JPH02198816A - Mold - Google Patents
MoldInfo
- Publication number
- JPH02198816A JPH02198816A JP1798689A JP1798689A JPH02198816A JP H02198816 A JPH02198816 A JP H02198816A JP 1798689 A JP1798689 A JP 1798689A JP 1798689 A JP1798689 A JP 1798689A JP H02198816 A JPH02198816 A JP H02198816A
- Authority
- JP
- Japan
- Prior art keywords
- gate
- punch
- cavity
- molten resin
- sprue
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000465 moulding Methods 0.000 claims abstract description 7
- 239000011347 resin Substances 0.000 abstract description 21
- 229920005989 resin Polymers 0.000 abstract description 21
- 238000001816 cooling Methods 0.000 abstract description 2
- 238000010008 shearing Methods 0.000 abstract 1
- 230000008023 solidification Effects 0.000 abstract 1
- 238000007711 solidification Methods 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 4
- 238000007599 discharging Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000002893 slag Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/38—Cutting-off equipment for sprues or ingates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/263—Moulds with mould wall parts provided with fine grooves or impressions, e.g. for record discs
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/0025—Preventing defects on the moulded article, e.g. weld lines, shrinkage marks
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明はディスクゲートを有し、前記ディスクゲートを
型内で切断する樹脂成形金型に関する。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a resin molding mold having a disc gate and cutting the disc gate within the mold.
従来の技術
従来この種樹脂成形金型は第３図に示す様にキャビティ
１３にディスクゲート１２およびスプルー１１を接続し
、ディスクゲート２の直下にパンチ１４を配置する構成
になっていた。2. Description of the Related Art Conventionally, this type of resin molding mold has a structure in which a disc gate 12 and a sprue 11 are connected to a cavity 13, and a punch 14 is disposed directly below the disc gate 2, as shown in FIG.
そしてこの様な構成において、キャビティ１３に樹脂を
充填完了した後バンチ１４を前進させ、パンチ先端面１
４ａとキャビティ面１５との間に存在する溶融樹脂をス
プルー１１又はキャビティ１３へ排除することによって
型内でゲート処理しようとするものであった。In such a configuration, after filling the cavity 13 with resin, the bunch 14 is moved forward, and the punch tip surface 1 is
Gate processing was attempted within the mold by discharging the molten resin existing between 4a and the cavity surface 15 into the sprue 11 or the cavity 13.
発明が解決しようとする課題
しかしながら上記のような構成ではパンチ前進時点にお
いてすでにキャビティ内の溶融樹脂は冷却固化を開始し
ており、パンチ先端面とキャビティ面との間の溶融樹脂
はスプルー又はキャビティへ完全に排除することが困難
であることから、成形品のゲート部にパリが残留したり
、あるいは前記パリを毎ショットはさみ込むことからパ
ンチ先端面およびキャビティ面の損傷が著しく進行する
という課題を有していた。Problems to be Solved by the Invention However, with the above configuration, the molten resin in the cavity has already started cooling and solidifying when the punch moves forward, and the molten resin between the punch tip surface and the cavity surface flows into the sprue or the cavity. Since it is difficult to completely eliminate the chips, there are problems in that the chips remain at the gate of the molded product, or that damage to the punch tip surface and cavity surface progresses significantly due to the chips being caught in each shot. Was.
課題を解決するための手段
上記課題を解決するための本発明の技術的手段はキャビ
ティ面よりスプルー側に凹状に、その厚さを延長したデ
ィスクゲートと、前記ディスクゲートと対向して配置さ
れ、その外径が前記ディスクゲート内径よりも小で前記
ディスクゲート内に前進可能なパンチと、前記パンチ先
端部に形成されたスラグウェル部と、前記パンチ内部に
摺動可能に配置されたエジェクタービンとからなるもの
である。Means for Solving the Problems The technical means of the present invention for solving the above problems is a disk gate whose thickness is extended in a concave shape toward the sprue side from the cavity surface, and which is arranged opposite to the disk gate, a punch having an outer diameter smaller than the inner diameter of the disk gate and capable of advancing into the disk gate; a slug well formed at the tip of the punch; and an ejector turbine slidably disposed inside the punch. It consists of
作 用
この技術的手段の作用は次の様になる。すなわちパンチ
前進初期においてはパンチ先端部とキャビティ面との間
に存在する溶融樹脂はスプルー又はキャビティへ排除さ
れるが、パンチ前進ストロークがゲート厚さを越えると
ディスクゲート内に閉じ込められた溶融樹脂はスプルー
へ更に排除され続け、この時点でディスクゲートはパン
チにより完全に剪断されることとなる。Effect The effect of this technical means is as follows. In other words, at the beginning of the punch advance, the molten resin existing between the punch tip and the cavity surface is removed to the sprue or cavity, but when the punch advance stroke exceeds the gate thickness, the molten resin trapped inside the disk gate is removed. Further expulsion continues onto the sprue, at which point the disc gate is completely sheared by the punch.
実施例
以下本発明の一実施例を第１図に示し説明する。１はス
プルー、２はキャビティ面５よりスプルー側に向かって
凸に延長されたディスクゲート、３はキャビティ、４は
スリーブ状のパンチ、６はパンチ４の中心部に配置され
たスラグウェル、７はスラグウェル６を排出するための
エジェクタービンである。EXAMPLE An example of the present invention is shown in FIG. 1 and will be described below. 1 is a sprue, 2 is a disk gate extending convexly from the cavity surface 5 toward the sprue side, 3 is a cavity, 4 is a sleeve-shaped punch, 6 is a slug well placed in the center of the punch 4, and 7 is a This is an ejector turbine for discharging the slag well 6.
本図に示す状態でスプルー１１デイスクゲート２を通過
して溶融樹脂がキャビティ３に充填され、前記溶融樹脂
の冷却固化が進行しないうちにパンチ４をすばやく前進
させる。パンチ４の前進開始時にはディスクゲート２内
の溶融樹脂はスプルーへ逆流し、又１部はキャビティ３
へ更に流入するが、パンチ４がディスクゲート２の厚さ
以上に前進するとパンチ４によってディスクゲート２と
キャビティの３の間は閉塞され、ディスクゲート２から
キャビティ３への溶融樹脂の流入は停止し、ディスクゲ
ート２とキャビティ３とは型内で完全に分離される。In the state shown in this figure, the sprue 11 passes through the disk gate 2 and the cavity 3 is filled with molten resin, and the punch 4 is quickly advanced before the molten resin is cooled and solidified. When the punch 4 starts moving forward, the molten resin in the disc gate 2 flows back to the sprue, and a part of it flows back into the cavity 3.
However, when the punch 4 advances beyond the thickness of the disc gate 2, the gap between the disc gate 2 and the cavity 3 is closed by the punch 4, and the flow of molten resin from the disc gate 2 to the cavity 3 is stopped. , the disk gate 2 and cavity 3 are completely separated within the mold.
パンチ４が更に前進を続は前進限に到達するまでの間、
ディスクゲート２内の溶融樹脂はスプルー１へ流出を続
ける。スプルー１．ディスクゲート２．キャビティ３内
の樹脂が完全に冷却固化した状態で金型のパート部８を
開き、成形品及びディスクゲートを突出すと各々別々に
離型し、成形品のディスクゲート跡は平滑に仕上げられ
た状態になっている。Punch 4 continues to move forward until it reaches its forward limit.
The molten resin in the disc gate 2 continues to flow to the sprue 1. Sprue 1. Disc gate 2. When the resin in cavity 3 has completely cooled and solidified, part 8 of the mold is opened, and the molded product and disc gate are projected and released from the mold separately, leaving the disc gate marks on the molded product smooth. is in a state.
第２図にビンポイントゲート９とディスクゲート２を組
合わせた他の実施例を示す。FIG. 2 shows another embodiment in which the bin point gate 9 and the disk gate 2 are combined.
発明の効果
本発明によればパンチによってディスクゲートが型内で
完全に剪断されるため成形品のゲート跡にパリが発生せ
ず、又、パンチがディスクゲート部を形成する金型面に
直接接触せず、かつパリ状の樹脂カスをはさむことも無
いためゲート部金型面及びパンチを損傷する可能性が大
１１に低減し金型寿命が延びるという効果がある。Effects of the Invention According to the present invention, since the disk gate is completely sheared within the mold by the punch, no flaking occurs at the gate mark on the molded product, and the punch directly contacts the mold surface that forms the disk gate portion. Moreover, since there is no possibility of pinching resin particles in the form of resin particles, the possibility of damaging the gate part mold surface and punch is greatly reduced by 11 times, which has the effect of extending the life of the mold.
第１図は本発明の一実施例の成形金型の要部断面図、第
２図は本発明の他の実施例の成形金型の要部断面図、第
３図は従来の成形金型の要部断面図である。
２・・・・・・ディスクゲート、４・・・・・・パンチ
、５・・・・・・キャビティ面、６・・・・・・スラグ
ウェル、７・・・・・・エジェクタービン。
代理人の氏名 弁理士 粟野重孝 ほか１名派
し）
味
―）Fig. 1 is a cross-sectional view of a main part of a molding die according to an embodiment of the present invention, Fig. 2 is a cross-sectional view of a main part of a molding die according to another embodiment of the present invention, and Fig. 3 is a conventional molding die. FIG. 2... Disc gate, 4... Punch, 5... Cavity surface, 6... Slug well, 7... Eject turbine. Name of agent: Patent attorney Shigetaka Awano and one other person) Aji-)
Claims (1)
したディスクゲートと、前記ディスクゲートと対向して
配置され、その外径が前記ディスクゲート内径よりも小
で前記ディスクゲート内に前進可能なパンチと、前記パ
ンチ先端部に形成されたスラグウェル部と、前記パンチ
内部に摺動可能に配置されたエジェクタービンとからな
る成形金型。a disc gate whose thickness is extended in a concave manner from the cavity surface toward the sprue; and a punch which is disposed opposite to the disc gate, has an outer diameter smaller than the inner diameter of the disc gate, and is capable of advancing into the disc gate. A molding die comprising: a slug well formed at the tip of the punch; and an ejector turbine slidably disposed inside the punch.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1798689A JP2707676B2 (en) | 1989-01-27 | 1989-01-27 | Mold |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1798689A JP2707676B2 (en) | 1989-01-27 | 1989-01-27 | Mold |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02198816A true JPH02198816A (en) | 1990-08-07 |
| JP2707676B2 JP2707676B2 (en) | 1998-02-04 |
Family
ID=11959047
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1798689A Expired - Fee Related JP2707676B2 (en) | 1989-01-27 | 1989-01-27 | Mold |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2707676B2 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1999043486A1 (en) * | 1998-02-25 | 1999-09-02 | Fuji Photo Film Co., Ltd. | Injection molding method and injection mold |
| WO2003020491A1 (en) * | 2001-08-31 | 2003-03-13 | Netstal-Maschinen Ag | Method and device for the automatic production of wafers |
| JP2006116721A (en) * | 2004-10-19 | 2006-05-11 | Bando Chem Ind Ltd | Molding machine and molding method |
| JP2008119952A (en) * | 2006-11-13 | 2008-05-29 | Nissei Plastics Ind Co | Mold for molding disk substrate |
-
1989
- 1989-01-27 JP JP1798689A patent/JP2707676B2/en not_active Expired - Fee Related
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1999043486A1 (en) * | 1998-02-25 | 1999-09-02 | Fuji Photo Film Co., Ltd. | Injection molding method and injection mold |
| US7147814B1 (en) | 1998-02-25 | 2006-12-12 | Fuji Photo Film Co., Ltd. | Injection molding method and injection mold |
| WO2003020491A1 (en) * | 2001-08-31 | 2003-03-13 | Netstal-Maschinen Ag | Method and device for the automatic production of wafers |
| JP2006116721A (en) * | 2004-10-19 | 2006-05-11 | Bando Chem Ind Ltd | Molding machine and molding method |
| JP4511902B2 (en) * | 2004-10-19 | 2010-07-28 | バンドー化学株式会社 | Molding apparatus and molding method |
| JP2008119952A (en) * | 2006-11-13 | 2008-05-29 | Nissei Plastics Ind Co | Mold for molding disk substrate |
| JP4698551B2 (en) * | 2006-11-13 | 2011-06-08 | 日精樹脂工業株式会社 | Disc substrate molding method |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2707676B2 (en) | 1998-02-04 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20081017 Year of fee payment: 11 |
|
| LAPS | Cancellation because of no payment of annual fees |