JPH02215077A - High temperature heating element, its manufacturing method,and manufacture of ceramic heater - Google Patents
High temperature heating element, its manufacturing method,and manufacture of ceramic heaterInfo
- Publication number
- JPH02215077A JPH02215077A JP1333021A JP33302189A JPH02215077A JP H02215077 A JPH02215077 A JP H02215077A JP 1333021 A JP1333021 A JP 1333021A JP 33302189 A JP33302189 A JP 33302189A JP H02215077 A JPH02215077 A JP H02215077A
- Authority
- JP
- Japan
- Prior art keywords
- heating element
- temperature heating
- aluminum nitride
- heating conductor
- paste
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000010438 heat treatment Methods 0.000 title claims abstract description 83
- 239000000919 ceramic Substances 0.000 title claims description 19
- 238000004519 manufacturing process Methods 0.000 title claims description 15
- 239000004020 conductor Substances 0.000 claims abstract description 32
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims abstract description 22
- 238000000034 method Methods 0.000 claims abstract description 12
- 239000000463 material Substances 0.000 claims abstract description 7
- 230000001681 protective effect Effects 0.000 claims abstract description 5
- 239000000758 substrate Substances 0.000 claims description 22
- YXTPWUNVHCYOSP-UHFFFAOYSA-N bis($l^{2}-silanylidene)molybdenum Chemical compound [Si]=[Mo]=[Si] YXTPWUNVHCYOSP-UHFFFAOYSA-N 0.000 claims description 13
- 229910021343 molybdenum disilicide Inorganic materials 0.000 claims description 11
- 238000005516 engineering process Methods 0.000 claims description 8
- 239000011888 foil Substances 0.000 claims description 7
- 238000005245 sintering Methods 0.000 claims description 6
- 239000000203 mixture Substances 0.000 claims description 5
- 238000007639 printing Methods 0.000 claims description 5
- 239000000126 substance Substances 0.000 claims description 5
- 230000006978 adaptation Effects 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 239000012298 atmosphere Substances 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 230000001590 oxidative effect Effects 0.000 claims description 3
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 3
- 238000005121 nitriding Methods 0.000 claims 1
- 238000009434 installation Methods 0.000 abstract description 2
- MHPGUDLSTATOHA-UHFFFAOYSA-N [Si]([O-])([O-])([O-])O[Si]([O-])([O-])[O-].[Mo+6] Chemical compound [Si]([O-])([O-])([O-])O[Si]([O-])([O-])[O-].[Mo+6] MHPGUDLSTATOHA-UHFFFAOYSA-N 0.000 abstract 2
- 230000002349 favourable effect Effects 0.000 abstract 2
- 238000009413 insulation Methods 0.000 abstract 1
- 239000000843 powder Substances 0.000 description 7
- 229910052581 Si3N4 Inorganic materials 0.000 description 6
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 6
- 239000007789 gas Substances 0.000 description 4
- 239000010410 layer Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 4
- 229910052721 tungsten Inorganic materials 0.000 description 4
- 239000010937 tungsten Substances 0.000 description 4
- 230000032683 aging Effects 0.000 description 3
- 229910010293 ceramic material Inorganic materials 0.000 description 3
- 229910016006 MoSi Inorganic materials 0.000 description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- 238000002485 combustion reaction Methods 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 239000011733 molybdenum Substances 0.000 description 2
- 229910021344 molybdenum silicide Inorganic materials 0.000 description 2
- 239000003921 oil Substances 0.000 description 2
- 230000035939 shock Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 239000001856 Ethyl cellulose Substances 0.000 description 1
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 1
- AMQJEAYHLZJPGS-UHFFFAOYSA-N N-Pentanol Chemical compound CCCCCO AMQJEAYHLZJPGS-UHFFFAOYSA-N 0.000 description 1
- PCEXQRKSUSSDFT-UHFFFAOYSA-N [Mn].[Mo] Chemical compound [Mn].[Mo] PCEXQRKSUSSDFT-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052681 coesite Inorganic materials 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- YOCUPQPZWBBYIX-UHFFFAOYSA-N copper nickel Chemical compound [Ni].[Cu] YOCUPQPZWBBYIX-UHFFFAOYSA-N 0.000 description 1
- 229910052906 cristobalite Inorganic materials 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 235000019325 ethyl cellulose Nutrition 0.000 description 1
- 229920001249 ethyl cellulose Polymers 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 229910052839 forsterite Inorganic materials 0.000 description 1
- 239000000446 fuel Substances 0.000 description 1
- MSNOMDLPLDYDME-UHFFFAOYSA-N gold nickel Chemical compound [Ni].[Au] MSNOMDLPLDYDME-UHFFFAOYSA-N 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- HCWCAKKEBCNQJP-UHFFFAOYSA-N magnesium orthosilicate Chemical compound [Mg+2].[Mg+2].[O-][Si]([O-])([O-])[O-] HCWCAKKEBCNQJP-UHFFFAOYSA-N 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 239000011572 manganese Substances 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000002689 soil Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 229910052682 stishovite Inorganic materials 0.000 description 1
- 229910052905 tridymite Inorganic materials 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F23—COMBUSTION APPARATUS; COMBUSTION PROCESSES
- F23Q—IGNITION; EXTINGUISHING-DEVICES
- F23Q7/00—Incandescent ignition; Igniters using electrically-produced heat, e.g. lighters for cigarettes; Electrically-heated glowing plugs
- F23Q7/001—Glowing plugs for internal-combustion engines
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/40—Heating elements having the shape of rods or tubes
- H05B3/42—Heating elements having the shape of rods or tubes non-flexible
- H05B3/46—Heating elements having the shape of rods or tubes non-flexible heating conductor mounted on insulating base
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F23—COMBUSTION APPARATUS; COMBUSTION PROCESSES
- F23Q—IGNITION; EXTINGUISHING-DEVICES
- F23Q7/00—Incandescent ignition; Igniters using electrically-produced heat, e.g. lighters for cigarettes; Electrically-heated glowing plugs
- F23Q7/001—Glowing plugs for internal-combustion engines
- F23Q2007/004—Manufacturing or assembling methods
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、窒化アルミニウム製取りつけ基板および該
基板の上に塗られた加熱導体を備えた高温加熱素子に関
する。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a high temperature heating element with an aluminum nitride mounting substrate and a heating conductor coated on the substrate.
前記形式の高温加熱要素は、周知のとと（自動車産業に
おいて、たとえばスタート補助としてディーゼルエンジ
ンの始動をスムーズにするために用いられると（に予熱
プラグ、加熱アダプタあるいは赤熱体としてのセラミッ
ク加熱装置の製造に広範に用いられている。High-temperature heating elements of the above type are well known and used in the automotive industry, for example as starting aids to smooth the starting of diesel engines (in ceramic heating devices as preheating plugs, heating adapters or incandescent bodies). Widely used in manufacturing.
西ドイツ国特許出願公開第３５１２４８３号明細書から
知られているセラミック加熱装置は、タトエばＭＯ８ｉ
２粉末とＳｉ３Ｎ４粉末から成る混合物で作られた焼結
物加熱素子、電気絶縁性セラミック焼結体、それに電薦
供給装置とから構成されている。この公知の加熱装置に
おける加熱素子はＭｏＳ ｉ ２ 粉末トＳｉ ３Ｎ４
粉末から成る混合物から成る混合物で作られた焼結物か
ら構成されているが、この場合５１３Ｎ４粉末の粒子直
径はｆｌ／ｂＳ ｉ ２粉末のそれよりも太き（なって
いる。The ceramic heating device known from DE 35 12 483 A1 is the TATOE MO8i
The device consists of a sintered heating element made of a mixture of Si3N4 powder and Si3N4 powder, an electrically insulating ceramic sintered body, and an electrically recommended feeding device. The heating element in this known heating device is made of MoS i 2 powder and Si 3N4.
It consists of a sinter made of a mixture of powders, in which case the particle diameter of the 513N4 powder is larger than that of the fl/bS i 2 powder.
さらに、たとえばディーゼルエンノン用の予熱プラグと
して用いられることができ、そしてセラミック加熱体の
製造のためにＭｏＳ ｉ□とＳ ｉ 、Ｎ４から成る混
合物で作られた焼結物が用いられるセラミック加熱装置
は、西ドイツ国特許出願公開第３３４２７５３号明細書
から知られている。Furthermore, ceramic heating devices which can be used, for example, as preheating plugs for diesel ennones, and in which a sinter made of a mixture of MoSi and Si, N4 are used for the production of ceramic heating bodies. is known from German Patent Application No. 33 42 753.
さらに、西ドイツ国特許出願公開第３０１１２９７号明
細書からは、窒化硅素、サイアロン（５ｉａｌｏｎ ）
、窒化アルミニウム、炭化硅素から成るセラミック体と
このセラミック体の中に埋められたタングステンまたは
モリブデン製の金属体で作られる高温加熱素子がプレー
ト状またはひも状をしたものが知られている。Furthermore, from West German Patent Application No. 3011297, silicon nitride, Sialon (5ialon)
A plate-shaped or string-shaped high-temperature heating element made of a ceramic body made of aluminum nitride or silicon carbide and a metal body made of tungsten or molybdenum embedded in the ceramic body is known.
また、西ドイツ国特許出願公開第３３３５１４４号明細
書からは、内燃機関用のインレット／々−すに、セラミ
ック材料の中へ埋め込まれたタングステン製加熱抵抗か
ら成る加熱装置が取りつけられたものが知られている。It is also known from German Patent Application No. 33 35 144 that an inlet for an internal combustion engine is fitted with a heating device consisting of a tungsten heating resistor embedded in a ceramic material. ing.
このセラミック材料はたとえば窒化硅素（Ｓｉ３Ｎ４）
から構成されている。This ceramic material is, for example, silicon nitride (Si3N4).
It consists of
また、米国特許第４０３５６１３５号明細書から知られ
ている円筒状をしたセラミック加熱要素は、酸化アルミ
ニウムおよびフォルステライト（Ｆｏｒｓｔｅｒｉｔｅ
）のような加熱抵抗セラミック材料と、このセラミック
材料の上に塗られるモリブデン・マンガンペーストやタ
ングステンペーストのような導電性金属ペースト製の熱
発生抵抗から構成されている。Also known from U.S. Pat. No. 4,035,6135 is a cylindrical ceramic heating element made of aluminum oxide and forsterite.
) and a heat-generating resistor made of a conductive metal paste, such as molybdenum-manganese paste or tungsten paste, coated on top of the ceramic material.
特開昭５４−１０９５３６号公報からは、すでに円板状
をしたセラミック小板とこの上に印刷されるモリブデン
、タングステン、あるいはマンガン製の抵抗体とから構
成されるグロープラグ用のセラミック加熱装置も知られ
ている。JP-A-54-109536 also discloses a ceramic heating device for glow plugs that consists of a small ceramic plate already in the shape of a disk and a resistor made of molybdenum, tungsten, or manganese printed on it. Are known.
西Ｐイツ国特許出願公開第３３０７１０９号明細書から
は、最終的にと（にディーゼルエンジンの燃焼室内に燃
料を噴射するための装置であって、噴射ノズルと燃料の
噴流によって濡らされる赤熱体とを備えたものが知られ
ている。From US Pat. It is known that it has the following.
この場合この赤熱体は噴射ノズルの燃焼室側正面に取り
つけられており、かつ、加熱可能な壁によって取り囲ま
れた、燃料噴流の通過し一部蒸発するための溝を有して
いる。そしてこの赤熱体はセラミックから成り、かつ加
熱要素はセラミックの表面上に塗られた金属被覆によっ
て形成されることもできろ。In this case, this incandescent body is mounted on the front face of the injection nozzle facing the combustion chamber and has a groove, surrounded by a heatable wall, for the passage of the fuel jet and for partial evaporation. The incandescent body may then consist of ceramic and the heating element may be formed by a metal coating applied onto the surface of the ceramic.
さらに一般に知られているのは、高い熱伝導率と耐高温
の高電気絶縁性、それに高硬質、良機械的特性、良好な
熱交換能力を特徴としているＡｔＮセラミック製の取り
つけ基板であって、これは厚膜技術を使ってプリントす
ることができ、そのさい厚いフィルムペーストが差し込
まれるが、これはＡｔ２０３セラミック製取りつけ基板
の印刷のために知られているのと同じように行なわれる
。Furthermore, mounting substrates made of AtN ceramic are generally known, which are characterized by high thermal conductivity, high temperature resistance, high electrical insulation, high hardness, good mechanical properties, and good heat exchange ability. This can be printed using thick film technology, in which case a thick film paste is inserted, in the same way as is known for printing At203 ceramic mounting substrates.
これらの公知のセラミック加熱素子における欠点は、こ
れらが非常に高温となると耐えられないことと、十分な
熱衝撃に耐えられないこと、セラミック取りつけ基板上
へ印刷された加熱導体が十分にくついていないこと、そ
して製造コストが高いことである。The disadvantages of these known ceramic heating elements are that they cannot withstand very high temperatures, cannot withstand sufficient thermal shock, and do not have sufficient adhesion of the heating conductors printed on the ceramic mounting substrate. and the manufacturing cost is high.
これに対して、この発明による高温加熱要素は請求項１
の特徴部分を備えたもので、この長゛所としては比較的
安い加熱導体材料をベースにしているので低コストで製
造が可能となること、非常に高温（約１０００℃）にま
で耐えることができること、ジ硅化モリブデンは窒化硅
素の上よりも窒化アルミニウムの上の方がかなり良好に
くつ（こと、均一な温度分布が取りつけ基板の良好な熱
伝導によって達成されること、それに十分な熱衝撃に耐
えられること、などを挙げることができる。In contrast, the high temperature heating element according to the present invention is claimed in claim 1.
Its advantages are that it can be manufactured at low cost because it is based on a relatively cheap heating conductor material, and that it can withstand extremely high temperatures (approximately 1000°C). It is possible that molybdenum disilicide adheres significantly better on aluminum nitride than on silicon nitride (that is, a uniform temperature distribution is achieved by good heat conduction of the mounting substrate, and that there is sufficient resistance to thermal shock). You can list things like being able to endure.
この発明による高温加熱抵抗の製造はつぎのようにする
と有利に行なわれる。すなわち、窒化アルミニウム鯛の
取りつけ基板上へ厚膜技術で二硅化モリブデンペースト
製の加熱導体をプリントし、該ペーストは必要に応じて
電気抵抗調整のためのおよび／または熱膨張係数の改良
に係る適合化のための物質を４０容量％まで含有でき、
プリントされた該取りつけ基板を１６００°から１８０
０℃までの温度で保護ガスのもとに焼結させかつその後
エージングする。The production of the high temperature heating resistor according to the invention is advantageously carried out as follows. Namely, heating conductors made of molybdenum disilicide paste are printed by thick-film technology onto the mounting substrate of aluminum nitride, which paste is optionally adapted for adjusting the electrical resistance and/or for improving the coefficient of thermal expansion. It can contain up to 40% by volume of substances for
The printed mounting board is rotated from 1600° to 180°.
Sintering under protective gas at temperatures up to 0° C. and subsequent aging.
この発明による高温加熱素子の製造は、さらにたとえば
つぎのよ５にするとさらに有利に行なわれる。すなわち
、窒化アルミニウム製の取りつけ基板上へ厚膜技術で二
硅化モリブデンペースト製の加熱導体をプリントし、該
ペーストが必要に応じて電気抵抗調整のためのおよび／
または熱膨張係数の改良に係る適合化のための物質を４
０容量％まで含有でき、該プリントされた窒化アルミニ
ウム製取り付け基板の上べ別の窒化アルミニウム製取り
付け基板を塗り、がっ、加熱導体をはさんでサンＰイッ
テ状に積み重ねられた取りつけ基板を焼結する。The production of the high temperature heating element according to the invention is further advantageously carried out, for example, in the following manner. That is, a heating conductor made of molybdenum disilicide paste is printed by thick-film technology on a mounting substrate made of aluminum nitride, and the paste is used for adjusting the electrical resistance and/or as required.
or 4 materials for adaptation related to improvement of thermal expansion coefficient.
The printed aluminum nitride mounting board is coated with another aluminum nitride mounting board, and the mounting boards stacked in a stacked pattern with the heating conductor in between are baked. conclude.
厚膜技術を使って）硅化モリブデンペーストで印刷され
ることのできる窒化アルミニウム取りつけ基板としては
、市販されている適当な窒化アルミニウム箔を使ってお
り、これは窒化アルミニウムのほかに焼結温度で分解で
きたりあるいは蒸発できる結合剤を含んでいる。いわゆ
るプレスされたグリーンＡハ取りっけ基板または焼結さ
れた取りつけ基板などがこれである。The aluminum nitride mounting substrate, which can be printed with molybdenum silicide paste (using thick film technology), uses a suitable commercially available aluminum nitride foil, which in addition to aluminum nitride decomposes at the sintering temperature. Contains a binder that can be formed or evaporated. This includes a so-called pressed green A-type mounting board or a sintered mounting board.
窒化アルミニウム取りつけ基板の厚さはいろいろあって
よいが、おもに０．３〜３襲のもの、とりわけ０．５〜
２．０１８が有利である。The thickness of the aluminum nitride mounting board may vary, but it is mainly 0.3 to 3 thick, especially 0.5 to 3 thick.
2.018 is advantageous.
必要に応じて、用いられている窒化アルミニウム取りつ
け基板に添加剤たとえばＹ２Ｏ３のよ５な比較的わずか
の量の焼結助成剤を含めるのもよい。If desired, the aluminum nitride mounting substrate used may include additives such as Y2O3 in relatively small amounts as sintering aids.
電気的抵抗調整のためのおよび／または熱膨張係数の改
良に係る適合化のために、二硅化モモリブデンに添加す
ることのできる典型的な物質としては、酸化アルミニウ
ムおよび窒化アルミニウムがあげられる。Typical substances that can be added to molybdenum disilicide for adaptation to adjust the electrical resistance and/or to improve the coefficient of thermal expansion include aluminum oxide and aluminum nitride.
この発明に基づく高温加熱素子は、いろいろなタイプの
セラミック加熱装置の製造に使えるし、いろいろな用途
にも使える。とくに重要であるのは自動車産業にとって
である。ここではたとえばディーゼルエンソンの始動を
スムーズに行なわせるために、この加熱素子が予熱プラ
グ、グミ−プラグ、赤熱体などの製造用に加熱素子なら
びにインレット、６−ナーが据えつけられることがある
。このことが意味するのはこの発明による高温加熱素子
が固着素子で用いられている公知の組み込み方に習って
組み込むことができ、かつ、慣用の電流供給ユニットへ
接続することができる。The high temperature heating element according to the invention can be used in the manufacture of various types of ceramic heating devices and can be used in a variety of applications. This is particularly important for the automobile industry. Here, for example, in order to ensure a smooth start-up of a diesel engine, heating elements and inlets and 6-ners may be installed for the production of preheating plugs, gummy plugs, incandescent bodies, etc. This means that the high-temperature heating element according to the invention can be installed in accordance with the known installation methods used for fastening elements and can be connected to a customary current supply unit.
と（に有利なのは、この発明による高温加熱素子の製造
が機械的に何回も繰り返し使用可能となることである。It is advantageous that the production of high temperature heating elements according to the invention is mechanically reusable many times.
加熱素子の幅が３〜１０襲でかつ長さが１０〜５０語の
ものが有利である。Advantageously, the heating element has a width of 3 to 10 lines and a length of 10 to 50 words.
予熱プラグの中に取りつける場合、この発明による加熱
素子はと（に回転対称体として行なわれる。そのさいジ
硅化モリブデン導体路は、たとえばホットプレスされた
窒化アルミニウム製〕中実棒上に、あるいは中央棒に巻
回される苗土にプリントする。When installed in a preheating plug, the heating element according to the invention is implemented as a rotationally symmetric body. The molybdenum disilicide conductor track is then placed on a solid rod, for example made of hot-pressed aluminum nitride, or in the center. Print on seedling soil that is wrapped around a stick.
予熱プラグの場合に這、この加熱素子の直径ハ３〜５３
ａ） 、突出長さはｌＱ〜３Ｑｍ、棒長さは２０〜６
０１１１であるのが目的にかなう。In the case of a preheating plug, the diameter of this heating element is 3 to 53 mm.
a), protrusion length is 1Q~3Qm, rod length is 20~6
0111 serves our purpose.
以下、この発明の実施例を図面を使ってより詳しく説明
する。Embodiments of the present invention will be described in more detail below with reference to the drawings.
第１図には、簡略してしかもかなり強調して拡大して描
かれたこの発明による高温加熱素子がみられる。この高
温加熱素子は取りつけ基板１と加熱導体２と接続端子３
ａ、３ｂとから構成されている。取りつけ基板１は、た
とえば市販されている１ｍ厚さのＡＭ箔であり、この上
へ絹紗（けんしゃ）スクリーン捺染（なっせん）法で、
とくにこし器・たたき刷毛（ばけ）印刷により加熱導体
２が接続端子３ａ、３ｂとともにプリントされている。In FIG. 1, the high temperature heating element according to the invention is shown in a simplified but highly exaggerated and enlarged view. This high temperature heating element consists of a mounting board 1, a heating conductor 2 and a connecting terminal 3.
It is composed of a and 3b. The mounting board 1 is, for example, a commercially available AM foil with a thickness of 1 m, and onto this is printed using a silk screen printing method.
In particular, the heating conductor 2 is printed together with the connection terminals 3a, 3b by strainer/beater brush printing.
図示の場合この加熱導体はソゲザクの波形状になってい
るが、もちろん他の任意の形状でもよい。In the illustrated case, the heating conductor has a wavy shape, but of course it may have any other shape.
印刷に用いられるのは、つぎの組成のノ硅化モリブデン
ペーストである。A molybdenum silicide paste having the following composition is used for printing.
市販のＭｏＳｉ粉末 ６９．８重量％α−テルピ
ンオイル ７９．０重量％ペンツルアルコール １
５．０重ｉｔ％つぎに、加熱導体層の乾いたあとプリン
トした敗りつけ基板の上へ、＠２の取りつけ基板４（こ
れにはプリントは施こされていない。）でほぼ同じ厚さ
のものが、接続端子３ａ、３ｂを除いて覆われる。１つ
に結合されたこの取りつけ基板はそのあと１６００℃の
高温、５ミリノζ−ルの圧力のもと、水素１０％を含む
窒素雰囲気の中で２時間もの長さにわたって焼結する。Commercially available MoSi powder 69.8% by weight α-terpine oil 79.0% by weight Pentyl alcohol 1
5.0 weight it% Next, after the heating conductor layer has dried, apply the mounting board 4 of @2 (no printing is applied to this) onto the printed defeating board to approximately the same thickness. are covered except for the connection terminals 3a and 3b. The bonded mounting substrates are then sintered at a high temperature of 1600 DEG C. under a pressure of 5 mmol in a nitrogen atmosphere containing 10% hydrogen for as long as 2 hours.
この取りつけ基板ヰは醸化防止の働きをする。This mounting board serves to prevent oxidation.
しかしながら、取りつけ基板１が印刷された加熱導体２
とともに保護ガスと（に形成ガス（Ｆｏｒｍｉｅｒｇａ
ｓ ） のもとで１６００°〜１８００℃の間の温度
で焼結しそのあとエージングプロセスを受けたのであれ
ば、もうその取りつけ基板１をもう一方の取りつけ基板
養で覆うことはしな（でもよい。このエージングプロセ
スはたとえば、プリントしかつ焼結された取りつけ基板
が２〜６時間もの間酸化雰囲気中で赤熱することによっ
て行なう。このような処理によってＳｉＯ２保護層が形
成されるようになり、この層で加熱導体が酸化・還元雰
囲気中でも＋−分圧保護されることとなる。However, the heating conductor 2 on which the mounting board 1 is printed
together with the protective gas and the forming gas (Formierga
s) at a temperature between 1600° and 1800° C. and subsequently subjected to an aging process, it is no longer necessary to cover the mounting substrate 1 with another mounting substrate (but This aging process is carried out, for example, by heating the printed and sintered mounting substrate in an oxidizing atmosphere for a period of 2 to 6 hours.Such treatment causes the formation of a SiO2 protective layer; This layer protects the heating conductor from +/- partial pressure even in oxidizing/reducing atmospheres.
プリントされた取りつけ基板が第２の取りつけ基板法で
覆われているか否か忙は関係な（、どの場合でも加熱導
体はＡｆｆｌ取りつけ基板上へ固（固着している。It does not matter whether the printed mounting board is covered with a second mounting board method or not (in any case the heating conductor is firmly attached to the Affl mounting board).
接続端子は慣用のやり方で金属被覆すればよい。たとえ
ば、加熱導体を保護ガス可燃厚層ぺ−ストを介して銅・
ニッケル・金などのベースの上に接触させるかあるいは
ニッケルー銅からの無電流分離によって接触させること
ができる。The connection terminals may be metallized in a customary manner. For example, the heating conductor can be connected to copper through a protective gas combustible thick layer paste.
Contact can be made on a base such as nickel-gold or by currentless separation from nickel-copper.
第２図にみられる簡略図示の加熱素子が第１図のそれと
本質的に異なっている点は、Ａ／ｊｌＪ取りつけ基板が
フレキシブルなＡＭハゲリーン箔から成っている点であ
る。加熱導体６に接続端子７ａ、７ｂを覆ったあと、そ
の加熱導体６を支持している箔５の一部の上に＠２５ミ
クロン厚さのＡ四ペーストと有機バインダー（たとえば
、エチルセルロース、αテルピンオイル、ペン・ゾルア
ルコール）とから成るペースト層をプリントする。The essential difference of the simplified heating element shown in FIG. 2 from that of FIG. 1 is that the A/jlJ mounting substrate is comprised of flexible AM thin foil. After covering the heating conductor 6 with the connecting terminals 7a, 7b, apply @25 micron thick A4 paste and an organic binder (e.g. ethylcellulose, Print a paste layer consisting of pin oil, pen sol alcohol).
第２ａ図にみられる簡略図示の取りつけ基板は、そのあ
とＩＷ２ｂ図にみられる形に巻回する。The simplified mounting board seen in Figure 2a is then rolled into the shape seen in Figure IW2b.
巻回された加熱要素はつぎに約２時間１６００〜１８０
０℃の領域の温度で焼結する。そして接続端子７ａ、７
ｂに金属被覆する。The wound heating element is then heated at 1600 to 180 Hz for approximately 2 hours.
Sintering is carried out at a temperature in the range of 0°C. and connection terminals 7a, 7
Metal coating on b.
第３図に示された棒状予熱プラグは、実質的にプラグケ
ーシング８と、窒化アルミニウム製棒１０およびプリン
トされたジ硅化モリブデン加熱導体１１とから加熱素子
９と、この窒化アルミニウム製棒１０の上にはんだ付け
されたシース１２（ｅ端子）（このシース１２を介して
アルミニウム脚棒１０がプラグケーシング８の中へ圧入
されるようになる。）と、このアルミニウム脚棒１０の
上にはんだ付けされたシース１３゛（■端子）と、加熱
導体１１を■端子から守る絶縁物１４と、絶縁円板１５
と、丸ナツト１６と端子ゼルト１７とから成っている。The rod-shaped preheating plug shown in FIG. A sheath 12 (e terminal) (through which the aluminum leg bar 10 is press-fitted into the plug casing 8) is soldered onto the aluminum leg bar 10. a sheath 13゛ (■terminal), an insulator 14 that protects the heating conductor 11 from the ■terminal, and an insulating disk 15.
It consists of a round nut 16 and a terminal bolt 17.
第１図は、この発明による加熱素子の第１実施例で、比
較的堅いＡハ取りつけ箔に取りつけられた状態を示す斜
視図、第２ａおよび２ｂ図は、この発明による加熱素子
の第２実施例で、比較的フレキシブルなへハ取りつけ箔
に取りつけられた状態を示す略示図、第３図はこの発明
による加熱素子を使った棒状予熱プラグの断面図である
。
１・・・取りつけ基板、２・・・加熱導体、３ａ、３ｂ
・・・接続端子、ヰ・・・取りつけ基板、５・・・Ａハ
ゲリーン箔、６・・・加熱導体、７ａ、７ｂ・・・接続
端子、８・・・プラグケーシング、９・・・加熱素子、
ｌＯ・・・アルミニウム窒化物棒、１１・・・加熱導体
、１２・・・シース、１３・・・シース−，１４・・・
絶縁物、１δ・・・絶縁円板、１６・・・丸ナツト、１
７・・・端子ゼルト
Ｆｉｇ、２ｑ
・・・加熱素子
・・・加熱導体FIG. 1 is a perspective view of a first embodiment of a heating element according to the invention, shown mounted on a relatively stiff A mounting foil, and FIGS. 2a and 2b are a second embodiment of a heating element according to the invention. As an example, FIG. 3 is a cross-sectional view of a rod-shaped preheating plug using a heating element according to the present invention, which is a schematic diagram showing a state in which it is attached to a relatively flexible navel attachment foil. 1... Mounting board, 2... Heating conductor, 3a, 3b
...Connection terminal, I...Mounting board, 5...A thin foil, 6...Heating conductor, 7a, 7b...Connection terminal, 8...Plug casing, 9...Heating element ,
lO... Aluminum nitride rod, 11... Heating conductor, 12... Sheath, 13... Sheath, 14...
Insulator, 1δ... Insulating disk, 16... Round nut, 1
7...Terminal Zelt Fig, 2q...Heating element...Heating conductor
Claims (1)
に塗られた加熱導体を備えた高温加熱素子において、該
加熱素子が二硅化モリブデン製の加熱導体を有し、該加
熱導体に必要に応じて電気抵抗調整のためのおよび／ま
たは熱膨張係数の改良に係る適合化のための物質が少量
混合することができることを特徴とする高温加熱素子。 ２ 高温加熱素子が厚膜技術で取りつけ基板の上へ塗ら
れた二硅化モリブデン製加熱導体を有し、該加熱要素に
必要に応じて電気抵抗調整のためのおよび／または熱膨
張係数の改良に係る適合化のための１種以上の物質が、
プリントに用いられるペーストに対して４０重量パーセ
ントまでの量で混合することができる請求項１記載の高
温加熱素子。 ３、高温加熱素子が二硅化モリブデンおよび酸化アルミ
ニウムおよび／または窒化アルミニウムから成る混合物
で作られた加熱導体を有している請求項１および２のい
ずれか１項記載の高温加熱素子。 ４、請求項１から３までのいずれか１項記載の高温加熱
素子を製造する方法において、窒化アルミニウム製の取
りつけ基板上へ厚膜技術で二硅化モリブデンペースト製
の加熱導体をプリントし、該ペーストは必要に応じて電
気抵抗調整のためのおよび／または熱膨張係数の改良に
係る適合化のための物質を４０容量％まで含有でき、か
つプリントされた該取りつけ基板を１６００°から１８
００℃までの温度で保護ガスのもとに焼結しかつその後
エージングすることを特徴とする高温加熱体の製造方法
。 ５、該焼結された材料を酸化雰囲気中で焙焼することに
よりエージングする請求項４記載の方法。 ６、該焼結された材料を約２時間にわたつてＨ＿２５〜
４０％を含むＮ＿２から成る雰囲気中で１６００℃〜１
８００℃の温度で焙焼する請求項５記載の方法。 ７、請求項１から３までのいずれか１項記載の高温加熱
素子を製造する方法において、窒化アルミニウム製の取
りつけ基板上へ厚膜技術で二硅化モリブデンペースト製
の加熱導体をプリントし、該ペーストは必要に応じて電
気抵抗調整のためのおよび／または熱膨張係数の改良に
係る適合化のための物質を４０容量％まで含有でき、該
印刷された窒化アルミニウム製取り付け基板の上へ別の
窒化アルミニウム製取りつけ基板を塗り、かつ、加熱導
体をはさんでサンドイッチ状に積み重ねられた取りつけ
基板を焼結することを特徴とする加熱導体の製造方法。 ８、約２時間にわたつて１６００°〜１８００℃の範囲
内の温度で焼結を行なう請求項７記載の方法。 ９、窒化アルミニウム製取りつけ基板として箔あるいは
薄板を用いる請求項４から８までのいずれか１項記載の
方法。 １０、請求項１から３までのいずれか１項記載の高温加
熱素子を使用することを特徴とする、セラミック加熱装
置の製造方法。[Scope of Claims] 1. A high-temperature heating element comprising a mounting substrate made of aluminum nitride and a heating conductor coated on the substrate, wherein the heating element has a heating conductor made of molybdenum disilicide; A high-temperature heating element characterized in that a small amount of a substance for adjusting the electric resistance and/or for adapting the thermal expansion coefficient can be mixed therein as required. 2. The high-temperature heating element has a heating conductor made of molybdenum disilicide coated onto the mounting substrate using thick-film technology, which heating element is optionally provided with electrical resistance adjustment and/or thermal expansion coefficient improvement. The one or more substances for such adaptation are:
The high temperature heating element of claim 1, which can be mixed in an amount of up to 40 weight percent with respect to the paste used for printing. 3. High-temperature heating element according to claim 1, characterized in that the high-temperature heating element has a heating conductor made of a mixture of molybdenum disilicide and aluminum oxide and/or aluminum nitride. 4. A method for manufacturing a high-temperature heating element according to any one of claims 1 to 3, in which a heating conductor made of molybdenum disilicide paste is printed by thick film technology on a mounting substrate made of aluminum nitride; can optionally contain up to 40% by volume of materials for adjusting the electrical resistance and/or for improving the coefficient of thermal expansion, and the printed mounting board can be heated from 1600° to 18°C.
A method for producing a high-temperature heating element, characterized in that it is sintered under a protective gas at temperatures up to 00° C. and then aged. 5. The method of claim 4, wherein the sintered material is aged by roasting in an oxidizing atmosphere. 6. Heat the sintered material to H_25 for about 2 hours.
1600℃~1 in an atmosphere consisting of N_2 containing 40%
The method according to claim 5, wherein the roasting is carried out at a temperature of 800°C. 7. A method for manufacturing a high-temperature heating element according to any one of claims 1 to 3, in which a heating conductor made of molybdenum disilicide paste is printed by thick film technology on a mounting substrate made of aluminum nitride, and the heating conductor is made of molybdenum disilicide paste. may optionally contain up to 40% by volume of adaptation substances for adjusting the electrical resistance and/or for improving the coefficient of thermal expansion, and further nitriding is applied onto the printed aluminum nitride mounting substrate. A method for manufacturing a heating conductor, which comprises coating an aluminum mounting board and sintering the mounting boards stacked in a sandwich with the heating conductor in between. 8. The method of claim 7, wherein the sintering is carried out at a temperature within the range of 1600 DEG to 1800 DEG C. for about 2 hours. 9. The method as claimed in claim 4, wherein the aluminum nitride mounting substrate is a foil or a thin plate. 10. A method for manufacturing a ceramic heating device, characterized in that the high temperature heating element according to any one of claims 1 to 3 is used.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE3843863.1 | 1988-12-24 | ||
| DE3843863A DE3843863A1 (en) | 1988-12-24 | 1988-12-24 | High-temperature heating element, method of producing it and use thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02215077A true JPH02215077A (en) | 1990-08-28 |
| JP2848880B2 JP2848880B2 (en) | 1999-01-20 |
Family
ID=6370240
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1333021A Expired - Fee Related JP2848880B2 (en) | 1988-12-24 | 1989-12-25 | High-temperature heating element, method for manufacturing the same, and method for manufacturing ceramic heating device |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2848880B2 (en) |
| DE (1) | DE3843863A1 (en) |
| FR (1) | FR2641156B1 (en) |
| IT (1) | IT1237917B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1997042792A1 (en) * | 1996-05-05 | 1997-11-13 | Seiichiro Miyata | Electric heating element and electrostatic chuck using the same |
| CN103024954A (en) * | 2012-12-10 | 2013-04-03 | 冷水江市明玉陶瓷工具有限责任公司 | Silicon nitride composite ceramic heating element materials and preparation method thereof |
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| JP2838346B2 (en) * | 1993-02-04 | 1998-12-16 | 株式会社ユニシアジェックス | Ceramic heater and method of manufacturing the same |
| DE4325606A1 (en) * | 1993-07-30 | 1995-02-09 | Bach Wolfdietrich | Ceramic heating element and method for producing such a heating element |
| DE4332244C2 (en) * | 1993-09-23 | 1999-01-28 | Heraeus Noblelight Gmbh | Radiation arrangement with a thermal radiation source and its use |
| DE10030924A1 (en) | 2000-06-24 | 2002-01-03 | Bosch Gmbh Robert | glow plug |
| US6410894B1 (en) * | 2000-10-12 | 2002-06-25 | Watlow Electric Manufacturing Company | Metallic overcoat for thick film heater termination |
| ATE448447T1 (en) * | 2007-03-23 | 2009-11-15 | Rauschert Steinbach Gmbh | IGNITION DEVICES AND METHOD FOR IGNITING SOLID FUEL |
| DE202008013657U1 (en) * | 2008-10-17 | 2008-12-24 | Rauschert Steinbach Gmbh | electrode assembly |
| DE102011055283B4 (en) | 2011-11-11 | 2016-06-23 | Borgwarner Ludwigsburg Gmbh | Glow plug and method of making a glow plug |
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-
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- 1988-12-24 DE DE3843863A patent/DE3843863A1/en active Granted
-
1989
- 1989-10-06 FR FR8913089A patent/FR2641156B1/fr not_active Expired - Fee Related
- 1989-12-15 IT IT02271589A patent/IT1237917B/en active IP Right Grant
- 1989-12-25 JP JP1333021A patent/JP2848880B2/en not_active Expired - Fee Related
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1997042792A1 (en) * | 1996-05-05 | 1997-11-13 | Seiichiro Miyata | Electric heating element and electrostatic chuck using the same |
| US6486447B2 (en) | 1996-05-05 | 2002-11-26 | Seiichiro Miyata | Method of manufacturing an electric heating element |
| CN103024954A (en) * | 2012-12-10 | 2013-04-03 | 冷水江市明玉陶瓷工具有限责任公司 | Silicon nitride composite ceramic heating element materials and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2848880B2 (en) | 1999-01-20 |
| FR2641156B1 (en) | 1995-03-24 |
| FR2641156A1 (en) | 1990-06-29 |
| IT1237917B (en) | 1993-06-18 |
| DE3843863C2 (en) | 1991-03-14 |
| IT8922715A0 (en) | 1989-12-15 |
| DE3843863A1 (en) | 1990-06-28 |
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