JPH0213769U - - Google Patents
Info
- Publication number
- JPH0213769U JPH0213769U JP9222388U JP9222388U JPH0213769U JP H0213769 U JPH0213769 U JP H0213769U JP 9222388 U JP9222388 U JP 9222388U JP 9222388 U JP9222388 U JP 9222388U JP H0213769 U JPH0213769 U JP H0213769U
- Authority
- JP
- Japan
- Prior art keywords
- printed board
- electrode pattern
- tank
- gold
- gold plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007747 plating Methods 0.000 claims description 7
- 239000010931 gold Substances 0.000 claims description 5
- 229910052737 gold Inorganic materials 0.000 claims description 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 2
- 238000000034 method Methods 0.000 claims 1
- 229910052759 nickel Inorganic materials 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 3
Landscapes
- Electroplating Methods And Accessories (AREA)
- Manufacturing Of Printed Wiring (AREA)
Description
第１図は本考案に係る自動メツキラインの構成
図、第２図は本考案に係る装置の一実施例の要部
の構成図、第３図はプリント板の構成図である。
１……金メツキ槽、２……プリント板、２１…
…コネクタ用パターン、２２……電極パターン、
４……搬送機、４３……移送用モータ、４４……
掴部、４５ａ，４５ｂ，４５ｃ……シリンダ、５
１……電極パターン掴部、５１ａ，５１ｂ……ワ
イヤブラシよりなる腕、５２……シリンダ。
FIG. 1 is a block diagram of an automatic plating line according to the present invention, FIG. 2 is a block diagram of essential parts of an embodiment of the apparatus according to the present invention, and FIG. 3 is a block diagram of a printed board. 1...Gold plating tank, 2...Printed board, 21...
...Connector pattern, 22... Electrode pattern,
4... Conveyor, 43... Transfer motor, 44...
Gripping portion, 45a, 45b, 45c...Cylinder, 5
1... Electrode pattern gripping part, 51a, 51b... Arms made of wire brushes, 52... Cylinder.
Claims (1)
ネクタ用バターンに接続された電極パターンが形
成されたプリント板、 金メツキラインに沿つてモータにより移動する
部材に設けられたエアシリンダによつて上下方向
及び前後方向に駆動されると共に、前記プリント
板を掴んで次の工程の槽にそのプリント板を搬送
する複数個の搬送機、 シリンダによつて駆動され前記金メツキライン
に於けるニツケルメツキ槽及び金メツキ槽に夫々
対応して配置され、前記プリント板における電極
パターン部分を掴かむ一対のワイヤブラシで構成
されメツキ電流を供給する電極パターン掴部より
なり、 前記プリント板において金メツキ後、電極パタ
ーンを含む不要部分を切断するように構成したこ
とを特徴とするプリント板の金メツキ装置。[Scope of claim for utility model registration] A connector pattern to be plated with gold, a printed board with an electrode pattern connected to the connector pattern, and an air cylinder provided on a member that is moved by a motor along the gold plating line. a plurality of conveyors that are driven by cylinders in the vertical and longitudinal directions, and that grip the printed boards and transport them to the tank for the next process; The electrode pattern gripping section is arranged corresponding to the nickel plating tank and the gold plating tank, respectively, and is composed of a pair of wire brushes that grip the electrode pattern portion of the printed board and supplies a plating current, A printed board gold plating device, characterized in that it is configured to cut off unnecessary parts including electrode patterns.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9222388U JPH0726865Y2 (en) | 1988-07-12 | 1988-07-12 | Printed circuit board gold plating equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9222388U JPH0726865Y2 (en) | 1988-07-12 | 1988-07-12 | Printed circuit board gold plating equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0213769U true JPH0213769U (en) | 1990-01-29 |
| JPH0726865Y2 JPH0726865Y2 (en) | 1995-06-14 |
Family
ID=31316676
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9222388U Expired - Lifetime JPH0726865Y2 (en) | 1988-07-12 | 1988-07-12 | Printed circuit board gold plating equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0726865Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2019210540A (en) * | 2018-06-08 | 2019-12-12 | 深▲せん▼市創智成功科技有限公司 | Electroplating apparatus |
-
1988
- 1988-07-12 JP JP9222388U patent/JPH0726865Y2/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2019210540A (en) * | 2018-06-08 | 2019-12-12 | 深▲せん▼市創智成功科技有限公司 | Electroplating apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0726865Y2 (en) | 1995-06-14 |