JPH02202094A - Board warpage preventing method and device therefor - Google Patents
Board warpage preventing method and device thereforInfo
- Publication number
- JPH02202094A JPH02202094A JP2319089A JP2319089A JPH02202094A JP H02202094 A JPH02202094 A JP H02202094A JP 2319089 A JP2319089 A JP 2319089A JP 2319089 A JP2319089 A JP 2319089A JP H02202094 A JPH02202094 A JP H02202094A
- Authority
- JP
- Japan
- Prior art keywords
- board
- solder
- molten solder
- substrate
- warpage
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 13
- 229910000679 solder Inorganic materials 0.000 claims abstract description 102
- 238000005476 soldering Methods 0.000 claims abstract description 30
- 230000002265 prevention Effects 0.000 claims description 38
- 239000000758 substrate Substances 0.000 claims description 36
- 239000012530 fluid Substances 0.000 claims description 23
- 210000000078 claw Anatomy 0.000 claims description 11
- 238000013459 approach Methods 0.000 claims description 3
- 230000003449 preventive effect Effects 0.000 abstract 4
- 230000000694 effects Effects 0.000 description 5
- 230000007547 defect Effects 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 238000000926 separation method Methods 0.000 description 3
- 230000002950 deficient Effects 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、自動半田付は装置における基板の反り防止方
法及び装置に係り、特に半田槽の溶融半田に浸漬して半
田付けされた基板を該溶融半田から引き離す際に基板を
下に凸に反らせる力を支持する反り防止板を、溶融半田
の表面から出没自在に半田槽内に配設して基板の反りを
防止すると共に酸化物の除去に支障がないようにし、極
めて良好な半田付は性能が得られるようにした基板の反
り防止方法及び装置に関する。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a method and device for preventing warpage of a board in an automatic soldering device, and more particularly, the present invention relates to a method and device for preventing warping of a board in an automatic soldering device, and in particular, a method and device for preventing warpage of a board in an automatic soldering device. An anti-warp plate that supports the force that causes the board to warp downward when it is separated from the solder is placed in the solder tank so that it can move in and out from the surface of the molten solder, preventing the board from warping and preventing oxides from being removed. The present invention relates to a method and apparatus for preventing warpage of a board, which allows extremely good soldering performance to be obtained.
従来の技術
従来例について第６図を参照して説明すると、従来の自
動半田付は装置７においては、電子部品１が搭載された
基板２が搬送されて半田槽３の溶融半田４に基板２の下
面２ａが接触を開始し、加熱されてその温度が上昇し、
基板２が溶融半田４から離れる頃になると、第６図に示
すように、両側面２ｂはコンベアに連結された送り爪５
の先端溝部５ａにより把持されていてその幅方向には動
き得ないので、基板２が下に凸に反ることになり、半田
付は性能に種々の悪影響があった。このように基板２が
溶融半田４との接触中に下に凸に反る原因としては、以
下のことが考えられる。Conventional technology A conventional example will be explained with reference to FIG. 6. In the conventional automatic soldering device 7, a board 2 on which an electronic component 1 is mounted is conveyed, and the board 2 is applied to molten solder 4 in a solder bath 3. The lower surface 2a of the starts contact, is heated and its temperature increases,
When the substrate 2 is separated from the molten solder 4, as shown in FIG.
Since the board 2 is held by the groove 5a at its tip and cannot move in its width direction, the board 2 warps downward in a convex manner, which has various negative effects on soldering performance. The following may be the reason why the substrate 2 curves downward in a convex manner during contact with the molten solder 4.
（１１基板２自体の重さ及び電子部品１の重さが基板２
の幅方向の中央部２ｃの下方への撓みを最大とするよう
に下向きに作用する。(11 The weight of the board 2 itself and the weight of the electronic component 1 are
acts downward so as to maximize the downward deflection of the center portion 2c in the width direction.
（２）基板２が溶融半田４から離れようとすると、溶融
半田４の表面張力が基板２の下面２″ａに対して下向き
に作用するが、基板２の幅方向の中央部２ｃが最も下方
に撓み易い。(2) When the board 2 tries to move away from the molten solder 4, the surface tension of the molten solder 4 acts downward on the bottom surface 2''a of the board 2, but the center part 2c in the width direction of the board 2 is at the lowest point. It is easy to bend.
（３）基板２の下面２ａは溶融半田４と接触するので該
下面の温度は上面２ｄよりも高くなるので、下面２ａの
熱膨張の方が上面２ｄよりも大きいため基板２は必然的
に下に凸に反る。(3) Since the lower surface 2a of the substrate 2 comes into contact with the molten solder 4, the temperature of the lower surface is higher than that of the upper surface 2d, so the thermal expansion of the lower surface 2a is greater than that of the upper surface 2d, so the substrate 2 is inevitably lowered. It curves convexly.
以上のようなことが原因となって、基板２が下に凸に反
るわけであるが、この基板２の反りが生ずると、基板２
の両側面２ｂ付近と幅方向の中央部２ｃとでは、溶融半
田４から離れるタイミングがかなり異なり、幅方向の各
位置で半田付は条件が異なる結果となり、良好な半田付
は性能が得られない。即ち、例えば中央部２Ｃが最後に
溶融半田４から離れるため該中央部において常に半田付
けが完了することとなり、この部分においてブリッジ等
の半田付は不良が集中的に発生する。The above-mentioned factors cause the substrate 2 to warp downward in a convex manner.
The timing of separation from the molten solder 4 is quite different between the vicinity of both side surfaces 2b and the center part 2c in the width direction, resulting in different soldering conditions at each position in the width direction, and good soldering performance cannot be obtained. . That is, for example, since the central portion 2C is the last to leave the molten solder 4, soldering is always completed in the central portion, and soldering defects such as bridges occur intensively in this portion.
また基板２が下に凸に反る結果、中央部２ｃが溶融半田
４内に潜り、溶融半田４が基板２の上面２ｄ上に流入し
てかぶりを生じ、半田付は不良となる。またこれを防止
するため、溶融半田４の表面４ａの高さを低くすれば、
基板２の両側面２ｂ付近の下面２ａが溶融半田４に接触
しない事態が予想され、半田付は不能となる。Further, as a result of the substrate 2 convexly warping downward, the central portion 2c sinks into the molten solder 4, and the molten solder 4 flows onto the upper surface 2d of the substrate 2, causing fogging, resulting in defective soldering. Moreover, in order to prevent this, if the height of the surface 4a of the molten solder 4 is lowered,
It is expected that the lower surface 2a near both side surfaces 2b of the substrate 2 will not come into contact with the molten solder 4, making soldering impossible.
このような基板２の反りを防止するため、従来は半田槽
３の内部に基板２の中央部２ｃを下から支える固定式の
支持部材を配置したり、円周上に複数の突起が形成され
た回転体を配置して該突起により基板２の中央部２Ｃを
間欠的に支えるようにしたものが実用に供されているが
、これらの方式による支持部材又は突起は、溶融半田４
の表面４ａを覆う酸化物を酸化物除去装置によってすく
い取る作業に支障を来さないようにするには技術的にか
なりの困難を伴ない、十分に基板２の反りを防止し得る
高さに設定することが困難であった。In order to prevent such warping of the board 2, conventionally, a fixed support member that supports the center part 2c of the board 2 from below is disposed inside the solder bath 3, or a plurality of protrusions are formed on the circumference. A system in which a rotating body is arranged and the central part 2C of the substrate 2 is intermittently supported by the protrusion has been put into practical use.
It is technically difficult to prevent the oxide covering the surface 4a of the substrate 2 from interfering with the work of skimming the surface 4a with the oxide removal device, and the height is sufficiently high to prevent warping of the substrate 2. It was difficult to set up.
この結果、基板２が溶融半田４から離れようとするとき
に基板２の下面２ａに対して下向きに作用する溶融半田
４の表面張力によって基板２の中央部２Ｃが下に凸に反
り、この部分においてブリッジ等の半田付は不良が依然
として発生するという欠点があった。As a result, when the substrate 2 tries to separate from the molten solder 4, the surface tension of the molten solder 4 acting downwardly against the lower surface 2a of the substrate 2 causes the central portion 2C of the substrate 2 to warp downward in a convex manner, and this portion However, soldering bridges and the like had the disadvantage that defects still occurred.
更に別の方式としては、コンベアの上方から該コンベア
と共に同速度で移動する基板吊下げ部材を設けて、該吊
下げ部材によって基板２の中央部２ｃを支えてその反り
を防止するようにしたものも実用に供されているが、こ
れによると反り防止のための設備が非常に大規模化して
、自動半田付は装置全体のコストの半分位の費用がかか
ることもあり、極めて不経済であった。Still another method is to provide a board hanging member that moves at the same speed as the conveyor from above the conveyor, and the hanging member supports the central part 2c of the board 2 to prevent it from warping. has also been put into practical use, but the equipment needed to prevent warping has become extremely large-scale, and automatic soldering costs about half the cost of the entire device, making it extremely uneconomical. Ta.
目 的
本発明は、上記した従来技術の欠点を除くためになされ
たものであって、その目的とするところは、自動半田付
は装置において、電子部品が搭載された基板の両側面を
複数の送り爪により把持されてコンベアにより搬送され
る基板に対して第１流体圧シリンダによって接近及び復
帰動作を行うように上下動可能に支承された半田槽装置
と、該半田槽装置上に取り付けられた第２流体圧シリン
ダによって一端が該半田槽装置に対して相対的に上下動
可能に支承されて他の一端が半田槽装置を構成する半田
槽内に配設されており、半田付けの完了に伴ない半田槽
の溶融半田から基板を引き離す際に第２流体圧シリンダ
を作動させて反り防止板を基板の下面に当接させるよう
にした反り防止部材とを備え、基板が溶融半田から離れ
ようとするとき基板の下面に対して下向きに作用する該
基板の自重及び溶融半田の表面張力等を反り防止部材で
支持させて基板の反りを防止することにより、極めて簡
易な構成によって半田付けの際の基板の反りを防止でき
るようにし、基板の幅方向のどの位置も溶融半田から離
れるタイミングが同一となるようにし、ブリッジその他
の半田付は不良や溶融半田の基板上面へのかぶりを防止
し、良好な半田付は性能が得られるようにすることであ
る。Purpose The present invention has been made in order to eliminate the above-mentioned drawbacks of the prior art.The purpose of the present invention is to use an automatic soldering device to solder multiple parts on both sides of a board on which electronic components are mounted. a solder bath device supported in a vertically movable manner so that a first fluid pressure cylinder approaches and returns to a substrate gripped by a feed claw and conveyed by a conveyor; and a solder bath device mounted on the solder bath device. One end is supported by a second fluid pressure cylinder so as to be movable up and down relative to the solder tank device, and the other end is disposed within the solder tank constituting the solder tank device. and a warpage prevention member that operates a second fluid pressure cylinder to bring the warpage prevention plate into contact with the bottom surface of the board when the board is separated from the molten solder in the solder tank, thereby preventing the board from separating from the molten solder. By preventing the board from warping by supporting the board's own weight and the surface tension of the molten solder, which act downwardly against the bottom surface of the board, with the warp prevention member, it is possible to prevent the board from warping with an extremely simple configuration. To prevent the board from warping, to ensure that the timing of separation from the molten solder is the same for all positions in the width direction of the board, to prevent defects in bridges and other soldering, and to prevent molten solder from covering the top surface of the board. Good soldering is about performance.
また他の目的は、溶融半田表面の酸化物除去装置が作動
する際には、反り防止板が溶融半田中に潜るようにする
ことにより、酸化物の除去を十分に行い得るようにする
ことである。Another purpose is to ensure that when the device for removing oxides on the surface of molten solder is activated, the anti-warp plate is submerged in the molten solder, so that oxides can be removed sufficiently. be.
構成
要するに本発明方法（請求項１）は、電子部品が搭載さ
れてコンベアにより搬送される基板の両側面を複数の送
り爪により把持した状態で、半田付けの際に半田槽内に
配設された反り防止板の上面を前記基板の下面に当接さ
せて、該基板を下に凸に反らせる力を防止すると共に、
酸化物除去装置の作動中は前記反り防止板の上面を溶融
半田中に潜らせることを特徴とするものである。Configuration In short, the method of the present invention (claim 1) is such that a board on which electronic components are mounted and being conveyed by a conveyor is placed in a solder tank during soldering, with both sides of the board being gripped by a plurality of feed claws. The upper surface of the warpage prevention plate is brought into contact with the lower surface of the substrate to prevent a force that causes the board to warp downwardly, and
During operation of the oxide removal device, the upper surface of the warpage prevention plate is submerged in molten solder.
また本発明装置（請求項２）は、電子部品が搭載された
基板の両側面を複数の送り爪により把持されてコンベア
により搬送される前記基板に対して接近及び復帰動作を
行うように第１流体圧シリンダによって上下動可能に支
承された半田槽装置と、該半田槽装置上に取り付けられ
た第２流体圧シリンダによって一端が該半田槽装置に対
して相対的に上下動可能に支承されて他の一端が前記半
田槽装置を構成する半田槽内に配設され該半田槽の溶融
半田に浸漬された前記基板を該溶融半田から引き離す際
に反り防止板の上面を該基板の下面に当接させて前記基
板を下に凸に反らせる力を支持すると共に酸化物除去装
置の作動中は前記反り防止板の上面が溶融半田中に潜る
ようにした反り防止部材とを備えたことを特徴とするも
のである。Further, in the device of the present invention (claim 2), both sides of the board on which electronic components are mounted are gripped by a plurality of feed claws, and the first a solder tank device supported so as to be movable up and down by a fluid pressure cylinder; and one end supported so as to be movable up and down relative to the solder tank device by a second fluid pressure cylinder mounted on the solder tank device. The other end is disposed in a solder tank constituting the solder tank device, and when the board immersed in the molten solder of the solder tank is pulled away from the molten solder, the top surface of the warpage prevention plate is brought into contact with the bottom surface of the board. and a warpage prevention member that supports a force that causes the substrate to warp downward in a convex manner when the board is brought into contact with the board, and the upper surface of the warpage prevention plate is submerged in the molten solder while the oxide removal device is in operation. It is something to do.
以下本発明を図面に示す実施例に基いて説明する。第１
図及び第２図において、本発明に係る基板の反り防止装
置８は、半田槽装置９と、反り防止部材１０とを備えて
いる。The present invention will be explained below based on embodiments shown in the drawings. 1st
In the figures and FIG. 2, a board warpage prevention device 8 according to the present invention includes a solder bath device 9 and a warpage prevention member 10.
半田槽装置９は、半田槽３と加熱装置６と第１流体圧シ
リンダ１１とで構成されており、電子部品１が搭載され
てコンベア（図示せず）により搬送される基板２の下面
２ａに対し第１流体圧シリンダ１１の作動により半田槽
３内の溶融半田４を接触させるようにしたものである。The solder tank device 9 is composed of a solder tank 3, a heating device 6, and a first fluid pressure cylinder 11, and is configured to apply pressure to the bottom surface 2a of a board 2 on which an electronic component 1 is mounted and transported by a conveyor (not shown). On the other hand, the molten solder 4 in the solder bath 3 is brought into contact with the first fluid pressure cylinder 11 by operating the first fluid pressure cylinder 11.
半田槽３は、基板２を収容することが可能な表面積と所
定の深さを有する升状に形成されており、該半田槽の下
面３ａは加熱装置６の上面６ａに固着されている。The solder tank 3 is formed in the shape of a square having a surface area capable of accommodating the substrate 2 and a predetermined depth, and the lower surface 3 a of the solder tank is fixed to the upper surface 6 a of the heating device 6 .
加熱装置６は、熱伝導性の良好なアルミニウム合金製の
ヒータ部１３と外枠部材１４とを備えており、ヒータ部
１３は温度制御装置（図示せず）によって自動的に温度
管理されるようになっている。また加熱装置６は、外枠
部材１４の下面１４ａにおいて支持台１５に固着されて
いる。The heating device 6 includes a heater section 13 made of an aluminum alloy with good thermal conductivity and an outer frame member 14, and the temperature of the heater section 13 is automatically controlled by a temperature control device (not shown). It has become. Further, the heating device 6 is fixed to the support base 15 on the lower surface 14a of the outer frame member 14.
第１流体圧シリンダ１１としては、エアシリンダ及び油
圧シリンダ等の機器が搭載可能であって、本実施例にお
いては取扱いの容易なエアシリンダを採用している。そ
して該第１流体圧シリンダは基台１６に固定されており
、ピストンロッド１８は先端部１８ａにおいてナツト１
９により支持台１５と連結されている。ピストンロッド
１８の作動は、基板の反り防止装置８の電子制御装置（
図示せず）によって制御されており、ピストンロッド１
８の作動により半田槽３は上下方向に往復動するように
なっている。また該ピストンロッドの作動ストロークは
制限装置（図示せず）によって所定の大きさに調節可能
になっている。As the first fluid pressure cylinder 11, devices such as an air cylinder and a hydraulic cylinder can be mounted, and in this embodiment, an air cylinder that is easy to handle is used. The first fluid pressure cylinder is fixed to the base 16, and the piston rod 18 is connected to the nut 1 at the tip 18a.
It is connected to the support stand 15 by 9. The operation of the piston rod 18 is controlled by the electronic control device (
(not shown), and the piston rod 1
8 causes the solder bath 3 to reciprocate in the vertical direction. Further, the operating stroke of the piston rod can be adjusted to a predetermined size by a limiting device (not shown).
反り防止部材１０の一端１０ａは、基台１６に固定され
た複数の案内軸２０によって上下方向に摺動可能に支承
されたアングル部材２１の上面２１ａにねじ２２により
固定されている。One end 10a of the warpage prevention member 10 is fixed by a screw 22 to an upper surface 21a of an angle member 21 that is supported so as to be slidable in the vertical direction by a plurality of guide shafts 20 fixed to a base 16.
アングル部材２１は、半田槽３に固定された取付板４０
にブラケット４１．４２を介して取り付けられた第２流
体圧シリンダ１２（例えばエアシリンダ）のピストンロ
ッド２３の先端部２３ ａにナツト２４により固定され
ている。ピストン口・ソド２３の作動の上限は、基台１
６に螺着されたストッパねじ２５の一端２５ａに固着さ
れたクツション２６にアングル部材２１の上面２１ａが
当接した位置となり、ピストンロッド２３の作動の下限
は、基台１６に螺着されたストッパねじ２８の一端２８
ａに固着されたクツション２９にアングル部材２１の下
面２１ｂが当接した位置となる。The angle member 21 is attached to a mounting plate 40 fixed to the solder tank 3.
The piston rod 23 of the second fluid pressure cylinder 12 (for example, an air cylinder) is fixed by a nut 24 to the tip 23a of the piston rod 23 attached to the piston rod 23 via brackets 41, 42. The upper limit of the operation of the piston port/socket 23 is the base 1.
The upper surface 21a of the angle member 21 is in contact with the cushion 26 fixed to one end 25a of the stopper screw 25 screwed to the base 16, and the lower limit of the operation of the piston rod 23 is reached by the stopper screwed to the base 16. One end 28 of the screw 28
This is the position where the lower surface 21b of the angle member 21 is in contact with the cushion 29 fixed to the point a.
設定位置の定められたストッパねじ２５．２８はロック
ナツト３０により基台１６に固定されるようになってい
る。The stopper screws 25, 28, each having a set position, are fixed to the base 16 by means of a lock nut 30.
また反り防止部材１０の他の一端１０ｂは半田槽３内に
収容可能な四角形に形成されており、板部材３１．３２
を直角に組み合わせて角部にコーナ部材３３を当て、ね
じ３４により互いに固定された枠組構造になっている。The other end 10b of the warpage prevention member 10 is formed into a rectangular shape that can be accommodated in the solder bath 3, and has plate members 31 and 32.
It has a framework structure in which the parts are combined at right angles, corner members 33 are placed on the corners, and they are fixed to each other with screws 34.
なお、図示の実施例の外にプレス、溶接等の方法によっ
て一端１０ｂを一体に形成することも勿論可能である。In addition to the illustrated embodiment, it is of course possible to form the one end 10b integrally by a method such as pressing or welding.
板部材３１には複数個の長穴３１ａが形成されており、
該長大に沿って取付位置が自在に調節できる取付金具３
５がねじ３６により固定されている。該取付金具には反
り防止板３８がねじ３９によって取り付けられている。A plurality of long holes 31a are formed in the plate member 31,
Mounting bracket 3 whose mounting position can be freely adjusted along the length
5 is fixed with a screw 36. A warpage prevention plate 38 is attached to the mounting bracket with screws 39.
反り防止板３８の上面３８ａは、図示の実施例では、平
滑な面を有する形状をしているが、この外に櫛形状に間
欠的に突起部を設けたものであっても同一の目的を達成
することができる。また反り防止板３８は、基板２の大
きさによって複数本の使用も可能なように板部材３１の
長穴３１ａが複数個形成されている。In the illustrated embodiment, the upper surface 38a of the warpage prevention plate 38 has a smooth surface, but even if the upper surface 38a is provided with comb-shaped protrusions intermittently, the same purpose can be achieved. can be achieved. Further, the warpage prevention plate 38 has a plurality of elongated holes 31a formed in the plate member 31 so that a plurality of plates can be used depending on the size of the substrate 2.
そして本発明方法は、電子部品１が搭載されてコンベア
（図示せず）により搬送される基板２の両側面２ｂを複
数の送り爪５により把持した状態で基板２を半田付けの
際に半田槽３内に配設された反り防止板３８の上面３８
ａを基板２の下面２ａに当接させて、基板２を下に凸に
反らせる力を支持させることにより基板２の反りを防止
すると共に酸化物除去装置の作動中は前記反り防止板３
８の上面３８ａを溶融半田４中に潜らせる方法である。In the method of the present invention, a plurality of feed claws 5 grip both sides 2b of the board 2 on which the electronic component 1 is mounted and the board 2 is transported by a conveyor (not shown). The upper surface 38 of the warpage prevention plate 38 disposed within 3
a is brought into contact with the lower surface 2a of the substrate 2 to support the force that causes the substrate 2 to curve downward in a convex manner, thereby preventing the substrate 2 from warping, and during the operation of the oxide removal device, the warping prevention plate 3
8 is submerged in the molten solder 4.
作用
本発明は、上記のように構成されており、以下その作用
について説明する。第３図に示すように、電子部品ｌの
搭載された基板２の両側面２ｂを複数の送り爪５によっ
て把持された基板２は半田槽３の真上に搬送され、その
位置で一時停止する。Function The present invention is constructed as described above, and its function will be explained below. As shown in FIG. 3, the board 2 with the electronic components l mounted on both sides 2b of the board 2 gripped by a plurality of feed claws 5 is conveyed directly above the solder bath 3 and is temporarily stopped at that position. .
第４図に示すように、第１流体圧シリンダ１１のピスト
ンロッド１８が矢印Ａ方向に作動して半田槽３が上方に
持ち上げられ、溶融半田４の表面４ａが基板２の下面２
ａに接触し、該基板は溶融半田４内に所定の時間だけ浸
漬される。As shown in FIG. 4, the piston rod 18 of the first fluid pressure cylinder 11 operates in the direction of arrow A to lift the solder bath 3 upward, so that the surface 4a of the molten solder 4 is exposed to the bottom surface of the substrate 2.
a, and the substrate is immersed in the molten solder 4 for a predetermined time.
第１流体圧シリンダ１１の作動と略同時に第２流体圧シ
リンダ１２のピストンロッド２３が矢印Ｂ方向に作動し
て反り防止部材１０も矢印Ｂ方向に持ち上げられ、反り
防止板３８の上面３８ａは基板２の下面２ａに一様に当
接する。この場合、基板２の下面２ａが溶融半田４に接
触し、下面２ａの熱膨服の方が、上面２ｄより大きくな
り、このため基板２を下に凸に反らせようとする力が作
用するが、この力は反り防止板３８で支持されるため、
基板２は下に凸に反ることなく、第４図に示すように、
水平に保たれることになる。Almost simultaneously with the operation of the first fluid pressure cylinder 11, the piston rod 23 of the second fluid pressure cylinder 12 is operated in the direction of arrow B, and the warpage prevention member 10 is also lifted in the direction of arrow B, so that the upper surface 38a of the warpage prevention plate 38 is uniformly abuts against the lower surface 2a of 2. In this case, the lower surface 2a of the substrate 2 comes into contact with the molten solder 4, and the thermal expansion of the lower surface 2a becomes larger than that of the upper surface 2d, which causes a force to bend the substrate 2 downward. , this force is supported by the warp prevention plate 38, so
The substrate 2 does not curve downward in a convex manner, as shown in FIG.
It will remain horizontal.
次に、所定の時間だけ溶融半田４内に基板２を浸漬させ
てから、第５図に示すように、第１流体圧シリンダ１１
のピストンロッド１８が矢印Ｃ方向に作動して半田槽３
は下方に引き降ろされ、基板２が溶融半田４から離れよ
うとするときには、該溶融半田の表面張力が基板２の下
面２ａに対して下向きに作用し、該基板を下に凸に反ら
せようとする力が作用するが、この力は反り防止板３８
で支持されて基板２が下に凸に反らないので、基板２の
中央部２Ｃも両側面２ｂ付近も同時に溶融半田４から離
れることになり、中央部２Ｃに重点的に発生していたブ
リッジ等の半田付は不良が解消し、基板２に搭載された
電子部品１のリード線１ａの要半田付は箇所には非常に
良好な半田付けがなされる結果となる。Next, after immersing the substrate 2 in the molten solder 4 for a predetermined time, the first fluid pressure cylinder 11 is opened as shown in FIG.
The piston rod 18 operates in the direction of arrow C to open the solder bath 3.
is pulled down, and when the substrate 2 tries to separate from the molten solder 4, the surface tension of the molten solder acts downward on the lower surface 2a of the substrate 2, causing the substrate to curve downward in a convex manner. This force acts on the warpage prevention plate 38.
Since the board 2 is supported by the support and does not warp downward convexly, the center part 2C and the vicinity of both sides 2b of the board 2 are separated from the molten solder 4 at the same time. The defects in soldering such as the above are eliminated, and the lead wires 1a of the electronic component 1 mounted on the board 2 are soldered very well at the locations where soldering is required.
その後、第２流体圧シリンダ１２のピストンロッド２３
が矢印り方向に作動して反り防止部材１０を元の位置に
戻し、反り防止板３８の上面３８ａが溶融半田４内に潜
り込んだところで、溶耐半田４の表面４ａを被っている
酸化物が酸化物除去装置（図示せず）によって取り除か
れる。この場合、反り防止板３８は溶融半田中に潜って
いるので、酸化物除去装置の作動に全く支障がなく、酸
化物の除去を完全に行うことができる。After that, the piston rod 23 of the second fluid pressure cylinder 12
operates in the direction of the arrow to return the warpage prevention member 10 to its original position, and when the top surface 38a of the warpage prevention plate 38 has sunk into the molten solder 4, the oxide covering the surface 4a of the molten solder 4 is removed. It is removed by an oxide remover (not shown). In this case, since the warpage prevention plate 38 is submerged in the molten solder, there is no problem with the operation of the oxide removal device, and oxides can be completely removed.
基板２の半田付けが完了すると、該基板は次工程へ搬送
され、これに代って次の未半田付けの基板２が送り爪５
によって把持されて搬送されて来る。第３図に示すよう
に、基板２が半田槽３の真上に達した所で一時停止し、
以後上記したような工程を繰り返して自動的に半田付け
が継続される。When the soldering of the board 2 is completed, the board is transferred to the next process, and the next unsoldered board 2 is transferred to the feed claw 5 instead.
It is held and transported by As shown in FIG. 3, the board 2 temporarily stops when it reaches directly above the solder bath 3, and
Thereafter, the above steps are repeated to automatically continue soldering.
効果
本発明は、上記のように自動半田付は装置において、電
子部品が搭載された基板の両側面を複数の送り爪により
把持されてコンベアにより搬送される基板に対して第１
流体圧シリンダによって接近及び復帰動作を行うように
上下動可能に支承された半田槽装置と、該半田槽装置上
に取り付けられた第２流体圧シリンダによって一端が該
半田槽装置に対して相対的に上下動可能に支承された反
り防止板が半田槽装置を構成する半田槽内に配設され半
田付けの完了に伴ない半田槽の溶融半田から基板を引き
離す際に第２流体圧シリンダを作動させて反り防止板を
基板の下面に当接させるようにした反り防止部材とを備
え、基板が溶融半田から離れようとするとき基板の下面
に対して下向きに作用する該基板の自重及び溶融半田の
表面張力等を反り防止板で支持させるようにしたので、
極めて簡易な構成によって半田付けの際の基板の反りを
防止できる効果が得られ、基板の幅方向のどの位置も溶
融半田から離れるタイミングが同一となり、ブリッジそ
の他の半田付は不良や溶融半田の基板上面へのかぶりを
防止し得、良好な半田付は性能が得られる効果がある。Effects The present invention provides an automatic soldering device as described above, in which both sides of a board on which electronic components are mounted are gripped by a plurality of feed claws, and a first soldering process is performed on the board being conveyed by a conveyor.
A solder bath device is supported so as to be movable up and down so as to perform approach and return operations by a fluid pressure cylinder, and a second fluid pressure cylinder mounted on the solder bath device allows one end to be moved relative to the solder bath device. A warpage prevention plate supported so as to be vertically movable is disposed in the solder tank that constitutes the solder tank device, and operates a second fluid pressure cylinder when the board is separated from the molten solder in the solder tank upon completion of soldering. and a warpage prevention member configured to bring the warpage prevention plate into contact with the bottom surface of the board, and prevent the board's own weight and molten solder from acting downwardly against the bottom surface of the board when the board tries to separate from the molten solder. Since the surface tension etc. of
The extremely simple configuration has the effect of preventing the board from warping during soldering, and the timing of separation from the molten solder is the same for all positions in the width direction of the board, preventing bridges and other solder connections from being defective or molten solder on the board. It is possible to prevent fogging on the upper surface, and good soldering has the effect of improving performance.
また溶融半田表面の酸化物除去装置が作動する際には、
反り防止板が溶融半田中に潜るようにしたので、酸化物
の除去を十分に行い得るという効果がある。Also, when the oxide removal device on the surface of the molten solder operates,
Since the warpage prevention plate is made to be submerged in the molten solder, there is an effect that oxides can be sufficiently removed.
第１図から第５図は本発明の実施例に係り、第１図は基
板の反り防止装置の斜視図、第２図は基板の反り防止装
置の要部縦断面図、第３図は送り爪によって把持された
基板が基板の反り防止装置ににより支持された状態を示
す要部縦断面図、第４図は基板の反り防止装置において
半田槽に基板を浸漬した状態を示す要部縦断面図、第５
図は半田槽から基板を引き離す際に基板の反り防止装置
が作動した状態を示す要部縦断面図、第６図は従来例に
おける半田槽から基板を引き上げる際に発生する基板の
反りの状態を示す要部縦断面図である。
■は電子部品、２は基板、２ａは下面、２ｂは側面、３
は半田槽、４は溶融半田、５は送り爪、８は基板の反り
防止装置、９は半田槽装置、１０は反り防止部材、１０
ａは一端、１０ｂは他の一端、１１は第１流体圧シリン
ダ、１２は第２流体圧シリンダ、３８は反り防止板、３
８ａは上面である。
特許出願人 横田機械株式会社1 to 5 relate to embodiments of the present invention, in which FIG. 1 is a perspective view of a device for preventing warpage of a substrate, FIG. 2 is a vertical sectional view of main parts of the device for preventing warpage of a substrate, and FIG. FIG. 4 is a vertical cross-sectional view of the main part showing a state in which the board gripped by the claws is supported by the board warpage prevention device, and FIG. Figure, 5th
The figure is a vertical sectional view of the main part showing the state in which the board warpage prevention device is activated when pulling the board away from the solder tank, and Figure 6 shows the state of board warp that occurs when pulling the board out of the solder tank in a conventional example. FIG. ■ is an electronic component, 2 is a board, 2a is a bottom surface, 2b is a side surface, 3
1 is a solder tank, 4 is a molten solder, 5 is a feeding claw, 8 is a board warpage prevention device, 9 is a solder tank device, 10 is a warpage prevention member, 10
a is one end, 10b is the other end, 11 is a first fluid pressure cylinder, 12 is a second fluid pressure cylinder, 38 is a warpage prevention plate, 3
8a is the top surface. Patent applicant Yokota Machinery Co., Ltd.
Claims (1)
板の両側面を複数の送り爪により把持した状態で、半田
付けの際に半田槽内に配設された反り防止板の上面を前
記基板の下面に当接させて、該基板を下に凸に反らせる
力を防止すると共に、酸化物除去装置の作動中は前記反
り防止板の上面を溶融半田中に潜らせることを特徴とす
る自動半田付け装置における基板の反り防止方法。 ２ 電子部品が搭載された基板の両側面を複数の送り爪
により把持されてコンベアにより搬送される前記基板に
対して接近及び復帰動作を行うように第１流体圧シリン
ダによって上下動可能に支承された半田槽装置と、該半
田槽装置上に取り付けられた第２流体圧シリンダによっ
て一端が該半田槽装置に対して相対的に上下動可能に支
承されて他の一端が前記半田槽装置を構成する半田槽内
に配設され該半田槽の溶融半田に浸漬された前記基板を
該溶融半田から引き離す際に反り防止板の上面を該基板
の下面に当接させて前記基板を下に凸に反らせる力を支
持すると共に酸化物除去装置の作動中は前記反り防止板
の上面が溶融半田中に潜るようにした反り防止部材とを
備えたことを特徴とする基板の反り防止装置。[Scope of Claims] 1. When a plurality of feed claws grip both sides of a board on which electronic components are mounted and are being conveyed by a conveyor, a warpage prevention plate disposed in a solder tank is used during soldering. The upper surface is brought into contact with the lower surface of the substrate to prevent a force that would cause the substrate to warp downward, and the upper surface of the warp prevention plate is submerged in molten solder while the oxide removal device is in operation. A method for preventing board warping in automatic soldering equipment. 2. Both sides of a board on which electronic components are mounted are gripped by a plurality of feed claws, and supported so as to be movable up and down by a first fluid pressure cylinder so as to approach and return to the board being conveyed by a conveyor. a solder tank device, one end of which is supported so as to be movable up and down relative to the solder tank device by a second fluid pressure cylinder mounted on the solder tank device, and the other end forming the solder tank device. When the board disposed in a solder tank and immersed in the molten solder of the solder tank is pulled away from the molten solder, the top surface of the warpage prevention plate is brought into contact with the bottom surface of the board to make the board convex downward. An apparatus for preventing warpage of a substrate, comprising a warpage prevention member that supports a warping force and that allows the upper surface of the warpage prevention plate to be submerged in molten solder during operation of the oxide removal apparatus.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2319089A JPH02202094A (en) | 1989-01-31 | 1989-01-31 | Board warpage preventing method and device therefor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2319089A JPH02202094A (en) | 1989-01-31 | 1989-01-31 | Board warpage preventing method and device therefor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02202094A true JPH02202094A (en) | 1990-08-10 |
Family
ID=12103740
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2319089A Pending JPH02202094A (en) | 1989-01-31 | 1989-01-31 | Board warpage preventing method and device therefor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02202094A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5862588A (en) * | 1995-08-14 | 1999-01-26 | International Business Machines Corporation | Method for restraining circuit board warp during area array rework |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6250869B2 (en) * | 1984-11-09 | 1987-10-27 | Hitachi Ltd | |
| JPS62289365A (en) * | 1986-06-06 | 1987-12-16 | Tamura Seisakusho Co Ltd | Automatic soldering device |
-
1989
- 1989-01-31 JP JP2319089A patent/JPH02202094A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6250869B2 (en) * | 1984-11-09 | 1987-10-27 | Hitachi Ltd | |
| JPS62289365A (en) * | 1986-06-06 | 1987-12-16 | Tamura Seisakusho Co Ltd | Automatic soldering device |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5862588A (en) * | 1995-08-14 | 1999-01-26 | International Business Machines Corporation | Method for restraining circuit board warp during area array rework |
| US6068175A (en) * | 1995-08-14 | 2000-05-30 | International Business Machines Corporation | System for replacing a first area array component connected to an interconnect board |
| US6179196B1 (en) * | 1995-08-14 | 2001-01-30 | International Business Machines Corporation | Apparatus for manufacturing circuit boards |
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