JPH02126585A - Heat roll and its manufacture - Google Patents
Heat roll and its manufactureInfo
- Publication number
- JPH02126585A JPH02126585A JP27937988A JP27937988A JPH02126585A JP H02126585 A JPH02126585 A JP H02126585A JP 27937988 A JP27937988 A JP 27937988A JP 27937988 A JP27937988 A JP 27937988A JP H02126585 A JPH02126585 A JP H02126585A
- Authority
- JP
- Japan
- Prior art keywords
- roll
- layer
- coating layer
- metal
- resistance circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 5
- 229910052751 metal Inorganic materials 0.000 claims abstract description 33
- 239000002184 metal Substances 0.000 claims abstract description 33
- 238000007747 plating Methods 0.000 claims abstract description 24
- 239000010410 layer Substances 0.000 claims description 33
- 239000011247 coating layer Substances 0.000 claims description 32
- 239000011521 glass Substances 0.000 claims description 11
- 230000002093 peripheral effect Effects 0.000 claims description 10
- 239000000853 adhesive Substances 0.000 claims description 9
- 230000001070 adhesive effect Effects 0.000 claims description 9
- 238000005476 soldering Methods 0.000 claims description 8
- 239000011248 coating agent Substances 0.000 claims description 7
- 238000000576 coating method Methods 0.000 claims description 7
- 238000002844 melting Methods 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 7
- 230000015572 biosynthetic process Effects 0.000 claims description 3
- 238000004070 electrodeposition Methods 0.000 claims description 2
- 238000010304 firing Methods 0.000 claims 1
- 239000002245 particle Substances 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 abstract description 13
- 210000003298 dental enamel Anatomy 0.000 abstract description 6
- 239000000463 material Substances 0.000 abstract description 5
- 229910052759 nickel Inorganic materials 0.000 abstract description 3
- 229910052737 gold Inorganic materials 0.000 abstract 1
- 239000010408 film Substances 0.000 description 8
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 5
- 239000004810 polytetrafluoroethylene Substances 0.000 description 5
- 239000010409 thin film Substances 0.000 description 4
- 239000004809 Teflon Substances 0.000 description 3
- 229920006362 Teflon® Polymers 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 238000004544 sputter deposition Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000007772 electroless plating Methods 0.000 description 2
- 239000012943 hotmelt Substances 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 238000004381 surface treatment Methods 0.000 description 2
- 238000007738 vacuum evaporation Methods 0.000 description 2
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000008151 electrolyte solution Substances 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- KERTUBUCQCSNJU-UHFFFAOYSA-L nickel(2+);disulfamate Chemical compound [Ni+2].NS([O-])(=O)=O.NS([O-])(=O)=O KERTUBUCQCSNJU-UHFFFAOYSA-L 0.000 description 1
- -1 polytetrafluoroethylene Polymers 0.000 description 1
- 239000005871 repellent Substances 0.000 description 1
- 230000002940 repellent Effects 0.000 description 1
- 229910001925 ruthenium oxide Inorganic materials 0.000 description 1
- WOCIAKWEIIZHES-UHFFFAOYSA-N ruthenium(iv) oxide Chemical compound O=[Ru]=O WOCIAKWEIIZHES-UHFFFAOYSA-N 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000007592 spray painting technique Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、起動時の急速昇温性を向−ヒさせた複合型ヒ
ートロールに関する。更に詳しくは給電部の信頼性を向
上させたヒートロールとその製造方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a composite heat roll that improves rapid temperature rise during startup. More specifically, the present invention relates to a heat roll with improved reliability of a power feeding unit and a method of manufacturing the same.
（従来の技術）
現在、電子複写機などには、熱溶融性インクを加熱して
定着させるためにヒートロールが設けられている。(Prior Art) Currently, electronic copying machines and the like are provided with heat rolls for heating and fixing hot-melt ink.
第３図はヒートロールの従来例の一つを示すものでアル
ミニウムバイブ１１の中に、電気熱線ヒータや赤外線ヒ
ータなどの熱源１２を内蔵させるとともに熱伝導性のよ
いアルミニウムパイプの表面にポリテトラフロロエチレ
ン（ＰＴＦＥ）１３などの様な熱溶融性インクに対し非
粘着性の被覆層、を設けた構造となっている。Figure 3 shows one of the conventional heat rolls, in which a heat source 12 such as an electric hot wire heater or an infrared heater is built into an aluminum vibrator 11, and polytetrafluorocarbon is coated on the surface of an aluminum pipe with good thermal conductivity. It has a structure in which a non-adhesive coating layer is provided for heat-melting ink such as ethylene (PTFE) 13.
特開昭５５−７２３９０号公報に記載のヒータも、この
タイプの筒状または棒状ヒータであり、これにはアルミ
ニウムパイプの内部に熱源を外面に搭載した棒状体を配
置する他に、アルミニウムパイプの内面側に発熱抵抗体
を配置し、その内側から例えばガラス基材からなる円柱
状の支持部材を緊密に挿入して、その外周面で発熱抵抗
体を支持するタイプの筒状ヒータも開示されている。The heater described in JP-A-55-72390 is also this type of cylindrical or rod-shaped heater, and in addition to arranging a rod-shaped body inside an aluminum pipe with a heat source mounted on its outer surface, A cylindrical heater of the type in which a heat generating resistor is arranged on the inner surface side and a cylindrical support member made of, for example, a glass base material is tightly inserted from the inside of the heater to support the heat generating resistor on the outer circumferential surface is also disclosed. There is.
該公報にはまた筒状または棒状をなす基体の周面に酸化
ルテニウムなどの抵抗膜を薄膜法（蒸着、スパッタリン
グ）や厚膜法（印刷）により基体画面上に直接塗布した
後、焼成したヒータも開示されている。The publication also describes a heater in which a resistive film such as ruthenium oxide is applied directly onto the peripheral surface of a cylindrical or rod-shaped substrate by a thin film method (evaporation, sputtering) or a thick film method (printing), and then baked. is also disclosed.
また出願人による実願昭６２−１７６６７８号において
も、金属円筒体とその上を覆うガラス質コーティング層
と、該ガラス質コーティング層の表面に搭載された電気
抵抗回路網と、該電気抵抗回路網を覆う熱熱溶性インク
に対して非粘着性の外周コーティング層とを具備した複
合ヒートロールが提案されている。Furthermore, in Utility Model Application No. 176678/1983 filed by the applicant, a metal cylindrical body, a vitreous coating layer covering the metal cylinder, an electrical resistance network mounted on the surface of the vitreous coating layer, and the electrical resistance network are disclosed. A composite heat roll has been proposed that includes a non-adhesive outer peripheral coating layer and a thermofusible ink covering the heat roll.
この電気抵抗回路網はガラス質コーティング層の上に
■厚膜ペーストを希望する抵抗値に合わせて、必要なパ
ターンに塗布し、焼成して形成する。This electrical resistance network is formed by applying a thick film paste on the glassy coating layer in the required pattern according to the desired resistance value, and baking it.
■無電解メッキ法により、銅、ニッケルなどの金属を薄
くコーティングして抵抗体とする。■Using electroless plating, a thin layer of metal such as copper or nickel is coated to create a resistor.
■真空蒸着、スパッタリング、ＣＶＤ法などにより、抵
抗体となる適当な金属を薄膜状にコーティングする。■Coat a suitable metal that will become a resistor in a thin film using vacuum evaporation, sputtering, CVD, etc.
この何れかの方法により形成される。It is formed by any of these methods.
従来方法では、発熱するヒータ一部と、給電する給電部
とは同一の抵抗体膜厚としている。In the conventional method, a portion of the heater that generates heat and a power supply section that supplies power have the same resistor film thickness.
（発明が解決しようとする課題）
従来のように発熱するヒータ一部と、給電する給電部と
を同一の抵抗体膜厚とすると、抵抗体材料の金属の固有
抵抗は比較的小さいため、ヒータ一部の関係より膜厚は
薄くならざるを得ない。(Problem to be solved by the invention) If the heater part that generates heat and the power supply part that supplies electricity have the same resistor film thickness as in the past, the resistor material metal has a relatively small specific resistance, so the heater For some reasons, the film thickness has to be thinner.
このため、給電する給電部で給電リングを半田付けしよ
うとすると膜厚が薄いため半田くわれを生じる。For this reason, when attempting to solder the power supply ring at the power supply section that supplies power, solder cracks occur due to the thin film thickness.
また、ヒータ一部の電気抵抗回路網を覆う熱溶融性イン
クに対し非粘着性のテフロンなどのコーティングを施工
する時、この塗覆層の焼付けは大気中で行われているこ
とから、両端の金属膜の表面が酸化され易いものでは、
半田がつかないという現象を生じる。In addition, when applying a non-adhesive coating such as Teflon to the heat-melting ink that covers the electric resistance circuit network of a part of the heater, this coating layer is baked in the atmosphere, so it is necessary to If the surface of the metal film is easily oxidized,
This causes the phenomenon that solder does not stick.
本発明の目的は、前記課題を解決し、給電部で例えば給
電リングを半田付けする場合、半田くわれや半田はじき
を起すことなく、十分な半田付けが可能なヒートロール
とその製造方法を提供することにある。An object of the present invention is to solve the above-mentioned problems and provide a heat roll and a method for manufacturing the same, which enable sufficient soldering without causing solder creases or solder repellents when soldering, for example, a power supply ring at a power supply unit. It's about doing.
本発明は金属円筒体とその上を覆う結晶化ガラスのコー
ティング層と該結晶化ガラスのコーティング層の表面に
形成された電気抵抗回路層と、該電気抵抗回路層を覆う
熱溶融性インクに対して非粘着性の外周コーティング層
とからなるヒートロールにおいて、該ロールの両端の給
電部の該電気抵抗回路層上に０．１〜２０μｍの厚さの
金属メッキを施してなるヒートロールであり、また給電
リングの半田付は時の半田くわれによる接着不良問題を
なくすと共に、該給電部の金属メッキを、該電気抵抗回
路層を覆う熱溶融性インクに対し非粘着性外周コーティ
ング層を焼付は形成後に行なうことにより、該焼付時の
酸化による給電部の半田付は不良問題を解決したもので
ある。The present invention relates to a metal cylinder, a crystallized glass coating layer covering the metal cylinder, an electrical resistance circuit layer formed on the surface of the crystallized glass coating layer, and a heat-melting ink covering the electrical resistance circuit layer. A heat roll comprising a non-adhesive outer peripheral coating layer, the heat roll having a metal plating with a thickness of 0.1 to 20 μm on the electric resistance circuit layer of the power supply portion at both ends of the roll, In addition, the soldering of the power supply ring eliminates the problem of poor adhesion due to solder cracks during soldering, and the metal plating of the power supply part is baked with a non-adhesive outer coating layer against the heat-melting ink that covers the electrical resistance circuit layer. By performing this after formation, the problem of defective soldering of the power supply section due to oxidation during baking can be solved.
本発明の金属円筒体は、第３図の如ぎ、内部中空の筒状
体ばかりでなく、内部が充実した棒状の円筒形状体をも
含む。The metal cylindrical body of the present invention includes not only a hollow cylindrical body as shown in FIG. 3, but also a rod-shaped cylindrical body with a solid interior.
ガラス質コーティング層は金属円筒体の表面をその金属
の種類に合わせて適宜表面処理を施し、泳動電着法によ
って該金属の熱膨張係数に合わせたガラスフリット（例
えばアルカリフリーの結晶化ガラスフリット材料）をコ
ーティングし、乾燥後に焼成して得られる。The vitreous coating layer is formed by subjecting the surface of the metal cylinder to appropriate surface treatment according to the type of metal, and applying a glass frit (for example, an alkali-free crystallized glass frit material) that matches the thermal expansion coefficient of the metal by electrophoretic electrodeposition. ) is coated, dried and fired.
電気抵抗回路層はガラス質コーティング層の上に例えば
次のいずれかの方法により形成される。The electrical resistance circuit layer is formed on the vitreous coating layer by, for example, any of the following methods.
■ 厚膜ペーストを希望する抵抗値に合わせて必要なパ
ターンに塗布し、焼成して形成する。■ Apply the thick film paste in the required pattern according to the desired resistance value and bake it to form it.
■ 無電解メッキ法により、銅、ニッケルなどの金属を
薄くコーティングして抵抗体とする。■ Using electroless plating, a thin layer of metal such as copper or nickel is coated to create a resistor.
■ 真空蒸着、スパッタリング、ＣＶＤ法などにより、
抵抗体となる適当な金属を薄膜状にコーティングする。■ By vacuum evaporation, sputtering, CVD method, etc.
A suitable metal that will become a resistor is coated in a thin film.
電気抵抗回路層の上に形成する外周の被覆層は、その抵
抗形成用の金属の種類及び／又は被覆材の種類に合わせ
て、必要に応じて適宜表面処理を施した上で形成する。The outer periphery coating layer formed on the electrical resistance circuit layer is formed after performing appropriate surface treatment as necessary depending on the type of metal and/or coating material for forming the resistance.
ロールの両端の給電部は、外周のコーティング層コーテ
ィング時にはマスクして、外周のコーティング層がつか
ないようにする。The power supply parts at both ends of the roll are masked when coating the outer periphery coating layer to prevent the outer periphery coating layer from adhering to them.
ロールの端部を交互に金属メッキ浴中に浸漬して金属メ
ッキを行う。メッキ用金属としてはＮｉ、ＣＬＩ、ＡＱ
、Ａｕなどが適当である。メッキ厚みは０．１〜２０μ
雇の厚さとする。厚さが０．１／ｌ ｍ未満であると給
電リング半田付は時にメッキ層が半田くわれを起こし、
給゛電リングの電気的接続が不完全となる。また２０μ
ｍを超える厚みとするとコスト高となる。Metal plating is performed by dipping the ends of the roll alternately into a metal plating bath. Ni, CLI, AQ as plating metals
, Au, etc. are suitable. Plating thickness is 0.1~20μ
It is assumed that the amount of employment is high. If the thickness is less than 0.1/lm, the plating layer may sometimes cause solder cracks when soldering the power supply ring.
The electrical connection of the power supply ring becomes incomplete. Also 20μ
If the thickness exceeds m, the cost will increase.
以下に、本発明を実施例によって、更に具体的に説明す
るが、本発明は、この実施例に限定されるものではない
。EXAMPLES The present invention will be explained in more detail below with reference to Examples, but the present invention is not limited to these Examples.
第１図は本発明のヒートロールの斜視図である。FIG. 1 is a perspective view of the heat roll of the present invention.
１はヒートロール本体、２はロールの両端部、３は給電
リングを示す。円で囲った内部は、夫々ロール本体部と
両端給電部の表面の断面層を示す。1 is a heat roll body, 2 is both ends of the roll, and 3 is a power supply ring. The inside of the circle indicates the cross-sectional layer of the surface of the roll main body and the both-end power supply parts, respectively.
ロール本体部は基材の金属上にホウロウ層、その上に電
気抵抗回路層、その上に熱溶融性インクに対し非粘着性
の外周コーティング層が被覆されている。両端給電部は
基材の金属上にホウロウ層、その上に電気抵抗回路層、
その上にメッキ層が被覆されている。The roll main body is coated with an enamel layer on a metal base, an electrical resistance circuit layer on top of the enamel layer, and a peripheral coating layer that is non-adhesive to hot-melt ink. The both-end power supply part has an enamel layer on the base metal, an electric resistance circuit layer on top of it,
A plating layer is coated thereon.
このヒートロールは、金属円筒体にガラス質コーティン
グ層（ホウロウ層）と電気抵抗回路層を具備したものに
、熱溶融性インクに対し、非粘着性の外周コーティング
層としてポリテトラフルオロエチレン（ＰＴＦＥ）をス
プレー塗装し４００℃で焼付処理して形成しである。This heat roll has a metal cylindrical body with a glassy coating layer (enamel layer) and an electrical resistance circuit layer, and polytetrafluoroethylene (PTFE) as a non-adhesive outer coating layer for heat-melting ink. It is formed by spray painting and baking at 400°C.
両端部の給電部は、このＰＴＦＥコーティング時にはマ
スクをして、電気抵抗回路層を表面に残しておく。第２
図はメッキ槽の断面立面図である。The power supply sections at both ends are masked during this PTFE coating, leaving the electrical resistance circuit layer on the surface. Second
The figure is a cross-sectional elevational view of the plating tank.
メッキ！！４にスルファミン酸ニッケルの電解液７を入
れ、ロールの端部を図の如く挿入し、陽極を５、ロール
の電気抵抗回路を陰極６として電気Ｎｉメッキを行い、
膜厚１．５μｍのメッキ層を形成した。plating! ! Put electrolytic solution 7 of nickel sulfamate in 4, insert the end of the roll as shown in the figure, perform electrolytic Ni plating with 5 as the anode and the electric resistance circuit of the roll as the cathode 6.
A plating layer with a thickness of 1.5 μm was formed.
第２図において、８はガラスライニング層、９はＮｉメ
ッキ部、１０はＰＴＦＥ （テフロン）のコーティング
層である。In FIG. 2, 8 is a glass lining layer, 9 is a Ni plating part, and 10 is a PTFE (Teflon) coating layer.
このヒートロールの両端Ｎｉメッキ部に給電リングを嵌
合し、半田付けした所、電気抵抗回路部の半田くわれも
なく、半田ぬれ性も良好で、確実な電気接続ができた。When power supply rings were fitted and soldered to the Ni-plated portions at both ends of this heat roll, there were no solder holes in the electrical resistance circuit portion, and the solder wettability was good, resulting in a reliable electrical connection.
本発明のヒートロールは
（１）ロール両端の給電部へ０．１〜２０μｍの厚さに
金属メッキが施されているから給電リング取付において
、電気抵抗回路の半田くわれがなくなり、給電装置取付
が確実にできる。In the heat roll of the present invention, (1) metal plating is applied to the power supply parts at both ends of the roll to a thickness of 0.1 to 20 μm, so there is no need to solder the electrical resistance circuit when installing the power supply ring, and the power supply device can be attached easily. can definitely be done.
（２）０−ル本体は金属円筒体の上にガラス質コーティ
ング層、電気抵抗回路層、外周コーティング層を形成し
ているので、外周コーティング層の表面温度が適温とな
るまでの昇温時間を短縮させることができる。(2) Since the 0-ru main body has a glassy coating layer, an electrical resistance circuit layer, and an outer coating layer formed on a metal cylinder, it takes a long time to raise the temperature until the surface temperature of the outer coating layer reaches the appropriate temperature. It can be shortened.
（３）電気抵抗回路層の熱を、主として外周コーティン
グ層に速やかに伝達できるので、ロール本体の熱膨脹を
少なくして使用時の寸法安定性に優れたものとすること
ができる。(3) Since the heat of the electrical resistance circuit layer can be quickly transferred mainly to the outer peripheral coating layer, thermal expansion of the roll body can be reduced and excellent dimensional stability can be achieved during use.
（４）ロール両端の給電部の電気抵抗回路部の表面に形
成するメッキ層は、ロールの電気抵抗回路層の上に熱溶
融性インクに対し非粘着性のテフロン等の外周コーティ
ング層を焼付は形成後に設けるため外周コーティング層
の焼付の際の両端部表面の酸化がメッキ操作により除去
され半田ぬれ性が向上し、給電リングのロウ付が容易に
確実にできる。(4) For the plating layer formed on the surface of the electrical resistance circuit section of the power supply section at both ends of the roll, a peripheral coating layer such as Teflon, which is non-adhesive to heat-melting ink, is baked onto the electrical resistance circuit layer of the roll. Since it is provided after formation, oxidation on the surfaces of both ends during baking of the outer peripheral coating layer is removed by the plating operation, improving solder wettability and making it possible to easily and reliably braze the power supply ring.
等の優れた効果が得られるものである。Excellent effects such as these can be obtained.
第１図は本発明のヒートロールの斜視図である。
円内はそれぞれの部分の表面層の断面層を拡大して示し
た図である。
第２図は本発明のヒートロールの両端部の給電部のメッ
キ操作に使用するメッキ装置を示した断面立面図である
。
第３図は従来の内部加熱式ヒートロールの断面図を示す
。FIG. 1 is a perspective view of the heat roll of the present invention. The inside of the circle is an enlarged view of the cross-sectional layer of the surface layer of each portion. FIG. 2 is a cross-sectional elevational view showing a plating apparatus used for plating the power supply parts at both ends of the heat roll of the present invention. FIG. 3 shows a cross-sectional view of a conventional internally heated heat roll.
Claims (1)
ング層と、該結晶化ガラスのコーティング層の表面に形
成された電気抵抗回路層と該電気抵抗回路層を覆うコー
ティング層とからなるヒートロールにおいて、該ロール
の両端の給電部の該電気抵抗回路層上に０．１〜２０μ
ｍの厚さの金属メッキを施してなるヒートロール。 ２、金属円筒体に結晶化ガラス粒子を泳動電着にて塗覆
し、焼成して結晶化ガラスの被覆層を形成する工程と該
結晶化ガラス被覆層表面に所望の抵抗回路層を形成する
工程と、該抵抗回路層を形成したロール両端の給電部を
除く該抵抗回路層表面に熱溶融性インクに対して非粘着
性の外周被覆層を塗覆し、焼付ける工程と該外周被覆層
を焼付け形成後ロール両端部に給電リングを半田付けす
る工程とを有するヒートロールの製法に於いて前記の外
周被覆層の焼付け形成後にロール両端部の給電部に０．
１〜２０μｍの厚さに金属メッキを施し、その後給電リ
ングを半田付けすることを特徴とするヒートロールの製
造方法。[Claims] 1. A metal cylinder, a coating layer of crystallized glass covering the metal cylinder, an electrical resistance circuit layer formed on the surface of the coating layer of crystallized glass, and a coating covering the electrical resistance circuit layer. In a heat roll consisting of a layer, a layer of 0.1 to 20 μ
A heat roll made of metal plating with a thickness of m. 2. A step of coating a metal cylinder with crystallized glass particles by electrophoretic electrodeposition and firing to form a crystallized glass coating layer, and a step of forming a desired resistance circuit layer on the surface of the crystallized glass coating layer. and a step of coating and baking a peripheral coating layer that is non-adhesive to heat-melting ink on the surface of the resistive circuit layer except for the power feeding parts at both ends of the roll on which the resistive circuit layer is formed, and baking the peripheral coating layer. In a method for manufacturing a heat roll, which includes the step of soldering power supply rings to both ends of the roll after formation, 0.0% is applied to the power supply parts at both ends of the roll after baking and forming the outer peripheral coating layer.
A method for manufacturing a heat roll, comprising applying metal plating to a thickness of 1 to 20 μm, and then soldering a power supply ring.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27937988A JPH02126585A (en) | 1988-11-07 | 1988-11-07 | Heat roll and its manufacture |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27937988A JPH02126585A (en) | 1988-11-07 | 1988-11-07 | Heat roll and its manufacture |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02126585A true JPH02126585A (en) | 1990-05-15 |
Family
ID=17610323
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP27937988A Pending JPH02126585A (en) | 1988-11-07 | 1988-11-07 | Heat roll and its manufacture |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02126585A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6376816B2 (en) * | 2000-03-03 | 2002-04-23 | Richard P. Cooper | Thin film tubular heater |
| KR100417352B1 (en) * | 1998-12-11 | 2004-03-19 | 주식회사 대우일렉트로닉스 | Drum washing machine |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5848681U (en) * | 1981-09-29 | 1983-04-01 | 三菱重工業株式会社 | underwater hoppa |
| JPS59178471A (en) * | 1983-03-29 | 1984-10-09 | Kyocera Corp | Heat fixing roller |
-
1988
- 1988-11-07 JP JP27937988A patent/JPH02126585A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5848681U (en) * | 1981-09-29 | 1983-04-01 | 三菱重工業株式会社 | underwater hoppa |
| JPS59178471A (en) * | 1983-03-29 | 1984-10-09 | Kyocera Corp | Heat fixing roller |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100417352B1 (en) * | 1998-12-11 | 2004-03-19 | 주식회사 대우일렉트로닉스 | Drum washing machine |
| US6376816B2 (en) * | 2000-03-03 | 2002-04-23 | Richard P. Cooper | Thin film tubular heater |
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