JPH02215013A - Shielded electric wire - Google Patents
Shielded electric wireInfo
- Publication number
- JPH02215013A JPH02215013A JP3716889A JP3716889A JPH02215013A JP H02215013 A JPH02215013 A JP H02215013A JP 3716889 A JP3716889 A JP 3716889A JP 3716889 A JP3716889 A JP 3716889A JP H02215013 A JPH02215013 A JP H02215013A
- Authority
- JP
- Japan
- Prior art keywords
- insulating layer
- polyphenylene ether
- ether resin
- foaming
- modified polyphenylene
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920001955 polyphenylene ether Polymers 0.000 claims abstract description 18
- -1 phosphate compound Chemical class 0.000 claims abstract description 12
- 239000011342 resin composition Substances 0.000 claims abstract description 11
- 239000004020 conductor Substances 0.000 claims abstract description 10
- 238000004132 cross linking Methods 0.000 claims abstract description 9
- 229910019142 PO4 Inorganic materials 0.000 claims abstract description 5
- 239000010452 phosphate Substances 0.000 claims abstract description 5
- 238000005187 foaming Methods 0.000 claims description 16
- 229920005989 resin Polymers 0.000 claims description 10
- 239000011347 resin Substances 0.000 claims description 10
- 239000004088 foaming agent Substances 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 claims description 5
- 230000001678 irradiating effect Effects 0.000 claims description 4
- 230000005865 ionizing radiation Effects 0.000 claims description 2
- 125000003545 alkoxy group Chemical group 0.000 claims 1
- 125000000217 alkyl group Chemical group 0.000 claims 1
- 125000004438 haloalkoxy group Chemical group 0.000 claims 1
- 229910052736 halogen Inorganic materials 0.000 claims 1
- 150000002367 halogens Chemical class 0.000 claims 1
- 229910052739 hydrogen Inorganic materials 0.000 claims 1
- 239000001257 hydrogen Substances 0.000 claims 1
- 125000004435 hydrogen atom Chemical class [H]* 0.000 claims 1
- 239000000126 substance Substances 0.000 claims 1
- 125000001424 substituent group Chemical group 0.000 claims 1
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 abstract description 4
- 239000000203 mixture Substances 0.000 abstract description 3
- 229920005990 polystyrene resin Polymers 0.000 abstract description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 abstract 2
- 239000010410 layer Substances 0.000 description 33
- 239000006260 foam Substances 0.000 description 8
- 238000000034 method Methods 0.000 description 7
- 239000004698 Polyethylene Substances 0.000 description 5
- 238000009413 insulation Methods 0.000 description 5
- 229920000573 polyethylene Polymers 0.000 description 5
- 238000010894 electron beam technology Methods 0.000 description 4
- 238000001125 extrusion Methods 0.000 description 4
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 2
- 239000004156 Azodicarbonamide Substances 0.000 description 2
- 229910001209 Low-carbon steel Inorganic materials 0.000 description 2
- VRFNYSYURHAPFL-UHFFFAOYSA-N [(4-methylphenyl)sulfonylamino]urea Chemical compound CC1=CC=C(S(=O)(=O)NNC(N)=O)C=C1 VRFNYSYURHAPFL-UHFFFAOYSA-N 0.000 description 2
- XOZUGNYVDXMRKW-AATRIKPKSA-N azodicarbonamide Chemical compound NC(=O)\N=N\C(N)=O XOZUGNYVDXMRKW-AATRIKPKSA-N 0.000 description 2
- 235000019399 azodicarbonamide Nutrition 0.000 description 2
- 238000007664 blowing Methods 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 239000003063 flame retardant Substances 0.000 description 2
- 230000008054 signal transmission Effects 0.000 description 2
- KOMNUTZXSVSERR-UHFFFAOYSA-N 1,3,5-tris(prop-2-enyl)-1,3,5-triazinane-2,4,6-trione Chemical compound C=CCN1C(=O)N(CC=C)C(=O)N(CC=C)C1=O KOMNUTZXSVSERR-UHFFFAOYSA-N 0.000 description 1
- SEILKFZTLVMHRR-UHFFFAOYSA-N 2-phosphonooxyethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCOP(O)(O)=O SEILKFZTLVMHRR-UHFFFAOYSA-N 0.000 description 1
- CGSLYBDCEGBZCG-UHFFFAOYSA-N Octicizer Chemical compound C=1C=CC=CC=1OP(=O)(OCC(CC)CCCC)OC1=CC=CC=C1 CGSLYBDCEGBZCG-UHFFFAOYSA-N 0.000 description 1
- YSMRWXYRXBRSND-UHFFFAOYSA-N TOTP Chemical compound CC1=CC=CC=C1OP(=O)(OC=1C(=CC=CC=1)C)OC1=CC=CC=C1C YSMRWXYRXBRSND-UHFFFAOYSA-N 0.000 description 1
- OKKRPWIIYQTPQF-UHFFFAOYSA-N Trimethylolpropane trimethacrylate Chemical compound CC(=C)C(=O)OCC(CC)(COC(=O)C(C)=C)COC(=O)C(C)=C OKKRPWIIYQTPQF-UHFFFAOYSA-N 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- YICSVBJRVMLQNS-UHFFFAOYSA-N dibutyl phenyl phosphate Chemical compound CCCCOP(=O)(OCCCC)OC1=CC=CC=C1 YICSVBJRVMLQNS-UHFFFAOYSA-N 0.000 description 1
- ASMQGLCHMVWBQR-UHFFFAOYSA-M diphenyl phosphate Chemical compound C=1C=CC=CC=1OP(=O)([O-])OC1=CC=CC=C1 ASMQGLCHMVWBQR-UHFFFAOYSA-M 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 150000003013 phosphoric acid derivatives Chemical class 0.000 description 1
- 150000003014 phosphoric acid esters Chemical class 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 230000005236 sound signal Effects 0.000 description 1
- XZZNDPSIHUTMOC-UHFFFAOYSA-N triphenyl phosphate Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)(=O)OC1=CC=CC=C1 XZZNDPSIHUTMOC-UHFFFAOYSA-N 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Landscapes
- Organic Insulating Materials (AREA)
- Communication Cables (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は電子機器間、電子機器の機器内配線等に用いる
低静電容量のシールド電線に関するものである。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a low capacitance shielded wire used for wiring between electronic devices, internal wiring of electronic devices, etc.
（従来の技術）
第１図はシールド電線の一般的構造の横断面図で、（１
）は内部導体、（２）は絶縁層、（３）は多数本の錫メ
ツキ軟鋼線を絶縁層（２）上に横巻きして構成したシー
ルド層、（４）は塩化ビニル等の外部被覆層である。(Prior art) Figure 1 is a cross-sectional view of the general structure of a shielded wire.
) is the internal conductor, (2) is the insulating layer, (3) is the shield layer formed by winding a large number of tin-plated mild steel wires horizontally on the insulating layer (2), and (4) is the outer coating such as vinyl chloride. It is a layer.
従来より、上記絶縁層（２）として発泡ポリエチレンを
用いたシールド電線が、テレビのアンテナ、チェーチー
間の信号伝送用や、ビデオ、オーディオ類の信号伝送用
、コンピューター類のインターフェース用等の信号伝送
用の電線として幅広く使用されている。Conventionally, shielded wires using foamed polyethylene as the insulating layer (2) have been used for signal transmission between TV antennas, cables, video and audio signals, computer interfaces, etc. It is widely used as electric wire.
このような用途では、信号周波数がＩＩＩ■２以上の高
周波で使用されることが多く、周囲の電界ノイズを遮蔽
するため、絶縁層（２）の外側にシールド層（３）を設
けるのが通常である。In such applications, signal frequencies are often used at high frequencies of III■2 or higher, and a shield layer (3) is usually provided on the outside of the insulating layer (2) to shield the surrounding electric field noise. It is.
ところが、このようなシールド層（３）を設けた電線で
は、内部導体（１）とシールド層（３）の間に静電容量
が生じ、高周波信号を伝送する場合、伝送損失が大きく
なる。従って、これらシールド電線の内部導体（１）上
の絶縁層（２）には誘電率の小さな材料を使用すること
が不可欠である。However, in an electric wire provided with such a shield layer (3), capacitance is generated between the internal conductor (1) and the shield layer (3), resulting in large transmission loss when transmitting a high frequency signal. Therefore, it is essential to use a material with a small dielectric constant for the insulating layer (2) on the internal conductor (1) of these shielded wires.
このような誘電体の小さな絶縁層としては、ポリエチレ
ン等の低誘電率の樹脂の発泡体が知られており、発泡さ
せたポリチレンや難燃化ポリエチレンを絶縁層とするシ
ールド電線が既に信号伝送用電線として広く使用されて
いるのは上述の通りである。Foamed resins with low dielectric constants such as polyethylene are known as such small dielectric insulation layers, and shielded wires with insulation layers made of foamed polyethylene or flame-retardant polyethylene are already being used for signal transmission. As mentioned above, wires are widely used as electric wires.
又発泡ポリエチレン以上の高強度の発泡絶縁層を得る方
法としては、変性ポリフェニレンエーテル樹脂を使用す
る方法があり、絶縁層を形成する方法としては、ポリフ
ェニレンエーテル樹脂組成物を内部導体上に押し出すと
同時に発泡させる方法と、発泡剤を発泡温度以下でポリ
フェニレンエーテル樹脂に配合し、これを発泡温度以下
で電線に成形後、この電線を発泡温度以上に加熱して発
泡させる方法がある。In addition, a method for obtaining a foamed insulating layer with higher strength than foamed polyethylene is to use modified polyphenylene ether resin, and a method for forming the insulating layer is to simultaneously extrude a polyphenylene ether resin composition onto the internal conductor. There is a method of foaming, and a method of blending a foaming agent into polyphenylene ether resin at a temperature below the foaming temperature, molding this into an electric wire at a temperature below the foaming temperature, and then heating the electric wire above the foaming temperature to foam the resin.
（解決しようとする課題）
しかし、上述の押し出しと同時に発泡させて絶縁層を形
成する方法は、絶縁層の発泡状態のコントロールと９、
絶縁層の外径、外観等のコントロールを同時に行なう必
要があり、極細線等の押し出し加工精度のきびしいもの
には向かない。押し出し加工精度を上げるには樹脂を発
泡させずに押し出し、電線に成形後、加熱発泡させれば
よいが、この場合には気泡率が安定しないことや、平均
の気泡率が大きくなり、極細線ではピンホールを生じ易
いという問題点がある。(Problem to be Solved) However, the method of forming an insulating layer by foaming at the same time as the extrusion described above requires control of the foaming state of the insulating layer.
It is necessary to control the outer diameter and appearance of the insulating layer at the same time, and it is not suitable for extruding items such as ultra-fine wires that require strict extrusion processing precision. In order to improve the precision of extrusion processing, it is possible to extrude the resin without foaming it, heat it and foam it after forming it into an electric wire. However, in this case, the bubble rate may not be stable, the average bubble rate may become large, and the However, there is a problem in that pinholes are likely to occur.
（課題を解決するための手段）
本発明は上述の問題点を解消したシールド電線を提供す
るもので、その特徴は、第１図に示すようなシールド電
線において、絶縁層（２）が発泡した変性ポリフェニレ
ンエーテル樹脂組成物によって形成されており、かつ架
橋されていることにある。(Means for Solving the Problems) The present invention provides a shielded wire that solves the above-mentioned problems, and is characterized in that the insulation layer (2) is foamed in the shielded wire as shown in FIG. It is formed from a modified polyphenylene ether resin composition and is crosslinked.
（作用）
変性ポリフェニレンエーテル樹脂組成物を用いて発泡絶
縁体を製造する方法の一つに、発泡剤を発泡温度以下で
ポリフェニレンエーテル樹脂組成物に混合し、これを発
泡温度以下の温度で内部導体上「押し出して電線に成形
後、この電線を発泡温度以上に加熱して発泡させる方法
がある。この場合、上記絶縁層を成形後、架橋すること
なく加熱発泡させると平均気泡径が大きくなり、絶縁層
ノ厚さが２００ｊｍ以下の薄層のものでは、ピンホール
が多発する。この気泡径は加熱発泡の前に絶縁層を架橋
させることによって大幅に低下し、２００１以下の厚さ
の絶縁層においてもピンホールが全く生じないことを見
出した。(Function) One of the methods for producing a foamed insulator using a modified polyphenylene ether resin composition is to mix a foaming agent into a polyphenylene ether resin composition at a temperature below the foaming temperature, and then to form an internal conductor at a temperature below the foaming temperature. There is a method of extruding and forming an electric wire and then heating the electric wire above the foaming temperature to foam it. In this case, if the insulating layer is molded and then heated and foamed without crosslinking, the average cell diameter will increase. In the case of a thin insulating layer with a thickness of 200 cm or less, pinholes occur frequently.The bubble diameter can be significantly reduced by crosslinking the insulating layer before heating and foaming. It was also found that no pinholes were formed at all.
本発明で使用する変性ポリフェニレンエーテル樹脂組成
物は、一般にポリ（２，６−シメチルフエニレンエーテ
ル）とポリスチレン樹脂等の混合物、或はポリフェニレ
ンエーテルにスチレン等をグラフト重合させたグラフト
マーとして知られて彰り、これにホスフェート化合物を
添加して難燃化したものも市販されている。The modified polyphenylene ether resin composition used in the present invention is generally known as a mixture of poly(2,6-dimethylphenylene ether) and polystyrene resin, or as a graftomer obtained by graft polymerizing styrene etc. to polyphenylene ether. Additionally, flame retardant products made by adding phosphate compounds are also commercially available.
架橋は市販の変性ポリフェニレンエーテル樹脂組成物に
電子線やγ線等の電離性放射線を照射することによって
も行なうことができるが、そのまま照射するだけでは架
橋効率が低いため、トリアリルイソシアヌート、トリア
リルイソシアヌレート、トリメチロールプロパントリメ
タクリレートのような多官能性モノマーや、２−メタク
リロイロキシエチルアシッドホスフェート等の不飽和基
を有するリン酸エステルを架橋助剤としてあらかじめ配
合しておくことが望ましい。照射線量は架橋助剤の配合
量等によって異なるが、通常１１ｒａｄ以上であり、好
ましくは３〜３ＯＮｒ＠ｄである。Crosslinking can also be carried out by irradiating a commercially available modified polyphenylene ether resin composition with ionizing radiation such as electron beams or gamma rays. It is desirable to blend in advance a polyfunctional monomer such as allyl isocyanurate and trimethylolpropane trimethacrylate, or a phosphoric acid ester having an unsaturated group such as 2-methacryloyloxyethyl acid phosphate as a crosslinking aid. The irradiation dose varies depending on the amount of the crosslinking aid, etc., but is usually 11 rad or more, preferably 3 to 3 ONr@d.
ホスフェート化合物としては、タレジルジフェニルホス
フェート、２−エチルへキシルジフェニルホスフェート
、トリクレジルホスフェート、トリイソプロピルフェニ
ルホスフェート、トリフェニルホスフェート、ジブチル
フェニルホスフェート等が使用可能である。As the phosphate compound, talesyl diphenyl phosphate, 2-ethylhexyl diphenyl phosphate, tricresyl phosphate, triisopropylphenyl phosphate, triphenyl phosphate, dibutylphenyl phosphate, etc. can be used.
発泡剤としては、ｐ−トルエンスルホニルセミカルバジ
ドやアゾジカルボンアミドのような発泡温度が２００℃
以上のものが好ましく、これより低温で発泡するもので
は、樹脂の溶融が充分でないため独立気泡が形成されな
い。Foaming agents with a foaming temperature of 200℃ such as p-toluenesulfonyl semicarbazide and azodicarbonamide
The above are preferred; if the foam foams at a lower temperature than this, the resin will not melt sufficiently and closed cells will not be formed.
（実施例）
実施例１；
樹脂分１００重量部に対し約３０重量部のホスフェート
化合物を含む変性ポリフェニレンエーテル樹脂（抗張力
３．５ｋｇ／−■２、伸び１５０％、誘電率２．８７Ｉ
ＫＩＩｚ）１００重量部に対して、ｐ−トルエンスルホ
ニルセミカルバジド（分解温度２２０〜２３０℃）を１
重量部、トリアリルイソシアヌレート５重量部を１８０
℃で混合し、押出用のペレットとした。これを押出機に
よりダイ部の設定温度２００℃で導体（直径０．５１腸
の軟鋼線）上に０．１■纏の厚さに押し出して未発泡の
電線に成形後、電子線を１５Ｍｒａｄ照射して絶縁層を
架橋せしめ、未発泡の架橋電線を作成した。この電線の
長さ方向に連続的に４００℃の熱風をあてて絶縁層を発
泡させ、約１０ｍ長さの発泡電線を得た。(Example) Example 1; Modified polyphenylene ether resin containing about 30 parts by weight of a phosphate compound per 100 parts by weight of resin (tensile strength 3.5 kg/-2, elongation 150%, dielectric constant 2.87 I
100 parts by weight of p-toluenesulfonyl semicarbazide (decomposition temperature 220-230°C)
180 parts by weight, 5 parts by weight of triallylisocyanurate
The mixture was mixed at ℃ to form pellets for extrusion. This is extruded onto a conductor (mild steel wire with a diameter of 0.51 mm) to a thickness of 0.1 mm using an extruder at a temperature set at 200°C in the die section to form an unfoamed wire, and then irradiated with an electron beam of 15 Mrad. The insulating layer was crosslinked to produce an unfoamed crosslinked electric wire. Hot air at 400° C. was continuously applied in the length direction of this electric wire to foam the insulating layer, thereby obtaining a foamed electric wire with a length of about 10 m.
この発泡電線の絶縁層の誘電率は！、Ｂであり、外径は
（１，８５ｍｍでほぼ一定であった。又絶縁層の気泡は
平均径１５ｓ−であり、ピンホールは全く生じなかった
。What is the dielectric constant of the insulation layer of this foam wire? , B, and the outer diameter was approximately constant at 1.85 mm.The average diameter of the bubbles in the insulating layer was 15 s-, and no pinholes were formed at all.
実施例２：
発泡剤としてｐ−トルエンスルホニルセミカルバシトの
代りにアゾジカルボンアミドを使用して、実施例と同様
にして１０ｍ長の発泡電線を作製した。この電線の絶縁
層の誘電率は１．８であり、外径は０．８−層でほぼ一
定であった。又絶縁層の気泡の平均径は３０ｊｍであり
、ピンホールは全く生じなかった。Example 2: A 10 m long foamed electric wire was produced in the same manner as in Example, using azodicarbonamide instead of p-toluenesulfonyl semicarbasite as a foaming agent. The dielectric constant of the insulating layer of this electric wire was 1.8, and the outer diameter was approximately constant at 0.8-layer. Further, the average diameter of the bubbles in the insulating layer was 30 m, and no pinholes were generated at all.
比較例１：
実施例１と全く同様にして未発泡の電線を作製した。こ
の電線の絶縁層に電子線を照射せず（架橋させず）に、
４００℃の熱風をあてて発泡させたところ、ピンホール
や・１００μ■以上の大きさの気泡が多数見られ、誘電
率はピンホールによる短絡のため測定できなかった。Comparative Example 1: An unfoamed electric wire was produced in exactly the same manner as in Example 1. Without irradiating the insulating layer of this electric wire with an electron beam (without crosslinking),
When it was foamed by blowing hot air at 400°C, many pinholes and bubbles with a size of 100μ or more were observed, and the dielectric constant could not be measured due to short circuits caused by the pinholes.
比較例２：
実施例２と全く同様にして未発泡の電線を作製した。こ
の電線の絶縁層に電子線を照射せず（架橋させず）に４
００℃の熱風をあてて発泡させたところ、ピンホールや
１００ｘ■以上の大きさの気泡が多数見られ、誘電率は
ピンホールによる短絡のため測定できなかった。Comparative Example 2: An unfoamed electric wire was produced in exactly the same manner as in Example 2. 4 without irradiating the insulating layer of this wire with an electron beam (without crosslinking).
When it was foamed by blowing hot air at 00°C, many pinholes and bubbles larger than 100x2 were observed, and the dielectric constant could not be measured due to short circuits caused by the pinholes.
（発明の効果）
以上説明したように、本発明によれば、高い難燃性と低
い誘電率を有し、かつ機械的強度にすぐれた薄層の発泡
絶縁層を具えたシールド電線が得られる。(Effects of the Invention) As explained above, according to the present invention, it is possible to obtain a shielded wire having a thin foam insulation layer having high flame retardancy and low dielectric constant and excellent mechanical strength. .
第１図はシールド電線の一般的構造の横断面図である。
１・・・内部導体、２・・・絶縁層、３・・・シールド
層、４・・・外部被覆層。FIG. 1 is a cross-sectional view of the general structure of a shielded wire. DESCRIPTION OF SYMBOLS 1... Internal conductor, 2... Insulating layer, 3... Shield layer, 4... Outer coating layer.
Claims (3)
を具えたシールド電線において、上記絶縁層が発泡した
変性ポリフェニレンエーテル樹脂組成物によって形成さ
れ、かつ架橋されていることを特徴とするシールド電線
。(1) A shielded wire having an insulating layer on an inner conductor and a shield layer on the outside thereof, wherein the insulating layer is formed of a foamed modified polyphenylene ether resin composition and is crosslinked. Electrical wire.
造式で示される基本骨格を有するポリフェニレンエーテ
ル樹脂とホスフェート化合物を含むものであって、発泡
前の伸びが１００％以上、誘電率が２．８以下であるこ
とを特徴とする請求項（１）記載のシールド電線。 ▲数式、化学式、表等があります▼ ここで、Ｒ＿１、Ｒ＿２、Ｒ＿３及びＲ＿４は水素、ア
ルキル基、ハロゲン、アルコキシ基及びハロアルコキシ
基の中から選んだ一価置換基、ｎは自然数である。(2) The modified polyphenylene ether resin composition contains a polyphenylene ether resin having a basic skeleton represented by the following structural formula and a phosphate compound, and has an elongation of 100% or more and a dielectric constant of 2.8 or less before foaming. The shielded wire according to claim 1, characterized in that: ▲There are mathematical formulas, chemical formulas, tables, etc.▼ Here, R_1, R_2, R_3, and R_4 are monovalent substituents selected from hydrogen, alkyl groups, halogens, alkoxy groups, and haloalkoxy groups, and n is a natural number.
テル樹脂を発泡温度より充分低い温度で内部導体上に押
し出し、これに電離性放射線を照射して架橋させた後に
、絶縁層を発泡温度以上に加熱して発泡させて形成した
ものであることを特徴とする請求項（１）記載のシール
ド電線。(3) The insulating layer is formed by extruding a modified polyphenylene ether resin containing a foaming agent onto the internal conductor at a temperature sufficiently lower than the foaming temperature, crosslinking it by irradiating it with ionizing radiation, and then heating the insulating layer to a temperature higher than the foaming temperature. The shielded wire according to claim 1, which is formed by heating and foaming.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3716889A JPH02215013A (en) | 1989-02-15 | 1989-02-15 | Shielded electric wire |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3716889A JPH02215013A (en) | 1989-02-15 | 1989-02-15 | Shielded electric wire |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02215013A true JPH02215013A (en) | 1990-08-28 |
Family
ID=12490071
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3716889A Pending JPH02215013A (en) | 1989-02-15 | 1989-02-15 | Shielded electric wire |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02215013A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001052537A (en) * | 1999-08-09 | 2001-02-23 | Sumitomo Electric Ind Ltd | Non-halogen flame retardant shield cable |
| WO2014103674A1 (en) * | 2012-12-27 | 2014-07-03 | 株式会社オートネットワーク技術研究所 | Wire harness |
-
1989
- 1989-02-15 JP JP3716889A patent/JPH02215013A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001052537A (en) * | 1999-08-09 | 2001-02-23 | Sumitomo Electric Ind Ltd | Non-halogen flame retardant shield cable |
| WO2014103674A1 (en) * | 2012-12-27 | 2014-07-03 | 株式会社オートネットワーク技術研究所 | Wire harness |
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