JPH0216121A - Production of optical disc base - Google Patents
Production of optical disc baseInfo
- Publication number
- JPH0216121A JPH0216121A JP63166029A JP16602988A JPH0216121A JP H0216121 A JPH0216121 A JP H0216121A JP 63166029 A JP63166029 A JP 63166029A JP 16602988 A JP16602988 A JP 16602988A JP H0216121 A JPH0216121 A JP H0216121A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- temperature
- polymer
- mold temperature
- optical disc
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000003287 optical effect Effects 0.000 title claims abstract description 28
- 238000004519 manufacturing process Methods 0.000 title claims description 18
- 229920005989 resin Polymers 0.000 claims abstract description 44
- 239000011347 resin Substances 0.000 claims abstract description 44
- 238000001746 injection moulding Methods 0.000 claims abstract description 7
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 claims description 42
- 239000000758 substrate Substances 0.000 claims description 15
- 238000000034 method Methods 0.000 claims description 4
- 239000000243 solution Substances 0.000 claims description 4
- 239000002904 solvent Substances 0.000 claims description 4
- 239000000126 substance Substances 0.000 claims 1
- 229920000642 polymer Polymers 0.000 abstract description 26
- 239000000155 melt Substances 0.000 abstract description 3
- BATCUENAARTUKW-UHFFFAOYSA-N 4-[(4-hydroxyphenyl)-diphenylmethyl]phenol Chemical compound C1=CC(O)=CC=C1C(C=1C=CC(O)=CC=1)(C=1C=CC=CC=1)C1=CC=CC=C1 BATCUENAARTUKW-UHFFFAOYSA-N 0.000 description 12
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 12
- 229920005668 polycarbonate resin Polymers 0.000 description 12
- 239000004431 polycarbonate resin Substances 0.000 description 12
- -1 3-phenyl-4-hydroxyphenyl Chemical group 0.000 description 11
- 230000000052 comparative effect Effects 0.000 description 9
- 229920000515 polycarbonate Polymers 0.000 description 8
- 239000004417 polycarbonate Substances 0.000 description 8
- YGYAWVDWMABLBF-UHFFFAOYSA-N Phosgene Chemical compound ClC(Cl)=O YGYAWVDWMABLBF-UHFFFAOYSA-N 0.000 description 7
- 239000002216 antistatic agent Substances 0.000 description 7
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 6
- 239000006096 absorbing agent Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 238000000465 moulding Methods 0.000 description 6
- 239000000654 additive Substances 0.000 description 5
- 238000004458 analytical method Methods 0.000 description 5
- 239000003963 antioxidant agent Substances 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 4
- 230000003078 antioxidant effect Effects 0.000 description 4
- 230000000740 bleeding effect Effects 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 4
- 229920001577 copolymer Polymers 0.000 description 4
- 235000014113 dietary fatty acids Nutrition 0.000 description 4
- ROORDVPLFPIABK-UHFFFAOYSA-N diphenyl carbonate Chemical compound C=1C=CC=CC=1OC(=O)OC1=CC=CC=C1 ROORDVPLFPIABK-UHFFFAOYSA-N 0.000 description 4
- 239000000194 fatty acid Substances 0.000 description 4
- 229930195729 fatty acid Natural products 0.000 description 4
- 239000000314 lubricant Substances 0.000 description 4
- 239000004014 plasticizer Substances 0.000 description 4
- 235000011121 sodium hydroxide Nutrition 0.000 description 4
- 238000005160 1H NMR spectroscopy Methods 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- 239000007864 aqueous solution Substances 0.000 description 3
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 3
- 239000003086 colorant Substances 0.000 description 3
- 238000004040 coloring Methods 0.000 description 3
- 238000011049 filling Methods 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 238000006116 polymerization reaction Methods 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 2
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 2
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 description 2
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 2
- 238000000862 absorption spectrum Methods 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 2
- 239000012964 benzotriazole Substances 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- MVPPADPHJFYWMZ-UHFFFAOYSA-N chlorobenzene Chemical compound ClC1=CC=CC=C1 MVPPADPHJFYWMZ-UHFFFAOYSA-N 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 125000000325 methylidene group Chemical group [H]C([H])=* 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- 239000012044 organic layer Substances 0.000 description 2
- ZQBAKBUEJOMQEX-UHFFFAOYSA-N phenyl salicylate Chemical compound OC1=CC=CC=C1C(=O)OC1=CC=CC=C1 ZQBAKBUEJOMQEX-UHFFFAOYSA-N 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- YGSDEFSMJLZEOE-UHFFFAOYSA-N salicylic acid Chemical compound OC(=O)C1=CC=CC=C1O YGSDEFSMJLZEOE-UHFFFAOYSA-N 0.000 description 2
- 230000035945 sensitivity Effects 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- HVLLSGMXQDNUAL-UHFFFAOYSA-N triphenyl phosphite Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)OC1=CC=CC=C1 HVLLSGMXQDNUAL-UHFFFAOYSA-N 0.000 description 2
- AUGNJTSMGVHRPS-UHFFFAOYSA-N (4-butylphenyl) 2-hydroxybenzoate Chemical compound C1=CC(CCCC)=CC=C1OC(=O)C1=CC=CC=C1O AUGNJTSMGVHRPS-UHFFFAOYSA-N 0.000 description 1
- DNIAPMSPPWPWGF-GSVOUGTGSA-N (R)-(-)-Propylene glycol Chemical compound C[C@@H](O)CO DNIAPMSPPWPWGF-GSVOUGTGSA-N 0.000 description 1
- HVRGFWZLHOKCGE-UHFFFAOYSA-N 2,6-dibutyl-4-ethylphenol Chemical compound CCCCC1=CC(CC)=CC(CCCC)=C1O HVRGFWZLHOKCGE-UHFFFAOYSA-N 0.000 description 1
- CJWNFAKWHDOUKL-UHFFFAOYSA-N 2-(2-phenylpropan-2-yl)phenol Chemical compound C=1C=CC=C(O)C=1C(C)(C)C1=CC=CC=C1 CJWNFAKWHDOUKL-UHFFFAOYSA-N 0.000 description 1
- TYVUZHAPQWPWKJ-UHFFFAOYSA-N 2-(2-phenylpropyl)phenol Chemical compound C=1C=CC=CC=1C(C)CC1=CC=CC=C1O TYVUZHAPQWPWKJ-UHFFFAOYSA-N 0.000 description 1
- WXHVQMGINBSVAY-UHFFFAOYSA-N 2-(benzotriazol-2-yl)-4-tert-butylphenol Chemical compound CC(C)(C)C1=CC=C(O)C(N2N=C3C=CC=CC3=N2)=C1 WXHVQMGINBSVAY-UHFFFAOYSA-N 0.000 description 1
- YEVQZPWSVWZAOB-UHFFFAOYSA-N 2-(bromomethyl)-1-iodo-4-(trifluoromethyl)benzene Chemical compound FC(F)(F)C1=CC=C(I)C(CBr)=C1 YEVQZPWSVWZAOB-UHFFFAOYSA-N 0.000 description 1
- LZHCVNIARUXHAL-UHFFFAOYSA-N 2-tert-butyl-4-ethylphenol Chemical compound CCC1=CC=C(O)C(C(C)(C)C)=C1 LZHCVNIARUXHAL-UHFFFAOYSA-N 0.000 description 1
- XOUQAVYLRNOXDO-UHFFFAOYSA-N 2-tert-butyl-5-methylphenol Chemical compound CC1=CC=C(C(C)(C)C)C(O)=C1 XOUQAVYLRNOXDO-UHFFFAOYSA-N 0.000 description 1
- BKMAEERFCKIKJR-UHFFFAOYSA-N 2-tridecoxycarbonylbenzoic acid Chemical compound CCCCCCCCCCCCCOC(=O)C1=CC=CC=C1C(O)=O BKMAEERFCKIKJR-UHFFFAOYSA-N 0.000 description 1
- YMTYZTXUZLQUSF-UHFFFAOYSA-N 3,3'-Dimethylbisphenol A Chemical compound C1=C(O)C(C)=CC(C(C)(C)C=2C=C(C)C(O)=CC=2)=C1 YMTYZTXUZLQUSF-UHFFFAOYSA-N 0.000 description 1
- RKSBPFMNOJWYSB-UHFFFAOYSA-N 3,3-Bis(4-hydroxyphenyl)pentane Chemical compound C=1C=C(O)C=CC=1C(CC)(CC)C1=CC=C(O)C=C1 RKSBPFMNOJWYSB-UHFFFAOYSA-N 0.000 description 1
- ODJQKYXPKWQWNK-UHFFFAOYSA-L 3-(2-carboxylatoethylsulfanyl)propanoate Chemical compound [O-]C(=O)CCSCCC([O-])=O ODJQKYXPKWQWNK-UHFFFAOYSA-L 0.000 description 1
- XJWXAXVPTVZLSO-UHFFFAOYSA-N 3-tritylbenzene-1,2-diol Chemical compound OC1=CC=CC(C(C=2C=CC=CC=2)(C=2C=CC=CC=2)C=2C=CC=CC=2)=C1O XJWXAXVPTVZLSO-UHFFFAOYSA-N 0.000 description 1
- CYYZDBDROVLTJU-UHFFFAOYSA-N 4-n-Butylphenol Chemical compound CCCCC1=CC=C(O)C=C1 CYYZDBDROVLTJU-UHFFFAOYSA-N 0.000 description 1
- MBGYSHXGENGTBP-UHFFFAOYSA-N 6-(2-ethylhexoxy)-6-oxohexanoic acid Chemical compound CCCCC(CC)COC(=O)CCCCC(O)=O MBGYSHXGENGTBP-UHFFFAOYSA-N 0.000 description 1
- ADRNSOYXKABLGT-UHFFFAOYSA-N 8-methylnonyl diphenyl phosphite Chemical compound C=1C=CC=CC=1OP(OCCCCCCCC(C)C)OC1=CC=CC=C1 ADRNSOYXKABLGT-UHFFFAOYSA-N 0.000 description 1
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical compound [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 description 1
- KWIUHFFTVRNATP-UHFFFAOYSA-N Betaine Natural products C[N+](C)(C)CC([O-])=O KWIUHFFTVRNATP-UHFFFAOYSA-N 0.000 description 1
- 239000004255 Butylated hydroxyanisole Substances 0.000 description 1
- GHKOFFNLGXMVNJ-UHFFFAOYSA-N Didodecyl thiobispropanoate Chemical compound CCCCCCCCCCCCOC(=O)CCSCCC(=O)OCCCCCCCCCCCC GHKOFFNLGXMVNJ-UHFFFAOYSA-N 0.000 description 1
- BJQHLKABXJIVAM-UHFFFAOYSA-N Diethylhexyl phthalate Natural products CCCCC(CC)COC(=O)C1=CC=CC=C1C(=O)OCC(CC)CCCC BJQHLKABXJIVAM-UHFFFAOYSA-N 0.000 description 1
- 239000003508 Dilauryl thiodipropionate Substances 0.000 description 1
- 239000002656 Distearyl thiodipropionate Substances 0.000 description 1
- YNQLUTRBYVCPMQ-UHFFFAOYSA-N Ethylbenzene Chemical compound CCC1=CC=CC=C1 YNQLUTRBYVCPMQ-UHFFFAOYSA-N 0.000 description 1
- UTGQNNCQYDRXCH-UHFFFAOYSA-N N,N'-diphenyl-1,4-phenylenediamine Chemical compound C=1C=C(NC=2C=CC=CC=2)C=CC=1NC1=CC=CC=C1 UTGQNNCQYDRXCH-UHFFFAOYSA-N 0.000 description 1
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 1
- KEQFTVQCIQJIQW-UHFFFAOYSA-N N-Phenyl-2-naphthylamine Chemical compound C=1C=C2C=CC=CC2=CC=1NC1=CC=CC=C1 KEQFTVQCIQJIQW-UHFFFAOYSA-N 0.000 description 1
- 238000005481 NMR spectroscopy Methods 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- YSMRWXYRXBRSND-UHFFFAOYSA-N TOTP Chemical compound CC1=CC=CC=C1OP(=O)(OC=1C(=CC=CC=1)C)OC1=CC=CC=C1C YSMRWXYRXBRSND-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 150000001338 aliphatic hydrocarbons Chemical class 0.000 description 1
- 150000003973 alkyl amines Chemical class 0.000 description 1
- 125000005907 alkyl ester group Chemical group 0.000 description 1
- 150000008052 alkyl sulfonates Chemical class 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 229910052921 ammonium sulfate Inorganic materials 0.000 description 1
- 235000011130 ammonium sulphate Nutrition 0.000 description 1
- 125000000129 anionic group Chemical group 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- 229960003237 betaine Drugs 0.000 description 1
- LLEMOWNGBBNAJR-UHFFFAOYSA-N biphenyl-2-ol Chemical compound OC1=CC=CC=C1C1=CC=CC=C1 LLEMOWNGBBNAJR-UHFFFAOYSA-N 0.000 description 1
- 239000001273 butane Substances 0.000 description 1
- 235000019282 butylated hydroxyanisole Nutrition 0.000 description 1
- CZBZUDVBLSSABA-UHFFFAOYSA-N butylated hydroxyanisole Chemical compound COC1=CC=C(O)C(C(C)(C)C)=C1.COC1=CC=C(O)C=C1C(C)(C)C CZBZUDVBLSSABA-UHFFFAOYSA-N 0.000 description 1
- 229940043253 butylated hydroxyanisole Drugs 0.000 description 1
- 125000002091 cationic group Chemical group 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- FZFAMSAMCHXGEF-UHFFFAOYSA-N chloro formate Chemical compound ClOC=O FZFAMSAMCHXGEF-UHFFFAOYSA-N 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- FJBFPHVGVWTDIP-UHFFFAOYSA-N dibromomethane Chemical compound BrCBr FJBFPHVGVWTDIP-UHFFFAOYSA-N 0.000 description 1
- DOIRQSBPFJWKBE-UHFFFAOYSA-N dibutyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 description 1
- JQCXWCOOWVGKMT-UHFFFAOYSA-N diheptyl phthalate Chemical compound CCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCC JQCXWCOOWVGKMT-UHFFFAOYSA-N 0.000 description 1
- 235000019304 dilauryl thiodipropionate Nutrition 0.000 description 1
- DROMNWUQASBTFM-UHFFFAOYSA-N dinonyl benzene-1,2-dicarboxylate Chemical compound CCCCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCCCC DROMNWUQASBTFM-UHFFFAOYSA-N 0.000 description 1
- PWWSSIYVTQUJQQ-UHFFFAOYSA-N distearyl thiodipropionate Chemical compound CCCCCCCCCCCCCCCCCCOC(=O)CCSCCC(=O)OCCCCCCCCCCCCCCCCCC PWWSSIYVTQUJQQ-UHFFFAOYSA-N 0.000 description 1
- 235000019305 distearyl thiodipropionate Nutrition 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000006735 epoxidation reaction Methods 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- 150000008282 halocarbons Chemical class 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- DJDSLBVSSOQSLW-UHFFFAOYSA-N mono(2-ethylhexyl) phthalate Chemical compound CCCCC(CC)COC(=O)C1=CC=CC=C1C(O)=O DJDSLBVSSOQSLW-UHFFFAOYSA-N 0.000 description 1
- YWWHKOHZGJFMIE-UHFFFAOYSA-N monoethyl phthalate Chemical compound CCOC(=O)C1=CC=CC=C1C(O)=O YWWHKOHZGJFMIE-UHFFFAOYSA-N 0.000 description 1
- ZICLWBMRDQUIDO-UHFFFAOYSA-N monoisodecyl phthalate Chemical compound CC(C)CCCCCCCOC(=O)C1=CC=CC=C1C(O)=O ZICLWBMRDQUIDO-UHFFFAOYSA-N 0.000 description 1
- IJDNQMDRQITEOD-UHFFFAOYSA-N n-butane Chemical compound CCCC IJDNQMDRQITEOD-UHFFFAOYSA-N 0.000 description 1
- WIBFFTLQMKKBLZ-SEYXRHQNSA-N n-butyl oleate Chemical compound CCCCCCCC\C=C/CCCCCCCC(=O)OCCCC WIBFFTLQMKKBLZ-SEYXRHQNSA-N 0.000 description 1
- OFBQJSOFQDEBGM-UHFFFAOYSA-N n-pentane Natural products CCCCC OFBQJSOFQDEBGM-UHFFFAOYSA-N 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- QTDSLDJPJJBBLE-PFONDFGASA-N octyl (z)-octadec-9-enoate Chemical compound CCCCCCCCOC(=O)CCCCCCC\C=C/CCCCCCCC QTDSLDJPJJBBLE-PFONDFGASA-N 0.000 description 1
- DXGLGDHPHMLXJC-UHFFFAOYSA-N oxybenzone Chemical compound OC1=CC(OC)=CC=C1C(=O)C1=CC=CC=C1 DXGLGDHPHMLXJC-UHFFFAOYSA-N 0.000 description 1
- NFHFRUOZVGFOOS-UHFFFAOYSA-N palladium;triphenylphosphane Chemical compound [Pd].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 NFHFRUOZVGFOOS-UHFFFAOYSA-N 0.000 description 1
- FJKROLUGYXJWQN-UHFFFAOYSA-N papa-hydroxy-benzoic acid Natural products OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 229960000969 phenyl salicylate Drugs 0.000 description 1
- 150000008301 phosphite esters Chemical class 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-N phosphoric acid Substances OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 1
- 150000003018 phosphorus compounds Chemical class 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 238000012643 polycondensation polymerization Methods 0.000 description 1
- 238000006068 polycondensation reaction Methods 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- 125000001453 quaternary ammonium group Chemical group 0.000 description 1
- 150000003242 quaternary ammonium salts Chemical class 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 229960004889 salicylic acid Drugs 0.000 description 1
- 229940116351 sebacate Drugs 0.000 description 1
- 239000000344 soap Substances 0.000 description 1
- 150000003464 sulfur compounds Chemical class 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- 238000005809 transesterification reaction Methods 0.000 description 1
- STCOOQWBFONSKY-UHFFFAOYSA-N tributyl phosphate Chemical compound CCCCOP(=O)(OCCCC)OCCCC STCOOQWBFONSKY-UHFFFAOYSA-N 0.000 description 1
- XZZNDPSIHUTMOC-UHFFFAOYSA-N triphenyl phosphate Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)(=O)OC1=CC=CC=C1 XZZNDPSIHUTMOC-UHFFFAOYSA-N 0.000 description 1
- WGKLOLBTFWFKOD-UHFFFAOYSA-N tris(2-nonylphenyl) phosphite Chemical compound CCCCCCCCCC1=CC=CC=C1OP(OC=1C(=CC=CC=1)CCCCCCCCC)OC1=CC=CC=C1CCCCCCCCC WGKLOLBTFWFKOD-UHFFFAOYSA-N 0.000 description 1
- 238000004383 yellowing Methods 0.000 description 1
Landscapes
- Polyethers (AREA)
- Polyesters Or Polycarbonates (AREA)
- Optical Record Carriers And Manufacture Thereof (AREA)
- Manufacturing Optical Record Carriers (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は射出成形による光ディスク基板の製造法に関す
るものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method of manufacturing an optical disk substrate by injection molding.
光学用途に使用する成形物は、透明であると共に、光学
的歪みの小さいものであることが必要とされる。特にデ
ジタル信号を利用して情報の読み取り、書き込みを行う
光ディスクにおいては、光学的歪みは実成形品において
位相差として２０ｎｍ以下であることが要求される。ま
た、光ビームを光ディスク基板の記録膜に絞り込むため
に、光ビームは基板中を斜めに進行する。この時、斜め
入射の光ビームは大きな位相差を示し、これが情報読み
取り、書き込み時にエラーを発生する原因となる。Molded products used for optical purposes are required to be transparent and have low optical distortion. Particularly in optical discs in which information is read and written using digital signals, optical distortion is required to be 20 nm or less as a phase difference in actual molded products. Furthermore, in order to focus the light beam onto the recording film of the optical disc substrate, the light beam travels obliquely through the substrate. At this time, the obliquely incident light beam exhibits a large phase difference, which causes errors when reading and writing information.
従来、光ディスク基板はポリメチルメタクリレートや２
．２−ビス（４−ヒドロキシフェニル）プロパンを原料
とするポリカーボネート樹脂などが用いられている。と
ころが、前者は耐熱性、耐湿性、耐衝撃性において十分
な性能を有していない。一方、後者においては、耐熱性
、耐湿性、耐衝撃性などにおいて優れているものの、光
学的歪みが大きく、これに起因して複屈折が大きくなり
、情報の読み取り感度が低下したり、エラーが発生する
という難点がある。Conventionally, optical disc substrates have been made of polymethyl methacrylate or 2
．． Polycarbonate resins made from 2-bis(4-hydroxyphenyl)propane are used. However, the former does not have sufficient performance in terms of heat resistance, moisture resistance, and impact resistance. On the other hand, although the latter has excellent heat resistance, moisture resistance, and impact resistance, it has large optical distortion, which increases birefringence, reduces information reading sensitivity, and causes errors. There is a problem with this occurring.
また、４．４′−ジヒドロキシテトラフェニルメタンを
原料とするポリカーボネート樹脂やポリホルマール樹脂
を光学機器用素材とすることが特開昭６０−１６６３２
２号公報や特開昭６０−１８８４２６号公報に記載され
ているが、これら樹脂が光ディスクとしての上記要求特
性を十分に満足し得るものであるかどうかは確認されて
いない。In addition, it was disclosed in Japanese Patent Application Laid-Open No. 60-16632 that polycarbonate resin and polyformal resin made from 4,4'-dihydroxytetraphenylmethane were used as materials for optical equipment.
However, it has not been confirmed whether these resins can sufficiently satisfy the above-mentioned required characteristics for optical discs.
本発明は、前記事情に基づいてなされたもので、その目
的とするところは、耐熱性、耐湿性、耐衝撃性に優れ、
光学的歪み、特に斜め入射の複屈折が小さく、読み取り
エラーの少ない光ディスク基板を得ることにある。The present invention was made based on the above-mentioned circumstances, and its purpose is to have excellent heat resistance, moisture resistance, and impact resistance.
The object of the present invention is to obtain an optical disk substrate with small optical distortion, especially birefringence upon oblique incidence, and with few reading errors.
本発明者らは、前記課題を解決するために鋭意研究を重
ねた結果、特定の樹脂を特定の条件下で射出成形するこ
とにより目的とする光ディスク基板が得られることを見
出し本発明を完成するに至った。As a result of extensive research to solve the above problems, the present inventors discovered that the desired optical disk substrate could be obtained by injection molding a specific resin under specific conditions, and completed the present invention. reached.
すなわち、本発明は下記の式〔Ｉ〕で表される繰り返し
単位を有し、かつ塩化メチレンを溶媒とする濃度０．５
ｇ／ｄｌの溶液の２０℃における還元粘度が０．２０〜
０．６５ａ／ｇである重合体を、式中のＸが−ＣＯ−で
ある場合には、樹脂温度３４０〜４３０℃１金型温度１
２０〜２００℃で、式中のＸが−ＣＨ２−である場合に
は樹脂温度３２０℃〜４２０℃１金型温度１１０〜１８
０℃で射出成形することを特徴とする光ディスク基板の
製造法を提供するものである。That is, the present invention has a repeating unit represented by the following formula [I] and has a concentration of 0.5 using methylene chloride as a solvent.
Reduced viscosity of g/dl solution at 20°C is 0.20~
0.65a/g, when X in the formula is -CO-, the resin temperature is 340 to 430°C, the mold temperature is 1
20 to 200°C, and when X in the formula is -CH2-, resin temperature 320°C to 420°C 1 mold temperature 110 to 18
The present invention provides a method for manufacturing an optical disc substrate characterized by injection molding at 0°C.
（ここでＸは−Ｃ〇−又は−ＣＨ，−テある。）本発明
に用いられる重合体の還元粘度が０．２０ｄ１７ｇ未満
であると耐衝撃性が低下することがあり、０．６５ ａ
／ ｇを超えると樹脂の溶融粘度が高（なり、光ディス
ク基板に複屈折を生じさせることがある。好ましい還元
粘度の範囲は０．３〜０．６ｄｉ／ｇである。(Here, X is -C〇- or -CH, -te.) If the reduced viscosity of the polymer used in the present invention is less than 0.20d17g, the impact resistance may decrease, and 0.65a
/g, the melt viscosity of the resin becomes high and may cause birefringence in the optical disc substrate.The preferred reduced viscosity range is 0.3 to 0.6 di/g.
本発明に用いられる重合体は具体的には次式（Ｉ ａ）
で表される繰り返し単位を有するポリカーボネート樹脂
と、
合もポリホルマール樹脂の場合も、次の式で表される繰
り返し単位の１種又は２種以上を含有する共重合体であ
ってもよい。但し式［１］で表される繰り返し単位のモ
ル分率は５０％以上であることが好ましい。モル分率が
５０％未満であると複屈折低下の効果が不十分となるこ
とがある。Specifically, the polymer used in the present invention has the following formula (I a)
In the case of a polycarbonate resin having a repeating unit represented by the following formula and a polyformal resin, a copolymer containing one or more repeating units represented by the following formula may be used. However, the mole fraction of the repeating unit represented by formula [1] is preferably 50% or more. If the mole fraction is less than 50%, the effect of reducing birefringence may be insufficient.
次式（Ｉ ｂ）で表される繰り返し単位を有するポリホ
ルマール樹脂である。It is a polyformal resin having a repeating unit represented by the following formula (Ib).
本発明の重合体は、ポリカーボネート樹脂の場（上記式
中Ｘは本発明の重合体がポリカーボネート樹脂である場
合は−ＣＯ−であり、ポリホルマール樹脂である場合は
−ｃｔｔｚ−である。）本発明で用いられる樹脂には光
学的性質を損なわない範囲で、必要に応じ、酸化防止剤
、紫外線吸収剤、帯電防止剤、滑剤、着色剤等、通常ポ
リカーボネート樹脂やポリホルマール樹脂に添加される
添加物を配合することができる。The polymer of the present invention is a polycarbonate resin (in the above formula, X is -CO- when the polymer of the present invention is a polycarbonate resin, and -cttz- when the polymer of the present invention is a polyformal resin). The resin used in the invention may contain additives normally added to polycarbonate resins and polyformal resins, such as antioxidants, ultraviolet absorbers, antistatic agents, lubricants, and colorants, as necessary, to the extent that optical properties are not impaired. You can mix things.
ここで、本発明で用いられるポリカーボネート樹脂は４
，４′−ジヒドロキシテトラフェニルメタンとホスゲン
の重縮合により製造することができる。また、このよう
なホスゲン法によるポリカーボネートの製法のほかに、
炭酸ジフェニルなどを用いるエステル交換法によりポリ
カーボネートを製造することもできる。Here, the polycarbonate resin used in the present invention is 4
, 4'-dihydroxytetraphenylmethane and phosgene. In addition to the method for producing polycarbonate using the phosgene method,
Polycarbonate can also be produced by a transesterification method using diphenyl carbonate or the like.
なお、前記の共重合体を製造する場合には、２゜２−ビ
ス（４−ヒドロキシフェニル）プロパン、２．２−ビス
（３−メチル−４−ヒドロキシフェニル）プロパン、２
，２−ビス（３−フェニル−４−ヒドロキシフェニル）
プロパン、３，３−ビス（４−ヒドロキシフェニル）ペ
ンタン、２，２ビス（４−ヒドロキシフェニル）−２−
フェニルエタンなどのジヒドロキシ化合物をモノマーの
まま直接混合し、ホスゲン又は炭酸ジフェニルと共に反
応させてもよく、或いは４，４′−ジヒドロキシテトラ
フェニルメタンとホスゲン又は炭酸ジフェニルを重縮合
させてオリゴマーを得、コノオリゴマーと前記ジヒドロ
キシ化合物を反応させてもよい。また、逆に予め前記ジ
ヒドロキシ化合物とホスゲン又は炭酸ジフェニルを重縮
合させておき、その後４．４′−ジヒドロキシテトラフ
エニルメタンと反応させてもよい。In addition, when producing the above copolymer, 2゜2-bis(4-hydroxyphenyl)propane, 2.2-bis(3-methyl-4-hydroxyphenyl)propane, 2.
,2-bis(3-phenyl-4-hydroxyphenyl)
Propane, 3,3-bis(4-hydroxyphenyl)pentane, 2,2bis(4-hydroxyphenyl)-2-
Dihydroxy compounds such as phenylethane may be directly mixed as monomers and reacted with phosgene or diphenyl carbonate, or 4,4'-dihydroxytetraphenylmethane and phosgene or diphenyl carbonate may be polycondensed to obtain oligomers. The oligomer and the dihydroxy compound may be reacted. Alternatively, the dihydroxy compound and phosgene or diphenyl carbonate may be polycondensed in advance and then reacted with 4,4'-dihydroxytetraphenylmethane.
この重縮合の条件は所望する重合体の重合度などにより
一義的に定めることはできないが、通常は塩化メチレン
、クロロベンゼン等のハロゲン化炭化水素やピリジン等
の溶媒中で反応させる。さらに、縮重合反応を促進する
ために、トリエチルアミンのような第三級アミンまたは
第四級アンモニウム塩などの触媒を、また、重合度を調
製するために、フェノール、フェニルフェノール、クミ
ルフェノール、オクチルフェノール、ｐ−む−ブチルフ
ェノール、２−ヒドロキシフェニル−２フエニルプロパ
ンなどの分子ｉｔ調節剤を添加して反応を行うことが望
ましい。Although the conditions for this polycondensation cannot be uniquely determined depending on the degree of polymerization of the desired polymer, the reaction is usually carried out in a halogenated hydrocarbon such as methylene chloride or chlorobenzene, or a solvent such as pyridine. Furthermore, to promote the condensation polymerization reaction, catalysts such as tertiary amines such as triethylamine or quaternary ammonium salts, and phenol, phenylphenol, cumylphenol, octylphenol to adjust the degree of polymerization. , p-butylphenol, 2-hydroxyphenyl-2-phenylpropane, and the like are preferably added to carry out the reaction.
重合体として光弾性係数の小さいものを得たい場合には
、４，４′−ジヒドロキシテトラフェニルメタンの使用
割合を増やせばよい。If it is desired to obtain a polymer with a small photoelastic coefficient, the proportion of 4,4'-dihydroxytetraphenylmethane used may be increased.
次に、本発明で用いられるポリホルマール樹脂は４．４
′−ジヒドロキシテトラフェニルメタンを適当な触媒、
分子量調節剤などを用いて塩化メチレン、臭化メチレン
などのハロゲン化メチレンと反応させたり、また、これ
らのハロゲン化メチレン及び苛性ソーダなどの塩基と反
応させて製造することができる。分子量調節剤としては
ポリカーボネート樹脂製造の際に用いたものを使用する
ことができる。また、ポリカーボネート樹脂製造の際と
同様なジヒドロキシ化合物を共重合させることもできる
。重合体として光弾性係数の小さいものを得たい場合に
は、４．４′−ジヒドロキシテトラフェニルメタンの使
用割合を増やせばよい。Next, the polyformal resin used in the present invention has a 4.4
'-dihydroxytetraphenylmethane with a suitable catalyst,
It can be produced by reacting with halogenated methylenes such as methylene chloride and methylene bromide using a molecular weight regulator, or by reacting these halogenated methylenes with a base such as caustic soda. As the molecular weight regulator, those used in the production of polycarbonate resin can be used. Further, a dihydroxy compound similar to that used in the production of polycarbonate resin can also be copolymerized. If it is desired to obtain a polymer with a small photoelastic coefficient, the proportion of 4,4'-dihydroxytetraphenylmethane used may be increased.
本発明の重合体に使用される酸化防止剤としては、例え
ば、２．６−ジーＬ−ブチル−Ｐ−クレゾール、ブチル
化ヒドロキシアニソール、２．６−ジーＬ−ブチル−４
−エチルフェノール、ステアリル−β−（３，５−ジ−
ｔ−ブチル−４−ヒドロキシフェニル）プロピオネート
、２．２′メチレンビス（４−メチル−６−も−ブチル
フェノール）、２．２’−メチレン−ビス（４−エチル
−６−ｔ−ブチルフェノール）、４．４’−チオビス（
３−メチル−６−ｔ−ブチルフェノール）、４．４’−
ブチリデンビス（３−メチル６−ｔ−ブチルフェノール
）、テトラキス〔メチレン−３−（３’、５’−ジーＬ
−ブチルー４−ヒドロキシフェニル）プロピオネートコ
メタン、１．１．３−）リス（２−メチル−４−ヒドロ
キシ−５−ｔ−ブチルフェニル）ブタン等のフェノール
系化合物、フェニル−β−ナフチルアミン、Ｎ、Ｎ’−
ジフェニル−ｐ−フェニレンジアミン等のアミン系化合
物、トリス（ノニルフェニル）フォスファイト、トリフ
ェニルフォスファイト、トリオクタデシルフォスファイ
ト、ジフェニルイソデシルフォスファイト等のリン系化
合物、ジラウリルチオジプロピオネート、シミリスチル
チオジプロピオネート、ジステアリルチオジプロピオネ
ート等の硫黄化合物などが挙げられる。酸化防止剤の添
加量は、通常重合体に対して５０〜３００１）９１１％
好ましくは１００〜２００ ｐｐｍとする。Examples of the antioxidant used in the polymer of the present invention include 2,6-di-L-butyl-P-cresol, butylated hydroxyanisole, 2,6-di-L-butyl-4
-ethylphenol, stearyl-β-(3,5-di-
t-Butyl-4-hydroxyphenyl) propionate, 2.2'-methylenebis(4-methyl-6-mo-butylphenol), 2.2'-methylene-bis(4-ethyl-6-t-butylphenol), 4. 4'-thiobis(
3-methyl-6-t-butylphenol), 4.4'-
Butylidenebis(3-methyl6-t-butylphenol), tetrakis[methylene-3-(3',5'-di-L
-butyl-4-hydroxyphenyl)propionate comethane, phenolic compounds such as 1.1.3-)lis(2-methyl-4-hydroxy-5-t-butylphenyl)butane, phenyl-β-naphthylamine, N , N'-
Amine compounds such as diphenyl-p-phenylenediamine, phosphorus compounds such as tris(nonylphenyl)phosphite, triphenylphosphite, triotadecylphosphite, diphenylisodecylphosphite, dilaurylthiodipropionate, similistil Examples include sulfur compounds such as thiodipropionate and distearylthiodipropionate. The amount of antioxidant added is usually 50 to 3001)911% based on the polymer.
Preferably it is 100 to 200 ppm.
酸化防止剤の添加量が５０ｐｐｍ未満であると、成形時
に重合体の焼けが発生しやすく、このため複屈折が大き
くなることがある。また、３００ ｐｐｍを超えると、
成形時に重合体中の酸化防止剤が分解してガスが発生し
、やはり複屈折が大きくなることがある。If the amount of antioxidant added is less than 50 ppm, the polymer tends to burn during molding, which may increase birefringence. Also, if it exceeds 300 ppm,
During molding, the antioxidant in the polymer decomposes and generates gas, which may also increase birefringence.
使用される紫外線吸収剤としては、例えば、フェニルサ
リシレート、ｐ−Ｌ−プチルフェニルサリシレート等の
サリチル酸系紫外線吸収剤、２゜４−ジヒドロキシベン
ゾフェノン、２−ヒドロキシ−４−メトキシベンゾフェ
ノン等のベンゾフェノン系紫外線吸収剤、２− （２’
−ヒドロキシ−５′−メチルフェニル）ベンゾトリアゾ
ール、２−（２′−ヒドロキシ−５′−ｔ−ブチルフェ
ニル）ベンゾトリアゾール等のベンゾトリアゾール系紫
外線吸収剤等が挙げられる。紫外線吸収剤の添加量は、
重合体に対し１００〜５００ｐｐｏ＋とすることが好ま
しい。１ＯＯｐｐｎ未満では効果が不十分であり、５０
０ ｐｐｍ＋を超えると、添加剤のブリードなどによる
品質の低下を招くことがある。Examples of the UV absorbers used include salicylic acid UV absorbers such as phenyl salicylate and p-L-butylphenyl salicylate, and benzophenone UV absorbers such as 2°4-dihydroxybenzophenone and 2-hydroxy-4-methoxybenzophenone. agent, 2- (2'
Examples include benzotriazole ultraviolet absorbers such as -hydroxy-5'-methylphenyl)benzotriazole and 2-(2'-hydroxy-5'-t-butylphenyl)benzotriazole. The amount of UV absorber added is
It is preferable to set it as 100-500 ppo+ with respect to a polymer. If it is less than 1OOppn, the effect is insufficient, and 50
If it exceeds 0 ppm+, quality may deteriorate due to additive bleeding.
使用される帯電防止剤としては、例えば、ポリオキシエ
チレンアルキルアミン、ポリオキシエチレンアルキルア
ミド等の非イオン系帯電防止剤、アルキルスルホネート
、アルキルベンゼンスルホネート等のアニオン系帯電防
止剤、第４級アンモニウムクロライド、第４級アンモニ
ウムサルフェート等のカチオン系帯電防止剤、アルキル
ベタイン型、アルキルイミダシリン型等の両性帯電防止
剤等が挙げられる。帯電防止剤の添加量は、重合体に対
し、１００〜５，０ＯＯｐｐ−とすることが好ましい、
１ＯＯｐｐｎ未満では効果が不十分であり、５．０ＯＯ
ｐｐｎを超えると添加剤のブリードなどによる品質の低
下を招くことがある。Examples of the antistatic agent used include nonionic antistatic agents such as polyoxyethylene alkylamine and polyoxyethylene alkylamide, anionic antistatic agents such as alkyl sulfonate and alkylbenzene sulfonate, quaternary ammonium chloride, Examples include cationic antistatic agents such as quaternary ammonium sulfate, and amphoteric antistatic agents such as alkyl betaine type and alkylimidacilline type. The amount of antistatic agent added is preferably 100 to 5,000pp- to the polymer.
If it is less than 1OOppn, the effect is insufficient, and if it is 5.0OOppn, the effect is insufficient.
If it exceeds ppn, quality may deteriorate due to bleeding of additives.
使用される滑剤としては、脂肪族系炭化水素、高級脂肪
族系アルコール、脂肪酸アマイド系、金属石鹸系、脂肪
酸エステル系などの滑剤が挙げられる。滑剤の添加量は
、重合体に対し、５０〜５００ρｐＨとすることが好ま
しい、５０ｐｐｍ未満では効果が不十分であり、５ＯＯ
ｐｐｍを超えると、添加剤のブリードなどによる品質の
低下を招くことがある。Examples of the lubricant used include aliphatic hydrocarbon, higher aliphatic alcohol, fatty acid amide, metal soap, and fatty acid ester lubricants. The amount of lubricant added is preferably 50 to 500 ρpH to the polymer; less than 50 ppm is insufficiently effective;
If it exceeds ppm, quality may deteriorate due to bleeding of additives.
使用される着色剤としては、プラスチックの着色に使用
される通常の着色剤を使用することができる。As the colorant used, common colorants used for coloring plastics can be used.
さらに、本発明の重合体には、成形に際し、さらに他の
成分、例えば着色や透明性の劣化を防止するための亜リ
ン酸エステル類、メルトインデックス値を増大させるた
めの可塑剤等を添加することができる。Furthermore, other components such as phosphite esters to prevent coloring and deterioration of transparency, and plasticizers to increase the melt index value are added to the polymer of the present invention during molding. be able to.
また、可塑剤としては、例えば２−エチルへキシルフタ
レート、ｎ−ブチルフタレート、イソデシルフタレート
、トリデシルフタレート、ヘプチルフタレート、ノニル
フタレート等のアルキルフタレート類、２−エチルへキ
シルアジペート、２−エチルへキシルセバケート等の二
塩基酸のアルキルエステル類、リン酸トリブチル、リン
酸トリオクチル、リン酸トリクレジル、リン酸トリフェ
ニル等のリン酸アルキルエステル類、エポキシ化オレイ
ン酸オクチル、エポキシ化オレイン酸ブチル等のエポキ
シ化脂肪酸エステル類、あるいはポリエステル形可塑剤
、塩素化脂肪酸エステル類などが挙げられる。可塑剤の
添加量は、重合体に対し、１００〜１０．ＯＯＯｐｐｍ
とすることが好ましい。１００ ｐｐ＋ａ未満では効果
が不十分であり、１０．０００を超えると、添加剤のブ
リードによる品質の低下を招くことがある。Examples of plasticizers include alkyl phthalates such as 2-ethylhexyl phthalate, n-butyl phthalate, isodecyl phthalate, tridecyl phthalate, heptyl phthalate, and nonyl phthalate, 2-ethylhexyl adipate, and 2-ethyl phthalate. Alkyl esters of dibasic acids such as xyl sebacate, phosphoric acid alkyl esters such as tributyl phosphate, trioctyl phosphate, tricresyl phosphate, triphenyl phosphate, etc., epoxidation of epoxidized octyl oleate, epoxidized butyl oleate, etc. Examples include fatty acid esters, polyester plasticizers, and chlorinated fatty acid esters. The amount of plasticizer added is 100 to 10. OOOppm
It is preferable that If it is less than 100 pp+a, the effect is insufficient, and if it exceeds 10,000, quality may deteriorate due to additive bleeding.
本発明の光ディスク基板は前記したポリカーボネート樹
脂又はポリホルマール樹脂を特定な条件、すなわち、特
定の樹脂温度及び金型温度で射出成形して得ることがで
きる。The optical disk substrate of the present invention can be obtained by injection molding the above-mentioned polycarbonate resin or polyformal resin under specific conditions, that is, specific resin temperature and mold temperature.
まず、樹脂温度はポリカーボネート樹脂の場合は３４０
〜４３０℃１好ましくは３５０〜４２０℃であり、ポリ
ホルマール樹脂の場合、３２０〜４２０℃１好ましくは
３４０〜４１０℃である。First, the resin temperature is 340 for polycarbonate resin.
-430°C, preferably 350-420°C, and in the case of polyformal resin, 320-420°C, preferably 340-410°C.
樹脂温度が各樹脂について、所定の温度より低いと樹脂
の溶融が不十分となり、流動性が低下する結果、光学的
歪みを生じたり、樹脂の充填が不完全となり、転写性に
問題を生ずる。また樹脂温度が所定温度を超えると樹脂
の分解によって分子量が低下し、シルバーストリークを
生じたり、黄変などの着色が生じ成形品の透明性を損な
うことがある。If the resin temperature is lower than a predetermined temperature for each resin, the melting of the resin will be insufficient, resulting in decreased fluidity, resulting in optical distortion, incomplete filling of the resin, and problems with transferability. Furthermore, when the resin temperature exceeds a predetermined temperature, the molecular weight decreases due to decomposition of the resin, which may cause silver streaks or coloring such as yellowing, which may impair the transparency of the molded product.
次に、金型温度はポリカーボネート樹脂の場合、１２０
〜２００℃１好ましくは１３０〜１７０℃であり、ポリ
ホルマール樹脂の場合、１１０〜１８０℃５好ましくは
１２０〜１６０℃である。金型温度が各樹脂について、
所定の温度より低いと残留応力のため複屈折が生じやす
く、また金型温度が所定温度を超えると成形品に変形を
生ずる。Next, the mold temperature is 120°C in the case of polycarbonate resin.
~200°C, preferably 130 to 170°C, and in the case of polyformal resins, 110 to 180°C, preferably 120 to 160°C. The mold temperature for each resin is
If the temperature is lower than a predetermined temperature, birefringence is likely to occur due to residual stress, and if the mold temperature exceeds a predetermined temperature, the molded product will be deformed.
なお、金型温度とは金型表面の温度を意味する。Note that the mold temperature means the temperature of the mold surface.
以下、本発明を実施例に基づいて詳細に説明するが、本
発明はこれに限定されるものではない。Hereinafter, the present invention will be explained in detail based on Examples, but the present invention is not limited thereto.
製造例１
モノマーとして４．４′−ジヒドロキシテトラフェニル
メタン２００ｇ（０，５７モル）を２．ＯＮの水酸化ナ
トリウム水溶液１，５００ｍに溶解し、塩化メチレン６
３０ ｒｒｄｌを加え、激しく攪拌しながらホスゲンガ
スを１ 、 ３００ ｍｌ／ ｍｉｎの割合で吹き込ん
だ。ｐＨが１０になった時点でホスゲンの供給を止め、
静置し、クロロホーメート末端を有する重合度２〜１０
のオリゴマーの塩化メチレン溶液を得た。Production Example 1 200 g (0.57 mol) of 4,4'-dihydroxytetraphenylmethane was added as a monomer. Dissolved in 1,500 m of sodium hydroxide aqueous solution of ON, methylene chloride 6
30 rrdl was added, and phosgene gas was blown in at a rate of 1.300 ml/min while stirring vigorously. Stop the phosgene supply when the pH reaches 10,
When left standing, the degree of polymerization with chloroformate ends is 2 to 10.
A methylene chloride solution of the oligomer was obtained.
この操作をくり返して得られたオリゴマーの塩化メチレ
ン溶液３，５００ｔｄを塩化メチレン１゜０００ｄで希
釈し、新たに４，４′−ジヒドロキシテトラフェニルメ
タン１２０ｇを２．ＯＮの水酸化ナトリウム水溶液１，
５００ｄに溶解した水溶液、ｐ−ＬｅｒＬ−ブチルフェ
ノール１６ｇ、）リエチルアミン１．４−を加え、室温
で激しく攪拌し、１時間反応させた。反応終了後、生成
物を塩化メチレン１０１！、で希釈し、水１５！、水５
１．０゜ＯＩＮの塩酸５２、水５！、水５！の順に洗浄
して２０ｆのメタノール中に注入し、重合体を析出させ
て回収した。ここで得られた重合体の還元粘度７７５１
）／Ｃ（塩化メチレン、０．５ｇ／ｄ、２０’ｃ ）は
０．３８ｄｌ／ｇであった。また’Ｈ−ＮＭＲ分析、赤
外線吸収スペクトル分析の結果より、この重合体は下記
の繰り返し単位を有することが認められた。By repeating this operation, 3,500 td of a methylene chloride solution of the oligomer obtained was diluted with 1.000 d of methylene chloride, and 120 g of 4,4'-dihydroxytetraphenylmethane was added to 2. ON sodium hydroxide aqueous solution 1,
An aqueous solution dissolved in 500d, 16g of p-LerL-butylphenol, and 1.4-ethylamine were added, and the mixture was vigorously stirred at room temperature and allowed to react for 1 hour. After the reaction is completed, the product is converted into methylene chloride 101! , diluted with water 15! , water 5
1.0°OIN hydrochloric acid 52, water 5! , water 5! The polymer was washed in this order and poured into 20f of methanol to precipitate and collect the polymer. Reduced viscosity of the polymer obtained here: 7751
)/C (methylene chloride, 0.5 g/d, 20'c) was 0.38 dl/g. Furthermore, from the results of 'H-NMR analysis and infrared absorption spectrum analysis, it was confirmed that this polymer had the following repeating units.
製造例２
製造例１において新たに後添加した４、４′ジヒドロキ
シテトラフ工ニルメタン１２０ｇの代わりに４．４′−
ジヒドロキシテトラフェニルメタン６０ｇ及び２．２−
ビス（４−ヒドロキシフェニル）プロパン３９ｇを用い
たほかは製造例１と同様にして、ポリカーボネート共重
合体を得た。Production Example 2 Instead of 120 g of 4,4' dihydroxytetraphenylmethane newly added later in Production Example 1, 4.4'-
60g of dihydroxytetraphenylmethane and 2.2-
A polycarbonate copolymer was obtained in the same manner as in Production Example 1 except that 39 g of bis(4-hydroxyphenyl)propane was used.
このポリカーボネート共重合体の還元粘度ηｓｐ／Ｃは
、０．４０ｄｌ／ｇであった。また’Ｈ−ＮＭＲ分析、
赤外線吸収スペクトル分析の結果より、この重合体は下
記の繰り返し単位を存することが認められた。The reduced viscosity ηsp/C of this polycarbonate copolymer was 0.40 dl/g. Also 'H-NMR analysis,
From the results of infrared absorption spectrum analysis, it was confirmed that this polymer contained the following repeating units.
（実施例１）
製造例１で得られたポリカーボネートをテクノプラス株
式会社製成形機により、樹脂温度４１０℃１金型温度１
７０℃で成形し、厚さ１．２鵬、直径１３０ａ＋＋のデ
ィスク基板を作製し、エリプソメーターにより複屈折を
測定した。その結果を表１に示す。また、このポリカー
ボネートの各物性値を表２に示す。(Example 1) The polycarbonate obtained in Production Example 1 was molded using a molding machine manufactured by Techno Plus Co., Ltd. at a resin temperature of 410°C, a mold temperature of 1.
A disk substrate having a thickness of 1.2 mm and a diameter of 130 mm was prepared by molding at 70° C., and its birefringence was measured using an ellipsometer. The results are shown in Table 1. Further, Table 2 shows each physical property value of this polycarbonate.
（実施例２）
金型温度を１３０℃にした以外は実施例１と同様の操作
を行った。結果を表１に示す。(Example 2) The same operation as in Example 1 was performed except that the mold temperature was 130°C. The results are shown in Table 1.
（実施例３）
製造例２で得られたポリカーボネート共重合体を用いた
以外は、実施例１と同様の操作を行った。(Example 3) The same operation as in Example 1 was performed except that the polycarbonate copolymer obtained in Production Example 2 was used.
結果を表１及び表２に示す。The results are shown in Tables 1 and 2.
（実施例４）
樹脂温度を３５０℃にした以外は実施例１と同様の操作
を行った。結果を表１に示す。(Example 4) The same operation as in Example 1 was performed except that the resin temperature was 350°C. The results are shown in Table 1.
分でなく、成形品に変形が生じた。However, the molded product was deformed.
（比較例４）
金型温度を８０℃にした以外は実施例１と同様の操作を
行った。結果を表１に示す。残留応力のため大きな複屈
折を示した。(Comparative Example 4) The same operation as in Example 1 was performed except that the mold temperature was 80°C. The results are shown in Table 1. It exhibited large birefringence due to residual stress.
（比較例１）
樹脂温度を４４０℃にした以外は実施例１と同様の操作
を行った。得られた成形品はシルバーストリークを生じ
ていた。(Comparative Example 1) The same operation as in Example 1 was performed except that the resin temperature was 440°C. The obtained molded product had silver streaks.
（比較例２）
樹脂温度を３２０℃にした以外は実施例１と同様の操作
を行った。その結果、樹脂の充填が不完全で転写性が悪
かった。(Comparative Example 2) The same operation as in Example 1 was performed except that the resin temperature was 320°C. As a result, resin filling was incomplete and transferability was poor.
（比較例３）
金型温度を２１０℃にした以外は実施例１と同様の操作
を行った。その結果、金型内で固化が十（比較例５）
ビスフェノールＡを原料とするポリカーボネート（還元
粘度７７ｓｐ／ｃ ０．３８ ｄＪｌ／ ｇ ）を用
い、樹脂温度３３０℃１金型温度１１５℃にした以外は
、実施例１と同様の操作を行った。結果を表１及び表２
に示す。(Comparative Example 3) The same operation as in Example 1 was performed except that the mold temperature was 210°C. As a result, solidification in the mold was sufficient (Comparative Example 5) Polycarbonate made from bisphenol A (reduced viscosity 77 sp/c 0.38 dJl/g) was used, and the resin temperature was 330°C and the mold temperature was 115°C. Except for this, the same operation as in Example 1 was performed. The results are shown in Table 1 and Table 2.
Shown below.
（製造例３）
反応器に４．４′−ジヒドロキシテトラフェニルメタン
８８０ｇ（２，５モル）、水酸化ナトリウム２２０ｇ（
５，５モル）、塩化メチレン２５５ｇ（３，０モル）及
び溶媒のＮ−メチルピロリドン２゜５００ｄを入れ、攪
拌下に塩化メチレンの還流温度で４時間反応させた。反
応終了後、生成物を冷却して塩化メチレン１０１！、を
加えて希釈し、ｏ、。(Production Example 3) 880 g (2.5 mol) of 4,4'-dihydroxytetraphenylmethane and 220 g of sodium hydroxide (
5.5 moles), 255 g (3.0 moles) of methylene chloride, and 2.500 d of N-methylpyrrolidone as a solvent were added, and the mixture was reacted for 4 hours at the reflux temperature of methylene chloride while stirring. After the reaction is completed, the product is cooled and the methylene chloride 101! , and dilute by adding o.
１規定の塩酸及び水でそれぞれ洗浄し、有機層を分離し
てメタノール中に注入してポリホルマール樹脂を析出回
収した。ここで得られた重合体の還元粘度ηｓｐ／ｃ（
塩化メチレン、０．５ｇ／ｄｌ．２０℃）は０．３２ｄ
ｌ／ｇであった。また’Ｈ−ＮＭＲ分析の結果より、こ
の重合体は下記の繰り返し単位を有すること認められた
。The organic layer was washed with 1N hydrochloric acid and water, and the organic layer was separated and poured into methanol to precipitate and recover the polyformal resin. The reduced viscosity ηsp/c (
Methylene chloride, 0.5 g/dl. 20℃) is 0.32d
It was l/g. Furthermore, from the results of 'H-NMR analysis, it was confirmed that this polymer had the following repeating units.
（製造例４）
製造例３において４，４′−ジヒドロキシテトラフェニ
ルメタン８８０ｇの代わりに４．４−ジヒドロキシテト
ラフェニルメタン７９２ｇ（２，２５モル）及び２．２
−ビス（４−ヒドロキシフェニル）プロパン５７ｇ（０
，２５モル）ヲ用いたほかは製造例３と同様にして、ポ
リホルマール共重合体を得た。このポリホルマール共重
合体の還元粘度ηＳｐ／ｃは０．３４ｄ１／ｇであった
。また１７（−ＮＭＲ分析の結果より、この重合体は下
記の繰り返し単位を有することが認められた。(Production Example 4) In Production Example 3, instead of 880 g of 4,4'-dihydroxytetraphenylmethane, 792 g (2.25 mol) of 4,4-dihydroxytetraphenylmethane and 2.2
-bis(4-hydroxyphenyl)propane 57g (0
. The reduced viscosity ηSp/c of this polyformal copolymer was 0.34 d1/g. Furthermore, the results of 17(-NMR analysis revealed that this polymer had the following repeating unit.
（実施例５）
製造例３で得られたポリホルマール樹脂をテクノプラス
株式会社製成形機により、樹脂温度４゜０℃、金型温度
１５０℃で成形し、厚さ１．２ｍ。(Example 5) The polyformal resin obtained in Production Example 3 was molded using a molding machine manufactured by Technoplus Co., Ltd. at a resin temperature of 4°0°C and a mold temperature of 150°C, to a thickness of 1.2 m.
直径１３０■のディスク基板を作製し、エリプソメータ
ーにより、複屈折を測定した。その結果を表１に示す、
また、このポリホルマール樹脂の各物性値を表２に示す
。A disk substrate with a diameter of 130 cm was prepared, and its birefringence was measured using an ellipsometer. The results are shown in Table 1.
Further, Table 2 shows each physical property value of this polyformal resin.
（実施例６）
金型温度を１２０ ”Ｃにした以外は実施例５と同様の
操作を行った。結果を表１に示す。(Example 6) The same operation as in Example 5 was performed except that the mold temperature was set to 120''C. The results are shown in Table 1.
（実施例７）
製造例４で得られたポリホルマール共重合体を用いた以
外は実施例５と同様の操作を行った。結果を表１及び表
２に示す。(Example 7) The same operation as in Example 5 was performed except that the polyformal copolymer obtained in Production Example 4 was used. The results are shown in Tables 1 and 2.
（比較例８）
金型温度を１９０“Ｃにした以外は、実施例５と同様の
操作を行った。その結果、金型内で固化が不十分で成形
品に変形が生じた。(Comparative Example 8) The same operation as in Example 5 was performed except that the mold temperature was set to 190"C. As a result, the molded product was deformed due to insufficient solidification in the mold.
（実施例８）
樹脂温度を３４０℃にした以外は、実施例５と同様の操
作を行った。結果を表１に示す。(Example 8) The same operation as in Example 5 was performed except that the resin temperature was 340°C. The results are shown in Table 1.
（比較例６）
樹脂温度を４３０℃にした以外は実施例５と同様の操作
を行った。得られた成形品はシルバーストリークを生じ
ていた。(Comparative Example 6) The same operation as in Example 5 was performed except that the resin temperature was 430°C. The obtained molded product had silver streaks.
（比較例９）
金型温度を１００℃にした以外は実施例５と同様の操作
を行った。結果を表１に示す。残留応力のため大きな複
屈折を示した。(Comparative Example 9) The same operation as in Example 5 was performed except that the mold temperature was 100°C. The results are shown in Table 1. It exhibited large birefringence due to residual stress.
（比較例７）
樹脂温度を３００℃にした以外は実施例５と同様の操作
を行った。その結果、樹脂の充填が不完全で転写性が悪
かった。(Comparative Example 7) The same operation as in Example 5 was performed except that the resin temperature was 300°C. As a result, resin filling was incomplete and transferability was poor.
パ
〔発明の効果〕
本発明により得られた光ディスク基板は、耐熱性、耐湿
性、耐衝撃性に優れるのみならず、複屈折、特に斜め入
射光における複屈折が小さく、光ディスク基板として有
用である。特に、ディジタルオーディオディスク、ディ
ジタルビデオディスク、光メモリ−ディスクなどの光デ
ィスク基板として用いた場合、ディスクに記録された情
報の読み取り感度が高く、エラーの発生が少なく極めて
有用である。[Effects of the Invention] The optical disk substrate obtained by the present invention not only has excellent heat resistance, moisture resistance, and impact resistance, but also has low birefringence, especially birefringence in obliquely incident light, and is useful as an optical disk substrate. . In particular, when used as an optical disk substrate for digital audio disks, digital video disks, optical memory disks, etc., it is extremely useful because it has high sensitivity in reading information recorded on the disk and has few errors.
Claims (1)
かつ塩化メチレンを溶媒とする濃度０．５ｇ／ｄｌの溶
液の２０℃における還元粘度が０．２０〜０．６５ｄｌ
／ｇである重合体を、式中のＸが−ＣＯ−である場合に
は、樹脂温度３４０〜４３０℃、金型温度１２０〜２０
０℃で、式中のＸが−ＣＨ＿２−である場合には樹脂温
度３２０℃〜４２０℃、金型温度１１０〜１８０℃で射
出成形することを特徴とする光ディスク基板の製造法。 ▲数式、化学式、表等があります▼〔 I 〕 （ここでＸは−ＣＯ−又は−ＣＨ＿２−である。）[Claims] 1. Having a repeating unit represented by the following formula [I],
and the reduced viscosity at 20°C of a solution with a concentration of 0.5 g/dl using methylene chloride as a solvent is 0.20 to 0.65 dl.
/g, when X in the formula is -CO-, the resin temperature is 340-430°C, the mold temperature is 120-20°C.
A method for manufacturing an optical disk substrate, characterized in that injection molding is carried out at 0°C, at a resin temperature of 320°C to 420°C, and a mold temperature of 110°C to 180°C, when X in the formula is -CH_2-. ▲There are mathematical formulas, chemical formulas, tables, etc.▼ [I] (Here, X is -CO- or -CH_2-.)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63166029A JPH0216121A (en) | 1988-07-05 | 1988-07-05 | Production of optical disc base |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63166029A JPH0216121A (en) | 1988-07-05 | 1988-07-05 | Production of optical disc base |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0216121A true JPH0216121A (en) | 1990-01-19 |
Family
ID=15823624
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63166029A Pending JPH0216121A (en) | 1988-07-05 | 1988-07-05 | Production of optical disc base |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0216121A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10109950A (en) * | 1996-10-03 | 1998-04-28 | Mitsui Petrochem Ind Ltd | Optical part |
-
1988
- 1988-07-05 JP JP63166029A patent/JPH0216121A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10109950A (en) * | 1996-10-03 | 1998-04-28 | Mitsui Petrochem Ind Ltd | Optical part |
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