JPH02222849A - Magnetic sensor - Google Patents
Magnetic sensorInfo
- Publication number
- JPH02222849A JPH02222849A JP1187207A JP18720789A JPH02222849A JP H02222849 A JPH02222849 A JP H02222849A JP 1187207 A JP1187207 A JP 1187207A JP 18720789 A JP18720789 A JP 18720789A JP H02222849 A JPH02222849 A JP H02222849A
- Authority
- JP
- Japan
- Prior art keywords
- magnetic
- hall element
- substrate
- sensor according
- plates
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000005291 magnetic effect Effects 0.000 title claims abstract description 169
- 239000000758 substrate Substances 0.000 claims abstract description 24
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims abstract description 3
- 239000000696 magnetic material Substances 0.000 claims description 14
- 239000012790 adhesive layer Substances 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 6
- 239000010410 layer Substances 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000010409 thin film Substances 0.000 claims description 4
- 239000000919 ceramic Substances 0.000 claims description 3
- 239000011521 glass Substances 0.000 claims description 3
- 229910001035 Soft ferrite Inorganic materials 0.000 claims description 2
- 238000000034 method Methods 0.000 abstract description 12
- 230000000694 effects Effects 0.000 abstract description 5
- 239000000126 substance Substances 0.000 abstract description 5
- 230000035882 stress Effects 0.000 abstract description 4
- 230000008646 thermal stress Effects 0.000 abstract description 4
- 238000012966 insertion method Methods 0.000 abstract description 2
- 239000003822 epoxy resin Substances 0.000 description 8
- 229920000647 polyepoxide Polymers 0.000 description 8
- 229920002050 silicone resin Polymers 0.000 description 6
- 239000010408 film Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000007747 plating Methods 0.000 description 4
- 238000000605 extraction Methods 0.000 description 3
- 229910000859 α-Fe Inorganic materials 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229910003087 TiOx Inorganic materials 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 230000005389 magnetism Effects 0.000 description 2
- 230000035945 sensitivity Effects 0.000 description 2
- 235000017166 Bambusa arundinacea Nutrition 0.000 description 1
- 235000017491 Bambusa tulda Nutrition 0.000 description 1
- 241001330002 Bambuseae Species 0.000 description 1
- 235000015334 Phyllostachys viridis Nutrition 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000003064 anti-oxidating effect Effects 0.000 description 1
- 239000011425 bamboo Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 229920006332 epoxy adhesive Polymers 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- WPYVAWXEWQSOGY-UHFFFAOYSA-N indium antimonide Chemical compound [Sb]#[In] WPYVAWXEWQSOGY-UHFFFAOYSA-N 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D5/00—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable
- G01D5/12—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Magnetic Variables (AREA)
- Hall/Mr Elements (AREA)
Abstract
Description
【発明の詳細な説明】
イ、産業上の利用分野
本発明は磁気センサーに関するものであり、特に磁気収
束装置とホール素子が対向する接合構造を有する磁気セ
ンサーに関するものである。DETAILED DESCRIPTION OF THE INVENTION A. Field of Industrial Application The present invention relates to a magnetic sensor, and particularly to a magnetic sensor having a junction structure in which a magnetic convergence device and a Hall element face each other.
口、従来の技術
磁界を感知し電圧を発生させる磁気センサーは、通常、
磁気収束装置とこれを電圧にて変化させるホール素子で
構成されている。磁気センサーの画部分は磁気を効果的
に収束する手段と、これと連結され電圧を発生させるホ
ール素子との効率的な接合に依り決定されるものであり
、更に、大量生産に適合する構造を有すべきである。Traditional technology Magnetic sensors that sense a magnetic field and generate a voltage are typically
It consists of a magnetic focusing device and a Hall element that changes this using voltage. The image area of a magnetic sensor is determined by a means for effectively converging magnetism and an efficient connection with a Hall element that generates a voltage. Should have.
既存の磁気センサーの構造を見れば、通常、二種の方式
にて分類される。The structures of existing magnetic sensors are generally classified into two types.
一番目の方式は、第１図に図示した如くホール素子２ｏ
をケース２３の孔に挿入し、その両側より一対の磁性体
棒２１”ａ、２１ｂを挿入し、上記ホール素子２０を挟
着させた後、これをエポキシ樹脂２２等でモールディン
グする方式であり、
二番目の方式は、第２図に図示された如く、ケースを使
用しないで、ホール素子２０′を直接一対の磁性体棒２
１’ａ、２１’ｂで挟持した後、エポキシ樹脂２２′等
で周辺部をモールディングする方式である。The first method uses a Hall element 2o as shown in FIG.
is inserted into a hole in the case 23, a pair of magnetic rods 21''a and 21b are inserted from both sides of the hole, the Hall element 20 is sandwiched therebetween, and then this is molded with epoxy resin 22 or the like. The second method, as shown in FIG. 2, is to connect the Hall element 20' directly to the pair of magnetic rods without using a case.
In this method, after sandwiching between 1'a and 21'b, the peripheral portion is molded with epoxy resin 22' or the like.
ハ０発明が解決しようとする課題
このような既存の接合方式は、磁性体棒とホール素子と
の間のエポキシ樹脂膜に伴う磁気抵抗の増大と磁性体棒
に及ぼす機械的衝撃や震動又は磁性体棒の熱膨張等に依
りホール素子に応力が集中され、ホール素子の特性が変
動し、信頼性が低下するようになる。このような欠点を
カバーし、高い感度を有する磁気センサーを製作するた
めには全体的な形状を大型化せざるを得ないため、その
使用において大きな問題点として認識されてきたのであ
る。Problems to be Solved by the Invention These existing bonding methods have problems such as an increase in magnetic resistance due to the epoxy resin film between the magnetic rod and the Hall element, and mechanical shocks, vibrations, or magnetic effects on the magnetic rod. Stress is concentrated on the Hall element due to thermal expansion of the body rod, and the characteristics of the Hall element fluctuate, resulting in a decrease in reliability. In order to overcome these drawbacks and manufacture a magnetic sensor with high sensitivity, the overall shape must be increased, which has been recognized as a major problem in its use.
更に、磁性体等の部品は極めて高い精度の加工精密度を
必要とし、その構造上組立てを自動化することがむつか
しく、手作業に依存していたので生産性も悪かった。Furthermore, components such as magnetic materials require extremely high processing precision, and due to their structure, it is difficult to automate assembly, and productivity is poor because they rely on manual labor.
本発明は、ホール素子と磁気収束用磁性体の接合方式を
既存の挿入式から対向接触式にて変更することにより、
磁気抵抗が少ない磁気回路を構成し、ホール素子に及ぼ
す磁気収束磁性体の影響を極小化し、信頼性が高く組立
てが簡便なる磁気センサーを提供することを目的とする
。The present invention changes the joining method between the Hall element and the magnetic material for magnetic convergence from the existing insertion method to a facing contact method.
It is an object of the present invention to provide a magnetic sensor that is highly reliable and easy to assemble by configuring a magnetic circuit with low magnetic resistance and minimizing the influence of a magnetic convergence magnetic material on a Hall element.
二９課題を解決するための手段
本発明の要旨を簡単に要約すれば次のとおりである。即
ち別途の非磁性体を中間に挿入接着した２個の磁性体板
にて成された磁気収束装置を独立製造の後、磁性体基板
上に磁性体突出部とホール素子−磁気ヨークを隔離設置
し、磁性体突出部が片側の磁気収束磁性体板に磁気的に
連結されるようにし、他側の磁気収束磁性体板にホール
素子の上部に接合された磁気ヨークを磁気的に接合させ
、磁気回路を構成する方式である。Means for Solving the 29 Problems The gist of the present invention can be briefly summarized as follows. That is, after independently manufacturing a magnetic convergence device made up of two magnetic plates with a separate non-magnetic substance inserted and glued in the middle, the magnetic protrusion and the Hall element-magnetic yoke are separately installed on the magnetic substrate. The magnetic protrusion is magnetically connected to the magnetic convergence magnetic plate on one side, and the magnetic yoke bonded to the upper part of the Hall element is magnetically connected to the magnetic convergence magnetic plate on the other side. This is a method of configuring a magnetic circuit.
図面を参照して詳細に説明すれば次のとおりである。A detailed description will be given below with reference to the drawings.
磁気収束装置１．ｌ′ ｌ″ ｌ＃は第３図Ａ、Ｂ、第
７図、第８図、第９図に図示されたものの如く磁性体板
４ａ、４ｂの間に非磁性体５．５′ ５″を挿入接着さ
せて構成する。Magnetic focus device 1. l'l"l# is a non-magnetic material 5.5'5" placed between the magnetic plates 4a and 4b as shown in FIGS. 3A, B, 7, 8, and 9. Constructed by inserting and gluing.
本発明に伴う磁気収束装置は、ホール素子８と直接接触
しないので、多様な形態で成形が可能である。つまり、
第３図Ａ％Ｂのように板状の磁性体板４ａ、４ｂの間に
板状の非磁性体５を介させて作ることもできるし、棒状
に成形することもできる。更に、板状又は棒状磁気収束
装置において、両側磁性体板４ａ、４ｂの間に挿入接続
される非磁性体５は、両側の磁性体板４ａ、４ｂを分離
させる役割を遂行するもので、第８図に図示されたよう
に中央部を分離して製造しても良いし、第９図に図示さ
れた如く平面状に成形しても良いが、本発明の主要実施
例は第３図Ａ、Ｂ及び第６図Ａ％Ｂのようにホール素子
８が設置された磁気回路２の連結の際、磁気収束をより
効率的に行うため磁気回路２が付着された部分を突出さ
せる形態を使用する方式を選択したのである。Since the magnetic convergence device according to the present invention does not come into direct contact with the Hall element 8, it can be molded in various forms. In other words,
It can be made by interposing a plate-shaped nonmagnetic material 5 between plate-shaped magnetic plates 4a and 4b as shown in FIG. 3A%B, or it can be formed into a rod shape. Furthermore, in the plate-shaped or rod-shaped magnetic convergence device, the non-magnetic material 5 inserted and connected between the magnetic plates 4a and 4b on both sides serves to separate the magnetic plates 4a and 4b on both sides. The central part may be separated and manufactured as shown in FIG. 8, or it may be formed into a flat shape as shown in FIG. 9, but the main embodiment of the present invention is shown in FIG. 3A. , B and FIG. 6A%B, when connecting the magnetic circuit 2 in which the Hall element 8 is installed, a form is used in which the part to which the magnetic circuit 2 is attached protrudes in order to more efficiently converge the magnetic field. They chose this method.
即ち、磁気収束装置の磁性体板４ａ、４ｂを通過する磁
束がその突出部７を通じ収束され磁気回路部２を通過す
るようにしたものである。That is, the magnetic flux passing through the magnetic plates 4a and 4b of the magnetic concentrator is converged through the protrusion 7 and passes through the magnetic circuit section 2.
磁気回路部２は第４図Ａ、Ｂに図示した如く、磁性体基
板６上の一側に突出部７を付着し、他側には上記突出部
７と適当な間隔（磁気収束装置１の非磁性体板５の幅以
上に該当する間隔である）が保持されるよう半導体薄膜
を積層させたホール素子チップ８を形成し、その上段に
上記突出部７と水平な高さになるよう磁気ヨーク９を付
着することにより磁気回路部２を構成する。磁気回路部
２は配線基板３の一側に付着され、配線基板３上の他側
上部には電気伝導パターン１０が設置されリード線１１
にて磁気回路部２のホール素子チップ８と連結される。As shown in FIGS. 4A and 4B, the magnetic circuit section 2 has a protrusion 7 attached to one side of the magnetic substrate 6, and an appropriate distance from the protrusion 7 to the other side (a distance between the protrusion 7 and the magnetic concentrator 1). A Hall element chip 8 is formed by stacking semiconductor thin films so that a gap corresponding to the width of the non-magnetic plate 5 or more is maintained, and a magnetic layer is placed on the upper stage of the Hall element chip 8 so that the height is parallel to the protrusion 7. The magnetic circuit section 2 is constructed by attaching the yoke 9. The magnetic circuit part 2 is attached to one side of the wiring board 3, and an electrically conductive pattern 10 is installed on the upper part of the other side of the wiring board 3, and a lead wire 11 is installed on the other side of the wiring board 3.
It is connected to the Hall element chip 8 of the magnetic circuit section 2 at.
配線基板３の底面には、電気伝導パターン１０に連結さ
れるリード引き出し用端子部１３が形成されており外部
装置（図示省く）に連結されるようになる。A lead extraction terminal portion 13 is formed on the bottom surface of the wiring board 3 to be connected to the electrically conductive pattern 10 and to be connected to an external device (not shown).
ホ１作用
本発明は一対の磁性体板４ａ、４ｂの間にエポキシ接着
剤やガラス接着剤等で非磁性体５を一体に結合させ、磁
気収束装置１を構成することにより機械的強度が大きく
なり、ホール素子チップ８が磁気収束装置１の下部に磁
気ヨーク９を介して接続されるので、磁性体板４ａ、４
ｂの間隔程度がセンサーの感度に及ぼす影響を大いに減
することができる。E1 Effect The present invention has a magnetic convergence device 1 which has a large mechanical strength by integrally bonding a non-magnetic material 5 between a pair of magnetic material plates 4a and 4b using epoxy adhesive, glass adhesive, etc. Since the Hall element chip 8 is connected to the lower part of the magnetic concentrator 1 via the magnetic yoke 9, the magnetic plates 4a, 4
The influence of the distance b on the sensitivity of the sensor can be greatly reduced.
更に、ホール素子チップ８に及ぼす機械的応力や熱応力
も大いに低減されるので、ホール素子チップ８の特性変
動がほぼ無くなり信頼度を高めることができる。更に、
磁気回路部２の磁性体基板６上に設置された突出部７と
磁気ヨーク９は、磁気収束装置ｌと磁気的に連結される
ので磁気抵抗も低減されるようになり、磁気収束効果も
改善される。Furthermore, since the mechanical stress and thermal stress exerted on the Hall element chip 8 are greatly reduced, variations in the characteristics of the Hall element chip 8 are almost eliminated, and reliability can be increased. Furthermore,
The protrusion 7 and the magnetic yoke 9 installed on the magnetic substrate 6 of the magnetic circuit section 2 are magnetically connected to the magnetic convergence device l, so that magnetic resistance is also reduced and the magnetic convergence effect is improved. be done.
ホール素子チップ８は、磁性体基板６上に電気的絶縁層
を挾んで半導体薄膜を積層させると同時に電極ペシベー
ション膜等を形成して構成され、磁気ヨーク９は磁性体
板４ａ、４ｂ、磁性体基板６及びホール素子チップ８を
通じて流れる磁気を効果的に接続させる役割をすること
になる。The Hall element chip 8 is constructed by laminating a semiconductor thin film on a magnetic substrate 6 with an electrically insulating layer sandwiched therebetween, and at the same time forming an electrode pestivation film, etc. The magnetic yoke 9 consists of magnetic plates 4a, 4b, This serves to effectively connect the magnetism flowing through the body substrate 6 and the Hall element chip 8.
更に、配線基板３はリード線の導出を極めて容易になら
しめ、電源回路や信号処理基板と一体化してハイブリッ
ドＩＣ化することもできる。Furthermore, the wiring board 3 allows lead wires to be drawn out very easily, and can be integrated with a power supply circuit and a signal processing board to form a hybrid IC.
なお、磁性体板４ａ、４ｂ、磁性体基板６、突出部７、
磁気ヨーク９及び配線基板３等の材質は熱膨張率がほぼ
同じ材質を使用し、温度変化に伴う熱応力がホール素子
チップ８に加わるのを防止することができるし、これに
依って磁気センサーの信頼性を一層向上させることがで
きる。In addition, the magnetic plates 4a and 4b, the magnetic substrate 6, the protrusion 7,
The magnetic yoke 9, the wiring board 3, etc. are made of materials with approximately the same coefficient of thermal expansion, which can prevent thermal stress caused by temperature changes from being applied to the Hall element chip 8, and thereby the magnetic sensor The reliability of the system can be further improved.
このように各構成部品等の熱膨張率が互いに同一なるよ
うにするためには上記において並べた磁性材をソフトフ
ェライトとし、非磁竹材はその成分造成に依り熱膨張率
を変化させることができる。５ｉ０２系のガラス又はＢ
ａＯ−ＴｉＯｘ系、ＣａＯ−ＴｉＯｘ系等のＴｉ０ａを
主成分とするセラミックが好ましいのである。In order to make the coefficients of thermal expansion of each component the same as described above, the magnetic materials arranged above are made of soft ferrite, and the coefficient of thermal expansion of the non-magnetic bamboo material can be changed depending on its composition. . 5i02 series glass or B
Ceramics containing TiOa as a main component, such as aO-TiOx and CaO-TiOx, are preferred.
これを実施例で説明すれば次ｑとおりである。This will be explained using examples as follows.
へ、実施例
ＣａＯ−ＴｉＯｉ基板に通常の＾１ｔＯ，ハイブリッド
ＩＣ基板を製作する方法で電気伝導パター２１０１貫通
ホール１２、リード引き出し用端子１３を形成して配線
基板３を作成する。磁気回路部２はＭｎ−Ｚｎ系のフェ
ライト基板６上に同じ材料でなされた突出部７をシリコ
ン樹脂で接着して構成した後、該磁性体基板６を上記配
線基板３上にシリコン樹脂で接着するこの時、磁性体基
板６と突出部７どの間のシリコン樹脂接着層の厚さは１
０μｍ以下とするのが好ましい。EXAMPLE 1 A wiring board 3 is prepared by forming an electrically conductive pattern 2101 through hole 12 and a terminal for lead extraction 13 on a CaO-TiOi substrate using the usual method of manufacturing a hybrid IC board. The magnetic circuit section 2 is constructed by adhering protrusions 7 made of the same material on a Mn-Zn ferrite substrate 6 with silicone resin, and then adhering the magnetic substrate 6 onto the wiring board 3 using silicone resin. At this time, the thickness of the silicone resin adhesive layer between the magnetic substrate 6 and the protrusion 7 is 1
It is preferable to set it to 0 μm or less.
更に、磁気ヨーク９とホール素子チップ８を得るために
は、先づ、Ｍｎ−Ｚｎ系のフェライト基板に３μｍ程度
の厚さでエポキシ樹脂を絶縁層となしてＩｎＳｂ薄膜を
形成し、その上に化学銅鍍金、電気銅鍍金、電気ニッケ
ル鍍金、電気金鍍金等を実施し、電極を形成し、更にＩ
ｎＳｂ膜の上にポリイミド酸化防止膜を形成した後、磁
気ヨークをシリコン樹脂で接着させ、ウェハーを作り、
該ウェハーを再びグイシングカッターで１ｍｍ程度にて
切り出せば、磁気ヨーク９が接着されたホール素子チッ
プ８を容易に得ることができる。Furthermore, in order to obtain the magnetic yoke 9 and the Hall element chip 8, an InSb thin film is first formed on a Mn-Zn ferrite substrate with a thickness of about 3 μm using an epoxy resin as an insulating layer, and then Chemical copper plating, electrolytic copper plating, electrolytic nickel plating, electrolytic gold plating, etc. are carried out to form electrodes, and then I
After forming a polyimide anti-oxidation film on the nSb film, a magnetic yoke was bonded with silicone resin, and a wafer was made.
By cutting the wafer again to a length of about 1 mm using a guising cutter, the Hall element chip 8 to which the magnetic yoke 9 is bonded can be easily obtained.
このようにして得られたホール素子チップ８を上記磁性
体基板６上の突出部７と適当な間隔を置いて゛エポキシ
樹脂で接着し、突出部７の上面と磁気ヨーク９の上面が
平行を成すようにしながら夫々一対の磁性体板４ａ５４
ｂと接続され得るようにする。The Hall element chip 8 thus obtained is adhered to the protrusion 7 on the magnetic substrate 6 with an epoxy resin at an appropriate distance, so that the upper surface of the protrusion 7 and the upper surface of the magnetic yoke 9 are parallel to each other. While doing so, each pair of magnetic plates 4a54
b.
この時、磁気ヨーク９とホール素子チップ８との間の接
着層の厚さは６μｍとし、磁性体基板６とホール素子チ
ップ８との間の接着層の厚さは３μｍ以下となすのが好
ましい。At this time, the thickness of the adhesive layer between the magnetic yoke 9 and the Hall element chip 8 is preferably 6 μm, and the thickness of the adhesive layer between the magnetic substrate 6 and the Hall element chip 8 is preferably 3 μm or less. .
以後、ワイヤボンディング法によりホール素子チップ８
と配線基板３の電気伝導パターン１０とを接続し、ボン
ディングワイヤ及びホール素子チップ８、磁気ヨークの
周辺をエポキシ樹脂でコーティングする。Thereafter, the Hall element chip 8 is bonded using the wire bonding method.
and the electrically conductive pattern 10 of the wiring board 3 are connected, and the periphery of the bonding wire, the Hall element chip 8, and the magnetic yoke is coated with epoxy resin.
尚、磁気収束装置・ｌは第７図に図示したようにＭｎ−
Ｚｎ系のフェライトブロックとＣａｏ−Ｔｉ０□系のセ
ラミックブロックをエポキシ樹脂により接着し、しかる
後にワイヤカッターにより切断し形成する。In addition, the magnetic convergence device l is Mn- as shown in Fig. 7.
A Zn-based ferrite block and a Cao-Ti0□-based ceramic block are bonded together using an epoxy resin, and then cut using a wire cutter.
このようにして完成された一対の磁性体板４ａ、４ｂ底
面に磁性体基板６と配線基板３とを位置させ、一側の磁
性体板４ａと突出部７とをシリコン樹脂で接着し、他側
の磁性体板４ｂと磁気ヨーク９とをシリコン樹脂で接着
すれば磁気センサーが完成されるし、該磁気センサーの
周辺はリード引き出し用端子部１３を除いては、エポキ
シ樹脂でコーティングし補強するのが好ましい。The magnetic substrate 6 and the wiring board 3 are placed on the bottom surfaces of the pair of magnetic plates 4a and 4b completed in this way, and the magnetic plate 4a on one side and the protrusion 7 are adhered with silicone resin, and the other A magnetic sensor is completed by bonding the magnetic plate 4b on the side and the magnetic yoke 9 with silicone resin, and the area around the magnetic sensor, except for the terminal portion 13 for leading out, is coated with epoxy resin and reinforced. is preferable.
こうすれば、一対の磁性体板４ａ、４ｂと磁性体基板６
及びホール素子チップ８を連結する磁気通路上の磁気抵
抗の断面が０．８ｍｍ角であり、 １５μｍのエアギャ
ップに相当する磁気センサーを容易に得ることができる
。In this way, the pair of magnetic plates 4a and 4b and the magnetic substrate 6
The cross section of the magnetic resistance on the magnetic path connecting the Hall element chips 8 is 0.8 mm square, and a magnetic sensor corresponding to an air gap of 15 μm can be easily obtained.
従って、磁性体板４ａ、４ｂを通過する磁束の大部分を
ホール素子チップ８の感知部が存在する面積の０．８ｍ
ｍ角部分に収束させることができる。Therefore, most of the magnetic flux passing through the magnetic plates 4a and 4b is transferred to 0.8 m of the area where the sensing part of the Hall element chip 8 exists.
It can be converged to an m-square part.
ト１発明の効果
以上における如く、本発明の磁気センサーは各部品を熱
膨張率がほぼ同じ材質で選定し、ホール素子に加わる機
械的な応力や温度変化に伴う熱応力に基づく不平衡電圧
変動等の特性変化が公知の技術に比べて顕著に低減され
ることにより高い信頼度を得ることができるものである
。(1) Effects of the Invention As described above, in the magnetic sensor of the present invention, each component is selected from materials with approximately the same coefficient of thermal expansion, and unbalanced voltage fluctuations due to mechanical stress applied to the Hall element or thermal stress due to temperature changes are avoided. It is possible to obtain high reliability by significantly reducing changes in characteristics such as the following, compared to known techniques.
更に、本発明は半導体素子へ一般的に使用するダイボン
ダー、ワイヤボンダー等を使用し、手作業でない量産装
置を適切に使用することができる。Furthermore, the present invention uses die bonders, wire bonders, etc. commonly used for semiconductor devices, and can appropriately use mass production equipment that does not require manual work.
付言すれば、本発明の磁気センサーは磁気収束効果を利
用して、磁気抵抗が少ない小型の磁気センサーを容易に
得ることができる。In addition, the magnetic sensor of the present invention makes use of the magnetic convergence effect to easily obtain a small magnetic sensor with low magnetic resistance.
第１図、第２図は、従来の磁気センサーの断面図、第３
図Ａ、Ｂは夫々本発明に係る磁気収束装置の正面図と平
面図、第４図Ａ、Ｂは夫々本発明に係る磁気回路部及び
配線基板の正面図と平面図、第５図Ａ、Ｂは夫々本発明
に係る磁気センサーの正面図と平面図、第６図Ａ、Ｂは
夫々本発明に係る磁気センサーの拡大断面図及び分離図
、第７図は、本発明に係る磁気収束装置の加工例を示し
た斜視図、第８図及び第９図は、本発明に係る磁気収束
装置の他の実施例を示した平面図である。
１：磁気収束装置 ２：磁気回路部
３：配線基板 ４ａ、４ｂ：磁性体板５：非磁性
体 ６：磁性体基板
７：突出部 ８：ホール素子チップ９：磁気ヨ
ーク １０：電気伝導パターン１１：リード線
１２：貫通ホール１３：リード引き出し用端子部Figures 1 and 2 are cross-sectional views of conventional magnetic sensors;
Figures A and B are a front view and a plan view, respectively, of a magnetic convergence device according to the present invention, Figures 4A and B are a front view and a plan view, respectively, of a magnetic circuit section and a wiring board according to the present invention, and Figure 5A, B is a front view and a plan view of a magnetic sensor according to the present invention, FIGS. 6A and B are an enlarged sectional view and an exploded view of a magnetic sensor according to the present invention, respectively, and FIG. 7 is a magnetic convergence device according to the present invention. 8 and 9 are plan views showing other embodiments of the magnetic convergence device according to the present invention. 1: Magnetic convergence device 2: Magnetic circuit section 3: Wiring board 4a, 4b: Magnetic board 5: Non-magnetic material 6: Magnetic board 7: Projection part 8: Hall element chip 9: Magnetic yoke 10: Electrically conductive pattern 11 :Lead
12: Through hole 13: Terminal part for lead extraction
Claims (10)
挿入させた磁気収束装置１と、上記磁気収束装置１の一
側磁性体板４ａ、４ｂに対向接続される磁性体突出部７
が付着された磁性体基板６上に、上記突出部７と適当な
間隔を置いて設置された、半導体薄膜を積層して形成さ
れ、その上段に他側磁性体板４ａに接続される磁気ヨー
ク９が接着されたホール素子チップ８にて構成される磁
気回路部２及び一側に上記磁気回路部２が接着され、上
記磁気回路部２のホール素子チップ８より引出されたリ
ード線１１に接続される電気伝導パターン１０を設置し
た配線基板３にて構成される磁気センサー。(1) A magnetic concentrator 1 in which a non-magnetic material 5 is inserted between a pair of magnetic plates 4a and 4b, and a magnetic body connected oppositely to one side of the magnetic plates 4a and 4b of the magnetic concentrator 1. Projection 7
A magnetic yoke is formed by stacking a semiconductor thin film, which is placed at an appropriate distance from the protrusion 7 on a magnetic substrate 6 to which is attached, and a magnetic yoke connected to the other magnetic plate 4a on the upper layer. The magnetic circuit part 2 is made up of a Hall element chip 8 to which 9 is glued, and the magnetic circuit part 2 is glued to one side, and connected to a lead wire 11 drawn out from the Hall element chip 8 of the magnetic circuit part 2. A magnetic sensor is constructed of a wiring board 3 on which an electrically conductive pattern 10 is installed.
板６、磁気ヨーク９、非磁性体５及び配線基板３を熱膨
張率がほぼ同一の材料にて形成することを特徴とする特
許請求の範囲第１項記載の磁気センサー。(2) The pair of magnetic plates 4a and 4b, the protruding portion 7, the magnetic substrate 6, the magnetic yoke 9, the non-magnetic material 5, and the wiring board 3 are made of materials with substantially the same coefficient of thermal expansion. A magnetic sensor according to claim 1.
板６及び磁気ヨーク９をソフトフェライトで形成し、非
磁性体５及び配線基板３はＳｉＯ＿２を主成分とするガ
ラスで成ることを特徴とする特許請求の範囲第２項記載
の磁気センサー。(3) The pair of magnetic plates 4a and 4b, the protrusion 7, the magnetic substrate 6, and the magnetic yoke 9 are made of soft ferrite, and the non-magnetic material 5 and the wiring board 3 are made of glass containing SiO_2 as a main component. The magnetic sensor according to claim 2, characterized in that:
系、ＣａＯ−ＴｉＯ＿２系統のＴｉＯ＿２を主成分とす
るセラミックで形成することを特徴とする特許請求の範
囲第２項記載の磁気センサー。(4) Non-magnetic material 5 and wiring board 3 are BaO-TiO_2
3. The magnetic sensor according to claim 2, wherein the magnetic sensor is formed of a ceramic whose main component is TiO_2 of the CaO-TiO_2 system.
される磁気収束装置１を平面形にて形成することを特徴
とする特許請求の範囲第１項記載の磁気センサー。(5) The magnetic sensor according to claim 1, wherein the magnetic convergence device 1 composed of a pair of magnetic plates 4a, 4b and a non-magnetic body 5 is formed in a planar shape.
を水平に設置したことを特徴とする特許請求の範囲第１
項記載の磁気センサー。(6) Claim 1 characterized in that the protrusion 7 on the magnetic substrate 6 and the upper surface of the magnetic yoke 9 are installed horizontally.
Magnetic sensor as described in section.
特許請求の範囲第１項記載の磁気センサー。(7) The magnetic sensor according to claim 1, wherein the non-magnetic material 5 is divided into two pieces.
１０μｍ以下にしたことを特徴とする特許請求の範囲第
１項記載の磁気センサー。(8) The magnetic sensor according to claim 1, wherein the thickness of the adhesive layer between the magnetic substrate 6 and the protrusion 7 is 10 μm or less.
層の厚さを６μｍ以下にすることを特徴とする特許請求
の範囲第１項記載の磁気センサー。(9) The magnetic sensor according to claim 1, wherein the thickness of the adhesive layer between the magnetic yoke 9 and the Hall element chip 8 is 6 μm or less.
着層の厚さを３μｍ以下にすることを特徴とする特許請
求の範囲第１項記載の磁気センサー。(10) The magnetic sensor according to claim 1, wherein the thickness of the adhesive layer between the magnetic substrate 6 and the Hall element chip 8 is 3 μm or less.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1988-9069 | 1988-07-20 | ||
| KR1019880009069A KR940010586B1 (en) | 1988-07-20 | 1988-07-20 | Electronic sensor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02222849A true JPH02222849A (en) | 1990-09-05 |
| JP2621986B2 JP2621986B2 (en) | 1997-06-18 |
Family
ID=19276240
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1187207A Expired - Lifetime JP2621986B2 (en) | 1988-07-20 | 1989-07-19 | Magnetic sensor |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP2621986B2 (en) |
| KR (1) | KR940010586B1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016173317A (en) * | 2015-03-17 | 2016-09-29 | エスアイアイ・セミコンダクタ株式会社 | Semiconductor device |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100792350B1 (en) * | 2006-08-09 | 2008-01-08 | 삼성전기주식회사 | Magnetic sensor and method of manufacturing thereof |
-
1988
- 1988-07-20 KR KR1019880009069A patent/KR940010586B1/en not_active IP Right Cessation
-
1989
- 1989-07-19 JP JP1187207A patent/JP2621986B2/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016173317A (en) * | 2015-03-17 | 2016-09-29 | エスアイアイ・セミコンダクタ株式会社 | Semiconductor device |
Also Published As
| Publication number | Publication date |
|---|---|
| KR900002055A (en) | 1990-02-28 |
| KR940010586B1 (en) | 1994-10-24 |
| JP2621986B2 (en) | 1997-06-18 |
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