JPH02125900A - Equipment for electrolytically treating local area of surface of metallic material - Google Patents
Equipment for electrolytically treating local area of surface of metallic materialInfo
- Publication number
- JPH02125900A JPH02125900A JP27865688A JP27865688A JPH02125900A JP H02125900 A JPH02125900 A JP H02125900A JP 27865688 A JP27865688 A JP 27865688A JP 27865688 A JP27865688 A JP 27865688A JP H02125900 A JPH02125900 A JP H02125900A
- Authority
- JP
- Japan
- Prior art keywords
- paste
- hollow electrode
- electrode
- metal material
- pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000007769 metal material Substances 0.000 title claims abstract description 31
- 238000011282 treatment Methods 0.000 claims abstract description 44
- 235000011837 pasties Nutrition 0.000 claims abstract description 19
- 239000003792 electrolyte Substances 0.000 claims description 31
- 239000012212 insulator Substances 0.000 claims description 8
- 238000005868 electrolysis reaction Methods 0.000 claims description 2
- 238000002386 leaching Methods 0.000 abstract description 21
- 238000000034 method Methods 0.000 abstract description 8
- 238000004381 surface treatment Methods 0.000 abstract description 6
- 230000001105 regulatory effect Effects 0.000 abstract description 2
- 239000007788 liquid Substances 0.000 abstract 2
- 230000001276 controlling effect Effects 0.000 abstract 1
- 238000007747 plating Methods 0.000 description 21
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 13
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 12
- 229910052751 metal Inorganic materials 0.000 description 12
- 239000002184 metal Substances 0.000 description 12
- 238000005554 pickling Methods 0.000 description 12
- 238000012545 processing Methods 0.000 description 12
- 239000000463 material Substances 0.000 description 11
- 239000002253 acid Substances 0.000 description 8
- 229910000831 Steel Inorganic materials 0.000 description 7
- 239000010935 stainless steel Substances 0.000 description 7
- 229910001220 stainless steel Inorganic materials 0.000 description 7
- 239000010959 steel Substances 0.000 description 7
- 238000004040 coloring Methods 0.000 description 6
- 150000003839 salts Chemical class 0.000 description 6
- 238000003466 welding Methods 0.000 description 6
- 150000007513 acids Chemical class 0.000 description 5
- 229920001495 poly(sodium acrylate) polymer Polymers 0.000 description 5
- NNMHYFLPFNGQFZ-UHFFFAOYSA-M sodium polyacrylate Chemical compound [Na+].[O-]C(=O)C=C NNMHYFLPFNGQFZ-UHFFFAOYSA-M 0.000 description 5
- 239000000243 solution Substances 0.000 description 5
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 4
- 238000005422 blasting Methods 0.000 description 4
- 239000002562 thickening agent Substances 0.000 description 4
- IXPNQXFRVYWDDI-UHFFFAOYSA-N 1-methyl-2,4-dioxo-1,3-diazinane-5-carboximidamide Chemical compound CN1CC(C(N)=N)C(=O)NC1=O IXPNQXFRVYWDDI-UHFFFAOYSA-N 0.000 description 3
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- 238000009713 electroplating Methods 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 239000000835 fiber Substances 0.000 description 3
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 3
- 235000019353 potassium silicate Nutrition 0.000 description 3
- 239000000661 sodium alginate Substances 0.000 description 3
- 235000010413 sodium alginate Nutrition 0.000 description 3
- 229940005550 sodium alginate Drugs 0.000 description 3
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 2
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- 229910021536 Zeolite Inorganic materials 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 description 2
- 239000008119 colloidal silica Substances 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- CMMUKUYEPRGBFB-UHFFFAOYSA-L dichromic acid Chemical compound O[Cr](=O)(=O)O[Cr](O)(=O)=O CMMUKUYEPRGBFB-UHFFFAOYSA-L 0.000 description 2
- HNPSIPDUKPIQMN-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Al]O[Al]=O HNPSIPDUKPIQMN-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- -1 flat plates Chemical compound 0.000 description 2
- AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 description 2
- 238000001802 infusion Methods 0.000 description 2
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229910017604 nitric acid Inorganic materials 0.000 description 2
- 229920001778 nylon Polymers 0.000 description 2
- 238000002161 passivation Methods 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 229910052708 sodium Inorganic materials 0.000 description 2
- 239000011734 sodium Substances 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 239000000230 xanthan gum Substances 0.000 description 2
- 235000010493 xanthan gum Nutrition 0.000 description 2
- 229920001285 xanthan gum Polymers 0.000 description 2
- 229940082509 xanthan gum Drugs 0.000 description 2
- 239000010457 zeolite Substances 0.000 description 2
- BJEPYKJPYRNKOW-REOHCLBHSA-N (S)-malic acid Chemical compound OC(=O)[C@@H](O)CC(O)=O BJEPYKJPYRNKOW-REOHCLBHSA-N 0.000 description 1
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 1
- 229910000851 Alloy steel Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 description 1
- 229910021586 Nickel(II) chloride Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 1
- FEWJPZIEWOKRBE-UHFFFAOYSA-N Tartaric acid Natural products [H+].[H+].[O-]C(=O)C(O)C(O)C([O-])=O FEWJPZIEWOKRBE-UHFFFAOYSA-N 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 241000607479 Yersinia pestis Species 0.000 description 1
- BJEPYKJPYRNKOW-UHFFFAOYSA-N alpha-hydroxysuccinic acid Natural products OC(=O)C(O)CC(O)=O BJEPYKJPYRNKOW-UHFFFAOYSA-N 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 1
- 239000004327 boric acid Substances 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- 239000001913 cellulose Substances 0.000 description 1
- 229920002678 cellulose Polymers 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000008151 electrolyte solution Substances 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 235000019253 formic acid Nutrition 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- 239000001630 malic acid Substances 0.000 description 1
- 235000011090 malic acid Nutrition 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 description 1
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 description 1
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000010865 sewage Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 235000002639 sodium chloride Nutrition 0.000 description 1
- 241000894007 species Species 0.000 description 1
- 239000011975 tartaric acid Substances 0.000 description 1
- 235000002906 tartaric acid Nutrition 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- 239000002759 woven fabric Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/04—Electroplating with moving electrodes
- C25D5/06—Brush or pad plating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/10—Electrodes, e.g. composition, counter electrode
- C25D17/14—Electrodes, e.g. composition, counter electrode for pad-plating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
- C25F3/00—Electrolytic etching or polishing
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
Description
【発明の詳細な説明】
〈産業上の利用分野〉
本発明は、金属材表面あるいは構造物の溶接部などの部
分脱スケール、部分めっきなどを簡便に行う装置に関す
る。DETAILED DESCRIPTION OF THE INVENTION <Field of Industrial Application> The present invention relates to an apparatus that easily performs partial descaling, partial plating, etc. on the surface of a metal material or a welded part of a structure.
〈従来の技術〉
従来、金属材表面あるいは構造物の脱スケール法として
は、電解液を満たした容器を処理部に取り付は通電する
方法、ショツトブラスト、水溶液による酸洗などの方法
が用いられている。<Conventional technology> Conventionally, methods used to descale metal surfaces or structures include attaching a container filled with electrolyte to a processing unit and applying electricity, shot blasting, and pickling with an aqueous solution. ing.
〈発明が解決しようとする課題〉
しかし、前述の電解液を用いた方法の場合、金属表面が
平滑でなかったり、角部や端部であフたりすると、電解
液がこぼれたり流失してしまい処理は困難であった。
また、垂直面、対地面に関しては、なおさら難しかった
。<Problem to be solved by the invention> However, in the case of the method using the electrolyte described above, if the metal surface is not smooth or gets wet at corners or edges, the electrolyte may spill or be washed away. Processing was difficult.
Also, it was even more difficult on the vertical plane and on the ground.
また、ショツトブラストを行なうには、粉塵、騒音の問
題が、また酸洗をするには下水の汚濁等の環境問題等が
あり、なおかつショツトブラストでは表面に加工硬化層
が残在し、機械的性質の低下、処理に長時間か必要など
の問題があった。In addition, shot blasting has problems with dust and noise, and pickling has environmental problems such as sewage pollution.Moreover, shot blasting leaves a work-hardened layer on the surface and is mechanically unstable. There were problems such as deterioration in properties and the need for long processing times.
本発明の目的は、上記従来技術の問題点を解消し、金属
材の部分表面処理技術、特に現場において効率良く、か
つ高品質な種々の局部的処理が可能な、電解処理装置を
提供することにある。It is an object of the present invention to solve the problems of the above-mentioned conventional techniques and to provide a technique for partial surface treatment of metal materials, particularly an electrolytic treatment apparatus capable of performing various local treatments efficiently and with high quality on-site. It is in.
〈課題を解決するための手段〉
すなわち本発明者らは、前記目的を達成するために研究
を重ね、部分表面処理技術において従来処理できなかっ
た溶接部や垂直面、対地面などの部分について、電極形
状およびペーストの適量供給などに工夫を重ね、安定し
た電解電流を確保し、現場において高品質な部分表面処
理を可能にした装置の開発に成功した。<Means for Solving the Problems> In other words, the present inventors have conducted repeated research in order to achieve the above-mentioned object, and have developed a method for welding parts, vertical surfaces, surfaces facing surfaces, etc. that could not be treated conventionally using partial surface treatment technology. By repeatedly devising the electrode shape and supplying the appropriate amount of paste, we succeeded in developing a device that ensures a stable electrolytic current and enables high-quality partial surface treatment on-site.
すなわち、本発明は、複数のペースト状電解液噴出口お
よびペースト状電解液供給口を有する中空電極と、この
中空電極をカバーし、かつ前記ペースト状電解液噴出口
から噴出するペースト状電解液を浸出させるパッドと、
前記中空電極の中空部に前記ペースト状電解液供給口を
経て任意量のペースト状電解液を送給するペースト状電
解液送供給装置と、前記中空電極と表面処理すべき金属
材料との間に通電する電源装置とを有することを特徴と
する金属材表面の局部電解処理装置を提供する。That is, the present invention provides a hollow electrode having a plurality of pasty electrolyte spouts and a pasty electrolyte supply port, and a pasty electrolyte that covers the hollow electrode and spouts out from the pasty electrolyte spouts. a pad to be leached; a pasty electrolyte supply device that supplies an arbitrary amount of pasty electrolyte to the hollow part of the hollow electrode through the pasty electrolyte supply port; and a metal to be surface-treated with the hollow electrode. Provided is an apparatus for local electrolytic treatment of the surface of a metal material, characterized by having a power supply device that conducts current between the material and the material.
そして、前記中空電極の噴出孔の開口量を調節するペー
スト状電解液調整手段を有するのがよい。Further, it is preferable to include a paste electrolyte adjusting means for adjusting the opening amount of the ejection holes of the hollow electrode.
また、前記ペースト状電解液送給装置にペースト状電解
液流量調整手段を付加するのがよい。Further, it is preferable to add a paste electrolyte flow rate adjusting means to the paste electrolyte supply device.
そして、前記中空電極の形状がＬ字形または球形である
のが好ましい。Preferably, the hollow electrode has an L-shape or a spherical shape.
また、前記パッドは、金属材料と接する面が曲面である
のがよい。Further, it is preferable that the pad has a curved surface in contact with the metal material.
そして、前記中空電極とペースト状電解液送給装置とを
絶縁体を介して接続するのが好ましい。Preferably, the hollow electrode and the paste electrolyte supply device are connected via an insulator.
また、前記中空電極の供給口に剛性パイプを接続してな
るのがよい。Further, it is preferable that a rigid pipe is connected to the supply port of the hollow electrode.
最初に本発明の好適実施例に基づき本発明の部分電解処
理装置について説明する。First, the partial electrolytic treatment apparatus of the present invention will be explained based on a preferred embodiment of the present invention.
第１図には溶接部の局部電解処理例を、第３図および第
５図には、被処理材の異なった部位、すなわち垂直、対
地溶接部および円状溶接部における局部電解処理の例を
示す。Figure 1 shows an example of local electrolytic treatment of a weld, and Figures 3 and 5 show examples of local electrolytic treatment of different parts of the material to be treated, namely vertical, ground welds and circular welds. show.
また、第１図、第３図および第５図のように、局部電解
処理をする時に用いる中空電極、パッドの断面をそれぞ
れ第２図、第４図および第６図に示し、順を追って説明
する。In addition, as shown in Figures 1, 3, and 5, cross sections of the hollow electrode and pad used for local electrolytic treatment are shown in Figures 2, 4, and 6, respectively, and will be explained step by step. do.
まず、局部電解処理装置の構成を、第１図を用いて説明
する。First, the configuration of the local electrolytic treatment apparatus will be explained using FIG. 1.
本発明で用いられるペースト状電解液（以下単にペース
トという）は目的とする処理に応して異なるが、電解酸
洗用ペーストとしては、硫酸系、中性塩系などがある。The paste-like electrolytic solution (hereinafter simply referred to as paste) used in the present invention varies depending on the intended treatment, but examples of electrolytic pickling pastes include sulfuric acid-based and neutral salt-based.
めっき用ペーストとしては、通常のめフき溶液、各種金
属塩と酸あるいはアルカリとの混合溶液などのめフぎ種
を含有する溶液を用い、例えばポリアクリル酸ソーダ、
アルギン酸ナトリウム、ザンサンガム等の有機増粘剤お
よび／またはゼオライト、水ガラス、コロイダルシリカ
、コロイダルアルミナ、珪弗化ソーダ等の無機増粘剤な
どを加えてペースト化したものであればどのような方法
で製造されたものでも用いることができる。As the plating paste, solutions containing plating species such as ordinary plating solutions and mixed solutions of various metal salts and acids or alkalis are used, such as sodium polyacrylate,
Any method can be used as long as it is made into a paste by adding organic thickeners such as sodium alginate and xanthan gum and/or inorganic thickeners such as zeolite, water glass, colloidal silica, colloidal alumina, and sodium silicofluoride. Even manufactured ones can be used.
発色用ペーストとしては、力性ソーダ、力性カリ、アン
モニア等のアルカリ、もしくは塩酸、硫酸、硝酸、しゅ
う酸、ぶつ酸、クロム酸、重クロム酸、リン酸、ぎ酸、
酢酸、マロン酸、マレイン酸、リンゴ酸、酒石酸等の酸
、あるいは上記のアルカリもしくは酸の塩類を単独また
は混合した発色用水溶液を用い、たとえばポリアクリル
酸ソーダ、アルギン酸ナトリウム、ザンサンガム等の有
機増粘剤および／またはゼオライト、水ガラス、コロイ
ダルシリカ、コロイダルアルミナ、珪弗化ソーダ等の無
機増粘剤などを加えてペースト化したものであればどの
ような方法で製造されたものでも用いることかできる。Coloring pastes include alkalis such as sodium hydroxide, potassium hydroxide, ammonia, hydrochloric acid, sulfuric acid, nitric acid, oxalic acid, butic acid, chromic acid, dichromic acid, phosphoric acid, formic acid,
Using an aqueous coloring solution containing acids such as acetic acid, malonic acid, maleic acid, malic acid, tartaric acid, or salts of the above alkalis or acids alone or in combination, organic thickeners such as sodium polyacrylate, sodium alginate, xanthan gum, etc. are used. Any paste produced by adding an agent and/or an inorganic thickener such as zeolite, water glass, colloidal silica, colloidal alumina, or sodium silicofluoride can be used. .
エツチング用、加工用ペーストとしては、力性ソーダの
アルカリ、もしくは塩酸、硫酸、硝酸、クロム酸、重ク
ロム酸、ぶつ酸等の酸および／または上記のアルカリも
しくは酸の塩類を単独または混合した物について、その
まままたは水を加えてペースト化されるものは勿論、さ
らにポリアクリル酸ソーダ、あるいは二酸化ケイ素、ア
ルミナ、水ガラス、アルギン酸ソーダの如きペースト化
材を加えて成るペーストであればどのような方法で製造
されたものでも用いることができる。For etching and processing pastes, alkalis such as hydric soda, acids such as hydrochloric acid, sulfuric acid, nitric acid, chromic acid, dichromic acid, butic acid, and/or salts of the above alkalis or acids may be used alone or in combination. Of course, it can be made into a paste as it is or by adding water, or it can be made into a paste by adding a pasting agent such as sodium polyacrylate, silicon dioxide, alumina, water glass, or sodium alginate. Those manufactured by can also be used.
そして、金属材上に部分的に供給しても供給された幅以
上に拡散していくことのないタッキネス、粘度を有する
ものである。 したがって、溶接部、鋼管等の局部的な
部分の加工であっても特に確実にしかも簡単に電解処理
を行うことができる。It also has such tackiness and viscosity that it will not spread beyond the supplied width even if it is partially supplied onto the metal material. Therefore, electrolytic treatment can be carried out particularly reliably and easily even when processing localized parts such as welds and steel pipes.
また、本発明を適用することのできる金属材とは、平板
、カップ、つぼ、皿などのステンレス、チタン、金、銀
、銅のような金属製品、少なくとも表面が金属である積
層製品などおよび溶接部、鋼管等の局部を含め広い範囲
可能である。In addition, metal materials to which the present invention can be applied include metal products such as stainless steel, titanium, gold, silver, and copper such as flat plates, cups, pots, and plates, laminated products with at least a metal surface, and welded products. It is possible to cover a wide range of areas, including local parts of steel pipes, etc.
局部電解に用いられるペーストは、ペースト状電解液送
給装置１のペースト槽２からペースト供給ポンプ３よっ
てバイブ４を伝って供給される。The paste used for local electrolysis is supplied from the paste tank 2 of the paste electrolyte supply device 1 through the vibrator 4 by the paste supply pump 3.
ペーストの流量はバイブ４の途中に設置されたペースト
状電解液渣量調整手段であるペースト流量調節バルブ５
およびペースト供給ポンプ３によって調整され、過剰に
流出されたペーストは、バイパス配管１８を経由してペ
ースト槽２に戻る。The paste flow rate is controlled by a paste flow rate adjustment valve 5 installed in the middle of the vibrator 4, which is a means for adjusting the amount of paste electrolyte residue.
The excess paste adjusted by the paste supply pump 3 returns to the paste tank 2 via the bypass pipe 18.
バイブ４を使って流れ込む必要量のペーストは、接続管
６を経て、後述する中空電極の中にはいりこみ、中空電
極表面のパッド８より浸出される。The necessary amount of paste that flows in using the vibrator 4 passes through the connecting tube 6, enters the hollow electrode described later, and is exuded from the pad 8 on the surface of the hollow electrode.
このとき、パッド８表面と被処理材である金属材９とを
接触させ、電流を流しつつ中空電極と連動するバイブ４
を移動することによって電解処理をすることができる。At this time, the surface of the pad 8 is brought into contact with the metal material 9 that is the material to be treated, and the vibrator 4 is connected to the hollow electrode while applying current.
Electrolytic treatment can be performed by moving the
すなわち図中に示すような２枚の金属材の垂直溶接部
１０のような電解処理しにくい局所部分においても電解
処理することが可能である。In other words, it is possible to perform electrolytic treatment even on localized areas that are difficult to electrolytically treat, such as the vertical weld 10 between two metal materials as shown in the figure.
また、バイブ４と電極間で回転させながら、電解処理を
行ってもよい。 すなわち、接続管６としてロータリー
ジヨイント等を用いてバイブと電極間を接続し、かつペ
ーストをパッド８全体に浸み込ませるようにすればパッ
ド表面を有効に利用することができ、また処理操作も簡
単である。Further, the electrolytic treatment may be performed while rotating between the vibrator 4 and the electrode. In other words, if a rotary joint or the like is used as the connecting tube 6 to connect the vibrator and the electrode, and the paste is soaked into the entire pad 8, the pad surface can be used effectively, and the processing operation can be made more efficient. is also easy.
パッド８の材質としては、電解処理の種類によって異な
るが電解酸洗であれば、例えば、ポリエステル繊維、ガ
ラス繊維、ナイロン繊維、アルミナ繊維などの織布、編
布などの絶縁体等がある。The material of the pad 8 varies depending on the type of electrolytic treatment, but in the case of electrolytic pickling, for example, there are insulators such as woven fabrics such as polyester fibers, glass fibers, nylon fibers, and alumina fibers, and knitted fabrics.
電解めっきの場合には、電解研磨のように比較的硬いパ
ッドは必要ないのでめっきペーストの酸に耐えられるよ
うな、スポンジ状の材質でもよい。 具体的には、ナイ
ロン繊維、ポリエステル繊維等が挙げられる。In the case of electrolytic plating, unlike electrolytic polishing, a relatively hard pad is not required, so a sponge-like material that can withstand the acid of the plating paste may be used. Specific examples include nylon fibers and polyester fibers.
また、発色処理の場合にはセルロース等を用いるのが好
ましいが、目的に応じ前述したものに限定することなく
、好ましいものを選択して用いればよい。Further, in the case of coloring treatment, it is preferable to use cellulose or the like, but the material is not limited to those mentioned above, and any suitable material may be selected and used depending on the purpose.
また、電解処理する際の電源は、電源装置１１より配線
１２をのばし、一方を金属材９に、また一方を中空電極
に取り付ければよく、必要量の電流を渣すことで所望の
電解処理をすることができる。In addition, the power source for electrolytic treatment can be obtained by extending the wiring 12 from the power supply device 11 and attaching one end to the metal material 9 and the other to the hollow electrode, and by drawing the necessary amount of current, the desired electrolytic treatment can be carried out. can do.
このとき配線極性を変えたり、ペーストの適宜な選択を
することにより酸洗、めっき、発色等の処理を自在に行
なうことができる。At this time, by changing the wiring polarity and selecting an appropriate paste, treatments such as pickling, plating, and coloring can be performed freely.
次に第２ａ図において、前記中空電極７内のペースト供
給手段の一構成例を示す。Next, in FIG. 2a, an example of the structure of the paste supply means within the hollow electrode 7 is shown.
前述したようにペーストはペースト状電解液送給装置１
のパイプ４を通り、バイブ４と中空電極７とを連結する
接続管６を経て、ペースト供給口１４より中空電極７中
に入り、中空電極７の有する電極孔１５ａから噴出しパ
ッド８より侵出される。As mentioned above, the paste is supplied to the paste electrolyte supply device 1.
The paste passes through the pipe 4, passes through the connecting pipe 6 that connects the vibrator 4 and the hollow electrode 7, enters the hollow electrode 7 from the paste supply port 14, is ejected from the electrode hole 15a of the hollow electrode 7, and leaks out from the ejection pad 8. It will be done.
さらに第２ａ図ではペーストの浸出量を調整するために
、中空電極７の内部に、図示の例では直管状のペースト
浸出調節手段１３を内接させ、これをペースト浸出調節
ハンドル１６と作動的に連結されている。 そしてペー
スト浸出調節ハンドル１６とペースト浸出調節手段１３
とは相対回転あるいは相対移動により、電極孔１５ａと
ペースト浸出調節手段の孔１５ｂの位置をずらせてそれ
らの間の開口部を調整することによりペーストの浸出量
を調整するように構成されている。Further, in FIG. 2a, in order to adjust the amount of paste leaching, a paste leaching adjustment means 13, which in the illustrated example has a straight tube shape, is inscribed inside the hollow electrode 7, and this is operatively connected to the paste leaching adjustment handle 16. connected. and paste leaching adjustment handle 16 and paste leaching adjustment means 13
By relative rotation or relative movement, the positions of the electrode hole 15a and the hole 15b of the paste leaching adjustment means are shifted to adjust the opening between them, thereby adjusting the amount of paste leaching.
このペースト浸出量を調整する際の具体例を第２ｂ図、
第２Ｃ図および第２ｄ図に示す。A specific example of adjusting the paste leaching amount is shown in Figure 2b.
This is shown in Figures 2C and 2d.
すなわち、第２ｂ図は、中空電極７およびペースト浸出
調節手段１３の噴出口１５を最大にしたものの一例であ
る。 この中空電極７およびペースト浸出調節手段１３
の噴出口１５は被処理材の形状・面積に応じ、１つある
いは複数個設けることができる。That is, FIG. 2b is an example in which the hollow electrode 7 and the spout 15 of the paste leaching control means 13 are maximized. This hollow electrode 7 and paste leaching control means 13
One or more spout ports 15 can be provided depending on the shape and area of the material to be treated.
第２Ｃ図および第２ｄ図にペーストの浸出量を第２ｂ図
と比べ減らした場合の例を示す。Figures 2C and 2d show examples where the amount of paste leached is reduced compared to Figure 2b.
これらはペースト浸出口を減らしたものであるが、中空
電極の電極孔１５ａとペースト浸出調節手段の孔１５ｂ
をずらして両者による開口部を調節して浸出量を調整す
ることも可能である。 また第２ａ図において、矢印ａ
で示したように左右方向に移動してもよく、本発明装置
は、特にこれらの調整方法に限定されるものではない。These are the ones with reduced paste infusion ports, but the electrode hole 15a of the hollow electrode and the hole 15b of the paste infusion adjustment means.
It is also possible to adjust the amount of seepage by shifting the openings between the two. Also, in Fig. 2a, arrow a
The adjustment method of the present invention is not particularly limited to these adjustment methods.
また中空電極７とバイブ４とをつなぐ接続管６内に絶縁
体１７を設け、中空電極７の電流はパイプ等に流れない
ようにするほうが好ましい。 絶縁体としてはテフロン
、塩化ビニル、シリコンゴムなどを用いるのが好ましい
。 絶縁体１７を設置することで電解処理において安定
した電流効率が得られるためである。Further, it is preferable to provide an insulator 17 in the connecting tube 6 that connects the hollow electrode 7 and the vibrator 4 so that the current of the hollow electrode 7 does not flow into a pipe or the like. As the insulator, it is preferable to use Teflon, vinyl chloride, silicone rubber, or the like. This is because by providing the insulator 17, stable current efficiency can be obtained in the electrolytic treatment.
中空電極およびパッドの組立体を上述したような形状と
することにより溶接部等の異形部や細部はもちろん、そ
れ以外の鋼板の、例えば平面部などにおける部分電解処
理が可能である。By forming the hollow electrode and pad assembly into the above-described shape, it is possible to perform partial electrolytic treatment not only on irregularly shaped parts such as welded parts and small parts, but also on other parts of the steel plate, such as flat parts.
さらに金属材間の溶接部がＬ字形であったり、球面であ
ったりした場合には、それぞれ第３図および第５図に示
すようにパッドの形状に工夫を加えて用いるのがよい。Further, when the weld between metal materials is L-shaped or spherical, it is preferable to modify the shape of the pad as shown in FIGS. 3 and 5, respectively.
このＬ字形および球形の電極−パッド組立体についての
断面図を第４図および第６図にそれぞれ示す。Cross-sectional views of the L-shaped and spherical electrode-pad assemblies are shown in FIGS. 4 and 6, respectively.
第４ａ図に示すようなＬ字形のパッド例８では前述した
筒状の中空電極７を所望の角度、位置で曲げ加工するこ
とができる。 Ｌ字形の場合、第４ａ図のｒＶ −ｒ
Ｖ線での断面図である第４ｂ図に示すように、中空電極
の外側のみにペースト噴出口１５を設ければほとんどの
場合足りるが、この内部の構造は第２ｂ図〜第２ｄ図に
示したように、目的、用途に応じ噴出口の大きさ、位置
を変えるのが好ましい。In the L-shaped pad example 8 shown in FIG. 4a, the cylindrical hollow electrode 7 described above can be bent at a desired angle and position. In the case of L-shape, rV −r in Fig. 4a
As shown in Figure 4b, which is a sectional view taken along the V line, it is sufficient in most cases to provide the paste spout 15 only on the outside of the hollow electrode, but the internal structure is shown in Figures 2b to 2d. As mentioned above, it is preferable to change the size and position of the jet nozzle depending on the purpose and use.
また、第５図は、鋼板に鋼管を溶接した場合のように、
溶接部が球面である場合の例である。 中空電極７およ
びパッド８を球形にすることで第６図に示すように球形
のバッド８全面からペーストを浸出させ、球面状局部の
電解処理を容易に行うことができる。In addition, Figure 5 shows the case where a steel pipe is welded to a steel plate.
This is an example where the welded part is a spherical surface. By making the hollow electrode 7 and pad 8 spherical, the paste can be exuded from the entire surface of the spherical pad 8, as shown in FIG. 6, and the electrolytic treatment of the spherical local area can be easily performed.
次に本発明の局部電解処理装置の作用について第１図の
部分電解処理装置に基づいて説明する。Next, the operation of the local electrolytic treatment apparatus of the present invention will be explained based on the partial electrolytic treatment apparatus shown in FIG.
本発明の部分電解処理装置は、電解酸洗、めっき、発色
、エツチング処理等の電解処理について用いることがで
きる。The partial electrolytic treatment apparatus of the present invention can be used for electrolytic treatments such as electrolytic pickling, plating, coloring, and etching.
第１図に示すように、所定のペーストは、ペースト状電
解液送給装置１のペースト槽２より、ペースト供給ポン
プ３によってバイブ４を経てペースト供給口１４より中
空電極７へと送られる。As shown in FIG. 1, a predetermined paste is sent from the paste tank 2 of the pasty electrolyte supply device 1 to the hollow electrode 7 through the paste supply port 14 via the vibrator 4 by the paste supply pump 3.
ペーストの流量は、被処理材である金属材の面積、形状
およびペーストを浸出するパッドの大きさ、形状によっ
て異なるが、バイブ４の途中に設装置されたペースト状
電解液流量調整手段であるペースト供給ポンプ３および
／またはペースト流量調節バルブ５によって、調整され
る。The flow rate of the paste varies depending on the area and shape of the metal material to be treated and the size and shape of the pad that exudes the paste. It is regulated by a feed pump 3 and/or a paste flow control valve 5.
もし過剰にペーストが流出された場合、バイパス配管１
８を経由してペースト槽２に戻ることにより、ペースト
の有効利用を図ることができる。If excessive paste is spilled, bypass pipe 1
By returning to the paste tank 2 via 8, the paste can be used effectively.
また、バイブ４は中空電極−バッド組立体を溶接部等へ
の押付移動が可能なように剛性のある、すなわちステン
レス鋼、高合金鋼の材質のものが好ましい。Further, the vibrator 4 is preferably made of a rigid material, that is, stainless steel or high alloy steel, so that the hollow electrode-bud assembly can be pressed and moved to a welding area or the like.
バイブ４と中空電極７は、第２ａ図に示すように、接続
管６でつなぎ、絶縁体１７をこれらの間にいれる方が好
ましい。 これは電極に電流を流した場合、バイブ４に
電流が流れ、さらには供給されるペーストにまで電流が
流れることを防止し、電流効率よく電解処理を行なうこ
とができる効果がある。It is preferable that the vibrator 4 and the hollow electrode 7 are connected by a connecting tube 6 and an insulator 17 is inserted between them, as shown in FIG. 2a. This has the effect that when a current is passed through the electrodes, the current is prevented from flowing through the vibrator 4 and further into the paste being supplied, allowing the electrolytic treatment to be carried out with high current efficiency.
ペースト供給口１４より供給されたペーストは、中空電
極の電極孔１５ａより噴出し、パッド８より浸出される
。The paste supplied from the paste supply port 14 is ejected from the electrode hole 15a of the hollow electrode and exuded from the pad 8.
また、第２図では、ペースト状電解液調整手段として中
空電極７と内接するペースト浸出調節手段１３を設けて
いる。Further, in FIG. 2, a paste leaching control means 13 is provided which is in internal contact with the hollow electrode 7 as a paste electrolyte adjusting means.
このペースト浸出調節手段１３には、前記電極孔１５ａ
と同様にペースト浸出量調節手段の孔１５ｂが設けられ
ている。This paste leaching control means 13 includes the electrode hole 15a.
Similarly, a hole 15b for adjusting the amount of paste exuded is provided.
このペースト浸出調整手段１３は、ペースト浸出調節ハ
ンドル１６と一体になっており、このハンドル１６を回
転、あるいは左右方向に８動させ、電極孔１５ａとペー
スト浸出量調節手段の孔１５ｂの開口位置をずらすこと
により、ペースト排出口１５より排出されるペースト量
を自由に調整することができる。 その−例を第２ｂ〜
ｄ図に示す。This paste leaching adjustment means 13 is integrated with a paste leaching adjustment handle 16, and by rotating or moving this handle 16 in the left and right directions, the opening positions of the electrode hole 15a and the hole 15b of the paste leaching amount adjustment means are adjusted. By shifting, the amount of paste discharged from the paste discharge port 15 can be freely adjusted. The example is from part 2b.
Shown in Figure d.
ここで、ペースト浸出調節手段１３は、電極と同質のス
テンレス鋼でできているものがよい。Here, the paste leaching control means 13 is preferably made of the same stainless steel as the electrodes.
ペースト排出口１５より排出されたペーストはパッド８
により含浸浸出され、前記中空電極と金属材間に通電す
ることにより所望の電解処理をすることができる。The paste discharged from the paste discharge port 15 is transferred to the pad 8.
The metal material is impregnated and leached, and a desired electrolytic treatment can be performed by passing current between the hollow electrode and the metal material.
また、金属材料９と接するパッド８の表面は、曲面加工
されているのが好ましい。 曲面とすることで金属材料
と接する面積は広くなり、処理効率がよく好ましい。Further, it is preferable that the surface of the pad 8 in contact with the metal material 9 is curved. A curved surface increases the area in contact with the metal material, which is preferable since processing efficiency is good.
また、電解処理を行なう溶接部等の局所部分がＬ字形で
あったり、球面であったりした場合は、前述していた中
空電極７およびパッド８の形状をもＬ字形または球面等
に加工し、電解処理を行なうのが好ましい。In addition, if the local part such as a welded part to be subjected to electrolytic treatment is L-shaped or spherical, the shapes of the hollow electrode 7 and pad 8 described above are also processed to be L-shaped or spherical. Preferably, electrolytic treatment is performed.
すなわちＬ字形とすれば、地面と垂直な面とはもちろん
のこと、対地面、角地のように従来電解処理しにくいと
ころでも、また、溶接部のように局所部分においても、
容易に処理することが可能である。In other words, if the L-shape is used, it can be applied not only to surfaces perpendicular to the ground, but also to areas that are difficult to conventionally treat electrolytically, such as on the ground and on corners, as well as to localized areas such as welds.
It can be easily processed.
〈実施例〉 以下に本発明を実施例に基づき具体的に説明する。<Example> The present invention will be specifically explained below based on Examples.
（実施例１）ニステンレス鋼溶接部の電解酸洗（脱スケ
ール）
ＳＵＳ３０４ステンレス鋼板（１２ｍｍ厚×３００ｍｍ
ｘｌ、０００ｍｍ）２枚をＴ形に隅肉溶接し、溶接部に
本発明の部分電解処理装置を用いて電解酸洗を行なった
。 用いたペーストの組成は、硫酸１０ｗｔ％、ポリア
クリル酸ソーダ５ｗｔ％、水８５ｗｔ％からなる。(Example 1) Electrolytic pickling (descaling) of stainless steel welded parts SUS304 stainless steel plate (12 mm thick x 300 mm
xl, 000 mm) were fillet welded into a T shape, and the welded portion was electrolytically pickled using the partial electrolytic treatment apparatus of the present invention. The composition of the paste used was 10 wt% sulfuric acid, 5 wt% sodium polyacrylate, and 85 wt% water.
電解酸洗条件は、後記第１表中に示す。The electrolytic pickling conditions are shown in Table 1 below.
また電極およびパッドの形は、円筒状、Ｌ形、あるいは
球形とそれぞれの形状を用いて行った。The shapes of the electrodes and pads were cylindrical, L-shaped, and spherical.
電解酸洗後、各Ｔ形試片を１０１００ｘｌＯＯｘ１００
の形状に切り出し、塩水噴霧試験により耐食性を調べた
。After electrolytic pickling, each T-shaped specimen was 10100xlOOx100
It was cut into the shape of , and its corrosion resistance was examined by a salt spray test.
結果を同第１表に示す。The results are shown in Table 1.
なお、電流密度は流れる電流と相対する電極のおおよそ
の面積から計算したものであり、処理時間は溶接部３０
ｃｍ当りに要した時間である。Note that the current density is calculated from the approximate area of the electrode facing the flowing current, and the processing time is calculated based on the welding area 30.
This is the time required per cm.
（比較例１）
比較例としてグラインダー仕上げによるものと１０％硫
酸による酸洗、溶接のままのものを挙げた。(Comparative Example 1) As a comparative example, one was finished with a grinder and the other was pickled with 10% sulfuric acid and left as welded.
評価としては、表面の仕上り状況と塩水噴霧試験１５０
時間による耐食性とし、結果を第１表に示す。For evaluation, surface finish and salt spray test 150
The corrosion resistance was determined by time and the results are shown in Table 1.
表１に示す結果よりわかるように、本発明例では、電極
、パッドの形状により、処理時間の差はあるものの、表
面仕上げむら、脱スケール度とも良好であり、脱スケー
ルと同時に５ＵＳ３０４ステンレス鋼表面および溶接部
には、強固な不働態化被膜が形成され、優れた耐食性を
ボした。As can be seen from the results shown in Table 1, in the example of the present invention, although there are differences in processing time depending on the shape of the electrode and pad, both the surface finish unevenness and the degree of descaling were good, and the 5US304 stainless steel surface was A strong passivation film was formed in the welded area, demonstrating excellent corrosion resistance.
比較例のグラインダー仕上げでは表面むらが少しあり、
１０％硫酸溶液での酸洗では、ブラッシングしないとス
ケールの除去はできず、１時間以上経過してもスケール
は完全に除去できず、能率も悪かった。The grinder finish of the comparative example has some surface unevenness,
When pickling with a 10% sulfuric acid solution, scale could not be removed without brushing, and the scale could not be completely removed even after one hour or more, resulting in poor efficiency.
評価基準 仕上げ
表面むら
○：裏表面らなし
６０表面むら小
Ｘ：表面むら犬
脱スケール ０・９９％以上
△、９０〜９９％
×・９０％以下
耐食性
○８錆発生はとんどなし
△・錆発生やや多い
×、錆発生多い
（実施例２）：普通鋼溶接部の部分電解Ｎｉめつぎ
１２ｍｍ厚の普通鋼をショツトブラストにより除錆し、
種々の電極、パッドでＮ１めつぎし、ガス切断後、Ｔ形
に隅肉溶接し、溶着金属部および溶接部近傍のＮｉめり
きのダメージ部を部分電解めっぎを行なった。Evaluation criteria Finished surface unevenness ○: No back surface 60 Surface unevenness small Slightly increased rust occurrence ×, increased rust occurrence (Example 2): Partially electrolyzed Ni joints in welded areas of ordinary steel 12 mm thick ordinary steel was rust-removed by shot blasting,
Various electrodes and pads were used for N1 bonding, and after gas cutting, fillet welding was performed in a T shape, and partial electrolytic plating was performed on the weld metal part and the damaged part of the Ni plating near the welding part.
Ｎｉめっき液の組成は次の通りである。The composition of the Ni plating solution is as follows.
硫酸ニッケル３３０ ｇ／ρ、塩化ニッケル４５ ｇ／
ｉＬ、ホウ酸３８ｇ／ρ、残部水に５ｗｔ％のポリアク
リル酸ソーダを添加した、ＮＬめっきペーストである。Nickel sulfate 330 g/ρ, Nickel chloride 45 g/
This is an NL plating paste in which 5 wt% of sodium polyacrylate is added to iL, boric acid 38 g/ρ, and the balance water.
第２表にＮｉめっき処理条件とその結果をあわせて示す
。Table 2 also shows the Ni plating treatment conditions and results.
溶接部近傍のＮｉめっきの確認は、溶接部の断面を切断
し、顕微鏡で観察した。Ni plating near the weld was confirmed by cutting a cross section of the weld and observing it with a microscope.
なお、Ｎｉめっ各の前処理としては、電解酸洗を実施例
１と同じペーストを用いて行なっている。 前処理およ
び電解Ｎｉめっきの電流密度は実施例１と同様に、被ｌ
Ａ理面に相対するおおよその面積によるものである。As a pretreatment for Ni plating, electrolytic pickling was performed using the same paste as in Example 1. The current density for pretreatment and electrolytic Ni plating was the same as in Example 1.
This is based on the approximate area relative to the A surface.
処理時間も実施例１同様に溶接ビード３０ｅｍ当りの時
間である。As in Example 1, the processing time is also the time per 30 em of weld bead.
電極およびパッドも実施例１と同様３種を用いた。As in Example 1, three types of electrodes and pads were used.
いずれの電極、パッドでも溶着金属部および溶接部近傍
にＮｉめっぎを施すことができることがわかる。It can be seen that Ni plating can be applied to the deposited metal part and the vicinity of the welded part with any electrode or pad.
第
表
評価基準
Ｎｉめっきの状況
顕微鏡による断面観察により、Ｎｉめつき厚さと、ピン
ホール
◎：Ｎｉめっき厚さがほぼ均一でピンホールの極少ない
もの○・Ｎｉめっき厚さがほぼ均一でピンホールが少し
あるものＸ：Ｎｉめっき厚さが薄く、不均一でピンホー
ルの多いもの〈発明の効果〉
以上詳述したように、本発明の金属材表面の部分電解処
理装置を用いれば、あらゆる金属材の表面処理を現場で
しかも低コストでかつ小型の装置で行なうことができる
。Table Evaluation Criteria Condition of Ni plating Cross-sectional observation using a microscope revealed the Ni plating thickness and pinholes ◎: Ni plating thickness is almost uniform and there are very few pinholes ○ Ni plating thickness is almost uniform and there are no pinholes X: Ni plating is thin, non-uniform, and has many pinholes (Effects of the Invention) As detailed above, if the partial electrolytic treatment apparatus for metal surfaces of the present invention is used, all metals can be coated. Surface treatment of materials can be carried out on-site at low cost and with small equipment.
従って、特にステンレスクラット鋼などのように片面側
の溶接部の処理を行なったり、構造物の一部分の除錆、
めっぎ処理する場合には本発明の特徴が発揮される。Therefore, it is necessary to treat the welds on one side of stainless steel, etc., and to remove rust from a part of the structure.
The features of the present invention are exhibited when plating is performed.
また、本発明は、電解設備の固定化の必要がなく、適切
な電極形状とペーストを選択することにより、あらゆる
金属構造物、金属製品の表面処理（電解酸洗、不働態化
処理、電解研磨、電解めっき、電解着色など）が簡単か
つ、迅速に行なうことかできる。In addition, the present invention eliminates the need to fix electrolytic equipment, and by selecting an appropriate electrode shape and paste, the present invention enables surface treatment (electrolytic pickling, passivation treatment, electrolytic polishing) of all metal structures and metal products. , electrolytic plating, electrolytic coloring, etc.) can be performed easily and quickly.
第１図、第３図および第５図は、筒状、Ｌ字形あるいは
球形電極をそれぞれ用いて行なう際の本発明の部分電解
処理装置の模式図である。
第２ａ図は、本発明の直管状の電極−パット組立体を有
する部分電解処理装置の部分縦断面図である。
第２ｂ図、第２Ｃ図および第２ｄ図は、ペスト噴出開口
の開口度を調節した種々の例を示す横断面図である。
第４ａ図は、本発明のＬ字形の電極−パット組立体を有
する電解処理装置の部分縦断面図である。
第４ｂ図は、第４ａ図のＩＶ −ＩＶ線での横断面図で
ある。
第６図は、本発明の球形の電極−パッド組立体を有する
電解処理装置の部分縦断面図である。
符号の説明
１・・・ペースト状電解液送給装置、
２・・・ペースト槽、
３・・・ペースト供給ポンプ、
４・・・パイプ、
５・・・ペースト流量調節バルブ、
６・・・接続管、
７・・・中空電極、
８・・・パッド、
９・・・金属材、
１０・・・溶接部、
１１・・・電源装置、
１２・・・配線、
１３・・・ペースト浸出量調節手段、
１４・・・ペースト供給口、
１５・・・ペースト噴出口、
１５ａ・・・中空電極電極孔、
１５ｂ・・・ペースト浸出量調節手段の孔、１６・・・
ペースト浸出量調節ハンドル、１７・・・絶縁体、
８・・・バイパス配管FIG. 1, FIG. 3, and FIG. 5 are schematic diagrams of the partial electrolytic treatment apparatus of the present invention when using a cylindrical, L-shaped, or spherical electrode, respectively. FIG. 2a is a partial longitudinal sectional view of a partial electrolytic treatment apparatus having a straight tube-shaped electrode-pad assembly according to the present invention. FIGS. 2b, 2C, and 2d are cross-sectional views showing various examples in which the degree of opening of the pest ejection opening is adjusted. FIG. 4a is a partial longitudinal sectional view of an electrolytic processing apparatus having an L-shaped electrode-pad assembly of the present invention. FIG. 4b is a cross-sectional view taken along line IV--IV of FIG. 4a. FIG. 6 is a partial longitudinal sectional view of an electrolytic processing apparatus having a spherical electrode-pad assembly of the present invention. Explanation of symbols 1...Paste electrolyte supply device, 2...Paste tank, 3...Paste supply pump, 4...Pipe, 5...Paste flow rate adjustment valve, 6...Connection Pipe, 7... Hollow electrode, 8... Pad, 9... Metal material, 10... Welding part, 11... Power supply device, 12... Wiring, 13... Paste leaching amount adjustment Means, 14... Paste supply port, 15... Paste spout, 15a... Hollow electrode hole, 15b... Hole of paste leaching amount adjusting means, 16...
Paste leaching amount adjustment handle, 17...Insulator, 8...Bypass piping
Claims (7)
電解液供給口を有する中空電極と、この中空電極をカバ
ーし、かつ前記ペースト状電解液噴出口から噴出するペ
ースト状電解液を浸出させるパッドと、 前記中空電極の中空部に前記ペースト状電解液供給口を
経て任意量のペースト状電解液を送給するペースト状電
解液送供給装置と、 前記中空電極と表面処理すべき金属材料との間に通電す
る電源装置とを有することを特徴とする金属材表面の局
部電解処理装置。(1) A hollow electrode having a plurality of pasty electrolyte spouts and a pasty electrolyte supply port, and a pad that covers this hollow electrode and exudes the pasty electrolyte spouted from the pasty electrolyte spouts. a pasty electrolyte feeding device that feeds an arbitrary amount of pasty electrolyte into the hollow part of the hollow electrode through the pasty electrolyte supply port; a connection between the hollow electrode and the metal material to be surface-treated; 1. An apparatus for local electrolytic treatment of a surface of a metal material, comprising a power supply device that supplies current between the two.
ト状電解液調整手段を有する請求項１に記載の金属材表
面の局部電解処理装置。(2) The apparatus for local electrolytic treatment of the surface of a metal material according to claim 1, further comprising a paste electrolyte adjusting means for adjusting the opening amount of the ejection holes of the hollow electrode.
液流量調整手段を付加する請求項１または２に記載の金
属材表面の局部電解処理装置。(3) The device for local electrolytic treatment of the surface of a metal material according to claim 1 or 2, wherein the pasty electrolyte feeding device includes a pasty electrolyte flow rate adjusting means.
求項１ないし３のいずれかに記載の金属材表面の局部電
解処理装置。(4) The device for local electrolytic treatment of the surface of a metal material according to any one of claims 1 to 3, wherein the hollow electrode has an L-shape or a spherical shape.
請求項１ないし４のいずれかに記載の金属材表面の局部
電解処理装置。(5) The device for local electrolytic treatment of the surface of a metal material according to any one of claims 1 to 4, wherein the pad has a curved surface in contact with the metal material.
縁体を介して接続する請求項１ないし５のいずれかに記
載の金属材表面の局部電解処理装置。(6) The local electrolysis treatment device for the surface of a metal material according to any one of claims 1 to 5, wherein the hollow electrode and the paste electrolyte supply device are connected through an insulator.
る請求項１ないし６のいずれかに記載の金属材表面の局
部電解処理装置。(7) The device for local electrolytic treatment of the surface of a metal material according to any one of claims 1 to 6, wherein a rigid pipe is connected to the supply port of the hollow electrode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63278656A JPH0635680B2 (en) | 1988-11-04 | 1988-11-04 | Local electrolytic treatment device for metal surface |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63278656A JPH0635680B2 (en) | 1988-11-04 | 1988-11-04 | Local electrolytic treatment device for metal surface |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02125900A true JPH02125900A (en) | 1990-05-14 |
| JPH0635680B2 JPH0635680B2 (en) | 1994-05-11 |
Family
ID=17600323
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63278656A Expired - Lifetime JPH0635680B2 (en) | 1988-11-04 | 1988-11-04 | Local electrolytic treatment device for metal surface |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0635680B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2893478A1 (en) * | 2005-11-14 | 2007-05-18 | Eads Space Transp Sas Soc Par | THREE-DIMENSIONAL NON-DEVELOPABLE SURFACE PRINTED CIRCUIT AND MANUFACTURING METHOD THEREFOR. |
| WO2022014316A1 (en) * | 2020-07-14 | 2022-01-20 | 三菱電機株式会社 | Plating electrode, plating device, and plating method |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57171689A (en) * | 1981-04-13 | 1982-10-22 | Tokio Osaki | Plating device |
-
1988
- 1988-11-04 JP JP63278656A patent/JPH0635680B2/en not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57171689A (en) * | 1981-04-13 | 1982-10-22 | Tokio Osaki | Plating device |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2893478A1 (en) * | 2005-11-14 | 2007-05-18 | Eads Space Transp Sas Soc Par | THREE-DIMENSIONAL NON-DEVELOPABLE SURFACE PRINTED CIRCUIT AND MANUFACTURING METHOD THEREFOR. |
| WO2007057528A1 (en) * | 2005-11-14 | 2007-05-24 | Astrium Sas | Method for producing a non-developable surface printed circuit and the thus obtained printed circuit |
| WO2022014316A1 (en) * | 2020-07-14 | 2022-01-20 | 三菱電機株式会社 | Plating electrode, plating device, and plating method |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0635680B2 (en) | 1994-05-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5277785A (en) | Method and apparatus for depositing hard chrome coatings by brush plating | |
| WO2018013868A1 (en) | Electrochemical methods, devices and compositions | |
| JPS62240795A (en) | Method and roller electrode for electroplating of metal during movement | |
| TW200528587A (en) | Apparatus adapted for membrane-mediated electropolishing | |
| CA3171824C (en) | Apparatus and method for in-situ electrosleeving and in-situ electropolishing internal walls of metallic conduits | |
| US4879015A (en) | Method and manual apparatus for the semimechanical galvanizing of sheet metal surfaces | |
| JPS58100695A (en) | Method and apparatus for electroplating | |
| CN113369779B (en) | Welding tool for assembling electric tricycle | |
| US20090090634A1 (en) | Method of plating metal onto titanium | |
| JPH02125900A (en) | Equipment for electrolytically treating local area of surface of metallic material | |
| DE1807481C3 (en) | Partial electroplating process | |
| CN109137052A (en) | A kind of electroplanting device and its electro-plating method of comprehensive coating | |
| JPH02182893A (en) | Electrolytic treatment device | |
| JPH04157197A (en) | Electrolytic treatment of surface of metallic material and electrode used the same | |
| DE3840310A1 (en) | Method for accelerated deposition of a thick reconditioning layer on a worn workpiece | |
| KR20200008453A (en) | Electrolytic polishing method of metal tube using ultrasonic wave | |
| DE19844832A1 (en) | Apparatus for localized cleaning metal surfaces, in particular, stainless steel surfaces within weld seam zones | |
| JPH06146066A (en) | Continuous electrolytic processor | |
| JPH0532538Y2 (en) | ||
| JPH04103792A (en) | Electrolytically treating device | |
| KR100920602B1 (en) | An apparatus for removing the oxide coat on an anode for strip eletroplating | |
| JPS63153293A (en) | Surface treatment of work | |
| JPH03166399A (en) | Method and equipment for electrolytic treatment for metallic material | |
| JP3186537B2 (en) | Electrolytic treatment equipment | |
| JP2672352B2 (en) | Electroplating method and apparatus |