JPH02175195A - Ball point pen tip - Google Patents
Ball point pen tipInfo
- Publication number
- JPH02175195A JPH02175195A JP63335391A JP33539188A JPH02175195A JP H02175195 A JPH02175195 A JP H02175195A JP 63335391 A JP63335391 A JP 63335391A JP 33539188 A JP33539188 A JP 33539188A JP H02175195 A JPH02175195 A JP H02175195A
- Authority
- JP
- Japan
- Prior art keywords
- gold
- tip
- alloy
- plating
- pole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007747 plating Methods 0.000 claims abstract description 48
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims abstract description 28
- 229910052737 gold Inorganic materials 0.000 claims abstract description 28
- 239000010931 gold Substances 0.000 claims abstract description 28
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 17
- 239000000956 alloy Substances 0.000 claims abstract description 17
- 238000009792 diffusion process Methods 0.000 claims abstract description 13
- 238000007772 electroless plating Methods 0.000 claims abstract description 9
- 238000010438 heat treatment Methods 0.000 claims description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 abstract description 16
- 229910052759 nickel Inorganic materials 0.000 abstract description 8
- 229910001369 Brass Inorganic materials 0.000 abstract description 6
- 239000010951 brass Substances 0.000 abstract description 6
- 229910000521 B alloy Inorganic materials 0.000 abstract description 5
- QDWJUBJKEHXSMT-UHFFFAOYSA-N boranylidynenickel Chemical compound [Ni]#B QDWJUBJKEHXSMT-UHFFFAOYSA-N 0.000 abstract description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 3
- 229910001096 P alloy Inorganic materials 0.000 abstract description 3
- 229910052802 copper Inorganic materials 0.000 abstract description 3
- 239000010949 copper Substances 0.000 abstract description 3
- 229910052751 metal Inorganic materials 0.000 abstract description 3
- 239000002184 metal Substances 0.000 abstract description 3
- OFNHPGDEEMZPFG-UHFFFAOYSA-N phosphanylidynenickel Chemical compound [P].[Ni] OFNHPGDEEMZPFG-UHFFFAOYSA-N 0.000 abstract description 3
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 abstract description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 abstract description 2
- 229910052782 aluminium Inorganic materials 0.000 abstract description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract description 2
- 229910052796 boron Inorganic materials 0.000 abstract description 2
- 229910052698 phosphorus Inorganic materials 0.000 abstract description 2
- 239000011574 phosphorus Substances 0.000 abstract description 2
- -1 etc. Substances 0.000 abstract 1
- 238000005461 lubrication Methods 0.000 abstract 1
- 238000006748 scratching Methods 0.000 abstract 1
- 230000002393 scratching effect Effects 0.000 abstract 1
- 229910052709 silver Inorganic materials 0.000 abstract 1
- 239000004332 silver Substances 0.000 abstract 1
- 239000000243 solution Substances 0.000 description 9
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 6
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 5
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 description 3
- MOFOBJHOKRNACT-UHFFFAOYSA-N nickel silver Chemical compound [Ni].[Ag] MOFOBJHOKRNACT-UHFFFAOYSA-N 0.000 description 3
- 239000010956 nickel silver Substances 0.000 description 3
- 239000012299 nitrogen atmosphere Substances 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 239000012298 atmosphere Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- 239000012895 dilution Substances 0.000 description 1
- 238000010790 dilution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920006015 heat resistant resin Polymers 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- QLOAVXSYZAJECW-UHFFFAOYSA-N methane;molecular fluorine Chemical compound C.FF QLOAVXSYZAJECW-UHFFFAOYSA-N 0.000 description 1
- CMWTZPSULFXXJA-VIFPVBQESA-N naproxen Chemical group C1=C([C@H](C)C(O)=O)C=CC2=CC(OC)=CC=C21 CMWTZPSULFXXJA-VIFPVBQESA-N 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- TXEYQDLBPFQVAA-UHFFFAOYSA-N tetrafluoromethane Chemical compound FC(F)(F)F TXEYQDLBPFQVAA-UHFFFAOYSA-N 0.000 description 1
- UONOETXJSWQNOL-UHFFFAOYSA-N tungsten carbide Chemical compound [W+]#[C-] UONOETXJSWQNOL-UHFFFAOYSA-N 0.000 description 1
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、耐摩耗性に優れ、潤滑性の高いポールペンチ
ップに関する。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a pole pen tip with excellent wear resistance and high lubricity.
（従来の技術とその課ｍ＞
従来、ポールペンを長期間使用すると、ポールとポール
受座との摩耗により、ポール沈みが生じるため、ポール
ペンチップを耐摩耗性の高い材料によりつくるか、ポー
ルペンチップのポール受座上に耐摩耗性の高い被膜を形
成することが知られている。(Conventional technology and its issues) Conventionally, when a pole pen is used for a long period of time, the pole sinks due to wear between the pole and the pole seat. It is known to form a highly wear-resistant coating on the pole seat.
しかし、これらのポールペンチップは、耐摩耗性の高い
材料を用いたものにおいては、チップ切削時等、表面に
凹凸が生じ、耐摩耗性の高い被膜を形成したものにおい
ても、潤滑性が不十分なため、ポールがスムーズに回転
せず、書き味の悪いものとなっていた。However, when these pole pen tips are made of highly wear-resistant materials, the surface becomes uneven when cutting the tip, and even when a highly wear-resistant coating is formed, the lubricity is insufficient. As a result, the pole did not rotate smoothly, resulting in poor writing quality.
そこで、耐摩耗性、潤滑性に優れた金属めっきをポール
受座表面に形成したポールペン体が実開昭５０−２６９
３９号に開示されている。上記金属めっきとして具体的
には、フッ化カーボン入りニッケルまたはフッ化カーボ
ン入り銅めっきが開示されているが、フッ化カーボンは
粒子径が大きいため、ポールペンチップ表面には凹凸が
生じ、潤滑性において不十分であり、粒子の剥離が生じ
易く、耐摩耗性においても不十分となる。Therefore, a pole pen body in which a metal plating with excellent wear resistance and lubricity was formed on the surface of the pole seat was developed in 1988-269.
It is disclosed in No. 39. Specifically, fluorocarbon-containing nickel or fluorocarbon-containing copper plating is disclosed as the metal plating, but since the particle size of fluorocarbon is large, unevenness occurs on the surface of the pole pen tip, resulting in poor lubricity. This is insufficient, particles tend to peel off, and wear resistance is also insufficient.
よって本発明は、耐摩耗性に優れ、潤滑性の高いポール
ペンチップ乞シことをその課題とするも傳
のである。Therefore, an object of the present invention is to provide a pole pen tip with excellent wear resistance and high lubricity.
（課題を解決するための手段）
即ち１本発明は、無ｆ［ｔ＃めっきにより合金めっき層
、金めつき層を順次形成した後、熱処理を施すことによ
り、少なくともポール受座上に金拡散めっき層を形成し
たポールペンチップを要旨とするものである。(Means for Solving the Problems) That is, 1 the present invention sequentially forms an alloy plating layer and a gold plating layer by F[t# plating, and then heat-treating the layers to prevent gold diffusion on at least the pole seat. The gist is a Pole pen tip with a plating layer formed on it.
以下１本発明を図面に基づき詳述する。The present invention will be explained in detail below based on the drawings.
第１図及び第２図は本発明のポールペンチップの一実施
例を示す要部縦断面図である。FIGS. 1 and 2 are longitudinal sectional views of essential parts showing an embodiment of the pole pen tip of the present invention.
ポールペンチップｌは、銅、ニッケル、アルミニウム等
の金３或いは合金、真鍮、洋白等よりなるものである。The pole pen tip l is made of gold or alloys such as copper, nickel, and aluminum, brass, and nickel silver.
該ポールペンチップ１上には、無電解めっきにより合金
めっきＭ２を形成するものであり、ニッケルーリン合金
或いはニッケルーホウ素合金が好ましい、この時、リン
含有量は１〜１５％、ホウ素含有量は１〜１０％が好ま
しい、厚さは１〜１０μｍが好ましい。An alloy plating M2 is formed on the pole pen tip 1 by electroless plating, preferably a nickel-phosphorus alloy or a nickel-boron alloy.At this time, the phosphorus content is 1 to 15%, and the boron content is 1. ~10% is preferred, and the thickness is preferably 1-10 μm.
該合金めっきＷ！Ｊ２上には、ｆｉ電解めっきにより金
めっきｆｖＪ３を形成するものであり、厚さは０゜１〜
３μｍが好ましい。The alloy plating W! Gold plating fvJ3 is formed on J2 by fi electroplating, and the thickness is 0°1~
3 μm is preferred.
この後、熱処理を施すことにより、表面に行くに従い金
拡散量が多くなった金拡散めっき層４が設けられる。該
金拡散めっき層４は、金拡散めっき暦４の上部４ａ（表
面）では金のみとなり、金拡散めっきＪｖＪ４の下°部
４ｂ（内面）では合金めっきのみとなっている場合もあ
る。Thereafter, heat treatment is performed to provide a gold diffusion plating layer 4 in which the amount of gold diffusion increases toward the surface. The gold diffusion plating layer 4 may include only gold on the upper part 4a (surface) of the gold diffusion plating layer 4, and only alloy plating on the lower part 4b (inner surface) of the gold diffusion plating JvJ4.
金拡散めっき層４は少なくともポール受座５上に形成さ
れていればよいが、ポールペンチップ先端６上にも形成
することにより、ポールペンチップ先端と紙面との摺触
により摩耗が生じ、ポール飛び（ポール外れ）が起こら
ず、ポールペンチップ先端が紙にひっかかることなく滑
らかに筆記できるという効果が得られる。It is sufficient that the gold diffusion plating layer 4 is formed at least on the pole seat 5, but if it is also formed on the tip of the tip of the tip of the tip of the tip of the tip 6, wear may occur due to the sliding contact between the tip of the tip of the tip of the tip of the tip of the tip of the tip of the tip of the tip of the tip of the tip of the tip of the tip of the paper, and the tip of the tip of the tip of the tip of the tip of the tip of the tip of the tip of the tip of the tip of the paper may cause wear. This allows you to write smoothly without the tip of the pole tip getting caught on the paper.
また、Ｈ，電解めっきは、ポールペンチップにポール７
を抱持せしめた状態で、無電解めっきを施しても、ポー
ル受座５上にめっき層を形成できるため、ポール受座５
上にめっき層を形成した後、ポールを入れることにより
、チップ先端６にクラックが生じたり、チップの開口部
が変形したりするという恐れがない、この時、ポールは
無電解めっ、きにより表面にめっきが付着しないもので
なければならず、具体的には、アルミナ、タングステン
カーバイド、ジルコニア、炭化ケイ素等のセラミック或
いは耐熱性の高い樹脂よりなるもの、成いは、全馬上に
上記非めっき材料によりコーティングを施したものが用
いられる。In addition, H, electrolytic plating is applied to Pole 7 on the Pole pen tip.
Even if electroless plating is performed while holding the pole seat 5, a plating layer can be formed on the pole seat 5.
By inserting the pole after forming a plating layer on top, there is no risk of cracking the chip tip 6 or deforming the chip opening. The surface must not be plated, and specifically, it must be made of ceramic such as alumina, tungsten carbide, zirconia, silicon carbide, or a highly heat-resistant resin, or all horses must be coated with the above-mentioned non-plating. A coated material is used.
（作 用）
本発明によると、無電解めっきにより合金めっき層を形
成した後、熱処理を施こすことにより。(Function) According to the present invention, after forming an alloy plating layer by electroless plating, heat treatment is performed.
合金めっきの硬度が上がり、更に、熱処理により。The hardness of alloy plating increases and further heat treatment.
合金めっき層に金が分散されることにより２合金めっき
層に潤滑性付与がなされる。By dispersing gold in the alloy plating layer, lubricity is imparted to the two alloy plating layers.
（実施例） 以下、実施例に基づき本発明を更に詳述する。(Example) Hereinafter, the present invention will be explained in further detail based on Examples.
失に灯上
洋白よりなるポールペンチップを、液温６０℃の無電解
ニッケルめっき液（ＢＥＬＮＩＣＫＥＬ。A pole pen tip made of nickel silver was coated with an electroless nickel plating solution (BELNICKEL) at a temperature of 60°C.
上付工業■！ｌ）に２０分間浸漬することにより。Top industry ■! l) by soaking for 20 minutes.
ニッケルーホウ素の合金層を２μｍ形成した０次に、液
温９０℃の無電解金めっき液（アトタックス１日本エン
ゲルベルト１制に１０分間浸漬し、金めつき層を１．０
μｍ形成した６次に、ポール嵌装孔にジルコニア製のポ
ールを嵌め、チップ先端をカシメ、この後、窒素雰囲気
中にて、４００℃、１時間、熱処理し、金を拡散させる
ことにより、金拡散めっき層を形成したポールペンチッ
プを得た。After forming a nickel-boron alloy layer with a thickness of 2 μm, it was immersed in an electroless gold plating solution (Attax 1 Japan Engelbert 1 System) at a temperature of 90°C for 10 minutes to form a gold plating layer of 1.0 μm.
Next, a zirconia pole was fitted into the pole fitting hole, the tip of the tip was caulked, and then heat treated at 400°C for 1 hour in a nitrogen atmosphere to diffuse the gold. A Pall pen tip with a diffusion plating layer formed thereon was obtained.
夾胤涯裟
真鍮よりなるポールペンチップを、無電解ニッケルめっ
き液°（ブルーシューマー、日本ガーゼンｉ製）を５倍
に希釈した液温９０℃の無電解めっき液に６分間浸漬す
ることにより、ニッケルーリン合金Ｍ ｔ＆３μｍ形成
した０次に、液ｉ！！９０℃の無電解金めっき液（アレ
テックス１日本エンゲルベルト■製）に２００分間浸漬
し、金めつき層を３．０μｍ形成した６次に、ポール嵌
装孔にアルミナ製のポールを嵌め、先端をカシメ、この
後。By immersing a pole pen tip made of brass for 6 minutes in an electroless plating solution at a temperature of 90°C, which is a 5-fold dilution of electroless nickel plating solution ° (Blue Schumer, manufactured by Nippon Garzen I), nickel was removed. Lulin alloy M t & 3 μm formed 0 order, liquid i! ! It was immersed in an electroless gold plating solution (Aretex 1, manufactured by Engelbert Japan) at 90°C for 200 minutes to form a gold plating layer of 3.0 μm.Next, an alumina pole was fitted into the pole fitting hole. After this, caulk the tip.
窒素雰囲気中にて、４００℃、３時間、熱処理し、金を
拡散させることにより、金拡散めっき層を形成したポー
ルペンチップを得た。Heat treatment was performed at 400° C. for 3 hours in a nitrogen atmosphere to diffuse gold, thereby obtaining a pole pen tip with a gold diffusion plating layer formed thereon.
尖産涯ユ
真鍮よりなるポールペンチップのポール嵌装孔にアルミ
ナ製のポールをｉ／Ｘめ、チップ先端をカシメ、この後
、上記ポールペンチップを、無電解ニッケルめっき液（
ブルーシューマー、日本ガーゼンｌｔ＄ｌＩりを５倍に
希釈した、液温９０℃の無電解めっき液に１０分間浸漬
することにより５ニツケル一リン合金層を５μｍ形成し
た０次に、液温９０℃の無電解金めっき液（アレテック
ス１日本エンゲルベルトｌＩＩ製）に５分間浸漬し、金
めっき層を０．１μｍ形成した１次に、窒素雰囲気中に
て。Place an alumina pole into the pole fitting hole of a pole pen tip made of brass, and swage the tip of the tip.
A nickel-phosphorus alloy layer of 5 μm was formed by diluting Blue Schumer and Nippon Garzen lt$lI 5 times in an electroless plating solution at a temperature of 90°C for 10 minutes. The sample was immersed in an electroless gold plating solution (Aretex 1 manufactured by Nippon Engelbert II) for 5 minutes to form a gold plating layer of 0.1 μm in a nitrogen atmosphere.
３００℃、２時間、熱処理し、金を拡散させることによ
り、金拡散めっき層を形成したポールペンチップを得た
。A heat treatment was performed at 300° C. for 2 hours to diffuse gold, thereby obtaining a pole pen tip with a gold diffusion plating layer formed thereon.
ル挽江上
真鍮よりなるポールペンチップのポール嵌装孔にアルミ
ナ製のポールを嵌め、チップ先端をカシメて、ポールペ
ンチップを−ｉ９だ。Insert an alumina pole into the pole fitting hole of a pole pen tip made of brass, swage the tip end, and make the pole pen tip -i9.
ル較且ス
洋白よりなるポールペンチップを、液温６０℃の無電解
ニッケルめっき液（ＢＥＬＮＩＣＫＥＬ。A Pole pen tip made of nickel silver was coated with an electroless nickel plating solution (BELNICKEL) at a temperature of 60°C.
上材工業■製）に２０分間浸漬することにより、ニッケ
ルーホウ素の合金層を２μｍ形成した４次に、ポール嵌
装孔にジルコニア製のポールを嵌め。A 2 μm thick nickel-boron alloy layer was formed by immersing it in a 2-μm thick nickel-boron alloy layer (manufactured by Uezai Kogyo) for 20 minutes.Then, a zirconia pole was fitted into the pole fitting hole.
チップ先端をカシメ、この後、立ＩＡ雰囲気中にて。Caulk the tip of the tip, then place it in a standing IA atmosphere.
４００℃、１時間、熱処理し、合金めっき層を形成した
ポールペンチップを得た。Heat treatment was performed at 400° C. for 1 hour to obtain a pole pen tip with an alloy plating layer formed thereon.
ル狡皿ユ
ニッケルめっき液として、ワット浴を使用し、フッ化カ
ーボンの微粉末（平均粒子径１μｍ）を５０ ｇ ／
！：を入れ１強制撹拌により分散させ、撹拌しながら、
４Ａ／ｄｔｒｒ、５０℃の条件にて、真鍮よりなるポー
ルペンチップ上に、５μｍのフッ化カーボンを含んだニ
ッケルめっき潜を形成し、次に、ポール嵌装孔にアルミ
ナ製のポールを嵌め。Using a Watts bath, 50 g/fine carbon fluoride powder (average particle size 1 μm) was used as the unitel plating solution.
! : Add 1. Disperse by forced stirring, and while stirring,
A 5 μm nickel plating layer containing fluorinated carbon was formed on a brass pole pen tip under conditions of 4 A/dtrr and 50°C, and then an alumina pole was fitted into the pole fitting hole.
チップ先端をカシメ、ポールペンチップを得た。The tip of the tip was caulked to obtain a pole pen tip.
（効 果）
実施例１〜３、比較例１〜３により得られたポールペン
チップをスーパーポール（ＢＨ１５，ぺんてる■Ｉりと
交換しサンプルとし、上質紙ＪＴＳ Ｐ−３２０１を
用い、筆記を行なったところ、実施例１〜３は滑らかに
筆記ができたのに対し、比較例１〜３はザラザラした感
触であった。また、これらのサンプルについて、ボニル
沈み試験を行なった結果を下表に示す。(Effects) The Pole pen tips obtained in Examples 1 to 3 and Comparative Examples 1 to 3 were replaced with Super Pole (BH15, Pentel II) as samples, and writing was performed using high quality paper JTS P-3201. However, while Examples 1 to 3 were able to be written smoothly, Comparative Examples 1 to 3 had a rough feel.Furthermore, the results of the Bonyl sinking test performed on these samples are shown in the table below. .
表１
第１図及び第２図は本発明のポールペンチップの一実施
例を示す要部縦断面図。Table 1 FIGS. 1 and 2 are longitudinal sectional views of essential parts showing one embodiment of the pole pen tip of the present invention.
１・・・・・・ポールペンチップ。1...Pole pen tip.
２・・・・・・合金めっき層、３・・・・・・金拡散め
っき層、４・・・・・・ポール受座2...Alloy plating layer, 3...Gold diffusion plating layer, 4...Pole seat
Claims (1)
くともポール受座上に金拡散めっき層を形成したポール
ペンチップ。[Scope of Claims] A pole pen tip in which a gold diffusion plating layer is formed at least on the pole seat by sequentially forming an alloy plating layer and a gold plating layer by electroless plating and then performing heat treatment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63335391A JP2630456B2 (en) | 1988-12-27 | 1988-12-27 | Ballpoint pen tip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63335391A JP2630456B2 (en) | 1988-12-27 | 1988-12-27 | Ballpoint pen tip |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02175195A true JPH02175195A (en) | 1990-07-06 |
| JP2630456B2 JP2630456B2 (en) | 1997-07-16 |
Family
ID=18288019
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63335391A Expired - Lifetime JP2630456B2 (en) | 1988-12-27 | 1988-12-27 | Ballpoint pen tip |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2630456B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5838069A (en) * | 1996-04-11 | 1998-11-17 | Ngk Spark Plug Co., Ltd. | Ceramic substrate having pads to be attached to terminal members with Pb-Sn solder and method of producing the same |
| CN104395098A (en) * | 2012-03-30 | 2015-03-04 | 德尔塔有限公司 | Stylographic pen with precious material |
-
1988
- 1988-12-27 JP JP63335391A patent/JP2630456B2/en not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5838069A (en) * | 1996-04-11 | 1998-11-17 | Ngk Spark Plug Co., Ltd. | Ceramic substrate having pads to be attached to terminal members with Pb-Sn solder and method of producing the same |
| CN104395098A (en) * | 2012-03-30 | 2015-03-04 | 德尔塔有限公司 | Stylographic pen with precious material |
| CN104395098B (en) * | 2012-03-30 | 2016-07-13 | 德尔塔有限公司 | There is the tip pen type pen of precious materials |
| US9421813B2 (en) | 2012-03-30 | 2016-08-23 | Delta S.R.L. | Stylographic pen with precious material |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2630456B2 (en) | 1997-07-16 |
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