JPH0213772U - - Google Patents

Info

Publication number
JPH0213772U
JPH0213772U JP9194988U JP9194988U JPH0213772U JP H0213772 U JPH0213772 U JP H0213772U JP 9194988 U JP9194988 U JP 9194988U JP 9194988 U JP9194988 U JP 9194988U JP H0213772 U JPH0213772 U JP H0213772U
Authority
JP
Japan
Prior art keywords
pad
lead
view
printed wiring
wiring board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9194988U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP9194988U priority Critical patent/JPH0213772U/ja
Publication of JPH0213772U publication Critical patent/JPH0213772U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本考案に係るプリント配線板の一実施
例の要部を示す斜視図、第2図は第1図の正面図
、第3図は本考案の他の実施例の要部を示す斜視
図、第4図は第3図の正面図、第5図、第9図、
第12図はそれぞれ基板に実装される電子部品を
示す平面図、第6図、第10図、第13図はそれ
ぞれ第5図、第9図、第12図に示す電子部品を
基板に実装する方式を示す断面図、第7図、第8
図はそれぞれ第6図の要部を示す拡大断面図、第
11図、第14図はそれぞれ第10図、第13図
の要部を示す拡大断面図、第15図、第16図は
それぞれリードをパツドから取り外す手段を示す
斜視図である。 2……基板(プリント配線板)、3……パツド
、5,9……リード、8……フラツトパツケージ
IC(電子部品)、3a,3b……凹部。
Fig. 1 is a perspective view showing the main parts of one embodiment of the printed wiring board according to the present invention, Fig. 2 is a front view of Fig. 1, and Fig. 3 shows the main parts of another embodiment of the invention. A perspective view, FIG. 4 is a front view of FIG. 3, FIG. 5, FIG. 9,
Fig. 12 is a plan view showing the electronic components mounted on the board, and Figs. 6, 10, and 13 show the electronic components shown in Figs. 5, 9, and 12, respectively, mounted on the board. Cross-sectional diagrams showing the method, Figures 7 and 8
The figures are enlarged sectional views showing the main parts of Fig. 6, Figs. 11 and 14 are enlarged sectional views showing the main parts of Figs. 10 and 13, respectively, and Figs. 15 and 16 are lead FIG. 3 is a perspective view showing means for removing the pad from the pad. 2... Substrate (printed wiring board), 3... Pad, 5, 9... Lead, 8... Flat package IC (electronic component), 3a, 3b... Recess.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 電子部品のリードが半田付けされるパツドが表
面に設けられたプリント配線板において、前記パ
ツドの表面の前記リードが当接する半田付け接触
部に凹部を形成したことを特徴とするプリント配
線板。
1. A printed wiring board having a pad on its surface to which a lead of an electronic component is soldered, characterized in that a recess is formed in a soldering contact portion of the surface of the pad where the lead comes into contact.
JP9194988U 1988-07-13 1988-07-13 Pending JPH0213772U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9194988U JPH0213772U (en) 1988-07-13 1988-07-13

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9194988U JPH0213772U (en) 1988-07-13 1988-07-13

Publications (1)

Publication Number Publication Date
JPH0213772U true JPH0213772U (en) 1990-01-29

Family

ID=31316406

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9194988U Pending JPH0213772U (en) 1988-07-13 1988-07-13

Country Status (1)

Country Link
JP (1) JPH0213772U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05172186A (en) * 1991-05-10 1993-07-09 Bayerische Motoren Werke Ag Torsional vibration damper for motive power unit gearing
JPH09232737A (en) * 1996-02-28 1997-09-05 Hitachi Aic Inc Printed-wiring board

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05172186A (en) * 1991-05-10 1993-07-09 Bayerische Motoren Werke Ag Torsional vibration damper for motive power unit gearing
JPH09232737A (en) * 1996-02-28 1997-09-05 Hitachi Aic Inc Printed-wiring board

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