JPH02206197A - Manufacture of multilayered printed wiring board - Google Patents
Manufacture of multilayered printed wiring boardInfo
- Publication number
- JPH02206197A JPH02206197A JP2711789A JP2711789A JPH02206197A JP H02206197 A JPH02206197 A JP H02206197A JP 2711789 A JP2711789 A JP 2711789A JP 2711789 A JP2711789 A JP 2711789A JP H02206197 A JPH02206197 A JP H02206197A
- Authority
- JP
- Japan
- Prior art keywords
- prepreg
- inner layer
- board
- printed wiring
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 11
- 229910001220 stainless steel Inorganic materials 0.000 claims abstract description 26
- 239000010935 stainless steel Substances 0.000 claims abstract description 26
- 238000000034 method Methods 0.000 claims description 29
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 11
- 239000011889 copper foil Substances 0.000 claims description 9
- 238000003475 lamination Methods 0.000 abstract description 7
- 238000010030 laminating Methods 0.000 abstract 1
- 239000000853 adhesive Substances 0.000 description 8
- 230000001070 adhesive effect Effects 0.000 description 8
- 239000000463 material Substances 0.000 description 7
- 238000000465 moulding Methods 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 6
- 238000007796 conventional method Methods 0.000 description 5
- 229910001369 Brass Inorganic materials 0.000 description 4
- 239000010951 brass Substances 0.000 description 4
- 229920001651 Cyanoacrylate Polymers 0.000 description 2
- MWCLLHOVUTZFKS-UHFFFAOYSA-N Methyl cyanoacrylate Chemical compound COC(=O)C(=C)C#N MWCLLHOVUTZFKS-UHFFFAOYSA-N 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/18—Handling of layers or the laminate
- B32B38/1825—Handling of layers or the laminate characterised by the control or constructional features of devices for tensioning, stretching or registration
- B32B38/1833—Positioning, e.g. registration or centering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
【発明の詳細な説明】
［発明の目的］
（産業上の利用分野）
本発明は、位置精度の高い多層プリント配線板か作業性
よく、低コストで得られる多層プリント配線板の製造方
法に関する。DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial Field of Application) The present invention relates to a method for producing a multilayer printed wiring board with high positional accuracy, good workability, and low cost.
（従来の技術）
近年、産業用電子機器等の高速化や高密度化の進行に伴
ない、電子部品を搭載する配線板の高多層化が進められ
ており、特に６層以上の導体層を有する多層板の需要が
増大しつつある。(Conventional technology) In recent years, as industrial electronic equipment has become faster and more dense, wiring boards on which electronic components are mounted are becoming more multi-layered. The demand for multilayer boards with
このような多層配線板は、従来から第３図に示すように
、絶縁板１の表裏両面に信号用と電源用の二つの配線パ
ターン２．３が形成された内層板４の複数枚を、その間
に適当な枚数のプリプレグ５ａを挾んで積層し、その両
面にプリプレグ５ｂと外層銅箔６を重ね合わせた後、図
示されないポットプレス等により全体を加熱加圧し、一
体に成形することにより製造されている。Conventionally, such a multilayer wiring board has a plurality of inner layer boards 4 each having two wiring patterns 2.3 for signals and power supply formed on both the front and back surfaces of an insulating board 1, as shown in FIG. In between, an appropriate number of prepregs 5a are sandwiched and laminated, and prepregs 5b and outer layer copper foil 6 are stacked on both sides of the prepreg 5a, and then the whole is heated and pressed using a pot press (not shown) or the like and molded into one piece. ing.
そして、このような製造方法において、内層相互の配線
パターンの位置合せは、従来から以下に示す各種の方式
で行われている。In such a manufacturing method, alignment of wiring patterns between inner layers has conventionally been performed using various methods shown below.
（ａ ＞ピンラミネーション方式
外層銅箔６、内層板４、プリプレグ５ ａ、 ５ ｂ等
の積層すべき全ての板の所定の位置に同じピッチでカイ
ト孔（図示せず）をあけるとともに、専用の金型の型面
に所定のピッチで金属製のガイドピンを立て、これらの
ピンを前記のカイト孔に挿嵌させて位置合せを行う方法
である６
＜ｂ）多重成形方式（シーゲンシャル方式）初めに４層
板を作り回路を完成した後、これに内層板を１枚ずつ重
ねて成形を行い、これを必要なたけ繰り返している。(a > Pin lamination method) Kite holes (not shown) are drilled at the same pitch in the predetermined positions of all the plates to be laminated, such as outer layer copper foil 6, inner layer board 4, prepreg 5 a, 5 b, etc. This is a method in which metal guide pins are set up at a predetermined pitch on the mold surface of the mold, and these pins are inserted into the above-mentioned kite holes for alignment.6 <b) Multiple molding method (sequential method) Introduction After making a four-layer board and completing the circuit, inner-layer boards are stacked on top of this one by one and molded, and this process is repeated as many times as necessary.
（Ｃ）接着剤方式
複数枚の内層板４とプリプレグ５ａに位置合せ用の孔を
あけ、これを重ねて位置合せ用治具にセットした後、シ
アノアクリレート系等の接着剤を用いて板間を相互に接
着固定するものである。(C) Adhesive method After drilling holes for alignment in multiple inner layer plates 4 and prepreg 5a, stacking them and setting them in a jig for alignment, use an adhesive such as cyanoacrylate to bond the plates. are fixed to each other by adhesive.
（ｄ ）ハトメ方式
接着剤の代わりにハトメを用い、位置合せされた状態で
固定する。 ずなわち、第４図に示すように内層板４と
プリプレグ５ａとを位置合ぜしつつ順に重ねたものに、
ハトメ７を打ち込んだ後、ハトメ７の先端部７ａをかし
めて機械的に締結する方式である。(d) Eyelet method: Use eyelets instead of adhesive and fix in aligned position. That is, as shown in FIG. 4, the inner layer plate 4 and prepreg 5a are aligned and stacked one on top of the other,
After the eyelet 7 is driven in, the tip 7a of the eyelet 7 is caulked and mechanically fastened.
（発明が解決しようどする課題）
しかしながら、これらの位置合せおよび固定方式におい
ては、次のような問題点がある。 すなわち、（イ）ピ
ンラミネーション方式は、高精度の位置合せが可能であ
る反面、小型のプレスしか使用することができず、生産
性か低い。 また、加熱、加圧成形後のピン抜き作業お
よびピン周りに付着した樹脂の除去作業に時間がかかる
問題がある。 （ロ）多重成形方式は、最終的な多層
配線板の製造までに時間がかかり、短納期という市場の
要求に応じきれないという欠点がある。 また、（ハ）
接着剤方式は、固定強度が十分でないばかりか、加熱、
加圧時に接着剤が劣化して固定部に割れやはがれが生じ
るなめ、位置合せ精度の低下が生じやすい問題かあった
。 更に、（ニ）ハトメ方式では、ハトメ７の本体の肉
厚が薄く強度が十分でないなめ、第５図に示すようにか
しめ時に、あるいはさらに外層銅箔６を重ねて加熱加圧
成形する際に、ハトメ７の中空直管部に曲がりやゆがみ
等が生じ その結果内層導体間に位置すれが生じる欠点
がある。(Problems to be Solved by the Invention) However, these alignment and fixing methods have the following problems. That is, (a) the pin lamination method allows highly accurate positioning, but on the other hand, only a small press can be used, resulting in low productivity. Further, there is a problem in that it takes time to remove the pin after heating and pressure forming and to remove the resin attached around the pin. (b) The multiple molding method has the drawback that it takes time to produce the final multilayer wiring board, and it cannot meet market demands for short delivery times. Also, (c)
Adhesive methods not only do not have sufficient fixing strength, but also
There was a problem in that the adhesive deteriorated during pressurization, causing cracks and peeling of the fixed part, which tended to reduce alignment accuracy. Furthermore, in the (d) eyelet method, the main body of the eyelet 7 is thin and does not have sufficient strength. , there is a drawback that the hollow straight pipe portion of the eyelet 7 is bent or distorted, resulting in misalignment between the inner layer conductors.
（発明が解決しようとする課題）
本発明は、これらの事情に鑑みてなされたもので、複数
枚の内層板を精度よく位置合せし、特に６層以上の導体
層を有する多層プリント配線板を高い生産性で安価に製
造する、多層プリント配線板の製造方法を提供しようと
するものである。(Problems to be Solved by the Invention) The present invention has been made in view of these circumstances, and is intended to accurately align a plurality of inner layer boards, particularly for multilayer printed wiring boards having six or more conductor layers. The present invention aims to provide a method for manufacturing a multilayer printed wiring board that can be manufactured at low cost with high productivity.
［発明の構成］
（課題を解決するための手段）
本発明者は、上記の目的を達成しようと鋭意研究を重ね
た結果、ピン方式の長所をハトメ方式に適用することに
よって上記目的を達成できることを見いだし、本発明を
完成したものである。[Structure of the Invention] (Means for Solving the Problem) As a result of extensive research aimed at achieving the above object, the present inventor has discovered that the above object can be achieved by applying the advantages of the pin method to the eyelet method. They discovered this and completed the present invention.
すなわち、本発明は、
表裏両面に配線パターンを形成してなる内層板の複数枚
を、内層板間にプリプレグを介して積層し、さらにその
両面に外層銅箔を重ねた後、全体を加熱、加圧して一体
に形成する多層プリント配線板の製造方法において、前
記内層板とプリプレグの所定の位置に位置合せ用の基準
孔を穿設し、その基準孔にハトメを打ち込み内層板とプ
リプレグをかしめた後、ハトメ内にステンレスピンを挿
入することにより、内層板１７Ｆｌにプリプレグを介し
て積層することを特徴とする多層プリント配線板の製造
方法である。That is, in the present invention, a plurality of inner-layer boards each having a wiring pattern formed on both the front and back sides are laminated with prepreg interposed between the inner-layer boards, and after overlaying outer-layer copper foil on both sides, the whole is heated. In a method for manufacturing a multilayer printed wiring board in which the inner layer board and the prepreg are integrally formed by pressurizing, a reference hole for alignment is bored at a predetermined position in the inner layer board and the prepreg, and an eyelet is driven into the reference hole to caulk the inner layer board and the prepreg. This method of manufacturing a multilayer printed wiring board is characterized in that the multilayer printed wiring board is laminated onto the inner layer board 17Fl via a prepreg by inserting a stainless steel pin into the eyelet.
本発明に用いる内層板、プリプレグ及び外層銅箔は、常
法によってつくられるもので特に製造方法や原材料に限
定されるものではなく、通常使用される内層板、プリプ
レグ及び外層銅箔が使用できる。The inner layer plate, prepreg, and outer layer copper foil used in the present invention are made by conventional methods, and are not particularly limited to the manufacturing method or raw materials. Usually used inner layer plates, prepreg, and outer layer copper foil can be used.
本発明に用いるハトメとしては銅、黄銅製などで、銅、
黄銅製の場合には直径５ＩｌｌＩｌ１１１、肉厚０．４
１１１１１１程度のものがよい。The eyelets used in the present invention are made of copper, brass, etc.
In the case of brass, the diameter is 5IllIl111 and the wall thickness is 0.4
Something around 111111 is good.
本発明に用いるステンレスピンとしては、積層成形時に
使用するステンレス板と同一材質のものであることが望
ましい。 それは、成形時のびずみをできるだけ小さく
するためである。 すなわち、ステンレス板と同じ熱膨
脹係数を有することが好ましい６ またステンレスピン
の長さは、内層部分子外層プリプレグの成形後厚さの１
／２以下であることが好ましい。 １／２を超えると
ステンレス板に傷やヘコミができることがあり好ましく
ない。 更にハトメとステンレスピンとのクリアランス
は０，０５〜０．１１１１１であることが望ましい。
クリアランスが０．０５１Ｉｆｉ未満であると作業性が
悪く、また０、１１Ｉｌを超えると位置合せ精度か悪く
なり好ましくない。The stainless pin used in the present invention is preferably made of the same material as the stainless steel plate used during lamination molding. This is to minimize distortion during molding. In other words, it is preferable to have the same coefficient of thermal expansion as the stainless steel plate6.The length of the stainless steel pin is 1 of the thickness of the inner molecular outer layer prepreg after molding.
/2 or less is preferable. If it exceeds 1/2, scratches or dents may occur on the stainless steel plate, which is not preferable. Further, it is desirable that the clearance between the eyelet and the stainless steel pin is 0.05 to 0.11111.
If the clearance is less than 0.051 Ifi, the workability will be poor, and if it exceeds 0.11 Il, the alignment accuracy will be poor, which is not preferable.
次に図面を用いて本発明を説明する。Next, the present invention will be explained using the drawings.
第１図は本発明に係る６層の多層プリント配線板の層構
成を示す断面図である。 第２図は第１図の円■部分（
ハトメ部分）の部分拡大図である。FIG. 1 is a sectional view showing the layer structure of a six-layer multilayer printed wiring board according to the present invention. Figure 2 is the circle ■ part of Figure 1 (
It is a partial enlarged view of the eyelet part.
第１図に示したように、表裏両面に配線パターンを形成
した内層板４の２枚をその間にプリプレグ５ａを介して
積層しその所定の位置に基準孔を穿設する。 第２図に
拡大して示したように、基準孔にハトメ７を打ち込み内
層板４とプリプレグ５ａをかしめた後、ハトメ７の中に
ステンレスピン８を挿入する。 ステンレスピン８は、
多層プリント配線板の成形時に使用するステンレス板と
同一材質であることが望ましい。 その理由は、できる
限りひずみを小さくするためにステンレス板と同じ熱膨
脹係数のステンレスを用いる。 ステンレスピンの長さ
は内層部分、すなわち、プリプレグ５ａを介して２枚の
内層板４からなる内層部分子外層プリプレグ５ｂの１／
２の長さとなっている。 この長さはズレの精度を良く
するためと、ステンレス板のへこみや傷をなくす点から
望ましいものである。 ステンレスピン８を挿入した後
は、第１図に示すように、さらにプリプレグ５ｂを上下
に重ね合わせ、更にその上に外層銅箔６を重ねて、常法
によって加熱加圧成形一体にして多層プリント配線板を
製造することができる。As shown in FIG. 1, two inner layer plates 4 having wiring patterns formed on both the front and back surfaces are laminated with a prepreg 5a interposed therebetween, and reference holes are bored at predetermined positions. As shown in an enlarged view in FIG. 2, the stainless steel pin 8 is inserted into the eyelet 7 after driving the eyelet 7 into the reference hole and caulking the inner layer plate 4 and the prepreg 5a. Stainless steel pin 8 is
It is desirable that the material be the same as the stainless steel plate used when forming the multilayer printed wiring board. The reason for this is to use stainless steel with the same coefficient of thermal expansion as the stainless steel plate in order to minimize distortion. The length of the stainless steel pin is 1/1 of the inner layer portion, that is, the inner layer consisting of two inner layer plates 4 via the prepreg 5a, and the length of the outer molecular prepreg 5b.
It has a length of 2. This length is desirable from the standpoint of improving the precision of misalignment and eliminating dents and scratches on the stainless steel plate. After inserting the stainless steel pin 8, as shown in Fig. 1, the prepreg 5b is further stacked vertically, and the outer layer copper foil 6 is further stacked on top of that, and is integrally formed under heat and pressure using a conventional method to perform multilayer printing. Wiring boards can be manufactured.
（作用）
本発明の多層プリント配線板の製造方法は、６層板以上
の多層板の位置精度の確保と、４層板並みの作業性を得
るためにハトメとステンレスピンの両方を併用するもの
である。 すなわち、ハトメを打ち込むことによって内
層板同士の簡易位置きめが容易にできて作業性が良く、
低コスト化することか可能となる。 また、上記のハト
メの利点の他に、ステンレスピンの挿入によって、ハト
メのずれやへこみがなくなり、位置精度をピンラミネー
ション方式なみに向上させることが可能となる。(Function) The method for manufacturing a multilayer printed wiring board of the present invention uses both eyelets and stainless steel pins in order to ensure the positional accuracy of a multilayer board of six or more layers and to obtain workability comparable to that of a four-layer board. It is. In other words, by driving in the grommets, the inner layer plates can be easily positioned with respect to each other, resulting in good workability.
It becomes possible to reduce costs. In addition to the above-mentioned advantages of eyelets, insertion of stainless steel pins eliminates eyelet displacement and dents, making it possible to improve positional accuracy to the same level as the pin lamination method.
（実施例） 次に本発明を実施例によって説明する。(Example) Next, the present invention will be explained by examples.
実施例 １〜３
表裏両面に厚さ７０μｍの配線パターンが形成されな厚
さ０．４ｍｍの内層板（内層板のサイズは５００ｘ３０
０ｎ＋＋ｎ、比較例においても同じ）２枚を、間に２１
６タイプのプリプレグ３枚を挟んで重ねた。Examples 1 to 3 An inner layer board with a thickness of 0.4 mm without a wiring pattern of 70 μm thick on both the front and back surfaces (the size of the inner layer board is 500 x 30
0n++n, the same applies to the comparative example), with 21 sheets between them.
Three sheets of six types of prepreg were sandwiched and stacked.
これにかしめ用の基準孔をあり、その基準孔に黄銅製ハ
トメ（直径４１Ｉ１ｍ、肉厚０．４ｍｎ＋ ）を打込み
かしめて６層板用の内層材を作成した。 この内層材の
ハトメにステンレスピンをさし込み、しかる後、その両
面に２１６タイプのプリプレグ２枚と厚さ１８μｍの外
層銅箔とをそれぞれ順に重ね、全体を１７５°Ｃ，４〜
４０ｋｇ／ｃｎ＋２の条件で９０分間加熱加圧し一体に
成形して、６層の多層プリント配線板を製造した。 実
権例のステンレスピンのりリアランスを第１表に示すご
と＜０．０５ ｎｕｎ 、 ０．１０ＩＩ１１． ０．
１５ ＋ｕ＋とじた。This had a reference hole for caulking, and a brass eyelet (diameter 41I1m, wall thickness 0.4mm+) was driven into the reference hole and caulked to create an inner layer material for a six-layer board. A stainless steel pin is inserted into the eyelet of this inner layer material, and then two sheets of 216 type prepreg and an 18 μm thick outer layer copper foil are stacked on both sides in order, and the whole is heated at 175°C for 4 to 40 minutes.
A 6-layer multilayer printed wiring board was manufactured by heating and pressing under the conditions of 40 kg/cn+2 for 90 minutes and integrally molding. As shown in Table 1, the actual stainless steel pin adhesive clearance is <0.05 nun, 0.10II11. 0.
15 +u+ closed.
比較例 １
実施例１と同じ内層板とプリプレグとの内層材を、直径
５ｎＩｌの金属ピンを用いた通常のピンラミネーション
方式によりそれぞれ位置合せ固定した以外は、実施例と
同様にして６層の多層プリント配線板を製造した。Comparative Example 1 A 6-layer multilayer was fabricated in the same manner as in Example 1, except that the inner layer material of the same inner layer board and prepreg as in Example 1 was aligned and fixed by the usual pin lamination method using metal pins with a diameter of 5nIl. Manufactured printed wiring boards.
比較例 ２
実施例と同じ内層板の間にプリプレグを挟み込み、さら
にスペーサとしてガラス−エポキシ板を挟んだ後、内層
板との間を通常のシアノアクリレート系瞬間接着剤を用
いて接着固定した以外は実施例と同様な条件で６層の多
層プリント配線板を製造した。Comparative Example 2 Example except that a prepreg was sandwiched between the same inner layer plates as in Example, a glass-epoxy plate was further sandwiched as a spacer, and then the inner layer plates were bonded and fixed using a normal cyanoacrylate instant adhesive. A six-layer multilayer printed wiring board was manufactured under the same conditions as above.
比較例 ３
実施例と同様に内層板とプリプレグとの内層材を直径５
ｎｖ 、肉厚０．４ｒｎ■の銅製のハトメを用いて位置
合せ固定したが、ステンレスピンを用いず、それ以外は
実施例と同様な条件で、６層の多層プリント配線板を製
造した。Comparative Example 3 Similarly to the example, the inner layer material of the inner layer board and prepreg was
A six-layer multilayer printed wiring board was manufactured under the same conditions as in the example except that stainless steel pins were not used, but copper eyelets with a wall thickness of 0.4 rn and nv were used to align and fix.
比較例 ４
実施例と同様に内層板とプリプレグとの内層材を直径５
ＩＩｌｒｌ、肉厚０．４１１■の黄銅製のハトメを用い
て位置合せ固定したが、ステンレスビンを用いず、それ
以外は実施例と同様な条件で、６層の多層プリント配線
板を製造した。Comparative Example 4 Similarly to the example, the inner layer material of the inner layer plate and prepreg was
A 6-layer multilayer printed wiring board was manufactured under the same conditions as in the example except that a stainless steel bottle was not used, but a stainless steel bottle was used for positioning and fixing using brass eyelets with a thickness of 0.411 mm.
こうして実施例及び比較例で得られた多層プリント配線
板の位置ずれ、耐熱性、寸法安定性を次の方法によって
試験したので、その結果を第１表に示した。The multilayer printed wiring boards thus obtained in Examples and Comparative Examples were tested for misalignment, heat resistance, and dimensional stability by the following methods, and the results are shown in Table 1.
内層板の位置ずれ：内層各配線パターン間の基準孔間寸
法のずれを縦横両方向についてそれぞれ座標測定機で測
定。Misalignment of inner layer board: Measure the misalignment of the reference hole dimensions between each wiring pattern on the inner layer in both the vertical and horizontal directions using a coordinate measuring machine.
耐熱性：配線板をＤ−４／１００処理後２６０℃のハン
ダ中に３０秒間浸漬させた後、板の状態（そり等）を目
視で観察。Heat resistance: After D-4/100 treatment, the wiring board was immersed in solder at 260°C for 30 seconds, and the condition of the board (warpage, etc.) was visually observed.
寸法安定性：ＭＩＬ法による。Dimensional stability: Based on MIL method.
第１表中の内層の位置ずれの項目中、ＬｌとＬ２は１枚
目の内層板の表裏の配線パターンを表し、Ｌ３とＬ４は
２枚目の内層板の表裏の配線パターンを表す。 また表
中の○は良好、△は良好ではないが実用上さしつかえな
いもの、×は不良を表す。In the item of inner layer misalignment in Table 1, Ll and L2 represent the wiring patterns on the front and back sides of the first inner layer board, and L3 and L4 represent the wiring patterns on the front and back sides of the second inner layer board. Further, in the table, ◯ indicates good quality, △ indicates not good but practically acceptable, and × indicates poor quality.
［発明の効果］
以上の説明および第１表から明らかなように、本発明の
多層プリント配線板の製造方法は、ピンラミネーション
方式とハトメ方式の長所をそれぞれ採用したもので、複
数枚の内層板パターンを精度よく位置合せすることがで
き、特に６層以上の多層板を作業性良く、かつ低コスト
で製造することができる。[Effects of the Invention] As is clear from the above explanation and Table 1, the method for manufacturing a multilayer printed wiring board of the present invention adopts the advantages of the pin lamination method and the eyelet method, and Patterns can be aligned with high precision, and in particular, multilayer boards with six or more layers can be manufactured with good workability and at low cost.
第１図は本発明方法にかかる多層プリント配線板の層構
成を分離して示す断面図、第２図は第１図における円■
部分の拡大断面図、第３図は従来方法にかかる多層プリ
ント配線板の層構成を分離して示す断面図、第４図は従
来方法のハトメ方式を説明する部分断面図、第５図は従
来の多層プリント配線板における成形後のゆがみを説明
する部分拡大断面図である。
１・・・絶縁板、 ２．３・・・配線パターン、 ４・
・・内層板、 ５ａ・・・プリプレグ、 ６・・・外層
銅箔、７・・・ハトメ、 ８・・・ステンレスピン。FIG. 1 is a cross-sectional view showing the layer structure of a multilayer printed wiring board according to the method of the present invention, and FIG.
3 is a sectional view showing the layer structure of a multilayer printed wiring board separated according to the conventional method, FIG. 4 is a partial sectional view illustrating the grommet method of the conventional method, and FIG. 5 is a sectional view of the conventional method. FIG. 3 is a partially enlarged cross-sectional view illustrating distortion after molding in the multilayer printed wiring board of FIG. 1... Insulating board, 2.3... Wiring pattern, 4.
...Inner layer board, 5a...Prepreg, 6...Outer layer copper foil, 7...Emote, 8...Stainless steel pin.
Claims (1)
数枚を、内層板間にプリプレグを介して積層し、さらに
その両面に外層銅箔を重ねた後、全体を加熱、加圧して
一体に形成する多層プリント配線板の製造方法において
、前記内層板とプリプレグの所定の位置に位置合せ用の
基準孔を穿設し、その基準孔にハトメを打ち込み内層板
とプリプレグをかしめた後、ハトメ内にステンレスピン
を挿入することにより、内層板間にプリプレグを介して
積層することを特徴とする多層プリント配線板の製造方
法。1. Laminate multiple inner-layer boards with wiring patterns formed on both the front and back sides with prepreg interposed between the inner-layer boards, then overlay outer-layer copper foil on both sides, and then heat and pressurize the whole to make it into one piece. In the method for manufacturing a multilayer printed wiring board, a reference hole for alignment is drilled at a predetermined position in the inner layer board and the prepreg, an eyelet is driven into the reference hole, the inner layer board and the prepreg are caulked, and then the inner layer board and the prepreg are crimped. A method for manufacturing a multilayer printed wiring board, characterized in that the inner layer boards are laminated with prepreg interposed between them by inserting stainless steel pins into the board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2711789A JPH02206197A (en) | 1989-02-06 | 1989-02-06 | Manufacture of multilayered printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2711789A JPH02206197A (en) | 1989-02-06 | 1989-02-06 | Manufacture of multilayered printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02206197A true JPH02206197A (en) | 1990-08-15 |
Family
ID=12212121
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2711789A Pending JPH02206197A (en) | 1989-02-06 | 1989-02-06 | Manufacture of multilayered printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02206197A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6290802B1 (en) * | 1998-08-18 | 2001-09-18 | Nec Corporation | Method of manufacturing laminate and grommet used for the method |
-
1989
- 1989-02-06 JP JP2711789A patent/JPH02206197A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6290802B1 (en) * | 1998-08-18 | 2001-09-18 | Nec Corporation | Method of manufacturing laminate and grommet used for the method |
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