/4 of that of conventional hemit plates, and the machining accuracy of thickness, parallelism, etc. is about 2 to 3 times (for example, thickness unevenness can be reduced from 0.1 mIT' to 0°05 m''+ ), the difference in the amount of compressive deformation between the compressed part and the uncompressed part of the heat insulating pressure receiving member is small during press compression, and combined with the high precision of its own thickness and parallelism, the heat insulating pressure receiving member 0 or more acts to enable the object to be pressed to be pressed uniformly over the entire surface.The same is true even if it is located between the lower surface of the lowest heat plate and the upper surface of the movable platen, so the explanation will be omitted in detail.
（実 施 例）
以下本発明をより一層具体的に明らかにするために、そ
の一実施例を図面の第１図乃至第３図に従って詳細に説
明する。(Embodiment) In order to clarify the present invention more specifically, an embodiment thereof will be described in detail below with reference to FIGS. 1 to 3 of the drawings.
１はホットプレスの圧締シリンダであって、その鍔部の
四隅に４本のステー２をナツト４にて固定して立設して
いる。該４本のステー２の上部にはナツト４にて固定し
て上盤３を配設している。５は可動盤であって圧締シリ
ンダ１に挿嵌したラムＩＡの先端に固定している。６は
該可動盤の可動盤ガイドである。７は上盤３に固定した
最上段熱板、１０は可動盤５に固定した最下断熱板であ
り８．９は最上段熱板と最下段熱板の中間に配設された
中間熱板である。中間熱板８，９は可動盤が下降してい
るときは段板又は段仮に相当するストッパ（いずれも図
示せず）上に通常４ケの爪１１及び同じく通常４ケの爪
１２をそれぞれ介して載置され一定の熱板間隔を保って
いる。本例は合計４枚の熱板からなる３段ホットプレス
である。最上段熱板７と上ｆＩＩ３の闇及び最下段熱板
１０と可動盤５の間にはそれぞれ格子２０、位置決め断
熱部材２１及び断熱受圧部材２２を設けている０本例に
おいては位置決め断熱部材２１を複数（４枚）とし水平
方向の横ズレな防止するため格子２０の中に位置決めし
て配設している。該位置決め断熱部材２１はセラミック
材とすることができ、熱板からの輻射及び対流による伝
熱を阻止する目的をもつもの故４枚の合計面積を対向す
る熱板の面積と路面−としてばば熱板の表面全体をおお
うようにしている。該位置決め断熱部材２１には所定数
の断熱受圧部材２２を遊嵌若しくは挿嵌するための位置
決め穴２１Ａが設けである。一般的には格子２０の枠内
に位置決め断熱部材２１を完全に隙間なく配設する必要
はなく３〜４ｍｍの遊びをとり、従って該位置決め断熱
部材２１の位置決め穴２１Ａも断熱受圧部材２２が２ｍ
ｌ″′前後の隙間をもって遊嵌される程度の大きさとす
ればよい。また位置決め断熱部材２１を寸法的に１枚で
製造可能な小型のホットプレスにあっては当然ながら格
子２０は省略することができる。位置決め断熱部材２１
に遊嵌又は挿嵌される所定数の断熱受圧部材２２は両端
面が平行でその厚さ寸法が全て同一の短柱試の部材であ
って、本例では断面円形のセラミック材を使用している
。セラミック材としてはポーラス状のコープイライトが
最適なものの一つであって、その特性は圧縮強度が２７
００ ｋｇ／ｅｍ”圧縮変形量が面圧２００ｋｇ／ｃｍ
２のときおよそ０．０５ ｍｆｆ１、熱伝導率が０ 、
００３ ｃａｌ／ｃｍ −５ｅｅ・℃ となっている。Reference numeral 1 denotes a hot press clamping cylinder, and four stays 2 are fixed and erected at the four corners of the flange with nuts 4. An upper plate 3 is disposed above the four stays 2 and fixed with nuts 4. Reference numeral 5 denotes a movable platen fixed to the tip of the ram IA inserted into the clamping cylinder 1. 6 is a movable plate guide of the movable plate. 7 is the uppermost heat plate fixed to the upper plate 3, 10 is the lowermost heat insulating plate fixed to the movable plate 5, and 8.9 is the intermediate heat plate disposed between the uppermost heat plate and the lowermost heat plate. It is. When the movable platen is lowered, the intermediate hot plates 8 and 9 are placed on a stepped plate or a stopper (none of which is shown) corresponding to the stepped plate through normally four pawls 11 and normally four pawls 12, respectively. The heating plates are placed at a constant distance from each other. This example is a three-stage hot press consisting of a total of four hot plates. A grid 20, a positioning heat insulating member 21, and a heat insulating pressure receiving member 22 are provided between the uppermost heat plate 7 and the upper fII3 and between the lowermost heat plate 10 and the movable platen 5. In this example, a positioning heat insulating member 21 is provided. A plurality of (four) sheets are positioned and arranged in the grid 20 to prevent horizontal displacement. The positioning heat insulating member 21 can be made of a ceramic material, and has the purpose of blocking heat transfer by radiation and convection from the hot plates, so the total area of the four pieces is taken as the area of the opposing hot plates and the road surface. It covers the entire surface of the board. The positioning heat insulating member 21 is provided with positioning holes 21A into which a predetermined number of heat insulating pressure receiving members 22 are loosely fitted or inserted. Generally, it is not necessary to arrange the positioning heat insulating member 21 within the frame of the lattice 20 without any gaps, and there is a play of 3 to 4 mm. Therefore, the positioning hole 21A of the positioning heat insulating member 21 is
It is sufficient that the size is such that it can be fitted loosely with a gap before and after l'''.Also, in the case of a small-sized hot press that can manufacture the positioning heat insulating member 21 in one piece, the grid 20 can of course be omitted. Positioning heat insulating member 21
The predetermined number of heat-insulating pressure-receiving members 22 that are loosely fitted or inserted into the structure are short columnar members with parallel end faces and the same thickness, and in this example, ceramic materials with a circular cross section are used. There is. Porous copillite is one of the most suitable ceramic materials, and its characteristics include a compressive strength of 27.
00 kg/em” Compression deformation amount is surface pressure 200 kg/cm
2, approximately 0.05 mff1, thermal conductivity is 0,
003 cal/cm -5ee・℃.
これを従来のへミツト板と比較すると圧縮強度が約３倍
、圧縮変形量が約１／４、熱伝導率は約２倍となってい
る。圧縮強度が従来のへミツト板に比べておよそ３倍と
いうことは同じ面圧を受ける場合にはその受圧面積を１
／３にできるということであり第４図に示した従来の断
熱構造、すなわち格子１００の枠内全面に該格子１００
より僅かに厚い断熱板たるヘミット板２００ｔ−配設す
る構成に対し、圧縮変形量も考慮して算出した所定数の
断熱受圧部材により受圧面積すなわち断熱面積を従来の
１／３〜１／４とすることによってコープイライトの熱
伝導率がヘミット板に比べて約２倍大きいにもかかわら
ず全体の伝導による伝熱量をヘミット板に比べて２／３
程度と減少せしめているのである。又コープイライトは
加工精度の悪いヘミット板に比べて容易にその加工精度
をあげることができ、例えば厚さ精度において従来のへ
ミツト板においては±０゜１ ｍｍ程度の加工精度が限
界であったものを加工面積が減ったこととあいまってコ
ープイライトによる断熱受圧部材２２にあっては±０．
０５程度は容易に得ることができるものである。またコ
ープイライトの耐熱温度は１０００℃を越えておりあら
ゆる成形品に対応できる０以上詳述した断熱受圧部材２
２は、断熱部材であるとともに受圧部材でもあるので当
然位置決め断熱部材２１よりも厚さが厚い０位置決め断
熱部材２１と格子２０の厚さ関係はどちらが厚くてもか
まわないが該格子２０の厚さを断熱受圧部材２２より薄
く構成することはいうまでもない、最上段熱板７に合わ
せて該最上段熱板７の上面に格子２０ｔ−載置し、該格
子２０の枠内に４枚の位置決め断熱部材２１を配設し、
該位置決め断熱部材２１の位置決め穴２１Ａに所定数の
断熱受圧部材２２を遊嵌した状態で最上段熱板７を格子
２０の横ズレを許すことなく上盤３に固定（図示せず）
する、所定数の断熱受圧部材２２の平行端面が最上段熱
板７の上面と上盤３の下面にそれぞれ当接する。最下段
熱板１０と可動盤５の闇にあっても同様の構成となる。Comparing this to a conventional hemit board, the compressive strength is about 3 times, the amount of compressive deformation is about 1/4, and the thermal conductivity is about twice as high. The compressive strength is approximately three times that of conventional Hemitsu plates, which means that when receiving the same surface pressure, the pressure receiving area is 1
/3, and the conventional heat insulation structure shown in FIG.
For a configuration in which a slightly thicker heat insulating board, 200t Hemit plate, is installed, the pressure receiving area, that is, the heat insulating area is reduced to 1/3 to 1/4 of the conventional one by using a predetermined number of heat insulating pressure receiving members calculated taking into account the amount of compressive deformation. As a result, although the thermal conductivity of corpeillite is approximately twice as high as that of a Hemit plate, the overall amount of heat transferred by conduction is 2/3 that of a Hemit plate.
The extent of this is decreasing. In addition, the machining accuracy of corpeilite can be easily improved compared to hemit plates, which have poor machining accuracy.For example, in terms of thickness accuracy, conventional hemit plates had a machining accuracy of about ±0°1 mm. Coupled with the reduction in the processing area, the heat insulating pressure receiving member 22 made of copillite has a reduction of ±0.
A value of about 0.05 can be easily obtained. In addition, the heat-resistant temperature of corpeilite exceeds 1000℃, and it can be used for all molded products.
2 is a heat insulating member as well as a pressure receiving member, so it is naturally thicker than the positioning heat insulating member 21.0 Regarding the thickness relationship between the positioning heat insulating member 21 and the grid 20, it does not matter which one is thicker, but the thickness of the grid 20 Needless to say, the lattice 20t is made thinner than the heat insulating pressure receiving member 22. A lattice 20t is placed on the upper surface of the uppermost heating plate 7 in line with the uppermost heating plate 7, and four sheets are placed within the frame of the lattice 20. A positioning heat insulating member 21 is arranged,
With a predetermined number of heat insulating pressure receiving members 22 loosely fitted into the positioning holes 21A of the positioning heat insulating member 21, the uppermost heat plate 7 is fixed to the upper plate 3 without allowing the lattice 20 to shift laterally (not shown).
The parallel end surfaces of the predetermined number of heat-insulating pressure-receiving members 22 abut on the upper surface of the uppermost heat plate 7 and the lower surface of the upper plate 3, respectively. Even in the darkness between the lowest heating plate 10 and the movable platen 5, the same configuration is achieved.
（作 動） ノ次に作動について説明する。(action) Next, the operation will be explained.
第１図はホットプレスの可動！５が下降限度にある状態
であって、一定の間隔を保った熱板上、すなわち中間熱
板８．９及び最下段熱板１０上に被圧締物３０がそれぞ
れ挿入・載置されている。圧締シリンダ１に作動油が供
給されるとラムＩＡが上昇を始め、該ラムＩＡの先端に
固定して設けた可動盤５が４本のステー２に可動盤ガイ
ド６によってガイドされながら上昇する。上昇限度寸前
で上昇速度がスローダウンし、しかる後被圧締物３０の
圧締が開始される。すべての熱板の昇温が開始され設定
された温度に保つための温度コントロールが行なわれる
。圧締力換言すればラムＩＡに作用する作動油の圧力も
必要に応じて何段階にも圧力コントロールされる。各熱
板から被圧締物３０に熱の供給が行なわれるが、最上段
熱板７の上面から上盤３の下面及び最下段熱板１０の下
面から可動盤５の上面への熱の移動は阻止しなければな
らない、又圧締は高い平行精度を保って行なわれる必要
がある。これらのことについては（作用）の欄で詳述し
た通りである。加熱工程が終了すると通常は熱板が冷却
され被圧締物３０を冷却する。Figure 1 shows the hot press moving! 5 is at its lowering limit, and the pressurized objects 30 are inserted and placed on the hot plates kept at constant intervals, that is, on the intermediate hot plate 8.9 and the lowest hot plate 10, respectively. . When hydraulic oil is supplied to the clamping cylinder 1, the ram IA begins to rise, and the movable platen 5 fixedly provided at the tip of the ram IA rises while being guided by the four stays 2 and the movable platen guide 6. . The ascending speed slows down just before the ascending limit, and then the clamping of the object 30 to be compressed is started. The temperature of all hot plates begins to rise and temperature control is performed to maintain the set temperature. In other words, the pressure of the hydraulic oil acting on the ram IA is controlled in multiple stages as necessary. Heat is supplied from each hot plate to the pressurized object 30, but heat is transferred from the upper surface of the uppermost hot plate 7 to the lower surface of the upper plate 3 and from the lower surface of the lowermost hot plate 10 to the upper surface of the movable platen 5. must be prevented, and the clamping must be performed with high parallelism accuracy. These matters are as described in detail in the (effect) section. When the heating process is completed, the hot plate is usually cooled down and the object 30 to be pressed is cooled down.
冷却終了後可動盤５が下降し、成形された被圧締物３０
が取り出されて−サイクルが終了する。After cooling, the movable platen 5 is lowered and the pressed object 30 is formed.
is removed - the cycle ends.
（効 果）
最上段熱板と上盤及び最下段熱板と可動盤の間の断熱効
果の向上により、上盤や可動盤の熱変形（主としてソリ
）が無視できる程度に小さくなり、結果として成形品の
変形も小さくなる。最上段熱板及び最下段熱板の昇温遅
れや中間熱板との温度差が解消され、未硬化、未焼成、
未加硫、ボイド等の成形不良を駆逐した高品質の成形品
が得られる。又圧縮変形量が極めて小さく、且つ加工精
度の良いセラミック材を断熱受圧部材として用いること
により被圧締物を全面にわたって均等に圧締可能とし、
結果として高い平行精度の成形品を得ることができる。(Effect) By improving the insulation effect between the top heating plate and the upper plate, and between the bottom heating plate and the movable plate, the thermal deformation (mainly warping) of the upper plate and the movable plate becomes negligible, and as a result, Deformation of the molded product is also reduced. The delay in temperature rise between the top and bottom heating plates and the temperature difference between them and the intermediate heating plate has been eliminated, resulting in uncured, unbaked,
High-quality molded products can be obtained that eliminate molding defects such as unvulcanization and voids. In addition, by using a ceramic material with extremely small amount of compression deformation and high processing precision as the heat insulating pressure receiving member, it is possible to press the object to be pressed evenly over the entire surface.
As a result, a molded product with high parallelism accuracy can be obtained.
第１図は本発明の一実施例を示す正面図であり、第２図
は第１図のＩＩ −ＩＩ矢視における要部図、第３図は
第２図のＩＩＮ −ＩＩ！矢視断面図、第４図は第３図
に相当する従来例を示す図である。
１：圧締シリンダ ＩＡ、ラ ム
３：上 ！ ５°可動盤
７：最上段熱板 ８：中間熱板
９：中間熱板 １０．最下段熱板
２０：格 子 ２１：位置決め断熱部材２１Ａ：
位置決め穴 ２２：断熱受圧部材３０：被圧締物FIG. 1 is a front view showing one embodiment of the present invention, FIG. 2 is a main part view taken along arrow II-II in FIG. 1, and FIG. 3 is a front view showing an embodiment of the present invention. A sectional view taken in the direction of arrows, FIG. 4 is a diagram showing a conventional example corresponding to FIG. 3. 1: Clamping cylinder IA, ram 3: Top! 5° movable plate 7: Top heating plate 8: Intermediate heating plate 9: Intermediate heating plate 10. Lowermost heat plate 20: Grating 21: Positioning heat insulating member 21A:
Positioning hole 22: Heat insulation pressure receiving member 30: Pressurized object
Claims (1)
と可動盤との間に配設された熱板間に挿入した被圧締物
を加熱圧締するホットプレスに於いて、該上盤と可動盤
にそれぞれ熱板を固定する際、熱板からの熱を遮断する
ため該上盤と可動盤のそれぞれの熱板の間に平行な間隔
を維持するように複数のセラミック短柱状の断熱受圧部
材を設けたことを特徴とするホットプレスに於ける熱板
の断熱装置。 ２、上盤と可動盤のそれぞれの熱板の間又は上盤と可動
盤のいずれかの熱板の間に輻射熱を防止するための、断
熱受圧部材の位置決め穴を有する１又は複数の位置決め
断熱部材を設けた請求項１に記載のホットプレスに於け
る断熱装置。 ３、前記位置決め断熱部材を格子の枠内に配設した請求
項２に記載のホットプレスに於ける熱板の断熱装置。[Claims] 1. Hot-pressing method that heats and presses an object to be pressed inserted between hot plates arranged between the upper plate and the movable plate based on the movement of the movable plate in proximity to the upper plate. In a press, when fixing hot plates to the upper plate and the movable plate, a plurality of plates are used to maintain parallel spacing between the hot plates of the upper plate and the movable plate in order to block the heat from the hot plates. A heat insulating device for a hot plate in a hot press, characterized in that it is provided with a ceramic short pillar-shaped heat insulating pressure receiving member. 2. One or more positioning heat insulating members having positioning holes for the heat insulating pressure receiving member are provided to prevent radiant heat between each heat plate of the upper plate and the movable plate or between the heat plates of either the upper plate and the movable plate. A heat insulating device in a hot press according to claim 1. 3. The heat insulating device for a hot plate in a hot press according to claim 2, wherein the positioning heat insulating member is arranged within a frame of a lattice.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1048780A JPH07110440B2 (en) | 1989-02-28 | 1989-02-28 | Insulation device for hot plate in hot press |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1048780A JPH07110440B2 (en) | 1989-02-28 | 1989-02-28 | Insulation device for hot plate in hot press |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02224900A true JPH02224900A (en) | 1990-09-06 |
| JPH07110440B2 JPH07110440B2 (en) | 1995-11-29 |
Family
ID=12812764
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1048780A Expired - Fee Related JPH07110440B2 (en) | 1989-02-28 | 1989-02-28 | Insulation device for hot plate in hot press |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH07110440B2 (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5297480A (en) * | 1991-05-09 | 1994-03-29 | Hitachi Techno Engineering Co., Ltd. | High vacuum hot press |
| WO2006109906A1 (en) * | 2005-04-09 | 2006-10-19 | Lok-Il Choi | Multi-ram system having assembly-type ram head of vacuum pres for laminating multilayer printed circuit board |
| JP2007313864A (en) * | 2006-05-29 | 2007-12-06 | Taihei Mach Works Ltd | Press structure of horizontal multistage press apparatus |
| JP2013049071A (en) * | 2011-08-30 | 2013-03-14 | Kobe Steel Ltd | Die set for hot-forging press |
| CN114784360A (en) * | 2022-06-20 | 2022-07-22 | 常州精测新能源技术有限公司 | Battery cell hot-pressing device and hot-pressing method thereof |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102163816B1 (en) * | 2019-11-20 | 2020-10-12 | 최만호 | Press device |
-
1989
- 1989-02-28 JP JP1048780A patent/JPH07110440B2/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5297480A (en) * | 1991-05-09 | 1994-03-29 | Hitachi Techno Engineering Co., Ltd. | High vacuum hot press |
| WO2006109906A1 (en) * | 2005-04-09 | 2006-10-19 | Lok-Il Choi | Multi-ram system having assembly-type ram head of vacuum pres for laminating multilayer printed circuit board |
| JP2007313864A (en) * | 2006-05-29 | 2007-12-06 | Taihei Mach Works Ltd | Press structure of horizontal multistage press apparatus |
| JP2013049071A (en) * | 2011-08-30 | 2013-03-14 | Kobe Steel Ltd | Die set for hot-forging press |
| CN114784360A (en) * | 2022-06-20 | 2022-07-22 | 常州精测新能源技术有限公司 | Battery cell hot-pressing device and hot-pressing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH07110440B2 (en) | 1995-11-29 |
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| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |