JPH0213818B2 - - Google Patents

Info

Publication number
JPH0213818B2
JPH0213818B2 JP57119866A JP11986682A JPH0213818B2 JP H0213818 B2 JPH0213818 B2 JP H0213818B2 JP 57119866 A JP57119866 A JP 57119866A JP 11986682 A JP11986682 A JP 11986682A JP H0213818 B2 JPH0213818 B2 JP H0213818B2
Authority
JP
Japan
Prior art keywords
bonding
wire
lever
moving coil
cam
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP57119866A
Other languages
Japanese (ja)
Other versions
JPS5911636A (en
Inventor
Hideaki Myoshi
Masaaki Hoshama
Tadashi Takano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kaijo Denki Co Ltd
Original Assignee
Kaijo Denki Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kaijo Denki Co Ltd filed Critical Kaijo Denki Co Ltd
Priority to JP57119866A priority Critical patent/JPS5911636A/en
Publication of JPS5911636A publication Critical patent/JPS5911636A/en
Publication of JPH0213818B2 publication Critical patent/JPH0213818B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/787—Means for aligning
    • H01L2224/78733—Magnetic holding means
    • H01L2224/78734—Magnetic holding means in the lower part of the bonding apparatus, e.g. in the apparatus chuck
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus

Description

【発明の詳細な説明】 本発明は、ICペレツトとリードの間などにワ
イヤを懸け渡すボンデイング装置に関するもので
ある。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a bonding device for hanging a wire between an IC pellet and a lead.

ICチツプのパツドとリードとの間のボンデイ
ングを行なうには、ボンデイング装置のボンデイ
ングアームの先端に設けられたボンデイングツー
ル（例えば金線用のボールボンデイング用のキヤ
ピラリー、或いはアルミニウム線用のステツチボ
ンデイング用のウエツジ）にてワイヤを保持して
対象物であるパツド又はリードの表面に接触せし
めかつボンデイングツールにてワイヤの一部を押
しつぶして、熱圧縮により圧着するか超音波の作
用で溶着しめる。 To bond between the pads and leads of an IC chip, use a bonding tool (for example, a capillary for ball bonding of gold wire, or a stitch bonding tool for aluminum wire) installed at the tip of the bonding arm of the bonding device. The wire is held with a wedge) and brought into contact with the surface of the target pad or lead, a part of the wire is crushed with a bonding tool, and the wire is crimped by thermal compression or welded by the action of ultrasonic waves.

この種のボンデイング装置の従来の例を第１図
に示す。１０は超音波で振動子であり、フレーム
１１上にピン１２により揺動可能に支えられてい
る。１３はホーンであり、先端にキヤピラリー１
が設けられボンデイングアームの作用も有してい
る。振動子１０の他端にはレバー１４が設けら
れ、その端部に設けられたローラ１５がカム１６
と接触するようにバネ１７により反時計方向のモ
ーメントを受けている。１８はワイヤ２のリール
であり、１９はワイヤ２を握持してカツトするた
めのクランプ、２０はボールを引き上げてキヤピ
ラリー１の下端７に接触せしめるためのハーフク
ランプ。２１はボール３（第２図）を作るための
トーチであり、垂直軸２２のまわりに回動し得る
ようになつている。２３は位置検出装置であり、
ペレツト４及び各パツド５（第２図）の標準位置
からのズレを検出する。このズレの検出値に応じ
てフレーム１１又はペレツト４を水平面にＸ又は
Ｙ方向に移動せしめてキヤピラリー１とペレツト
４のパツド５との間の相対位置を調整し整合を行
なう。 A conventional example of this type of bonding apparatus is shown in FIG. Reference numeral 10 denotes an ultrasonic vibrator, which is supported on a frame 11 by pins 12 so as to be swingable. 13 is a horn, with capillary 1 at the tip.
is provided and also functions as a bonding arm. A lever 14 is provided at the other end of the vibrator 10, and a roller 15 provided at the end is connected to a cam 16.
A counterclockwise moment is applied by the spring 17 so as to make contact with. 18 is a reel for the wire 2; 19 is a clamp for gripping and cutting the wire 2; and 20 is a half clamp for pulling up the ball and bringing it into contact with the lower end 7 of the capillary 1. 21 is a torch for making the ball 3 (FIG. 2), and is rotatable around a vertical axis 22. 23 is a position detection device;
The deviation of the pellet 4 and each pad 5 (FIG. 2) from the standard position is detected. Depending on the detected value of this deviation, the frame 11 or the pellet 4 is moved horizontally in the X or Y direction to adjust the relative position between the capillary 1 and the pad 5 of the pellet 4 for alignment.

ボンデイングに当たつては、パルスモータなど
によりカム１６を回転せしめることにより、カム
１６の形状に応じてキヤピラリー１が昇降し、同
時に、フレーム１１を水平面内に所定の方向に所
定の距離を移動せしめながら、次の如くボンデイ
ング作業を行なう。 During bonding, by rotating the cam 16 using a pulse motor or the like, the capillary 1 is moved up and down according to the shape of the cam 16, and at the same time, the frame 11 is moved a predetermined distance in a predetermined direction in a horizontal plane. While doing so, perform the bonding work as follows.

第２図に示す如くキヤピラリー１を用い、ワイ
ヤ２の先端に形成したボール３をICペレツト４
のパツド５にボンデイングする場合につき説明す
る。６はパツド５と接続すべきリードである。 As shown in Fig. 2, using a capillary 1, a ball 3 formed at the tip of a wire 2 is inserted into an IC pellet 4.
The case of bonding to the pad 5 will be explained. 6 is a lead to be connected to pad 5.

先ず、フレーム１１をＸ、Ｙ方向に移動せし
め、同図ａの如くパツド５の直上の或る高さにキ
ヤピラリー１を位置せしめる。このときワイヤ２
の先端にはボール３が形成されている。t0はキヤ
ピラリー１の下端７から突出した部分のボール３
の高さである。次にキヤピラリー１を下降せしめ
て同図ｂの如くボール３をパツド５に接触せしめ
る。その後ローラ１５はカム１６から離れるが、
バネ１７の力により、さらにキヤピラリー１を押
し下げてボール３をつぶし、同図ｃの如く扁平部
８を形成する。この押しつぶしと同時に超音波振
動又は加熱を与える。t1は押しつぶし量、t2は扁
平部８の厚さである。この押しつぶし動作により
ワイヤ２をパツド５に固着せしめるに必要な押付
力を与え、また、扁平部８が形成されて電気的接
触に十分な接触面積が確保される。その後キヤピ
ラリー１を上昇及び水平方向にも移動せしめ、同
図ｄの如く、ボンドすべきリード６の上方に位置
せしめ、二点鎖線の如くキヤピラリー１を下降せ
しめて下端７によりワイヤ２の一部を押しつぶ
し、扁平部９を形成して超音波或いは加熱を併用
してリード６に固定せしめ、ワイヤ２を引いて扁
平部９の端から切断し、その後キヤピラリー１を
上昇せしめて一回のボンデイングを終了する。そ
の後ワイヤ２の先端にトーチによりボール３を形
成し、第２図ａの状態に戻り、次のボンデイング
を行なう。t′0はワイヤ２の直径、t′1は押しつぶ
し量、t′2は扁平部９の厚さである。 First, the frame 11 is moved in the X and Y directions, and the capillary 1 is positioned at a certain height directly above the pad 5, as shown in FIG. At this time wire 2
A ball 3 is formed at the tip. t 0 is the ball 3 that protrudes from the lower end 7 of the capillary 1
It is the height of Next, the capillary 1 is lowered to bring the ball 3 into contact with the pad 5 as shown in FIG. After that, the roller 15 separates from the cam 16, but
The force of the spring 17 further pushes down the capillary 1 and crushes the ball 3, forming a flat portion 8 as shown in FIG. At the same time as this crushing, ultrasonic vibration or heating is applied. t 1 is the amount of crushing, and t 2 is the thickness of the flat portion 8. This squeezing action provides a pressing force necessary to fix the wire 2 to the pad 5, and also forms a flat portion 8 to ensure a sufficient contact area for electrical contact. Thereafter, the capillary 1 is moved upward and horizontally to position it above the lead 6 to be bonded, as shown in FIG. Crush it to form a flat part 9, fix it to the lead 6 using ultrasonic waves or heating, pull the wire 2 and cut it from the end of the flat part 9, and then raise the capillary 1 to complete one bonding. do. Thereafter, a ball 3 is formed at the tip of the wire 2 with a torch, and the state shown in FIG. 2a is returned to perform the next bonding. t′ 0 is the diameter of the wire 2, t′ 1 is the amount of compression, and t′ 2 is the thickness of the flat portion 9.

以上の如きキヤピラリーボンデイングの他の、
例えばウエツジボンデイング（Al線に用いられ
る）の場合でも、押付力及び接触面積を得るため
にワイヤ２の一部の押しつぶしを行なう。 In addition to the above capillary bonding,
For example, even in the case of wedge bonding (used for Al wire), a portion of the wire 2 is crushed in order to obtain pressing force and contact area.

しかして、カム１６によるキヤピラリー１の昇
降運動のうち、例えば第２図ａの如く、ボール３
が下降してパツド５に近付いて来る場合、或る高
さまでは高速下降を行ない、所定の高さになり、
パツド５に近接すると低速下降としてボール３が
パツド５に接触するときの衝撃を防ぐようにす
る。また、同図ｃからｄの状態に移る場合には高
速上昇を行なう。このように高速下降又は高速上
昇を行なう場合、ボンデイングアームを構成する
ホーン１３やレバー１４などの部分の質量、慣性
モーメントにより追従の遅れ、オーバーランハン
テイング、振動等を生じ、正確な精度の高いつぶ
し工程を遂行するボンデイングを行なうことが困
難であつた。また、ハンテイングなどを防止する
ためにバネ１７を強くすると、バネ１７によるボ
ールの押つぶしの際の押付力が大き過ぎて適正な
押付力が得られないなどの支障を招いた。 Therefore, during the vertical movement of the capillary 1 by the cam 16, for example, as shown in FIG.
When it descends and approaches pad 5, it descends at high speed until it reaches a certain height, and then
When approaching the pad 5, the ball 3 descends at a low speed to prevent impact when the ball 3 contacts the pad 5. Furthermore, when moving from state c to state d in the figure, a high-speed rise is performed. When descending or ascending at high speed in this way, the mass and moment of inertia of parts such as the horn 13 and lever 14 that make up the bonding arm may cause tracking delays, overrun hunting, vibrations, etc. It was difficult to perform bonding to accomplish the crushing process. Furthermore, if the spring 17 is made stronger to prevent hunting, etc., the pressing force applied by the spring 17 when crushing the ball is too large, resulting in problems such as an inability to obtain an appropriate pressing force.

本発明は従来のものの上記の欠点を除き、ハン
テイングなどの不安定な作動を抑制し、精度の高
い安定したボンデイング作業を行ない、また、押
付力を任意の大きさに、かつ任意の時点で調節す
ることができ、信頼性の高いボンデイング作業を
可能とするボンデイング装置を提供することを目
的とするものである。 The present invention eliminates the above-mentioned drawbacks of the conventional ones, suppresses unstable operations such as hunting, performs highly accurate and stable bonding work, and adjusts the pressing force to any size and at any time. It is an object of the present invention to provide a bonding apparatus that enables highly reliable bonding work.

本発明は、支承フレーム１１に対し揺動可能に
支えられたレバー１４と、該レバー１４に固定さ
れた振動子１０及びーン１３とからなるボンデイ
ングアームの先端にボンデイングツールのキヤピ
ラリー１を備え、前記ボンデイングアームと前記
支承フレームとの間の相対的関係を電磁ソレノイ
ドにより拘束するようにしたボンデイング装置に
おいて、前記レバー１４の一端をローラ１５を介
して回転カム１６に従動自在に接触させ、支持用
フレームに固定したブラケツト２５にムービング
コイル２７を設け、該ムービングコイル２７に嵌
挿する強磁性体の挿入体２８をレバー１４に備え
ると共に、該レバー１４に当接する調節ネジ２６
を前記ブラケツト２５に突没自在に配備したこと
を特徴とするボンデイング装置である。 The present invention includes a capillary 1 of a bonding tool at the tip of a bonding arm consisting of a lever 14 supported swingably on a support frame 11, and a vibrator 10 and a horn 13 fixed to the lever 14. In the bonding device in which the relative relationship between the bonding arm and the support frame is restrained by an electromagnetic solenoid, one end of the lever 14 is brought into contact with the rotary cam 16 via a roller 15 so as to be freely driven, and the support frame is A moving coil 27 is provided on a bracket 25 fixed to the frame, and the lever 14 is provided with a ferromagnetic insert 28 that fits into the moving coil 27, and an adjustment screw 26 that abuts on the lever 14.
This is a bonding device characterized in that a bracket is provided in the bracket 25 so as to be freely protrusive and retractable.

本発明を実施例につき図面を用いて説明すれ
ば、第３図において、振動子１０及びホーン１３
にて形成されるボンデイングアームはレバー１４
に保持されて支承フレームであるフレーム１１に
対し、ピン１２のまわりに回動可能に支えられ、
その先端にボンデイングツールであるキヤピラリ
ー１を備えている。カム１６をパルスモータ又は
エンコーダを用いたモータ（図示せず）などによ
り駆動してローラ１５、レバー１４を介してボン
デイングアームの先のキヤピラリー１を昇降せし
めるようになつている。 To explain the present invention with reference to the drawings, in FIG. 3, a vibrator 10 and a horn 13 are shown.
The bonding arm formed by lever 14
It is supported rotatably around a pin 12 with respect to a frame 11 which is a support frame and is held in
A capillary 1, which is a bonding tool, is provided at its tip. The cam 16 is driven by a pulse motor or a motor using an encoder (not shown) to raise and lower the capillary 1 at the end of the bonding arm via the roller 15 and lever 14.

２４はフレーム１１と一体の支持フレームであ
り、これに固定されたブラケツト２５には、調節
ネジ２６、ムービングコイル２７、が取付けられ
ている。調節ネジ２６は、キヤピラリー１の最低
位置を調節し設定するストツパーである。ムービ
ングコイル２７に対応して、レバー１４には鋼な
どの強磁性体で作られた挿入体２８が設けられ、
ムービングコイル２７の中に一部挿入された状態
で組合されている。ムービングコイル２７は、電
圧が印加されると挿入体２８を介してレバー１４
を反時計方向に回転せしめようとするモーメント
を与えている。即ち、キヤピラリー１を常に下に
向けて押付ける向きの力を与えている。カム１６
とローラ１５が接触している間はその相互押付力
をムービングコイル２７にて与え、カム１６とロ
ーラ１５とが離れているときには、ボール３（第
２図）をつぶす押付力をムービングコイル２７に
て与えている。ムービングコイル２７は、このよ
うにしてボンデイングアームと支承フレームとの
間の相対的な回転を拘束する力を与えており、か
つ、この拘束力は印加電圧を変えることによつて
任意の時点で任意の大きさに調節することができ
る。従つて高速上昇又は高速降下時は強い拘束力
を与えてハンテイングなどを防止して速応性があ
り安定した作業を行ない、ボール３を押しつぶす
際には適度な押付力となして良好なボンデイング
作業を行なうことができる。 Reference numeral 24 denotes a support frame integral with the frame 11, and an adjustment screw 26 and a moving coil 27 are attached to a bracket 25 fixed to the support frame. The adjustment screw 26 is a stopper for adjusting and setting the lowest position of the capillary 1. Corresponding to the moving coil 27, the lever 14 is provided with an insert 28 made of a ferromagnetic material such as steel,
It is assembled with a portion inserted into the moving coil 27. Moving coil 27 moves lever 14 through insert 28 when voltage is applied.
It gives a moment that tries to rotate it counterclockwise. In other words, a force is applied that always pushes the capillary 1 downward. cam 16
While the cam 16 and the roller 15 are in contact with each other, the moving coil 27 applies a mutual pressing force, and when the cam 16 and the roller 15 are separated, the moving coil 27 applies a pressing force that crushes the ball 3 (Fig. 2). I'm giving it to you. The moving coil 27 thus provides a force that restrains the relative rotation between the bonding arm and the support frame, and this restraining force can be changed at any time by changing the applied voltage. The size can be adjusted. Therefore, when ascending or descending at high speed, a strong restraining force is applied to prevent hunting and the like, resulting in quick response and stable work, and when crushing the ball 3, an appropriate pressing force is applied to ensure good bonding work. can be done.

第２図ａの如き状態からボール３が下降して同
図ｂの如くボール３がパツド５にタツチしたあと
も、カム１６は回転して半径が一層減少するが、
キヤピラリー１の下降は一時停止するのでローラ
１５はカム１６から離れる。従つてカム１６とロ
ーラ１５との接触を導通などにより検出するタツ
チセンサ回路を備え、ボール３がパツド５にタツ
チしたことを検出する。 Even after the ball 3 descends from the state shown in Figure 2a and touches the pad 5 as shown in Figure 2b, the cam 16 rotates and the radius further decreases;
Since the lowering of the capillary 1 is temporarily stopped, the roller 15 separates from the cam 16. Therefore, a touch sensor circuit is provided which detects the contact between the cam 16 and the roller 15 by conduction or the like, and detects when the ball 3 touches the pad 5.

２９，３０はそれぞれクランプ１９、ハーフク
ランプ２０を操作するカムであり、それぞれパル
スモータ（図示せず）で駆動される。３１はワイ
ヤガイドである。 Cams 29 and 30 operate the clamp 19 and half clamp 20, respectively, and are driven by pulse motors (not shown). 31 is a wire guide.

導電材料により作られたワイヤガイド３２，３
３、接触棒３４，３５、空気噴出のノズル３６に
よりワイヤの繰り出し量検出機構が形成されてい
る。ワイヤ２は、リール１８からモータ５５によ
り繰り出される。繰り出し量が多すぎる場合、ノ
ズル３６から空気を噴射するとワイヤガイド３２
と３３との間のワイヤがたるんで接触棒３４，３
５の何れかに接触する。接触棒３４又は３５は他
の接触棒（即ち３５又は３４）或いはワイヤガイ
ド３２，３３の何らかと導通があると信号を発
し、たるみを検出し、モータ５５によるワイヤの
繰り出し量の多すぎることを検出しモータ５５を
止めるようになつている。 Wire guides 32, 3 made of conductive material
3. The contact rods 34, 35 and the air jet nozzle 36 form a wire feeding amount detection mechanism. The wire 2 is unwound from the reel 18 by a motor 55. If the amount of feed is too large, air is injected from the nozzle 36 and the wire guide 32
The wire between and 33 becomes slack and the contact rods 34, 3
Touch any of 5. When the contact rod 34 or 35 has conduction with another contact rod (i.e. 35 or 34) or with any of the wire guides 32, 33, it emits a signal, detects slack, and detects that the amount of wire fed out by the motor 55 is too large. It is designed to detect this and stop the motor 55.

第４，５，６図は別の実施例を示す。 Figures 4, 5 and 6 show another embodiment.

水平面内にＸ方向又はＹ方向に移動可能に支え
られているフレーム１１には、支承フレームとし
ての昇降フレーム３７が昇降ガイド３８に沿つて
昇降可能に保持されている。昇降フレーム３７に
はブラケツト３９が取付けられ、昇降フレーム３
７との間に渡したピン１２により保持具４０を介
して、ボンデイングアームを形成する振動子１
０、ホーン１３が回動可能に支えられている。ホ
ーン１３の先端にはボンデイングツールとしてウ
エツジ４１が設けられている。 An elevating frame 37 serving as a support frame is held in the frame 11, which is supported movably in the X direction or the Y direction in a horizontal plane, so as to be movable up and down along an elevating guide 38. A bracket 39 is attached to the lifting frame 37, and the lifting frame 3
The vibrator 1 forms a bonding arm via the holder 40 with the pin 12 passed between the vibrator 1 and the
0, the horn 13 is rotatably supported. A wedge 41 is provided at the tip of the horn 13 as a bonding tool.

昇降ガイド３８の裏側には昇降用のパルスモー
タ４２が備えられている。パルスモータ４２の軸
端には確動カムとして一定直径カム４３が備えら
れている。一定直径カム４３は、中心４４は輪か
くに対して偏心しているが、中心４４を通る直径
はD1＝D2と、どこでも等しくなつているカムで
ある。昇降フレーム３７にはカムローラ４５，４
６が、一定直径カム４３を僅かな予圧により挾む
ように設けられている。従つて一定直径カム４３
が一回転すると昇降フレーム３７は、一定直径カ
ムの最大半径Rmaxと最小半径Rminとの差 △Ｒ＝Rmax−Rmin だけ昇降する。 A pulse motor 42 for lifting and lowering is provided on the back side of the lifting guide 38. A constant diameter cam 43 is provided at the shaft end of the pulse motor 42 as a positive cam. The constant diameter cam 43 is a cam in which the center 44 is eccentric with respect to the hoop, but the diameter passing through the center 44 is equal everywhere, D 1 =D 2 . Cam rollers 45, 4 are mounted on the lifting frame 37.
6 are provided so as to sandwich the constant diameter cam 43 with a slight preload. Therefore constant diameter cam 43
When the cam rotates once, the elevating frame 37 moves up and down by the difference between the maximum radius Rmax and the minimum radius Rmin of the constant diameter cam, ΔR=Rmax-Rmin.

パルスモータ４２の代りにエンコーダ付きの
DCモータを用いてもよい。 With an encoder instead of the pulse motor 42
A DC motor may also be used.

以上の如く、一定直径カム４３を、僅かの予圧
を与えて二個のカムローラ４５，４６にて挾むよ
うに組み合わせたことにより、バツクラツシユは
なく、極めて高い精度でボンデイングツールを昇
降せしめることができる。 As described above, by combining the constant diameter cam 43 with a slight preload and sandwiching it between the two cam rollers 45 and 46, there is no backlash and the bonding tool can be raised and lowered with extremely high precision.

昇降フレーム３７にはブラケツト２５が固定さ
れ、調節ネジ２６、ムービングコイル２７、タツ
チセンサ４７が取付けられている。調節ネジ２６
は、昇降フレーム３７に対するウエツジ４１の最
低位置を調節し設定するストツパーであり、タツ
チセンサ４７の最小隙間を確保する作用も有す
る。ムービングコイル２７に対応して保持具４０
と一体のレバー４８には鋼などの強磁性体で作ら
れた挿入体２８が設けられ、ムービングコイル２
７の中に一部挿入された形で組み合わされてい
る。ムービングコイル２７は電圧が印加されると
挿入体２８を介して保持具４０を反時計方向に回
転せしめようとするモーメントを与え、ウエツジ
４１に常に下に向けて押付ける向きの力を与えて
いる。タツチセンサ４７は相手の対向片４９との
間隔が所定の値を越えると信号を発するようにな
つている。 A bracket 25 is fixed to the lifting frame 37, and an adjustment screw 26, a moving coil 27, and a touch sensor 47 are attached. Adjustment screw 26
is a stopper that adjusts and sets the lowest position of the wedge 41 with respect to the lifting frame 37, and also has the function of ensuring a minimum clearance for the touch sensor 47. A holder 40 corresponding to the moving coil 27
An insert body 28 made of a ferromagnetic material such as steel is provided on the lever 48 which is integrated with the moving coil 2.
It is combined with a part inserted into 7. When a voltage is applied to the moving coil 27, the moving coil 27 applies a moment through the insert 28 to rotate the holder 40 counterclockwise, and provides a force that constantly presses the wedge 41 downward. . The touch sensor 47 is designed to issue a signal when the distance between it and the opposing piece 49 exceeds a predetermined value.

ムービングコイル２７が挿入体２８を引付ける
拘束力は、印加する電圧によつて調節することが
できる。 The restraining force with which the moving coil 27 attracts the insert 28 can be adjusted by the applied voltage.

作動に当たつて、ウエツジ４１がペレツト４の
パツド５に近付くまでは昇降フレーム３７は急速
下降を行なう。このとき、ボンデイングアームが
各部の質量、慣性モーメントなどにより動揺しな
いよう、ムービングコイル２７の拘束力を強力と
なし、動揺を防ぐ。 In operation, the lifting frame 37 rapidly descends until the wedge 41 approaches the pad 5 of the pellet 4. At this time, the binding force of the moving coil 27 is made strong to prevent the bonding arm from swaying due to the mass of each part, moment of inertia, etc.

ウエツジ４１がパツド５に近接し、ウエツジ４
１の下側に保持されているワイヤ２がパツド５に
接触する直前に速度を切換えて低速降下となす。 The wedge 41 is close to the pad 5, and the wedge 4
Immediately before the wire 2 held under the wire 1 contacts the pad 5, the speed is changed to a low speed descent.

このとき、ムービングコイル２７の印加電圧を
小となして拘束力を低下せしめる。 At this time, the voltage applied to the moving coil 27 is reduced to reduce the binding force.

この状態で昇降フレーム３７を降下させるとウ
エツジ４１の下側のワイヤ２がパツド５と接触す
る。さらに昇降フレーム３７を降下させようとす
ると、ウエツジ４１はパツド５からの反力により
停止し、保持具４０はムービングコイル２７から
の拘束力にさからつて時計方向に回転しようとす
る。このときタツチセンサ４７は対向片４９から
離れるので、これを検出して、ワイヤ２とパツド
５との接触を検出する。 When the elevating frame 37 is lowered in this state, the wire 2 on the lower side of the wedge 41 comes into contact with the pad 5. When the elevating frame 37 is further lowered, the wedge 41 stops due to the reaction force from the pad 5, and the holder 40 attempts to rotate clockwise against the restraining force from the moving coil 27. At this time, the touch sensor 47 separates from the facing piece 49, so this is detected and the contact between the wire 2 and the pad 5 is detected.

その後さらに昇降フレーム３７を降下せしめる
に従いムービングコイル２７の拘束力は増大し、
ウエツジ４１によりワイヤ２が押つぶされてゆ
く。昇降フレーム３７が停止した後も、ムービン
グコイル２７の拘束力によりワイヤ２に押付力が
かけられている。ワイヤ２がパツド５に接触した
時点から超音波の振動を与え、溶着を行なう。 Thereafter, as the elevating frame 37 is further lowered, the restraining force of the moving coil 27 increases.
The wire 2 is crushed by the wedge 41. Even after the elevating frame 37 has stopped, a pressing force is applied to the wire 2 due to the restraining force of the moving coil 27. From the moment the wire 2 contacts the pad 5, ultrasonic vibrations are applied to perform welding.

溶着が完了した後ウエツジ４１を急速上昇せし
める。このとき、再びムービングコイル２７の拘
束力を強め、ボンデイングアームの動揺を防ぐ。 After welding is completed, the wedge 41 is quickly raised. At this time, the binding force of the moving coil 27 is strengthened again to prevent the bonding arm from shaking.

このように、支承フレームである昇降フレーム
３７に対するボンデイングアーム（振動子１０、
ホーン１３）の相対的回転はムービングコイル２
７により拘束され、その拘束は任意の時点で任意
の大きさに容易に調節できるので、高速上昇、降
下時には拘束力を大となしてハンテイングなどの
不安定動作を抑制し、精度の高い安定した動作を
行ない、ワイヤがボールを押しつぶす時には適度
な押付力を与えて良好なボンデイングを行なうこ
とが可能となる。 In this way, the bonding arm (vibrator 10,
The relative rotation of the horn 13) is controlled by the moving coil 2.
7, and the restraint can be easily adjusted to any size at any time, so the restraining force is increased during high-speed ascents and descents, suppressing unstable movements such as hunting, and providing highly accurate and stable When the wire presses the ball during operation, it is possible to apply an appropriate pressing force and perform good bonding.

５０はワイヤクランプであり、ソレノイド５１
により開閉し、かつガイド５２に沿つて、パルス
モータ（図示せず）により矢印５３の方向に往復
するようになつており、開閉及び往復動作の組み
合わせでワイヤ２をフイードするようになつてい
る。５４はワイヤガイドである。 50 is a wire clamp, and a solenoid 51
The wire 2 is opened and closed by the guide 52 and reciprocated along the guide 52 in the direction of an arrow 53 by a pulse motor (not shown), and the wire 2 is fed by a combination of the opening/closing and reciprocating movements. 54 is a wire guide.

ワイヤガイド３２，３３、接触棒３４，３５、
圧縮空気噴出のノズル３６とにより前述の実施例
と同様なワイヤ繰り出し量検出機構が形成され
る。 Wire guides 32, 33, contact rods 34, 35,
The compressed air jet nozzle 36 forms a wire feed-out amount detection mechanism similar to the previous embodiment.

本発明は、支持用フレームに固定したブラケツ
トにムービングコイルを設け、該ムービングコイ
ルに嵌挿する強磁性体の挿入体をレバーに備える
と共に、該レバーに当接する調節ネジを前記ブラ
ケツトに突没自在に配備したことにより、ボンデ
イングアームの動きを調節ネジで任意に規制して
キヤピラリーの最低位置を設定できるので、作業
性を大幅に向上し、しかもボンデイングアームの
動揺を防ぎ、ムービングコイルの拘束力増減をボ
ンデイングアームに安全に与え不安定動作がなく
てボンデイング作業を適確にし、著しく精度の高
い作業が可能であるし、ボンデイングアームの回
転に対する拘束力を任意の時点に、任意の大きさ
に選択して設定することができ、高速運転時も振
動を起こさず、追従遅れやオーバーランも抑制
し、かつワイヤの溶着時における押付力を適度に
選び、信頼性の高いボンデイングを行なうことが
できるボンデイング装置を提供することができ、
実用上極めて大なる効果を奏する。 In the present invention, a moving coil is provided on a bracket fixed to a support frame, a lever is provided with a ferromagnetic insert that fits into the moving coil, and an adjustment screw that abuts the lever can be protruded and retracted into the bracket. By installing the bonding arm in the position, the movement of the bonding arm can be arbitrarily regulated using the adjustment screw and the lowest position of the capillary can be set, which greatly improves work efficiency, prevents movement of the bonding arm, and increases or decreases the binding force of the moving coil. The bonding arm can be safely applied to the bonding arm without unstable movement, and the bonding work can be performed accurately.The restraining force against the rotation of the bonding arm can be selected at any time and to any size. A bonding system that does not cause vibration even during high-speed operation, suppresses follow-up delays and overruns, and allows for highly reliable bonding by appropriately selecting the pressing force when welding the wire. can provide equipment,
It has a great practical effect.

【図面の簡単な説明】[Brief explanation of drawings]

第１図は従来のボンデイング装置の正面図、第
２図ａ，ｂ，ｃ，ｄはボンデイングの工程説明
図、第３図は本発明の実施例の正面図、第４図は
別の実施例の正面図、第５図はその−線断面
図、第６図は第５図の−線断面図である。 １…キヤピラリー、２…ワイヤ、３…ボール、
４…ペレツト、５…パツド、６…リード、７…下
端、８…扁平部、９…扁平部、１０…振動子、１
１…フレーム、１２…ピン、１３…ホーン、１４
…レバー、１５…ローラ、１６…カム、１７…バ
ネ、１８…リール、１９…クランプ、２０…ハー
フクランプ、２１…トーチ、２２…垂直軸、２３
…位置検出装置、２４…支持フレーム、２５…ブ
ラケツト、２６…調節ネジ、２７…ムービングコ
イル、２８…挿入体、２９，３０…カム、３１，
３２，３３…ワイヤガイド、３４，３５…接触
棒、３６…ノズル、３７…昇降フレーム、３８…
昇降ガイド、３９…ブラケツト、４０…保持具、
４１…ウエツジ、４２…パルスモータ、４３…一
定直径カム、４４…中心、４５，４６…カムロー
ラ、４７…タツチセンサ、４８…レバー、４９…
対向片、５０…ワイヤクランプ、５１…ソレノイ
ド、５２…ガイド、５３…矢印、５４…ワイヤガ
イド、５５…モータ。 Fig. 1 is a front view of a conventional bonding device, Fig. 2 a, b, c, and d are explanatory diagrams of the bonding process, Fig. 3 is a front view of an embodiment of the present invention, and Fig. 4 is another embodiment. FIG. 5 is a sectional view taken along the line ``-'', and FIG. 6 is a sectional view taken along the line ``--'' in FIG. 1... Capillary, 2... Wire, 3... Ball,
4... Pellet, 5... Pad, 6... Lead, 7... Lower end, 8... Flat part, 9... Flat part, 10... Vibrator, 1
1... Frame, 12... Pin, 13... Horn, 14
...Lever, 15...Roller, 16...Cam, 17...Spring, 18...Reel, 19...Clamp, 20...Half clamp, 21...Torch, 22...Vertical axis, 23
...Position detection device, 24...Support frame, 25...Bracket, 26...Adjustment screw, 27...Moving coil, 28...Insert, 29, 30...Cam, 31,
32, 33... Wire guide, 34, 35... Contact rod, 36... Nozzle, 37... Lifting frame, 38...
Lifting guide, 39...bracket, 40...holding tool,
41... wedge, 42... pulse motor, 43... constant diameter cam, 44... center, 45, 46... cam roller, 47... touch sensor, 48... lever, 49...
Opposing piece, 50... wire clamp, 51... solenoid, 52... guide, 53... arrow, 54... wire guide, 55... motor.

Claims (1)

【特許請求の範囲】[Claims] １ 支承フレーム１１に対し揺動可能に支えられ
たレバー１４と、該レバー１４に固定された振動
子１０及びホーン１３とからなるボンデイングア
ームの先端にボンデインググツールのキヤピラリ
ー１を備え、前記ボンデイングアームと前記支承
フレームとの間の相対的関係を電磁ソレノイドに
より拘束するようにしたボンデイング装置におい
て、前記レバー１４の一端をローラ１５を介して
回転カム１６に従動自在に接触させ、支持用フレ
ームに固定したブラケツト２５にムービングコイ
ル２７を設け、該ムービングコイル２７に嵌挿す
る強磁性体の挿入体２８をレバー１４に備えると
共に、該レバー１４に当接する調節ネジ２６を前
記ブラケツト２５に突没自在に配備したことを特
徴とするボンデイング装置。1. The capillary 1 of a bonding tool is provided at the tip of a bonding arm consisting of a lever 14 supported swingably on a support frame 11, a vibrator 10 and a horn 13 fixed to the lever 14, and the bonding arm In a bonding device in which the relative relationship between the lever 14 and the supporting frame is restrained by an electromagnetic solenoid, one end of the lever 14 is brought into contact with the rotary cam 16 via a roller 15 so as to be able to move freely, and is fixed to the supporting frame. A moving coil 27 is provided on the bracket 25, and the lever 14 is provided with a ferromagnetic insert 28 that is inserted into the moving coil 27, and an adjustment screw 26 that comes into contact with the lever 14 can be freely projected into and retracted from the bracket 25. A bonding device characterized by being deployed.
JP57119866A 1982-07-12 1982-07-12 Bonding device Granted JPS5911636A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57119866A JPS5911636A (en) 1982-07-12 1982-07-12 Bonding device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57119866A JPS5911636A (en) 1982-07-12 1982-07-12 Bonding device

Publications (2)

Publication Number Publication Date
JPS5911636A JPS5911636A (en) 1984-01-21
JPH0213818B2 true JPH0213818B2 (en) 1990-04-05

Family

ID=14772201

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57119866A Granted JPS5911636A (en) 1982-07-12 1982-07-12 Bonding device

Country Status (1)

Country Link
JP (1) JPS5911636A (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60235432A (en) * 1984-05-09 1985-11-22 Toshiba Corp Wire bonding apparatus
JPS63155627A (en) * 1986-12-18 1988-06-28 Mitsubishi Electric Corp Wire-bonding system
JP3022613B2 (en) * 1991-02-27 2000-03-21 株式会社カイジョー Wire bonding equipment

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5214352A (en) * 1975-07-25 1977-02-03 Hitachi Ltd Equipment for wirebonding
JPS5345970A (en) * 1976-10-07 1978-04-25 Tesu Kk Apparatus for bonding
JPS5615631A (en) * 1979-07-14 1981-02-14 Nakajima Seisakusho Poultry breeding apparatus using low height container

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5214352A (en) * 1975-07-25 1977-02-03 Hitachi Ltd Equipment for wirebonding
JPS5345970A (en) * 1976-10-07 1978-04-25 Tesu Kk Apparatus for bonding
JPS5615631A (en) * 1979-07-14 1981-02-14 Nakajima Seisakusho Poultry breeding apparatus using low height container

Also Published As

Publication number Publication date
JPS5911636A (en) 1984-01-21

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