JPH0222284U - - Google Patents
Info
- Publication number
- JPH0222284U JPH0222284U JP10147988U JP10147988U JPH0222284U JP H0222284 U JPH0222284 U JP H0222284U JP 10147988 U JP10147988 U JP 10147988U JP 10147988 U JP10147988 U JP 10147988U JP H0222284 U JPH0222284 U JP H0222284U
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- cylinder
- welding gun
- polishing device
- abrasive powder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005498 polishing Methods 0.000 claims description 6
- 238000003466 welding Methods 0.000 claims description 6
- 239000000843 powder Substances 0.000 claims description 3
Landscapes
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
Description
第１図は本考案の溶接ガンの電極研摩装置の一
実施例における斜視図、第２図は溶接ガンおよび
電極研摩装置等の配置を表わす斜視図である。
１……溶接ガン（Ｃ型スポツト溶接ガン）、２
……上部固定電極、３……下部可動電極、４……
カツタ、５……電極研摩装置、６……研摩粉受け
（ゴム板）、１１……シリンダ（エアシリンダ）
。
FIG. 1 is a perspective view of one embodiment of the welding gun electrode polishing device of the present invention, and FIG. 2 is a perspective view showing the arrangement of the welding gun, electrode polishing device, etc. 1... Welding gun (C type spot welding gun), 2
... Upper fixed electrode, 3 ... Lower movable electrode, 4 ...
Katsuta, 5... Electrode polishing device, 6... Polishing powder receiver (rubber plate), 11... Cylinder (air cylinder)
.
Claims (1)
る下部可動電極との間に配置されて電極を研摩す
るカツタを具備した溶接ガンの電極研摩装置であ
つて、 上記カツタと、その下方に配置される上記シリ
ンダとの間に位置する研摩粉受けが設けられてい
ることを特徴とする溶接ガンの電極研摩装置。[Claims for Utility Model Registration] An electrode polishing device for a welding gun comprising a cutter disposed between an upper fixed electrode and a lower movable electrode that is driven up and down by a cylinder to polish the electrode, An electrode polishing device for a welding gun, characterized in that an abrasive powder receiver is provided between the cylinder and the cylinder disposed below the abrasive powder receiver.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10147988U JPH0222284U (en) | 1988-07-29 | 1988-07-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10147988U JPH0222284U (en) | 1988-07-29 | 1988-07-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0222284U true JPH0222284U (en) | 1990-02-14 |
Family
ID=31330514
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10147988U Pending JPH0222284U (en) | 1988-07-29 | 1988-07-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0222284U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003001435A (en) * | 2001-06-20 | 2003-01-08 | Fuji Heavy Ind Ltd | Chip collector for tip dresser |
| JP2003010978A (en) * | 2001-06-27 | 2003-01-15 | Fuji Heavy Ind Ltd | Chip recovery device for tip dresser |
-
1988
- 1988-07-29 JP JP10147988U patent/JPH0222284U/ja active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003001435A (en) * | 2001-06-20 | 2003-01-08 | Fuji Heavy Ind Ltd | Chip collector for tip dresser |
| JP4657501B2 (en) * | 2001-06-20 | 2011-03-23 | 富士重工業株式会社 | Chip dresser for chip dresser |
| JP2003010978A (en) * | 2001-06-27 | 2003-01-15 | Fuji Heavy Ind Ltd | Chip recovery device for tip dresser |
| JP4628595B2 (en) * | 2001-06-27 | 2011-02-09 | 富士重工業株式会社 | Chip dresser for chip dresser |