JPH02132970U - - Google Patents
Info
- Publication number
- JPH02132970U JPH02132970U JP4277889U JP4277889U JPH02132970U JP H02132970 U JPH02132970 U JP H02132970U JP 4277889 U JP4277889 U JP 4277889U JP 4277889 U JP4277889 U JP 4277889U JP H02132970 U JPH02132970 U JP H02132970U
- Authority
- JP
- Japan
- Prior art keywords
- recesses
- printed circuit
- engaged
- circuit board
- soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
Landscapes
- Combinations Of Printed Boards (AREA)
Description
第１図は本考案の一実施例を示す分解斜視図、
第２図は従来例の分解斜視図、第３図は正面図、
第４図は接続部品の斜視図、第５図は本考案の一
実施例を示す正面図である。
１……第１のプリント基板、２……第２のプリ
ント基板、３……第３のプリント基板、７……凹
所、８……凸部、９……銅箔、１０……はんだ付
部。
FIG. 1 is an exploded perspective view showing an embodiment of the present invention;
Figure 2 is an exploded perspective view of the conventional example, Figure 3 is a front view,
FIG. 4 is a perspective view of the connecting parts, and FIG. 5 is a front view showing one embodiment of the present invention. DESCRIPTION OF SYMBOLS 1... First printed circuit board, 2... Second printed circuit board, 3... Third printed circuit board, 7... Recess, 8... Convex part, 9... Copper foil, 10... Soldering Department.
Claims (1)
る少なくとも３枚のプリント基板が、その平面が
相互に直交するように前記凹凸部にて係合され、
当該係合部がはんだ付によつて機械的、電気的に
接続固定されるプリント基板の組立体。 At least three printed circuit boards having recesses and recesses formed on their joint sides that can be engaged with each other are engaged at the recesses and recesses so that their planes are perpendicular to each other,
A printed circuit board assembly in which the engaging portion is mechanically and electrically connected and fixed by soldering.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4277889U JPH02132970U (en) | 1989-04-11 | 1989-04-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4277889U JPH02132970U (en) | 1989-04-11 | 1989-04-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02132970U true JPH02132970U (en) | 1990-11-05 |
Family
ID=31554615
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4277889U Pending JPH02132970U (en) | 1989-04-11 | 1989-04-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02132970U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018032780A (en) * | 2016-08-25 | 2018-03-01 | 田淵電機株式会社 | Substrate set and sub-substrate for fixation |
| JP2020025012A (en) * | 2018-08-07 | 2020-02-13 | タイコエレクトロニクスジャパン合同会社 | Terminal-equipped circuit board and circuit board assembly |
-
1989
- 1989-04-11 JP JP4277889U patent/JPH02132970U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018032780A (en) * | 2016-08-25 | 2018-03-01 | 田淵電機株式会社 | Substrate set and sub-substrate for fixation |
| JP2020025012A (en) * | 2018-08-07 | 2020-02-13 | タイコエレクトロニクスジャパン合同会社 | Terminal-equipped circuit board and circuit board assembly |
| CN112655282A (en) * | 2018-08-07 | 2021-04-13 | 泰科电子日本合同会社 | Circuit board with terminal and circuit board assembly |