JPH021759A - Resin composition - Google Patents
Resin compositionInfo
- Publication number
- JPH021759A JPH021759A JP3387688A JP3387688A JPH021759A JP H021759 A JPH021759 A JP H021759A JP 3387688 A JP3387688 A JP 3387688A JP 3387688 A JP3387688 A JP 3387688A JP H021759 A JPH021759 A JP H021759A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- polyetherketone
- bonds
- aromatic polysulfone
- polymer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011342 resin composition Substances 0.000 title claims abstract description 17
- 229920005989 resin Polymers 0.000 claims abstract description 68
- 239000011347 resin Substances 0.000 claims abstract description 68
- 229920001643 poly(ether ketone) Polymers 0.000 claims abstract description 28
- 125000003118 aryl group Chemical group 0.000 claims abstract description 22
- 229920002492 poly(sulfone) Polymers 0.000 claims abstract description 18
- 239000004697 Polyetherimide Substances 0.000 claims abstract description 15
- 229920001601 polyetherimide Polymers 0.000 claims abstract description 15
- 229920000642 polymer Polymers 0.000 abstract description 8
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 abstract description 4
- 239000000203 mixture Substances 0.000 abstract description 4
- 125000001140 1,4-phenylene group Chemical group [H]C1=C([H])C([*:2])=C([H])C([H])=C1[*:1] 0.000 abstract description 2
- 239000000945 filler Substances 0.000 abstract description 2
- 239000003365 glass fiber Substances 0.000 abstract description 2
- 239000012779 reinforcing material Substances 0.000 abstract description 2
- 239000003381 stabilizer Substances 0.000 abstract description 2
- 239000000454 talc Substances 0.000 abstract description 2
- 229910052623 talc Inorganic materials 0.000 abstract description 2
- 230000002542 deteriorative effect Effects 0.000 abstract 1
- 239000000126 substance Substances 0.000 description 11
- 238000000034 method Methods 0.000 description 6
- 239000008188 pellet Substances 0.000 description 5
- 238000002156 mixing Methods 0.000 description 4
- 230000032683 aging Effects 0.000 description 3
- 239000000155 melt Substances 0.000 description 3
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- 239000004696 Poly ether ether ketone Substances 0.000 description 2
- 229920004738 ULTEM® Polymers 0.000 description 2
- 229920004695 VICTREX™ PEEK Polymers 0.000 description 2
- JUPQTSLXMOCDHR-UHFFFAOYSA-N benzene-1,4-diol;bis(4-fluorophenyl)methanone Chemical compound OC1=CC=C(O)C=C1.C1=CC(F)=CC=C1C(=O)C1=CC=C(F)C=C1 JUPQTSLXMOCDHR-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 125000005843 halogen group Chemical group 0.000 description 2
- 229920002530 polyetherether ketone Polymers 0.000 description 2
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical class C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 235000010582 Pisum sativum Nutrition 0.000 description 1
- 240000004713 Pisum sativum Species 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 239000012736 aqueous medium Substances 0.000 description 1
- 239000004760 aramid Substances 0.000 description 1
- 229920006231 aramid fiber Polymers 0.000 description 1
- -1 aromatic sulfone Chemical class 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 229920006038 crystalline resin Polymers 0.000 description 1
- NJLLQSBAHIKGKF-UHFFFAOYSA-N dipotassium dioxido(oxo)titanium Chemical compound [K+].[K+].[O-][Ti]([O-])=O NJLLQSBAHIKGKF-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- KSEBMYQBYZTDHS-HWKANZROSA-M ferulate Chemical group COC1=CC(\C=C\C([O-])=O)=CC=C1O KSEBMYQBYZTDHS-HWKANZROSA-M 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 125000001183 hydrocarbyl group Chemical group 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 239000002609 medium Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 239000002798 polar solvent Substances 0.000 description 1
- 238000006068 polycondensation reaction Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 230000000246 remedial effect Effects 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 125000001174 sulfone group Chemical group 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野］
本発明はポリエーテルケトン樹脂と芳香族ポリスルホン
樹脂およびポリエーテルイミド樹脂よりなる新規な樹脂
組成物に関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a novel resin composition comprising a polyetherketone resin, an aromatic polysulfone resin and a polyetherimide resin.
ポリエーテルケトン樹脂は化学的、機械的、熱的、電気
的性質等に優れた高機能のエンジニアリング樹脂である
。しかし、この樹脂は結晶性を有する為、他の結晶性樹
脂と同様、成形時の寸法変化が大きく、精密成形品を得
ることが困難であり、また高温時の剛性が不足している
との問題もあった。Polyetherketone resin is a highly functional engineering resin with excellent chemical, mechanical, thermal, and electrical properties. However, because this resin has crystallinity, like other crystalline resins, it undergoes large dimensional changes during molding, making it difficult to obtain precision molded products, and is said to lack rigidity at high temperatures. There were also problems.
ポリエーテルケトン樹脂のこれら欠点を改良する為に、
例えば芳香族ポリスルホン樹脂との併用（例えば、特願
昭５８−７５８０７．特願昭６０−１４８９８８等）或
はポリエーテルイミド樹脂との併用（例えば、特願昭５
９−５０３５８７等）等が行なわれているが、何れも上
記特性を満足するものは得られていない。In order to improve these drawbacks of polyetherketone resin,
For example, in combination with aromatic polysulfone resin (e.g., Japanese Patent Application No. 58-75807, Japanese Patent Application No. 60-148988, etc.), or with polyetherimide resin (e.g., Japanese Patent Application No. 1987-148988).
No. 9-503587, etc.), but none of them have been able to satisfy the above characteristics.
即ち、ポリエーテルケトン樹脂に芳香族ポリスルホン樹
脂を溶融混練することにより、ポリエーテルケトン樹脂
の高温時の剛性（例えば熱変形温度）を、ある程度間め
ることは可能であるが、方ポリエーテルケトン樹脂の特
徴である疲労特性や耐薬品性を悪くする。That is, by melt-kneading an aromatic polysulfone resin with a polyetherketone resin, it is possible to reduce the rigidity of the polyetherketone resin at high temperatures (for example, heat distortion temperature) to some extent. It worsens the fatigue characteristics and chemical resistance that are characteristics of resin.
また、ポリエーテルケトン樹脂にポリエーテルイミド樹
脂を溶融混練すると、両樹脂は比較的相溶性に富むため
ミクロにはいわゆる海鳥構造を呈さす、ポリエーテルケ
トン樹脂の低いガラス転移温度をポリエーテルイミド樹
脂の配合比率に応じて上昇させることができる。しかし
ながら、高温時の剛性（例えば熱変形温度）は芳香族ポ
リスルホン樹脂配合時はどには改良されず、逆にポリエ
−チルケトン樹脂の特徴である耐熱老化特性を悪くする
。In addition, when polyetherketone resin is melt-kneaded with polyetherimide resin, both resins are relatively compatible, so they exhibit a so-called seabird structure microscopically. It can be increased depending on the blending ratio of. However, the stiffness at high temperatures (for example, heat distortion temperature) is not significantly improved when aromatic polysulfone resins are blended, and on the contrary, the heat aging resistance characteristic of polyethyl ketone resins is deteriorated.
本発明はポリエーテルケトン樹脂の特徴である疲労特性
やクリープ特性、耐熱老化特性、耐薬品性、耐候性等の
特性を損じることなく、ポリエーテルケトン樹脂の欠点
である寸法安定性および高温時の剛性を改良した新規な
樹脂組成物を提供することにある。The present invention has been developed to improve dimensional stability and high temperature stability, which are disadvantages of polyetherketone resin, without impairing the characteristics of polyetherketone resin such as fatigue properties, creep properties, heat aging resistance, chemical resistance, and weather resistance. The object of the present invention is to provide a novel resin composition with improved rigidity.
Ｃ問題を解決するための手段〕
本発明者らは前記問題点を解決するために鋭意検討した
結果、ポリエーテルケトン樹脂と芳香族ポリスルホン樹
脂およびポリエーテルイミド樹脂を特定の割合で使用す
ることにより、本発明を完成した。Means for Solving Problem C] As a result of intensive studies by the present inventors in order to solve the above problems, the present inventors found that by using polyetherketone resin, aromatic polysulfone resin and polyetherimide resin in a specific ratio, , completed the invention.
即ち、本発明はポリエーテルケトン樹脂５〜５５ｗｔ％
と芳香族ポリスルホン樹脂５〜５５ｗ ｔ％およびポリ
エーテルイミド樹脂４０〜９０ｗｔ％からなる新規な樹
脂組成物である。That is, the present invention uses 5 to 55 wt% of polyetherketone resin.
This is a novel resin composition comprising 5 to 55 wt% of an aromatic polysulfone resin and 40 to 90 wt% of a polyetherimide resin.
本発明で用いられるポリエーテルケトン樹脂とは、代表
的には各種ビスフェノールのジアルカリ金属塩と２個の
ハロゲン原子がオルト位又はパラ位、好ましくはパラ位
の一〇〇−により、また場合により−ＣＯ−の一部が−
ＳＯ□−により置き換えられて活性化されている芳香族
シバライドとを、例えば溶剤として芳香族スルホンの存
在下で重縮合反応させることにより得られる重合体であ
る。代表的な例としては、例えば次の構造式からなるも
のが挙げられる。但し、「−φ−」はバラフェニレン基
を示す。The polyetherketone resin used in the present invention typically includes a dialkali metal salt of various bisphenols and two halogen atoms at the ortho or para position, preferably at the para position, or in some cases at the para position. A part of CO-
It is a polymer obtained by polycondensation reaction of an aromatic cibaride which has been substituted and activated with SO□-, for example, in the presence of an aromatic sulfone as a solvent. Typical examples include those having the following structural formula. However, "-φ-" represents a paraphenylene group.
［−φ−０−φ−ＣＯ−φ−０−］ｎ（１）例えばＩ（
１社製ＰＥＥＫ （商標）
尚、反復単位（１）の他に以下の反復単位を含ませるこ
とも出来る。[-φ-0-φ-CO-φ-0-]n(1) For example, I(
PEEK (trademark) manufactured by 1 company In addition to the repeating unit (1), the following repeating units can also be included.
［−φ−Ａ−φ−Ｏ−φ−ＣＯ−φ−０−］ｎ［−φ−
０−φ−８０２−φ−０−］ｎ（但し、式中Ａは直接結
合、酸素、硫黄、 ＳＯ□。[-φ-A-φ-O-φ-CO-φ-0-]n[-φ-
0-φ-802-φ-0-]n (where A is a direct bond, oxygen, sulfur, SO□.
ＣＯまたは二価の炭化水素基を示し、亜単位オルト位ま
たはパラ位にあり、ＱおよびＱ′は同一または異なるＣ
ＯまたはＳＯ！であり、Ａｒ’ は二価の芳香族基であ
り、そしてｍは０，１．２または３である。）
これらの芳香族ポリエーテルケトンは、例えば特開昭５
０−２７８９７号公報、特開昭５１−１１９７９７号公
報、特開昭５２−３８０００号公報、特開昭５４−９０
２９６号公報、特公昭５５−２３５７４号公報、特公昭
５６−２０９１号公報などに記載の方法によって容易に
製造でき、少なくともこれらの一種または二種以上の混
合物が用いられる。indicates CO or a divalent hydrocarbon group, in the subunit ortho or para position, Q and Q' are the same or different C
O or SO! , Ar' is a divalent aromatic group, and m is 0, 1.2 or 3. ) These aromatic polyetherketones are disclosed in, for example, JP-A-5
0-27897, JP 51-119797, JP 52-38000, JP 54-90
It can be easily produced by the methods described in Japanese Patent Publication No. 296, Japanese Patent Publication No. 55-23574, Japanese Patent Publication No. 56-2091, etc., and at least one type or a mixture of two or more of these can be used.
本発明で用いられる芳香族ポリスルホン樹脂とは、アル
カリフェルレート基と、電子吸引性スルホン基で活性化
された芳香族ハロゲン基と非プロトン性極性溶媒中で縮
合反応させることにより得られる形式の重合体であり、
アリーレン結合（芳香族結合）、エーテル結合およびス
ルホン結合の王者を必須の結合単位とする線状重合体で
ある。The aromatic polysulfone resin used in the present invention is a type of polymer obtained by condensing an alkali ferulate group and an aromatic halogen group activated with an electron-withdrawing sulfone group in an aprotic polar solvent. It is a combination,
It is a linear polymer whose essential bonding units are arylene bonds (aromatic bonds), ether bonds, and sulfone bonds.
例えば極めて代表的な例として次のような構造のちのが
挙げられる。For example, the following structure is a very typical example.
Ｌ
Ｈ３
これらの芳香族ポリスルホン樹脂は、例えば特公昭４０
−１００６７号、特公昭４２−７７９９号および特公昭
４７−６１７号などに記載の方法によって容易に製造で
きる。L H3 These aromatic polysulfone resins are
-10067, Japanese Patent Publication No. 42-7799, Japanese Patent Publication No. 47-617, and the like.
本発明で用いられるポリエーテルイミド樹脂とは、その
構造中にエーテル結合とイミド結合をともに存している
ポリマーの総称であるが、一般には（ｎ）式で表わされ
る構造を有する米国ゼネラル・エレクトリック社製の商
品名ウルテムが広く知られており、例えば特開昭５６−
８２６号広報に記載された方法によって容易に製造する
ことができる。The polyetherimide resin used in the present invention is a general term for polymers that have both ether bonds and imide bonds in their structure, and generally has a structure represented by formula (n). The product name Ultem manufactured by the company is widely known, for example,
It can be easily produced by the method described in Publication No. 826.
ＣＨ３（ＩＩ ）
本発明に於けるこれら樹脂の配合量は、ポリエーテルケ
トン樹脂５〜５５ｗｔ％に対して、芳香族ポリスルホン
樹脂５〜５５ｗ ｔ％およびポリエーテルイミド樹脂４
０〜９０ｗｔ％である。CH3(II) The blending amounts of these resins in the present invention are 5 to 55 wt% of the polyetherketone resin, 5 to 55 wt% of the aromatic polysulfone resin, and 4 to 55 wt% of the polyetherimide resin.
It is 0 to 90 wt%.
ポリエーテルケトン樹脂が５ｗｔ％未満で、芳香族ポリ
スルホン樹脂とポリエーテルイミド樹脂の合計量が９５
％以上であれば、ポリエーテルケトン樹脂の特徴である
疲労特性やクリープ特性、耐熱老化性、耐薬品性等が、
該樹脂組成物に全く反映されない。The polyetherketone resin is less than 5wt%, and the total amount of aromatic polysulfone resin and polyetherimide resin is 95% by weight.
% or more, the characteristics of polyetherketone resin such as fatigue properties, creep properties, heat aging resistance, chemical resistance, etc.
This is not reflected in the resin composition at all.
また、ポリエーテルケトン樹脂の量が全樹脂組成物の５
〜５５ｗｔ％であっても、芳香族ポリスルホン樹脂が５
１１ｔ％未満であれば、芳香族ポリスルホン樹脂の優れ
た高温剛性（高温時の弾性率）が該樹脂組成物に十分付
与されない。Also, the amount of polyetherketone resin is 5% of the total resin composition.
Even if the aromatic polysulfone resin is 55 wt%
If it is less than 11 t%, the excellent high temperature rigidity (elastic modulus at high temperature) of the aromatic polysulfone resin will not be sufficiently imparted to the resin composition.
更に、ポリエーテルケトン樹脂の量が全樹脂組成物の５
〜５５ｗ ｔ％であっても、ポリエーテルイミド樹脂が
４０ｗｔ％未満であれば、ポリエーテルケトン樹脂に起
因するガラス転移温度の上昇幅は小さく、該樹脂組成物
の耐熱寸法安定性はポリエーテルケトン樹脂単独の場合
と殆ど変わらない、また、芳香族ポリスルホン樹脂の欠
点である耐候性の乏しさが該樹脂組成物に大きく反映さ
れてしまい、ポリエーテルケトン樹脂の特徴のひとつが
損なわれる結果となる。Furthermore, the amount of polyetherketone resin is 5% of the total resin composition.
Even if the polyetherimide resin is less than 40 wt%, even if the polyetherimide resin is less than 40 wt%, the increase in the glass transition temperature due to the polyetherketone resin will be small, and the heat-resistant dimensional stability of the resin composition will be lower than that of the polyetherketone resin. It is almost the same as the resin alone, and the poor weather resistance, which is a drawback of aromatic polysulfone resin, is largely reflected in the resin composition, resulting in the loss of one of the characteristics of polyetherketone resin. .
本発明による樹脂組成物は、ポリエーテルケトン樹脂と
芳香族ポリスルホン樹脂およびポリエーテルイミド樹脂
が均一に溶融混練されていることが望ましく、混合方法
は特に制限されることはなく、種々の手段が採用できる
０例えば、各々別々に溶融押出機に供給して混合するこ
ともできるし、あらかじめヘンシェルミキサー、リボン
ブレンダー、タンブラ−などの混合機を利用して予備混
合し、溶融混練機に供給することもできる。又、水性媒
体や有機媒体に分散せしめて湿式混合法により混合する
方法を採用することも可能である。In the resin composition according to the present invention, it is desirable that the polyetherketone resin, aromatic polysulfone resin, and polyetherimide resin are uniformly melt-kneaded, and the mixing method is not particularly limited, and various methods may be employed. Possible 0 For example, each can be fed separately to a melt extruder and mixed, or it can be premixed in advance using a mixer such as a Henschel mixer, ribbon blender, or tumbler, and then fed to a melt kneader. can. It is also possible to adopt a method in which the components are dispersed in an aqueous medium or an organic medium and mixed by a wet mixing method.
本発明では必要に応じ、タルク、炭酸カルシウム、マイ
カ、ガラスピーズ等の充填材、ガラス繊維、炭素繊維、
チタン酸カリ繊維、アラミド繊維、セラミック質繊維等
の繊維状強化材、安定剤、紫外線吸収剤、着色剤等を樹
脂組成物の品質を撰なわない範囲で混和しても良い。In the present invention, fillers such as talc, calcium carbonate, mica, glass peas, glass fibers, carbon fibers,
Fibrous reinforcing materials such as potassium titanate fibers, aramid fibers, and ceramic fibers, stabilizers, ultraviolet absorbers, colorants, and the like may be mixed as long as the quality of the resin composition is not affected.
以下、実施例により本発明を説明する。 The present invention will be explained below with reference to Examples.
実施例１〜４
ポリエーテルケトン樹脂としてＶＩＣＴＲＥＸ ＰＥＥ
に４５０Ｇ （商標、英国インペリアルケミカルインダ
ストリー社製）ペレット、芳香族ポリスルホン樹脂とし
７ ＶＩＣＴｌ？ＥＸ ＰＥＳ ４１００Ｇ （商標、
英国インペリアルケミカルインダストリー社製）ペレッ
トおよびポリエーテルイミド樹脂としてＵＬＴＥＭ １
０００ （商標、米国ゼネラルエレクトリック社製）
ペレットを表−１に示す量で配合し、タンブラ−により
トライブレンドした。この混合物を３０ｍ＋ａφの二軸
押出機を用いてシリンダー温度３１０〜３５０ ’Ｃで
押出し、均一なペレット状の成形材料を得た。Examples 1-4 VICTREX PEE as polyetherketone resin
450G (trademark, manufactured by Imperial Chemical Industries, UK) pellets, aromatic polysulfone resin and 7 VICTl? EX PES 4100G (trademark,
ULTEM 1 as pellets and polyetherimide resin (manufactured by Imperial Chemical Industries, UK)
000 (trademark, manufactured by General Electric Company, USA)
Pellets were blended in the amounts shown in Table 1 and triblended using a tumbler. This mixture was extruded using a 30 m+aφ twin-screw extruder at a cylinder temperature of 310 to 350'C to obtain a uniform pellet-shaped molding material.
次にこのペレットを射出成形機によりシリンダー温度３
５０〜３８０°Ｃで試験片を成形し、寸法安定性、高温
剛性、耐候性、耐薬品性を測定した。Next, the pellets are put into an injection molding machine at a cylinder temperature of 3.
Test pieces were molded at 50 to 380°C, and dimensional stability, high temperature rigidity, weather resistance, and chemical resistance were measured.
ここで、線膨張係数は溶融体の流れ方向（Ｍａｃｈ−４
ｎｅ Ｄｉｒｅｃｔｉｏｎ ）をＡＳＴＭ ［１−６９
６に、熱変形温度はＡＳＴＭ ０−６４８にそれぞれ準
じて測定を行った。Here, the coefficient of linear expansion is the flow direction of the melt (Mach-4
ne Direction) to ASTM [1-69
6, the heat distortion temperature was measured according to ASTM 0-648.
また、室温下（ＲＴ） ・高温下（１５０°Ｃ）での
引張強度および３０日の促進暴露後の引張強度はＡＳＴ
ＭＤ−６３８に準じて測定した。尚、促進基ｎ（耐候性
）はカーボンアーク式促進耐候試験機を用いて、ＡＳＴ
Ｍ Ｄ−１４９９に従って実施した。In addition, the tensile strength at room temperature (RT) and high temperature (150°C) and after 30 days of accelerated exposure are AST
Measured according to MD-638. In addition, the promoting group n (weather resistance) is determined by AST using a carbon arc type accelerated weathering tester.
Performed according to MD-1499.
耐薬品性は試験片をキシレン中に２４時間浸漬した後の
表面状態（外観）により評価した。Chemical resistance was evaluated by the surface condition (appearance) after the test piece was immersed in xylene for 24 hours.
結果を表＝１に示す。The results are shown in Table 1.
表−１に見られる様に本発明の樹脂組成物は寸法安定性
、高温剛性に優れ、また耐候性および耐薬品性にも極め
て優れている。As seen in Table 1, the resin composition of the present invention has excellent dimensional stability and high temperature rigidity, as well as extremely excellent weather resistance and chemical resistance.
比較例１
ボ＋ＪＬ−チル）ｆトン樹脂ＶＩＣＴＲＥＸ ＰＥＥＫ
４５０Ｇ （商標、英国インペリアルレミカルインダ
ストリ−社製）ペレットを単独で使用した以外は、実施
例１〜４と同様の試験をした。結果を表−１に示す。Comparative Example 1 Bo+JL-chill) fton resin VICTREX PEEK
Tests were carried out in the same manner as in Examples 1 to 4, except that 450G (trademark, manufactured by Imperial Remedial Industries, UK) pellets were used alone. The results are shown in Table-1.
ポリエーテルケトン樹脂単独の場合は、耐候性、耐薬品
性は充分であるが、寸法安定性、高温剛性は不充分であ
る、
比較例２〜５
樹脂組成物の組成を表−１に示す様に変更した以外は、
実施例１〜４と同様の試験をした。結果を表−１に示す
。In the case of polyetherketone resin alone, weather resistance and chemical resistance are sufficient, but dimensional stability and high temperature rigidity are insufficient. Comparative Examples 2 to 5 The composition of the resin composition is shown in Table 1. Except for changing to
Tests similar to Examples 1 to 4 were conducted. The results are shown in Table-1.
何れも寸法安定性、高温剛性、耐候性、耐薬品性等を満
足させるには到っていない。None of them has reached the level of satisfying dimensional stability, high-temperature rigidity, weather resistance, chemical resistance, etc.
（発明の効果）
本発明による樹脂組成物は、ポリエーテルケトン樹脂の
特徴を生かしながら寸法安定性、高温剛性が大幅に改良
されており、高機能、高精度が要求される各種のエンジ
ニアリング部品に広く用いられる。(Effects of the Invention) The resin composition according to the present invention has significantly improved dimensional stability and high temperature rigidity while taking advantage of the characteristics of polyetherketone resin, and is suitable for various engineering parts that require high functionality and high precision. Widely used.
特許出願人 三井東圧化学株式会社Patent applicant Mitsui Toatsu Chemical Co., Ltd.
Claims (1)
ポリスルホン樹脂５〜５５ｗｔ％およびポリエーテルイ
ミド樹脂４０〜９０ｗｔ％とからなる樹脂組成物。(1) A resin composition comprising 5 to 55 wt% of a polyetherketone resin, 5 to 55 wt% of an aromatic polysulfone resin, and 40 to 90 wt% of a polyetherimide resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3387688A JPH021759A (en) | 1988-02-18 | 1988-02-18 | Resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3387688A JPH021759A (en) | 1988-02-18 | 1988-02-18 | Resin composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH021759A true JPH021759A (en) | 1990-01-08 |
Family
ID=12398719
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3387688A Pending JPH021759A (en) | 1988-02-18 | 1988-02-18 | Resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH021759A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1993021277A1 (en) * | 1992-04-22 | 1993-10-28 | Mitsui Toatsu Chemicals, Incorporated | Polyimide resin composition |
| JP2004123852A (en) * | 2002-10-01 | 2004-04-22 | Sumitomo Bakelite Co Ltd | Aromatic resin composition and film and sheet |
| JP2004168962A (en) * | 2002-11-22 | 2004-06-17 | Sumitomo Bakelite Co Ltd | Space tape for tab production process |
| JP2004182832A (en) * | 2002-12-02 | 2004-07-02 | Sumitomo Bakelite Co Ltd | Aromatic resin composition, heat-resistant sheet and sheet for reinforcing flexible circuit board |
| JP2018514618A (en) * | 2015-04-30 | 2018-06-07 | ソルベイ スペシャルティ ポリマーズ ユーエスエー， エルエルシー | Polymer composition based on biosource polyarylene ether ketone |
| WO2022220006A1 (en) * | 2021-04-14 | 2022-10-20 | 住友化学株式会社 | Resin composition and molded body |
| WO2022220005A1 (en) * | 2021-04-14 | 2022-10-20 | 住友化学株式会社 | Resin composition and molded body |
-
1988
- 1988-02-18 JP JP3387688A patent/JPH021759A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1993021277A1 (en) * | 1992-04-22 | 1993-10-28 | Mitsui Toatsu Chemicals, Incorporated | Polyimide resin composition |
| US5580918A (en) * | 1992-04-22 | 1996-12-03 | Mitsui Toatsu Chemicals, Inc. | Polyimide resin composition |
| JP2004123852A (en) * | 2002-10-01 | 2004-04-22 | Sumitomo Bakelite Co Ltd | Aromatic resin composition and film and sheet |
| JP2004168962A (en) * | 2002-11-22 | 2004-06-17 | Sumitomo Bakelite Co Ltd | Space tape for tab production process |
| JP2004182832A (en) * | 2002-12-02 | 2004-07-02 | Sumitomo Bakelite Co Ltd | Aromatic resin composition, heat-resistant sheet and sheet for reinforcing flexible circuit board |
| JP2018514618A (en) * | 2015-04-30 | 2018-06-07 | ソルベイ スペシャルティ ポリマーズ ユーエスエー， エルエルシー | Polymer composition based on biosource polyarylene ether ketone |
| WO2022220006A1 (en) * | 2021-04-14 | 2022-10-20 | 住友化学株式会社 | Resin composition and molded body |
| WO2022220005A1 (en) * | 2021-04-14 | 2022-10-20 | 住友化学株式会社 | Resin composition and molded body |
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