JPH02210710A - Moisture resistant dielectric material - Google Patents
Moisture resistant dielectric materialInfo
- Publication number
- JPH02210710A JPH02210710A JP1031305A JP3130589A JPH02210710A JP H02210710 A JPH02210710 A JP H02210710A JP 1031305 A JP1031305 A JP 1031305A JP 3130589 A JP3130589 A JP 3130589A JP H02210710 A JPH02210710 A JP H02210710A
- Authority
- JP
- Japan
- Prior art keywords
- inorganic filler
- dielectric material
- coupling agent
- silane coupling
- polymeric material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003989 dielectric material Substances 0.000 title claims abstract description 15
- 239000011256 inorganic filler Substances 0.000 claims abstract description 17
- 229910003475 inorganic filler Inorganic materials 0.000 claims abstract description 17
- 239000006087 Silane Coupling Agent Substances 0.000 claims abstract description 9
- 125000005010 perfluoroalkyl group Chemical group 0.000 claims abstract description 8
- 125000000217 alkyl group Chemical group 0.000 claims abstract description 3
- 229910052731 fluorine Inorganic materials 0.000 claims description 7
- 239000002861 polymer material Substances 0.000 claims description 7
- 239000011737 fluorine Substances 0.000 claims description 6
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims description 5
- 125000004432 carbon atom Chemical group C* 0.000 claims description 4
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 abstract description 9
- 229910002113 barium titanate Inorganic materials 0.000 abstract description 9
- 239000000463 material Substances 0.000 abstract description 9
- 229920005989 resin Polymers 0.000 abstract description 9
- 239000011347 resin Substances 0.000 abstract description 9
- 239000000945 filler Substances 0.000 abstract description 7
- 239000011521 glass Substances 0.000 abstract description 7
- 229920001971 elastomer Polymers 0.000 abstract description 5
- 239000005060 rubber Substances 0.000 abstract description 5
- AOWKSNWVBZGMTJ-UHFFFAOYSA-N calcium titanate Chemical compound [Ca+2].[O-][Ti]([O-])=O AOWKSNWVBZGMTJ-UHFFFAOYSA-N 0.000 abstract description 3
- 229910052799 carbon Inorganic materials 0.000 abstract description 3
- 230000002209 hydrophobic effect Effects 0.000 abstract description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 abstract 2
- BSYQEPMUPCBSBK-UHFFFAOYSA-N [F].[SiH4] Chemical compound [F].[SiH4] BSYQEPMUPCBSBK-UHFFFAOYSA-N 0.000 abstract 2
- 238000004381 surface treatment Methods 0.000 abstract 2
- 229920000642 polymer Polymers 0.000 abstract 1
- -1 fluororesin Polymers 0.000 description 6
- 239000000835 fiber Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- 239000002131 composite material Substances 0.000 description 3
- 239000012756 surface treatment agent Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- DXODQEHVNYHGGW-UHFFFAOYSA-N 1,1,2,2,3,3,4,4,5,5,6,6,7,7,8,8,8-heptadecafluorooctyl-tris(trifluoromethoxy)silane Chemical compound FC(F)(F)O[Si](OC(F)(F)F)(OC(F)(F)F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)F DXODQEHVNYHGGW-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 2
- 239000004810 polytetrafluoroethylene Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- PEVRKKOYEFPFMN-UHFFFAOYSA-N 1,1,2,3,3,3-hexafluoroprop-1-ene;1,1,2,2-tetrafluoroethene Chemical group FC(F)=C(F)F.FC(F)=C(F)C(F)(F)F PEVRKKOYEFPFMN-UHFFFAOYSA-N 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004962 Polyamide-imide Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- 239000006004 Quartz sand Substances 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 235000010724 Wisteria floribunda Nutrition 0.000 description 1
- 125000003545 alkoxy group Chemical group 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 229920006026 co-polymeric resin Polymers 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- NJLLQSBAHIKGKF-UHFFFAOYSA-N dipotassium dioxido(oxo)titanium Chemical compound [K+].[K+].[O-][Ti]([O-])=O NJLLQSBAHIKGKF-UHFFFAOYSA-N 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 125000001165 hydrophobic group Chemical group 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 150000002484 inorganic compounds Chemical class 0.000 description 1
- 239000012784 inorganic fiber Substances 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 125000005003 perfluorobutyl group Chemical group FC(F)(F)C(F)(F)C(F)(F)C(F)(F)* 0.000 description 1
- 125000005007 perfluorooctyl group Chemical group FC(C(C(C(C(C(C(C(F)(F)F)(F)F)(F)F)(F)F)(F)F)(F)F)(F)F)(F)* 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920006380 polyphenylene oxide Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 150000004760 silicates Chemical class 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 239000000344 soap Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 125000002023 trifluoromethyl group Chemical group FC(F)(F)* 0.000 description 1
- NMEPHPOFYLLFTK-UHFFFAOYSA-N trimethoxy(octyl)silane Chemical compound CCCCCCCC[Si](OC)(OC)OC NMEPHPOFYLLFTK-UHFFFAOYSA-N 0.000 description 1
- 229920006305 unsaturated polyester Polymers 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/16—Layered products comprising a layer of synthetic resin specially treated, e.g. irradiated
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
- B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/04—Ingredients treated with organic substances
- C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/44—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins
- H01B3/443—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins from vinylhalogenides or other halogenoethylenic compounds
- H01B3/445—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins from vinylhalogenides or other halogenoethylenic compounds from vinylfluorides or other fluoroethylenic compounds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/204—Di-electric
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/724—Permeability to gases, adsorption
- B32B2307/7242—Non-permeable
- B32B2307/7246—Water vapor barrier
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0239—Coupling agent for particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0242—Shape of an individual particle
- H05K2201/0245—Flakes, flat particles or lamellar particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0242—Shape of an individual particle
- H05K2201/0248—Needles or elongated particles; Elongated cluster of chemically bonded particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0242—Shape of an individual particle
- H05K2201/0254—Microballoons or hollow filler particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/032—Materials
- H05K2201/0323—Carbon
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、無機充填材を含む複合誘電体材料に係り、詳
しくは、耐湿性等の改良された誘電体材料に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a composite dielectric material containing an inorganic filler, and more particularly to a dielectric material with improved moisture resistance.
従来、高分子素材を誘電体材料として使用する場合に、
その電気的性質等を改善する目的で、各種の無機充填材
の添加による複合化が行なわれている。例えば、誘電率
を高めようとする場合には、特開昭６３−２２８５２６
号等に示されるように、充填材としてチタン酸バリウム
、チタン酸カルシウム、チタン酸マグネシウムなどの強
誘電材料を樹脂あるいはゴム中に添加すればよい。また
、それとは逆に低誘電率化を図る場合には、ガラス製微
小中空球体等の低誘電率の充填材が用いられる（本出願
人による特願昭６２−１１８５６２号等参照）。Conventionally, when using polymer materials as dielectric materials,
In order to improve its electrical properties, etc., composites are being made by adding various inorganic fillers. For example, when trying to increase the dielectric constant,
As shown in No. 1, etc., a ferroelectric material such as barium titanate, calcium titanate, magnesium titanate, etc. may be added to the resin or rubber as a filler. On the other hand, when lowering the dielectric constant is desired, a filler with a low dielectric constant such as glass micro hollow spheres is used (see Japanese Patent Application No. 118562/1989 filed by the present applicant).
ところで、これらの充填材を樹脂、ゴム等のマトリクス
材料に高濃度で添加する場合には、その分散性を改善す
るため、表面処理剤による処理が行なわれている。この
ような表面処理剤として、界面活性剤あるいは金属石ケ
ン等が従来より知られているが、いずれも未だ十分満足
すべきものではなく、特に、耐湿性の面ではその改善効
果が少ないために電気的特性が不安定になるという問題
点があり、また誘電正接が大幅に上昇してしまうなどの
問題点を有していた。By the way, when these fillers are added at high concentrations to matrix materials such as resins and rubbers, treatment with a surface treatment agent is performed in order to improve their dispersibility. Surfactants, metal soaps, etc. have been known as such surface treatment agents, but none of them are yet fully satisfactory, especially in terms of moisture resistance. However, there were problems in that the optical characteristics became unstable, and the dielectric loss tangent increased significantly.
本発明は、このような従来技術の問題点を解消するもの
であり、耐湿性等の向上した複合誘電体材料の撮像をそ
の目的とする。The present invention solves these problems of the prior art, and its purpose is to image a composite dielectric material with improved moisture resistance.
本発明者らは、かかる従来技術の問題点に鑑みて鋭意検
討を重ねた結果、特定のシランカップリング剤が所期の
目的を達成しうろことを見出し、本発明を完成するに至
った。The present inventors have made extensive studies in view of the problems of the prior art, and as a result have found that a specific silane coupling agent can achieve the intended purpose, and have completed the present invention.
即ち、本発明は、絶縁性高分子材料中に、下記一般式
％式％
〔式中、Ｒｆは炭素数１−１０のパーフルオロアルキル
基を、Ｒ１およびＲ１は炭素数１または２のアルキル基
を示し、ｎは１〜３の請求である〕で示されるフッ素系
シランカップリング剤で表面処理された無機充填材を分
散せしめてなる耐湿性誘電体材料である。That is, the present invention provides an insulating polymer material with the following general formula % [wherein, Rf is a perfluoroalkyl group having 1 to 10 carbon atoms, and R1 and R1 are an alkyl group having 1 or 2 carbon atoms]. This is a moisture-resistant dielectric material made by dispersing an inorganic filler whose surface is treated with a fluorine-based silane coupling agent represented by the following formulas, and n is a claim of 1 to 3.
本発明に用いる絶縁性高分子材料は、絶縁性を有するポ
リマーであれば樹脂、ゴムを問わないが、例を示すと、
フッ素樹脂、ポリオレフィン、飽和ポリエステル、ポリ
塩化ビニル、ポリフェニレンスルフィド、ポリフェニレ
ンオキシド、ポリエーテルエーテルケトン、ポリアミド
、ポリウレタンなどの熱可塑性の樹脂、あるいはポリミ
イド、エポキシ樹脂、不飽和ポリエステル、ポリアミド
イミドなどの熱硬化性の樹脂、またゴムとしては、シリ
コーンゴムなどを挙げることができる。The insulating polymer material used in the present invention may be resin or rubber as long as it has insulating properties, but examples include:
Thermoplastic resins such as fluororesin, polyolefin, saturated polyester, polyvinyl chloride, polyphenylene sulfide, polyphenylene oxide, polyetheretherketone, polyamide, polyurethane, or thermosetting resins such as polymide, epoxy resin, unsaturated polyester, polyamideimide, etc. Examples of the resin and rubber include silicone rubber.
また、本発明で使用することのできる無機充填材として
は、チタン酸バリウム、チタン酸カルシウム、酸化チタ
ン等の強誘電材料、ガラスバルーン、シラスバルーン等
の低誘電率の微小中空球体、ガラス繊維、炭素繊維、金
属繊維、セラミック繊維、ボロン繊維、チタン酸カリウ
ム繊維、アスベスト等の無機繊維、炭酸カルシ゛ウム、
高分散性ケイ酸塩、アルミナ、タルク、クレー マイカ
、ガラスフレーク、ガラス粉、石英砂、各種金属粉末、
カーボンブラック、硫酸バリウム等の粉末物質および炭
化ケイ素、アルミナ、窒化ホウ素、窒化ケイ素等の粉粒
状、板状の無機化合物、ウィスカーや金属ウィスカー等
の種々の材質、形状のものが、その使用目的に応じて選
択され、さらにこれらの充填材は二種以上組み合わせて
使用することができる。Inorganic fillers that can be used in the present invention include ferroelectric materials such as barium titanate, calcium titanate, and titanium oxide, micro hollow spheres with a low dielectric constant such as glass balloons and glass balloons, glass fibers, Carbon fiber, metal fiber, ceramic fiber, boron fiber, potassium titanate fiber, inorganic fiber such as asbestos, calcium carbonate,
Highly dispersed silicates, alumina, talc, clay mica, glass flakes, glass powder, quartz sand, various metal powders,
Powdered substances such as carbon black and barium sulfate; powdered and plate-like inorganic compounds such as silicon carbide, alumina, boron nitride, and silicon nitride; and various materials and shapes such as whiskers and metal whiskers, depending on the intended use. These fillers can be selected accordingly, and two or more of these fillers can be used in combination.
本発明においてフッ素系シランカップリング剤は、無機
充填材の表面に作用し、化学的結合により充填材の表面
を疎水性に改質するもので、前記した一般式で示される
シラン化合物であり、式中Ｒｒテ示されるパーフルオロ
アルキル基の具体例としては、パーフルオロメチル基（
ＣＦ 、−）、パーフルオロブチル基（ｃ ４Ｆ Ｉ−
）、パーフルオロオクチル基（Ｃ、Ｆ 、、−）などが
挙げられ、Ｒ−およびＲ″はメチル基またはエチル基で
ある。そして、これらカップリング剤の添加量は、無機
充填材の材質、性状（粒子径、表面積など）等によって
も異なるが、−船釣には無機充填材に対して０．１〜５
重量％であればよい。In the present invention, the fluorine-based silane coupling agent acts on the surface of the inorganic filler and modifies the surface of the filler to be hydrophobic through chemical bonding, and is a silane compound represented by the general formula described above, Specific examples of the perfluoroalkyl group represented by Rr in the formula include perfluoromethyl group (
CF , -), perfluorobutyl group (c 4F I-
), perfluorooctyl group (C, F,, -), etc., and R- and R'' are methyl or ethyl groups.The amount of these coupling agents added depends on the material of the inorganic filler, Although it varies depending on the properties (particle size, surface area, etc.), - For boat fishing, it is 0.1 to 5
It suffices if it is % by weight.
本発明によれば、パーフルオロアルキル基（Ｒｒ −）
の導入により臨界表面張力が著しく低下している７ ッ
素系シランカー／ フＩＪ ン’：ｆ剤（Ｒｆ（ＣＨｔ
）ｔＳｉ（ＯＲ’）ｎＲ’５−ｎ）を無機充填材の表面
処理剤として用いる。According to the invention, perfluoroalkyl group (Rr −)
The critical surface tension of the 7-fluorine-based silanker/F agent (Rf(CHt
)tSi(OR')nR'5-n) is used as a surface treatment agent for the inorganic filler.
そして、このカップリング剤中のアルコキシ基（ＯＲ１
）が、無機充填材の表面に吸着した水の水酸基（−ＯＨ
）等と反応して結合する。その結果、無機充填材の表面
は、同一のケイ素原子に結合しているパーフルオロアル
キル基によって覆われる。このパーフルオロアルキル基
は、臨界表面張力の極めて低い疎水基であるから、無機
充填材の表゛面が疎水性となって水分の影響を受けに（
くなる。さらに、四フッ化エチレン樹脂に代表される低
エネルギー界面特性を有する高分子材料をマトクリス材
料とした場合には、無機充填材の表面に存在するパーフ
ルオロアルキル基によりマトクリス高分子材料に対する
親和性が高まるので、特に、高濃度で充填したときにマ
トクリス高分子材料と無機充填材との界面に空隙が生じ
にくくなり、耐湿性はさらに向上する。Then, the alkoxy group (OR1
) is the hydroxyl group (-OH) of the water adsorbed on the surface of the inorganic filler.
), etc., and combine with them. As a result, the surface of the inorganic filler is covered with perfluoroalkyl groups bonded to the same silicon atom. Since this perfluoroalkyl group is a hydrophobic group with an extremely low critical surface tension, the surface of the inorganic filler becomes hydrophobic and is not affected by moisture (
It becomes. Furthermore, when a polymer material with low energy interfacial properties, such as tetrafluoroethylene resin, is used as a Matocrys material, the perfluoroalkyl group present on the surface of the inorganic filler increases the affinity for the Matocrys polymer material. As a result, voids are less likely to be formed at the interface between the Matocrys polymer material and the inorganic filler, especially when filled at a high concentration, and the moisture resistance is further improved.
以下、本発明を実施例をもって具体的に説明するが、本
発明は何らこれらの実施例に限定されるものではない。EXAMPLES Hereinafter, the present invention will be specifically explained with reference to Examples, but the present invention is not limited to these Examples in any way.
実施例１゜
０．３３５重量部のパーフルオロオクチルトリメトキシ
シラン（信越化学工業社製ＬＰ−ＢＴ）で処理した６７
重量部のチタン酸バリウム（富士チタン工業社製Ｎ−５
５００）と、四フッ化エチレン樹脂微粉末（三井デュポ
ンフロロケミカル社製テフロン６Ｊ）３３重量部とを混
合した後、さらに液体潤滑剤としてソルベントナフサ（
出光石油化学社製ＩＰ−１６２０）を加え、室温下に１
２時間放置した。そして、これら混和物をロールで圧延
して厚さＱ 、 １５ｓ＋ｎのシート状に成形した後、
３７０℃で３分間の焼成を行ない、本発明によるシート
状の誘電体材料を得た。Example 1 67 treated with 0.335 parts by weight of perfluorooctyltrimethoxysilane (LP-BT manufactured by Shin-Etsu Chemical Co., Ltd.)
Part by weight of barium titanate (N-5 manufactured by Fuji Titanium Industries, Ltd.)
500) and 33 parts by weight of polytetrafluoroethylene resin fine powder (Teflon 6J manufactured by DuPont Mitsui Fluorochemicals) were mixed, and then solvent naphtha (
Add IP-1620 (manufactured by Idemitsu Petrochemical Co., Ltd.) and let it stand at room temperature for 1
It was left for 2 hours. Then, after rolling these mixtures with rolls and forming them into a sheet with a thickness of Q, 15s+n,
Firing was performed at 370° C. for 3 minutes to obtain a sheet-shaped dielectric material according to the present invention.
このシート状誘電体材料の特性を調べるため、その両面
に厚さ２５μ鴎のテトラフルオロエチレン−ヘキサフル
オロプロピレン共重合樹脂を介してそれぞれ厚さ３５μ
−の銅箔を重ね、加熱プレスで加圧成形して銅張積層板
を得た。そして、この積層板について、常態および吸水
処理後での表面抵抗率、体積抵抗率、絶線抵抗、誘電率
、および誘電正接、さらに吸水率についても測定し、次
表に示した。なお、これらの試験は、ＪＩＳ規格Ｃ６４
８１ｒ印刷回路用銅張積層板」に準じて行なった。In order to investigate the properties of this sheet-like dielectric material, a 25-μ thick layer of tetrafluoroethylene-hexafluoropropylene copolymer resin was interposed on both sides of the dielectric material, and a 35-μ thick layer was placed on each side.
- copper foils were stacked and pressure-molded using a hot press to obtain a copper-clad laminate. The surface resistivity, volume resistivity, insulation resistance, dielectric constant, dielectric loss tangent, and water absorption rate of this laminate were measured in normal state and after water absorption treatment, and the results are shown in the following table. These tests are based on JIS standard C64.
81r Copper-clad laminates for printed circuits".
実施例２゜
チタン酸バリウム８６重量部を０．４３重量部のパーフ
ルオロオクチルトリメトキシシラン（ＣＦａ（ＣＦｔ）
ｔ（Ｃ１ｌｔ）ｔｓｉ（ＯＣＨｓ）ｓ ）で処理したも
のを１４重量部の四フッ化エチレン樹脂微粉末と混合し
、実施例１と同様にしてシート状の誘電体材料を得た。Example 2 86 parts by weight of barium titanate was mixed with 0.43 parts by weight of perfluorooctyltrimethoxysilane (CFa (CFt)).
t(C1lt)tsi(OCHs)s ) was mixed with 14 parts by weight of polytetrafluoroethylene resin fine powder to obtain a sheet-like dielectric material in the same manner as in Example 1.
さらに、このシート状誘電体材料を用いて銅張積層板を
形成し、同様な試験を行なった。その結果を表に示す。Furthermore, a copper-clad laminate was formed using this sheet-like dielectric material, and similar tests were conducted. The results are shown in the table.
比較例１
実施例１で用いたフッ素系シランカップリング剤で処理
したチタン酸バリウムの代わりに、無処理のチタン酸バ
リウムを用いる以外は実施例１と同様に行なった。結果
を表に示す。Comparative Example 1 The same procedure as in Example 1 was conducted except that untreated barium titanate was used in place of the barium titanate treated with the fluorine-based silane coupling agent used in Example 1. The results are shown in the table.
比較例２゜
実施例２で用いたフッ素系シランカップリング剤の代わ
りに、フッ素を含まないシランカップリング剤であるオ
クチルトリメトキシシラン〔Ｃ。Comparative Example 2 Instead of the fluorine-based silane coupling agent used in Example 2, octyltrimethoxysilane [C], which is a fluorine-free silane coupling agent, was used.
）−（１７Ｓ ｉ（ＯＣＨ５）３）でチタン酸バリウム
を処理する以外は実施例２と同様に行なった。その結果
接の小さいものであることがわかる。)-(17Si(OCH5)3) The same procedure as in Example 2 was carried out except that barium titanate was treated with (17Si(OCH5)3). As a result, it can be seen that the tangent is small.
なお、実施例としては示さないが、チタン酸バリウムに
代えて、例えば低誘電率の誘電体材料を得るために、ガ
ラス製の微小中空体等の他の無機充填材を配合した場合
にも、同様な傾向が見られた。Although not shown as an example, in place of barium titanate, for example, in order to obtain a dielectric material with a low dielectric constant, other inorganic fillers such as glass micro hollow bodies may be mixed. A similar trend was observed.
特許出願人 株式会社 潤 工 社〔発明の効果〕Patent applicant: Junkosha Co., Ltd. [Effects of the invention]
Claims (1)
ｎ〔式中、Ｒｆは炭素数１〜１０のパーフルオロアルキ
ル基を、Ｒ＾１およびＲ＾２は炭素数１または２のアル
キル基を示し、ｎは１〜３の整数である〕で示されるフ
ッ素系シランカップリング剤で表面処理された無機充填
材を分散せしめてなる耐湿性誘電体材料。(1) In the insulating polymer material, the following general formula Rf(CH_2)_2Si(OR^1)nR^2_2-
n [wherein, Rf represents a perfluoroalkyl group having 1 to 10 carbon atoms, R^1 and R^2 represent an alkyl group having 1 or 2 carbon atoms, and n is an integer of 1 to 3] A moisture-resistant dielectric material made by dispersing an inorganic filler whose surface has been treated with a fluorine-based silane coupling agent.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1031305A JPH02210710A (en) | 1989-02-10 | 1989-02-10 | Moisture resistant dielectric material |
| EP90301398A EP0382557A1 (en) | 1989-02-10 | 1990-02-09 | Dielectric material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1031305A JPH02210710A (en) | 1989-02-10 | 1989-02-10 | Moisture resistant dielectric material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02210710A true JPH02210710A (en) | 1990-08-22 |
Family
ID=12327581
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1031305A Pending JPH02210710A (en) | 1989-02-10 | 1989-02-10 | Moisture resistant dielectric material |
Country Status (2)
| Country | Link |
|---|---|
| EP (1) | EP0382557A1 (en) |
| JP (1) | JPH02210710A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1998035361A1 (en) * | 1997-02-05 | 1998-08-13 | Daikin Industries, Ltd. | Dielectric material for high frequency |
| JP2010180070A (en) * | 2009-02-03 | 2010-08-19 | Nitto Denko Corp | High permittivity insulation sheet, and method for producing the same |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2251860A (en) * | 1991-01-17 | 1992-07-22 | Rogers Corp | Ceramic tilled fluoropolymeric composite material |
| JPH0799646B2 (en) * | 1991-05-03 | 1995-10-25 | インターナショナル・ビジネス・マシーンズ・コーポレイション | Low dielectric constant composite laminates filled with molecularly porous airgel |
| JP2886432B2 (en) * | 1992-12-29 | 1999-04-26 | インターナショナル・ビジネス・マシーンズ・コーポレイション | Fluorinated polymer composition |
| US5358775A (en) * | 1993-07-29 | 1994-10-25 | Rogers Corporation | Fluoropolymeric electrical substrate material exhibiting low thermal coefficient of dielectric constant |
| CA2247477A1 (en) * | 1996-02-29 | 1997-09-04 | Joan V. Brennan | Thermoplastic elastomeric substrate material with tunable dielectric properties and laminates thereof |
| JP3684300B2 (en) * | 1998-06-26 | 2005-08-17 | 株式会社日立製作所 | Narrow cylindrical engine ignition coil device mounted in plug hole |
| DE19904133B4 (en) * | 1999-02-03 | 2007-02-08 | Degussa Ag | Surface modified insulator and method for modifying the surface of an insulator |
| DE19964309C2 (en) | 1999-11-15 | 2003-07-03 | Degussa | Triamino and fluoroalkyl functional organosiloxanes or mixtures thereof |
| DE102004040265A1 (en) * | 2004-08-19 | 2006-02-23 | Wacker-Chemie Gmbh | Mineral fiber-containing silicone rubber composition |
| GB2442535B (en) * | 2006-10-05 | 2011-07-13 | Ngf Europ Ltd | Method and articles |
| US7754969B2 (en) | 2007-06-08 | 2010-07-13 | Southwire Company | Armored cable with integral support |
| EP2085442A1 (en) | 2008-02-01 | 2009-08-05 | Evonik Degussa GmbH | Compounds containing fluoride with improved surface characteristics |
| DE102008007190A1 (en) | 2008-02-01 | 2009-08-06 | Construction Research & Technology Gmbh | Liquid, fluorine-containing and one-component composition |
| EP3224325B1 (en) * | 2014-11-27 | 2019-07-03 | Toyota Motor Europe | Lubricant coating for moving parts of automobiles |
| CN110713717A (en) * | 2019-11-23 | 2020-01-21 | 西北工业大学 | High-temperature-resistant dopamine-coated barium titanate/polyimide (BT @ PDA/PI) dielectric nano composite film |
| CN113444288B (en) * | 2021-06-10 | 2022-06-07 | 南昌工程学院 | Dioxaborane group modified barium titanate with reversible crosslinking structure and preparation method thereof |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4134848A (en) * | 1976-06-28 | 1979-01-16 | The United States Of America As Represented By The Secretary Of The Navy | Composite for improved stripline board material |
| JPS61205950A (en) * | 1985-03-11 | 1986-09-12 | Canon Inc | Image preserving material |
| JPS63199253A (en) * | 1987-02-13 | 1988-08-17 | Shin Etsu Chem Co Ltd | Rubber composition |
-
1989
- 1989-02-10 JP JP1031305A patent/JPH02210710A/en active Pending
-
1990
- 1990-02-09 EP EP90301398A patent/EP0382557A1/en not_active Withdrawn
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1998035361A1 (en) * | 1997-02-05 | 1998-08-13 | Daikin Industries, Ltd. | Dielectric material for high frequency |
| JP2010180070A (en) * | 2009-02-03 | 2010-08-19 | Nitto Denko Corp | High permittivity insulation sheet, and method for producing the same |
Also Published As
| Publication number | Publication date |
|---|---|
| EP0382557A1 (en) | 1990-08-16 |
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