JPH02142569U - - Google Patents
Info
- Publication number
- JPH02142569U JPH02142569U JP5019789U JP5019789U JPH02142569U JP H02142569 U JPH02142569 U JP H02142569U JP 5019789 U JP5019789 U JP 5019789U JP 5019789 U JP5019789 U JP 5019789U JP H02142569 U JPH02142569 U JP H02142569U
- Authority
- JP
- Japan
- Prior art keywords
- insulating tape
- leads
- tip
- dummy
- dummy lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004973 liquid crystal related substance Substances 0.000 description 1
Landscapes
- Wire Bonding (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Description
第1図はこの考案のキヤリアテープの正面図、
第2図Aは液晶表示パネルの要部拡大正面図、第
2図Bはキヤリアテープの要部拡大裏面図である
。
1……キヤリアテープ、2……絶縁性テープ、
3……フインガリード、4……ダミーリード、4
a……先端部、10……切欠部。
Figure 1 is a front view of the carrier tape of this invention.
FIG. 2A is an enlarged front view of the main part of the liquid crystal display panel, and FIG. 2B is an enlarged back view of the main part of the carrier tape. 1...Carrier tape, 2...Insulating tape,
3...Finger lead, 4...Dummy lead, 4
a... Tip portion, 10... Notch portion.
Claims (1)
ドが配列形成されるとともに、該フインガリード
の両側にそれぞれ複数のダミーリードが形成され
、且つ該ダミーリードの先端部に対応する部分の
絶縁性テープが除去され前記ダミーリードの先端
部が絶縁性テープから突出されてなることを特徴
とするキヤリアテープ。 A large number of finger leads are arranged and formed on one side edge of the insulating tape, and a plurality of dummy leads are formed on both sides of the finger leads, and a portion of the insulating tape corresponding to the tip of the dummy lead is removed. The carrier tape is characterized in that the tip of the dummy lead protrudes from the insulating tape.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989050197U JPH0749795Y2 (en) | 1989-05-01 | 1989-05-01 | Carrier tape |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989050197U JPH0749795Y2 (en) | 1989-05-01 | 1989-05-01 | Carrier tape |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH02142569U true JPH02142569U (en) | 1990-12-04 |
JPH0749795Y2 JPH0749795Y2 (en) | 1995-11-13 |
Family
ID=31568540
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1989050197U Expired - Lifetime JPH0749795Y2 (en) | 1989-05-01 | 1989-05-01 | Carrier tape |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0749795Y2 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05144889A (en) * | 1991-11-20 | 1993-06-11 | Fujitsu Ltd | Connection method of semiconductor chip mounting film |
JP2006019450A (en) * | 2004-06-30 | 2006-01-19 | Sumitomo Metal Micro Devices Inc | Circuit board and substrate after packaged |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5678569U (en) * | 1979-11-20 | 1981-06-25 | ||
JPS6169161A (en) * | 1984-09-12 | 1986-04-09 | Matsushita Electric Ind Co Ltd | Film lead |
JPS6232551U (en) * | 1985-08-13 | 1987-02-26 |
-
1989
- 1989-05-01 JP JP1989050197U patent/JPH0749795Y2/en not_active Expired - Lifetime
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5678569U (en) * | 1979-11-20 | 1981-06-25 | ||
JPS6169161A (en) * | 1984-09-12 | 1986-04-09 | Matsushita Electric Ind Co Ltd | Film lead |
JPS6232551U (en) * | 1985-08-13 | 1987-02-26 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05144889A (en) * | 1991-11-20 | 1993-06-11 | Fujitsu Ltd | Connection method of semiconductor chip mounting film |
JP2006019450A (en) * | 2004-06-30 | 2006-01-19 | Sumitomo Metal Micro Devices Inc | Circuit board and substrate after packaged |
Also Published As
Publication number | Publication date |
---|---|
JPH0749795Y2 (en) | 1995-11-13 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
EXPY | Cancellation because of completion of term |