JPH0220096A - Side-surface printing jig for side brazing type ceramic board - Google Patents
Side-surface printing jig for side brazing type ceramic boardInfo
- Publication number
- JPH0220096A JPH0220096A JP17038688A JP17038688A JPH0220096A JP H0220096 A JPH0220096 A JP H0220096A JP 17038688 A JP17038688 A JP 17038688A JP 17038688 A JP17038688 A JP 17038688A JP H0220096 A JPH0220096 A JP H0220096A
- Authority
- JP
- Japan
- Prior art keywords
- board
- positioning block
- vacuum
- printing
- printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 title claims abstract description 25
- 238000003854 Surface Print Methods 0.000 title 1
- 238000005219 brazing Methods 0.000 title 1
- 238000007639 printing Methods 0.000 claims abstract description 36
- 239000000758 substrate Substances 0.000 claims description 41
- 238000005452 bending Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明はサイドブレーズ型セラミック基板の側面印刷
治具に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a side printing jig for a side blaze type ceramic substrate.
従来、サイドブレーズ型セラミック基板（表面パターン
のリード部を側面に引き出し、側面で印刷処理し、その
側面をリードフレームにロー付するＩＣパッケージなど
に用いられるセラミック基板）の製造工程において、該
セラミックＪ、（板の側面に導体ペーストを印刷する際
に、該セラミック基板の位置合せおよび固定をする側面
印刷冶Ｊ（を用いていた。Conventionally, in the manufacturing process of side blaze type ceramic substrates (ceramic substrates used for IC packages, etc., in which the lead portion of the surface pattern is drawn out to the side, printed on the side, and the side is brazed to the lead frame), the ceramic J (When printing the conductive paste on the side surface of the board, a side printing jig (J) was used to align and fix the ceramic substrate.
第２図は、従来例のセラミック基板（以下基板という）
の側面印刷治具を示す斜視図であり、図中、Ａは側面印
刷治具、１は基板３の位置を合わせるＬ字型基板位置出
しブロック（以下位置出しブロックという）、２は位置
出しブロック１どの間に基板３を挾持し基板３を位置出
しブロック１に固定する押えブロック、４は心棒にばね
４ａを巻回したばね付き棒、５は導体ペーストを印刷す
る被印刷面である。Figure 2 shows a conventional ceramic substrate (hereinafter referred to as the substrate).
1 is a perspective view showing a side printing jig, in which A is a side printing jig, 1 is an L-shaped board positioning block (hereinafter referred to as a positioning block) for positioning the board 3, and 2 is a positioning block. 1 is a presser block which clamps the substrate 3 and fixes the substrate 3 to the positioning block 1; 4 is a spring-loaded rod having a spring 4a wound around its core; and 5 is a printing surface on which conductive paste is printed.
次に、この従来例の動作を第２図を用いて説明する。Next, the operation of this conventional example will be explained using FIG. 2.
第２図において、先ず、基板３を被印刷面５を七にして
位置出しブロック１により定位置に合わせる。次にばね
付き棒４で、ばね４ａの反発力を利用して、押えブロッ
ク２を基板３に押圧し、位置出しブロック１と押えブロ
ック２でノ、！、板３を挟持して定位置に固定し、被印
刷面５に導体ペーストを印刷する。In FIG. 2, first, the substrate 3 is brought into position with the positioning block 1 with the printing surface 5 facing 7. Next, the spring-loaded rod 4 uses the repulsive force of the spring 4a to press the presser block 2 against the substrate 3, and the positioning block 1 and presser block 2 are used to press the presser block 2 to the substrate 3. , the board 3 is clamped and fixed in place, and a conductive paste is printed on the printing surface 5.
以上のように、従来例においては、被印刷面５に印刷を
行う場合、基板３を位置出しブロック１にセットし、押
えブロック２を移動して挟持する作業と、前記印刷を終
了後、押えブロック２を弓出し、基板３を取出すという
手間のかかる作業があり、またこの従来例では押えブロ
ック２が必要てあり、位置出しブロック１と押えブロッ
ク２との間隔が狭く作業かやりすらいなどの問題点があ
った。As described above, in the conventional example, when printing on the printing surface 5, the substrate 3 is set on the positioning block 1, the presser block 2 is moved and held, and after the printing is finished, the presser There is a time-consuming work of bending out the block 2 and taking out the board 3, and in this conventional example, the presser block 2 is required, and the distance between the positioning block 1 and the presser block 2 is narrow, making it difficult to carry out the work. There was a problem.
この発明は上記のような問題点を解消するためになされ
たもので、真空源を用いることで、１個の真空系稼動ス
イッチ（図示せず）の操作および筒？トな装着作業で基
板の装着、固定を行えるとともに、押えブロックをなく
して基板の装着、取出しに広いスペースを得ることがで
きる治具を得ることを目的とする。This invention was made to solve the above-mentioned problems, and by using a vacuum source, one vacuum system operation switch (not shown) can be operated and the cylinder can be operated. To provide a jig capable of mounting and fixing a board with easy mounting work, as well as obtaining a wide space for mounting and taking out the board by eliminating a presser block.
このため、この発明においては、側面に導体ペーストを
印刷するサイドブレーズ型セラミック基板の側面印刷治
具において、位置出しブロックに設けられる真空源に接
続されて真空吸引する吸引部に前記セラミック基板を直
接吸着して前記位置出しブロックに当接できる当接手段
を具備し、かつ前記当接手段は前記セラミック基板を前
記位置出しブロックの所定位置に固定するものであるこ
とにより、前記目的を達成しようとするものである。Therefore, in the present invention, in a side blaze type ceramic substrate side printing jig that prints conductive paste on the side surface, the ceramic substrate is directly connected to a suction unit that is connected to a vacuum source provided in a positioning block and performs vacuum suction. In order to achieve the above object, the present invention is provided with abutting means capable of adsorbing and abutting against the positioning block, and the abutting means fixes the ceramic substrate at a predetermined position of the positioning block. It is something to do.
この発明におけるサイドブレーズ型セラミック基板の側
面印刷治具は、当接手段により、１）「記セラミック基
板は位置出しブロックに設けられる真空源に接続されて
真空吸引する吸引部に直接吸着して前記位置出しブロッ
クに当接され、前記位置出しブロックの所定位置に固定
する。The side blaze type ceramic substrate side printing jig according to the present invention has the following features: 1) The ceramic substrate is directly attracted to a suction unit that is connected to a vacuum source provided in the positioning block and performs vacuum suction by the abutting means. It is brought into contact with the positioning block and fixed at a predetermined position on the positioning block.
（実））−ｉイタｉｎ 以下この発明の一実施例を図面に基づいて説明する。(actual))-iitaiin An embodiment of the present invention will be described below based on the drawings.
第１図はこの発明の一実施例によるＪＪ：板の側面印刷
治具を示′１−斜視図であり、図中前記従来例における
と同一または相当構成要素は同一符号で表わし、重複説
明は省略する。FIG. 1 is a perspective view showing a JJ plate side printing jig according to an embodiment of the present invention, and in the figure, the same or equivalent components as in the conventional example are denoted by the same reference numerals, and duplicate explanations are omitted. Omitted.
また、第１図中、１ａは吸引部ｔｂ（下記）と内面１ｄ
（’前記）を’ｆＴするＬ字型基板位置出しブロック（
以下位置出しブロックという）、１ｂは位置出しブロッ
ク１ａのＬ字型の内面ＩＣに例えば窓枠状の連続した真
空溝６を刻設し、該真空溝６の縦溝部分に真空孔７を穿
孔し、真空源（図示せず）およびリーク弁（図示せず）
に連接して真空に吸引する吸引部、１ｄは位置出しブロ
ック１ａのＬ字型内面ＩＣに直角な他の内面である。In addition, in Fig. 1, 1a is the suction part tb (below) and the inner surface 1d.
('above)'fT' L-shaped board positioning block (
(hereinafter referred to as a positioning block), 1b has a continuous vacuum groove 6 in the shape of a window frame, for example, carved in the L-shaped inner surface IC of the positioning block 1a, and a vacuum hole 7 is bored in the vertical groove portion of the vacuum groove 6. vacuum source (not shown) and leak valve (not shown)
A suction part 1d that is connected to and draws a vacuum is the other inner surface perpendicular to the L-shaped inner surface IC of the positioning block 1a.
以上の側面印刷治具Ａの構成において、当接手段Ｂは、
コ、（板３を直接吸着して固定する吸引部１ｂと内面１
ｄを有し、基板３の被印刷面５に正確に印刷できる所定
位置を設定する位置出しブロック１ａと、基板３とより
構成されている。In the above configuration of the side printing jig A, the contact means B is
(The suction part 1b and the inner surface 1 that directly suction and fix the plate 3
d, and is composed of a positioning block 1a that sets a predetermined position where printing can be performed accurately on the printing surface 5 of the substrate 3, and the substrate 3.
次にこの実施例の動作を当接手段Ｂを中心にして′ｆＪ
１図を用いて説明する。Next, the operation of this embodiment will be explained with reference to the abutting means B.
This will be explained using Figure 1.
第１図において、先ず、位置出しブロック１ａを基板３
の被印刷面５に正確に印刷できる所定位置（図示せず）
に位置合せをする。その後、基板３を手作業又は自動移
送装置（図示せず）で位置出しブロック１ａの互いに直
角である内面ＩＣと１ｄに、被印刷面５を上にして押圧
、密着させ、真空源（図示せず）の？「ｇ（図示せず）
を閉じる。基板３が密着している吸引部１ｂの真空溝６
は真空孔７を通じて真空吸引されるので、基板３は基板
位置出しブロック１ａの予め位置合せしておいた被印刷
面５に正確に印刷できる所定位置に合され固定される。In FIG. 1, first, the positioning block 1a is placed on the substrate 3.
A predetermined position (not shown) that allows accurate printing on the printing surface 5 of
Align. Thereafter, the substrate 3 is pressed and brought into close contact with the inner surfaces IC and 1d of the positioning block 1a, which are perpendicular to each other, by hand or an automatic transfer device (not shown), with the surface to be printed 5 facing up. Z)'s? "g (not shown)
Close. Vacuum groove 6 of suction part 1b to which substrate 3 is in close contact
Since the substrate 3 is vacuum-suctioned through the vacuum hole 7, the substrate 3 is aligned and fixed at a predetermined position where printing can be performed accurately on the printing surface 5, which has been aligned in advance, of the substrate positioning block 1a.
次いで、被印刷面５に導体ペースト印刷を行う。印刷を
完了後、真空系のり−ク弁（図示せず）を開き、真空孔
７よりリークすることによりセラミック基板３を取り外
すことができる。Next, conductor paste printing is performed on the printing surface 5. After printing is completed, the ceramic substrate 3 can be removed by opening a vacuum system leak valve (not shown) and leaking from the vacuum hole 7.
なお、を記の一実施例の場合は、位置出しブロック１ａ
を所定位置にセットした後、基板３を固定したが、基板
３を位置出しブロック１ａに固定後、位置出しブロック
１ａを所定位置にセットしてもよい。In addition, in the case of the embodiment described below, the positioning block 1a
Although the substrate 3 is fixed after being set at a predetermined position, the positioning block 1a may be set at a predetermined position after the substrate 3 is fixed to the positioning block 1a.
また、上記一実施例では押えブロック２をなくしてセラ
ミック基板３の装着スペースを広くしたが、前記従来例
に示した押えブロック２から、ばね付き棒４をなくし、
押えブロック２を直接真空源に接続することでも、基板
の装着に広いスペースを得ることができる。In addition, in the above-mentioned embodiment, the holding block 2 was eliminated to widen the mounting space for the ceramic substrate 3, but the spring-loaded rod 4 was removed from the holding block 2 shown in the conventional example,
By directly connecting the holding block 2 to a vacuum source, a large space for mounting the substrate can also be obtained.
（発明の効果〕
以上説明したように、この発明によれば、側面に導体ペ
ーストを印刷するサイドブレーズ型セラミック基板の側
面印刷治具において、位置出しブロックに設けられる真
空源に接続されて真空吸引する吸引部に前記セラミック
基板を直接吸着してＯη記位置出しブロックに当接でき
る当接手段を具備し、かつ前記当接手段は前記セラミッ
ク基板を前記位置出しブロックの所定位置に固定するの
で、−個の真空系稼動スイッチの操作および簡単な基板
の移動作業で基板の装着、固定を行えるとともに、押え
ブロックをなくして、基板の装着。(Effects of the Invention) As explained above, according to the present invention, in a side printing jig for a side blaze type ceramic substrate that prints conductive paste on the side surface, the side printing jig is connected to a vacuum source provided in the positioning block to perform vacuum suction. The suction unit is provided with abutting means that can directly attract the ceramic substrate and abut against the positioning block Oη, and the abutment means fixes the ceramic substrate at a predetermined position of the positioning block. - Boards can be mounted and fixed by operating the vacuum system operation switch and moving the board easily, and the board can be mounted without using a holding block.
取出しに広いスペースを得ることができる効果がある。This has the effect of providing a large space for taking out items.
第１図はこの発明の一実施例による基板の側面印刷治具
を示す斜視図、第２図は従来例の基板の側面印刷治具を
示す斜視図である。
Ａ −−−−−−側面印刷治具
Ｂ・・・・・・当接手段
１ 、 １ ａ−・・・−・位置出しブロック２・・・
・・・押えブロック
３・・・・・・セラミック基板
５・・・・・・被印刷面
６−−−−−−真空満
７−−−−−・真空孔FIG. 1 is a perspective view showing a substrate side printing jig according to an embodiment of the present invention, and FIG. 2 is a perspective view showing a conventional substrate side printing jig. A -------- Side printing jig B... Contact means 1, 1 a--- Positioning block 2...
... Presser block 3 ... Ceramic substrate 5 ... Printing surface 6 --- Vacuum full 7 --- Vacuum hole
Claims (1)
ミック基板の側面印刷治具において、位置出しブロック
に設けられる真空源に接続されて真空吸引する吸引部に
前記セラミック基板を直接吸着して前記位置出しブロッ
クに当接できる当接手段を具備し、かつ前記当接手段は
前記セラミック基板を前記位置出しブロックの所定位置
に固定するものであることを特徴とするサイドブレーズ
型セラミック基板の側面印刷治具。In a side printing jig for a side blaze type ceramic substrate that prints a conductive paste on the side surface, the ceramic substrate is directly attracted to a suction section that is connected to a vacuum source provided in a positioning block and performs vacuum suction, and the ceramic substrate is attached to the positioning block. 1. A side blaze type ceramic substrate side printing jig, comprising abutting means capable of abutting, the abutting means fixing the ceramic substrate at a predetermined position of the positioning block.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17038688A JPH0220096A (en) | 1988-07-08 | 1988-07-08 | Side-surface printing jig for side brazing type ceramic board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17038688A JPH0220096A (en) | 1988-07-08 | 1988-07-08 | Side-surface printing jig for side brazing type ceramic board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0220096A true JPH0220096A (en) | 1990-01-23 |
Family
ID=15903973
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17038688A Pending JPH0220096A (en) | 1988-07-08 | 1988-07-08 | Side-surface printing jig for side brazing type ceramic board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0220096A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100297434B1 (en) * | 1998-11-25 | 2001-09-29 | 구자홍 | Device fixing plate |
-
1988
- 1988-07-08 JP JP17038688A patent/JPH0220096A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100297434B1 (en) * | 1998-11-25 | 2001-09-29 | 구자홍 | Device fixing plate |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0220096A (en) | Side-surface printing jig for side brazing type ceramic board | |
| JP3053104B2 (en) | Thin plate holding device | |
| JP2004174519A (en) | Device for holding hyperthin metal plate in laser cutting machine | |
| JP2001089840A (en) | Jig for thin film deposition for electronic parts | |
| JP3146604B2 (en) | Screen printing machine | |
| JP2891052B2 (en) | Electronic component manufacturing method | |
| JP2734574B2 (en) | Substrate positioning device in thick film printing process | |
| JP3635650B2 (en) | Thermocompression tool replacement structure for electronic component mounting machines | |
| KR200203481Y1 (en) | PCB Clamp Device for Screen Printer | |
| JPH0193134A (en) | Lead frame stay device | |
| JP4474206B2 (en) | Substrate holding device | |
| KR200254117Y1 (en) | Clamping system of pcb for screen printer | |
| KR0126428Y1 (en) | Port fixing jig of board | |
| JPH05226412A (en) | Outer lead bonding method and device therefor | |
| JP3101687B2 (en) | Square glass substrate positioning platform | |
| JPH05229095A (en) | Cream solder printing and coating apparatus | |
| JPH0969699A (en) | Connector press-in device | |
| JPH0311917Y2 (en) | ||
| JP3250567B2 (en) | Double-sided mounting board fixing method and double-sided mounting board fixing device | |
| JPH0317805A (en) | Track alignment device for core block | |
| JPH0468625B2 (en) | ||
| JPH02180529A (en) | Method and device for assembling snap ring | |
| JPH0564784U (en) | Pressure application stage for pressure element measurement | |
| JP2002134846A (en) | Electronic component mounting board and apparatus for reversing and transferring board | |
| JPH10106903A (en) | Fixing device of a plurality of works |